A silicon wafer collecting device for a wire cutting machine

Abstract

This utility model discloses a silicon wafer collecting device for a wire cutting machine, including a support box. A through hole is provided at the top of the support box, and a collecting assembly is installed within the through hole. The collecting assembly includes two U-shaped plates, upper and lower, connected by two sets of symmetrically arranged limiting posts. Vertical plates are fixedly connected to the inner sides of the limiting posts. Several slots are provided on the inner walls of both vertical plates, with the slots on the two plates being symmetrical. The collecting assembly is controlled to rise and fall by a lifting assembly installed within the through hole. A conveying assembly is provided on one side of the collecting assembly and is mounted on the support box. This utility model can transport silicon wafers into the collecting assembly via a conveyor belt. The silicon wafers are supported by the corresponding two slots, preventing them from being squeezed or overlapping, greatly reducing the damage rate, lowering costs, and reducing manual handling, thus significantly improving work efficiency.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing equipment technology, and in particular to a silicon wafer collecting device for a wire cutting machine. Background Technology

[0002] Monocrystalline silicon is a relatively reactive non-metallic element and an important component of crystalline materials, at the forefront of new materials development. Its main applications are as a semiconductor material and in solar photovoltaic power generation and heating. Due to the numerous advantages of solar energy, such as cleanliness, environmental friendliness, and convenience, solar energy utilization technology has made significant progress in research and development, commercial production, and market expansion over the past thirty years, becoming one of the world's fastest-growing and most stable emerging industries. Monocrystalline silicon can be used in the production and deep processing of single-crystal products at the diode, rectifier, circuit, and solar cell levels. Its subsequent products, integrated circuits and semiconductor discrete devices, are widely used in various fields and also occupy an important position in military electronic equipment. With the rapid development of photovoltaic technology and micro-miniature semiconductor inverter technology, monocrystalline silicon solar cells produced using single-crystal silicon can directly convert solar energy into light energy, marking the beginning of a green energy revolution.

[0003] In the silicon wafer production process, a wire cutting machine is needed to cut silicon rods into wafers. The existing collection devices are just a tank. When collecting the cut silicon wafers, they will be squeezed and overlapped, causing damage to the silicon wafers, increasing production costs, and making it inconvenient to pick them up and resulting in low work efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a silicon wafer collecting device for wire cutting machines to solve the above-mentioned problems.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] This utility model discloses a silicon wafer collecting device for a wire cutting machine, comprising a support box, a through hole at the top of the support box, a collecting assembly within the through hole, and the collecting assembly comprising two upper and lower U-shaped plates connected by two sets of symmetrically arranged limiting posts. A vertical plate is fixedly connected to the inner side of each limiting post. Several slots are provided on the inner walls of both vertical plates, and the slots on the two vertical plates are symmetrical. The collecting assembly is controlled to rise and fall by a lifting assembly installed within the through hole. A conveying assembly is provided on one side of the collecting assembly and is mounted on the support box.

[0007] Furthermore, each of the four corners of the bottom of the support box is equipped with a caster wheel with a stop mechanism.

[0008] Furthermore, the lifting assembly includes a base frame, a linear screw module, and a mounting frame. The mounting frame is placed inside the through hole and mounted on the support box. The linear screw module is connected to the mounting frame. The base frame is connected to the slider of the linear screw module. The base frame is connected to the bottom surface of the U-shaped plate below.

[0009] Furthermore, the mounting bracket is L-shaped, and an infrared sensor is mounted on the top of the mounting bracket. A sensing block matching the infrared sensor is mounted on the top surface of the U-shaped plate above.

[0010] Furthermore, the conveying assembly includes a conveying frame connected above the support box. One end of the conveying frame is placed in the groove of the U-shaped plate. Two sets of symmetrically arranged pulleys are installed on the conveying frame. The pulleys are rotatably connected to the conveying frame. A conveyor belt is connected to the two pulleys in the same set. The two pulleys at the same end of the conveying frame are connected by a rotating shaft. The rotating shaft is controlled to rotate by a drive assembly. Limiting plates are provided on the front and rear end faces of the conveying frame.

[0011] Furthermore, the conveyor frame is connected above the support box via a support frame.

[0012] Furthermore, the end of the conveyor frame away from the collecting assembly is inclined downwards, while the end placed within the groove of the U-shaped plate is horizontally positioned.

[0013] Furthermore, the drive assembly includes a motor connected to the conveyor frame, a drive pulley connected to the output end of the motor, a driven pulley connected to the rotating shaft, and the drive pulley and the driven pulley connected by a belt.

