Coating apparatus

Abstract

This application relates to a coating equipment. The coating equipment includes a vacuum coating chamber, a workpiece holder, target assembly mechanisms, and a drive and adjustment mechanism. The vacuum coating chamber has a workpiece holder disposed within it. Multiple target assembly mechanisms are arranged around the workpiece holder within the vacuum coating chamber. The target assembly mechanisms are used to sputter coating material particles onto the surface of the workpiece to be coated. The drive and adjustment mechanism is disposed on the target assembly mechanisms and is used to adjust the sputtering parameters of the target assembly mechanisms, including sputtering distance, sputtering angle, and magnetic field distribution. The drive and adjustment mechanism coordinates the sputtering distance, sputtering angle, and magnetic field distribution of the multiple target assembly mechanisms to dynamically match the surface morphology of the workpiece to be coated in three-dimensional space, thereby achieving uniform coverage of sputtered particles on the surface of the workpiece and improving the yield and performance consistency of high-end optical components.

Description

Technical Field

[0001] This application relates to the field of vacuum coating technology, and in particular to coating equipment. Background Technology

[0002] Magnetron sputtering is a core branch of physical vapor deposition (PVD) technology. With its advantages of high deposition rate, strong controllability of film composition, and wide applicability to various materials, it has become the mainstream process for preparing nanoscale optical thin films and functional coatings. Utilizing the synergistic effect of electromagnetic fields, an efficient plasma environment is constructed in a vacuum, and mass transfer is achieved through ion bombardment of the target, ultimately forming a thin film on the substrate surface.

[0003] When developing multilayer stacked optical interference PVD films, because these films need to achieve specific optical properties through the interference effect of light, the precision requirement for the film thickness is to reach the nanometer level. Typically, the thickness of each layer needs to be controlled within the range of 10-100nm, which makes the process control difficulty increase exponentially.

[0004] However, existing conventional coating equipment has revealed significant technical bottlenecks when dealing with the preparation of such ultrathin film layers. It is prone to producing products with inconsistent colors and film thicknesses. The prepared products generally have color variations that can be seen with the naked eye and poor uniformity. This is particularly prominent in high-end applications such as precision optical components and electronic display panels. As a result, the optical consistency standards of the end products cannot be met, and users' experience requirements for color reproduction and visual stability cannot be effectively guaranteed. Utility Model Content

[0005] Based on this, a coating device is provided to solve the problem of poor film uniformity.

[0006] Embodiments of this application disclose a coating apparatus, comprising:

[0007] Vacuum coating chamber;

[0008] A workpiece holder, which is disposed in the vacuum coating chamber, is used to support the workpiece to be coated;

[0009] A target assembly, comprising multiple target assemblies arranged around the workpiece holder within the vacuum coating chamber, wherein the target assemblies are used to sputter coating material particles onto the surface of the workpiece to be coated.

[0010] A drive adjustment mechanism is disposed on the target assembly mechanism and is used to adjust the sputtering parameters of the target assembly mechanism, including sputtering distance, sputtering angle and magnetic field distribution;

[0011] The drive adjustment mechanism coordinates the sputtering distance, sputtering angle, and magnetic field distribution of multiple target groups to dynamically match the surface morphology of the workpiece to be coated in three-dimensional space with the sputtered particles of each target group surrounding the workpiece holder, thereby achieving uniform coverage of sputtered particles on the surface of the workpiece to be coated.

[0012] In one embodiment, the target assembly mechanism includes:

[0013] The target tube is movably connected to the vacuum coating chamber;

[0014] The target material is disposed on the outer surface of the target tube and is used to provide coating material;

[0015] A magnetic core is rotatably connected to the outer surface of the target tube and is used to generate a magnetic field to control the trajectory of sputtered particles.