[0014] Furthermore, a tensioning wheel is installed on the conveyor frame.

[0015] Compared with the prior art, the beneficial technical effects of this utility model are as follows:

[0016] This invention can transport silicon wafers to the collection assembly via a conveyor belt, and support the silicon wafers with two corresponding slots to prevent them from squeezing or overlapping each other, greatly reducing the damage rate and cost. At the same time, it reduces manual handling and greatly improves work efficiency. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings.

[0018] Figure 1 This is a schematic diagram of the silicon wafer collecting device for a wire cutting machine according to this utility model;

[0019] Figure 2This is a front view of the silicon wafer collecting device for a wire cutting machine according to this utility model;

[0020] Figure 3 This is a top view of the silicon wafer collecting device for a wire cutting machine according to this utility model;

[0021] Explanation of reference numerals in the attached drawings: 1. Support box; 2. U-shaped plate; 3. Limiting post; 4. Vertical plate; 5. Slot; 6. Caster wheel; 7. Base frame; 8. Linear screw module; 9. Mounting frame; 10. Infrared sensor one; 11. Sensing block; 12. Conveyor frame; 13. Conveyor belt; 14. Rotating shaft; 15. Limiting plate; 16. Support frame; 17. Motor; 18. Tensioning wheel. Detailed Implementation

[0022] like Figure 1-3 As shown, a silicon wafer collecting device for a wire cutting machine includes a support box 1. Each of the four corners of the bottom of the support box 1 is equipped with a caster wheel 6 with a stop function to facilitate the adjustment of the device's position.

[0023] The top of the support box 1 has a through hole, and a collection component is provided in the through hole. The collection component includes two U-shaped plates 2, which are connected by two sets of symmetrically arranged limiting posts 3. A vertical plate 4 is fixedly connected to the inner side of the limiting post 3. Several slots 5 are provided on the inner wall of each of the two vertical plates 4. The slots 5 on the two vertical plates 4 are symmetrical. The collection component is controlled to lift by a lifting component installed in the through hole.

[0024] A stop bar is connected to the end of the slot 5 away from the conveying assembly, and the stop bar prevents the silicon wafer from running out of the slot 5.

[0025] The lifting assembly includes a base frame 7, a linear screw module 8, and a mounting bracket 9. The mounting bracket 9 is placed inside the through hole and mounted on the support box 1. The linear screw module 8 is connected to the mounting bracket 9. The base frame 7 is connected to the slider of the linear screw module 8 and is attached to the bottom surface of the U-shaped plate 2 below. The movement of the slider of the linear screw module 8 causes the base frame 7 to rise and fall, thereby raising and lowering the entire collecting assembly.

[0026] The mounting frame 9 is L-shaped. An infrared sensor 10 is installed on the top of the mounting frame 9. A sensing block 11 matching the infrared sensor 10 is installed on the top surface of the U-shaped plate 2 above. The infrared sensor 10 senses the position of the sensing block 11 to prevent the U-shaped plate 2 above from hitting the mounting frame 9. It can also know that the U-shaped plate 2 below has been raised to its highest position.

[0027] A conveying component is provided on one side of the collecting component, and the conveying component is installed on the support box 1.

[0028] The conveying assembly includes a conveyor frame 12 connected above the support box 1, and the conveyor frame 12 is connected above the support box 1 via a support frame 16. One end of the conveyor frame 12 is placed in the groove of the U-shaped plate 2. Two sets of symmetrically arranged pulleys are installed on the conveyor frame 12, and the pulleys are rotatably connected to the conveyor frame 12. A conveyor belt 13 is connected to the two pulleys in the same set. The two pulleys at the same end of the conveyor frame 12 are connected by a rotating shaft 14, and the rotating shaft 14 is controlled to rotate by a drive assembly. Limiting plates 15 are provided on both the front and rear end faces of the conveyor frame 12.

[0029] The tensioning wheel 18 is installed on the conveyor frame 12.

[0030] The end of the conveyor frame 12 away from the collection assembly is inclined downwards, while the other end, placed in the groove of the U-shaped plate 2, is set horizontally.

[0031] The drive assembly includes a motor 17 connected to the conveyor frame 12. A drive pulley is connected to the output end of the motor 17, and a driven pulley is connected to the rotating shaft 14. The drive pulley and the driven pulley are connected by a belt.