[0016] In one embodiment, the drive adjustment mechanism includes:

[0017] A distance adjustment component is driven and connected to the target tube, and the distance adjustment component can drive the target tube to move closer to or further away from the workpiece holder to adjust the sputtering distance;

[0018] An angle adjustment component is connected to the magnetic core drive and can drive the magnetic core to rotate inside the target tube to adjust the sputtering angle of the magnetic core relative to the workpiece holder and the magnetic field distribution.

[0019] In one embodiment, a sliding mechanism is provided in the vacuum coating chamber, one end of the sliding mechanism is close to the workpiece holder, and the other end extends away from the workpiece holder, and the target assembly mechanism is slidably connected to the sliding mechanism;

[0020] The distance adjustment component includes a linear transmission mechanism that drives the target assembly mechanism to move closer to or further away from the workpiece holder along the sliding mechanism to adjust the sputtering distance.

[0021] In one embodiment, a rotating shaft is rotatably connected inside the target tube, and the magnetic core is mounted on the rotating shaft;

[0022] The angle adjustment component includes a rotary transmission mechanism that drives the magnetic core to rotate around the axis of the rotation shaft to synchronously adjust the sputtering angle and the magnetic field distribution.

[0023] In one embodiment, the magnetic core has a scanning mode and a stationary mode;

[0024] During the scanning process, the angle adjustment component drives the magnetic core to reciprocate within a preset range.

[0025] When the magnetic core is in the fixed working condition, the angle adjustment component drives the magnetic core to remain stationary.

[0026] In one embodiment, the coating apparatus further includes a shielding mechanism, the shielding mechanism comprising:

[0027] A shielding member is movably connected to the outside of the target material, and the shielding member has a shielding position and a non-shielding position;

[0028] A blocking drive is provided, which is driven to the blocking member, and drives the blocking member to switch between the blocking position and the non-blocking position.

[0029] In one embodiment, four target assembly mechanisms are provided, and each target assembly mechanism is provided with two twin pairs of target tubes.

[0030] In one embodiment, the workpiece holder is rotatably disposed in the vacuum coating chamber, and the coating equipment further includes a first driving member, which is droopingly connected to the workpiece holder and drives the workpiece holder to rotate.

[0031] In one embodiment, the workpiece rack is provided with a plurality of workpiece turntables, the workpiece turntables are rotatably connected to the workpiece rack, the workpiece turntables are used to carry the workpieces to be coated, and the coating equipment further includes a second driving member, the second driving member is drivenly connected to the workpiece turntables, and the second driving member drives the workpiece turntables to rotate.

[0032] According to the coating equipment of this application embodiment, the workpiece to be coated is placed on the workpiece holder, and the sputtering parameters of the target group mechanism are adjusted by the drive adjustment mechanism. The target group mechanism coats the workpiece to be coated, which can achieve the effect of improving the uniformity of the film layer. Attached Figure Description

[0033] Figure 1 This is a top view of a coating apparatus according to an embodiment of this application.

[0034] Figure 2 This is a top view of the coating apparatus according to an embodiment of this application, where the workpiece to be coated and the magnetic core are rotatable.

[0035] Figure 3 This is a top view of the coating apparatus according to an embodiment of this application when the workpiece turntable is rotatable.

[0036] Figure label:

[0037] 1000. Coating equipment;

[0038] 100. Vacuum coating chamber;

[0039] 200. Workpiece holder; 210. Workpiece turntable;

[0040] 300. Target assembly mechanism; 310. Target tube; 320. Magnetic core;