[0032] An infrared sensor 2 is installed on the conveyor frame 12. The infrared sensor 2 senses the position of the conveyed silicon wafer. When the silicon wafer is sensed by the infrared sensor 2, the linear screw module 8 controls the collecting assembly to rise to a set position so that the silicon wafer can be directly delivered into the slot 5.

[0033] The operation process of this utility model is as follows:

[0034] In use, the empty collection assembly is installed on the base frame 7, and the U-shaped plate 2 below is connected to the base frame 7. Then, the linear screw module 8 works, driving the collection assembly to descend to the lowest position. At this time, the horizontal position of the conveyor belt 13 is above the uppermost slot 5. Then, the cut silicon wafers are transported on the conveyor frame 12 through the conveyor belt 13. When the infrared sensor 2 detects the silicon wafer, the linear screw module 8 controls the collection assembly to descend, so that the horizontal position of the conveyor belt 13 is slightly below the middle of the uppermost slot 5, so that the silicon wafer can be directly sent into the two symmetrically arranged slots 5. Then, when the next silicon wafer is detected by the infrared sensor 2, the linear screw module 8 drives the collection assembly to rise one slot 5 height, so that the silicon wafer can be sent into the second highest slot 5. Then, the above actions are repeated.

[0035] The embodiments described above are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Various modifications and improvements made to the technical solutions of the present utility model by those skilled in the art without departing from the spirit of the present utility model should fall within the protection scope defined by the claims of the present utility model.

Claims

1. A silicon wafer collecting device for a wire saw, characterized by: The system includes a support box (1), with a through hole at the top of the support box (1). A collection component is provided in the through hole. The collection component includes two U-shaped plates (2), which are connected by two sets of symmetrically arranged limiting posts (3). A vertical plate (4) is fixedly connected to the inner side of the limiting post (3). Several slots (5) are provided on the inner walls of the two vertical plates (4). The slots (5) on the two vertical plates (4) are symmetrical. The collection component is controlled to lift by a lifting component installed in the through hole. A conveying component is provided on one side of the collection component. The conveying component is installed on the support box (1).

2. The silicon wafer collecting device for a wire saw according to claim 1, characterized by: The support box (1) is equipped with casters (6) with stop function at each of the four corners of its bottom.

3. The silicon wafer collecting device for a wire saw according to claim 1, characterized by: The lifting assembly includes a base frame (7), a linear screw module (8), and a mounting frame (9). The mounting frame (9) is placed in the through hole and mounted on the support box (1). The linear screw module (8) is connected to the mounting frame (9). The base frame (7) is connected to the slider of the linear screw module (8). The base frame (7) is connected to the bottom surface of the U-shaped plate (2) below.

4. The silicon wafer collecting device for a wire cutting machine according to claim 3, characterized in that: The mounting bracket (9) is L-shaped, and an infrared sensor (10) is mounted on the top of the mounting bracket (9). A sensing block (11) matching the infrared sensor (10) is mounted on the top surface of the U-shaped plate (2) above.

5. The silicon wafer collecting device for a wire cutting machine according to claim 1, characterized in that: The conveying assembly includes a conveying frame (12) connected above the support box (1). One end of the conveying frame (12) is placed in the groove of the U-shaped plate (2). Two sets of symmetrically arranged pulleys are installed on the conveying frame (12). The pulleys are rotatably connected to the conveying frame (12). A conveyor belt (13) is connected to the two pulleys in the same set. The two pulleys at the same end of the conveying frame (12) are connected by a rotating shaft (14). The rotating shaft (14) is controlled to rotate by a drive assembly. Limiting plates (15) are provided on the front and rear end faces of the conveying frame (12).

6. The silicon wafer collecting device for a wire cutting machine according to claim 5, characterized in that: The conveyor frame (12) is connected above the support box (1) via a support frame (16).

7. The silicon wafer collecting device for a wire cutting machine according to claim 6, characterized in that: The end of the conveyor (12) away from the collection assembly is inclined downwards, and the other end placed in the groove of the U-shaped plate (2) is set horizontally.

8. The silicon wafer collecting device for a wire cutting machine according to claim 7, characterized in that: The drive assembly includes a motor (17) connected to the conveyor frame (12). The output end of the motor (17) is connected to a drive pulley, and the shaft (14) is connected to a driven pulley. The drive pulley and the driven pulley are connected by a belt.

9. The silicon wafer collecting device for a wire cutting machine according to claim 8, characterized in that: The tensioning wheel (18) is installed on the conveyor frame (12).

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