[0041] 2000, Workpiece to be coated. Detailed Implementation

[0042] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0043] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0044] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0046] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0047] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0048] See Figure 1 At least one embodiment of this application provides a coating apparatus 1000, which includes a vacuum coating chamber 100, a workpiece holder 200, a target assembly 300, and a drive adjustment mechanism. The workpiece holder 200 is disposed within the vacuum coating chamber 100 and is used to support the workpiece 2000 to be coated. Multiple target assemblies 300 are arranged around the workpiece holder 200 within the vacuum coating chamber 100, and the target assemblies 300 are used to sputter coating material particles onto the surface of the workpiece 2000. The drive adjustment mechanism is disposed on the target assemblies 300 and is used to adjust the sputtering parameters of the target assemblies 300, including sputtering distance, sputtering angle, and magnetic field distribution. The drive adjustment mechanism coordinates the sputtering distance, sputtering angle and magnetic field distribution of multiple target group mechanisms 300, so that the sputtered particles of each target group mechanism 300 surrounding the workpiece holder 200 dynamically match the surface morphology of the workpiece 2000 to be coated in three-dimensional space, so as to achieve uniform coverage of sputtered particles on the surface of the workpiece 2000 to be coated.

[0049] The vacuum coating chamber 100 provides a low-pressure, clean space for the sputtering coating process, effectively reducing the scattering interference of gas molecules on sputtered particles. The vacuum coating chamber 100 is not limited to any shape, including but not limited to cylindrical or polygonal shapes.

[0050] The sputtering distance, a key parameter in sputtering, specifically refers to the distance between the target material and the surface of the workpiece to be coated (2000). The sputtering distance directly affects the energy attenuation and scattering of particles during flight. A shorter sputtering distance results in higher particle energy, less scattering, and a faster deposition rate, but also a significant difference in flux between the edge and center. A longer sputtering distance leads to significant particle energy attenuation and a lower deposition rate, but improves scattering uniformity. Adjusting the sputtering distance using a drive mechanism ensures it remains within a suitable range, thereby enhancing film uniformity.

[0051] The sputtering angle, a key parameter in sputtering, specifically refers to the angle between the sputtering direction of the target material and the normal to the surface of the workpiece 2000. The sputtering angle directly affects the particle incident direction and deposition coverage characteristics. A small sputtering angle, close to 0°, during vertical sputtering, results in particles incident perpendicularly onto the workpiece 2000 surface, leading to high deposition efficiency and good film density. However, for workpieces with complex structures such as curved surfaces or grooves, geometric obstruction can easily create deposition blind zones, resulting in insufficient film thickness at edges or recesses. A large sputtering angle, such as 15° to 60°, during tilted sputtering, allows particles to incident at an angle, effectively improving coverage of complex structures. However, excessively large angles can intensify lateral diffusion of particles on the workpiece 2000 surface, potentially causing over-deposition or component segregation at edges. By adjusting the sputtering angle using a drive adjustment mechanism, the optimal incident angle can be dynamically matched to the geometry of the workpiece 2000 and the film performance requirements. For example, for flat workpieces 2000 to be coated, a small angle sputtering of 0° to 10° is used to ensure deposition efficiency and uniformity; for curved workpieces 2000 to be coated, a large angle sputtering of 30° to 50° is used to eliminate obstruction and achieve uniform coverage of the entire surface, thereby improving the uniformity and integrity of the film layer of workpieces 2000 with different structures.

[0052] The magnetic field distribution in sputtering parameters specifically refers to the spatial distribution and intensity gradient of the magnetic field generated by the magnetic core 320 within the vacuum coating chamber 100 during magnetron sputtering. The magnetic field distribution directly regulates the plasma density and the trajectory of sputtered particles. When the magnetic field strength is high, electrons are confined near the target surface, extending their path and increasing the probability of collisions with the working gas, significantly improving plasma density and sputtering yield. When the magnetic field strength is low, the confinement of electrons weakens, shortening their path within the vacuum coating chamber 100 and reducing the probability of collisions with the working gas, leading to a significant decrease in plasma density and sputtering yield. In this case, the sputtering efficiency on the target surface decreases, and the deposition rate slows down, but the local etching effect of the magnetic field on the target is weakened, improving target utilization. When the magnetic field distribution is concentrated, the plasma is focused in the central region of the target, the particle emission direction is concentrated, the deposition rate is fast but the coverage area is small, suitable for depositing small-area, highly dense films. When the magnetic field distribution is diffuse, the plasma is dispersed over a larger area, the particle emission angle range is wide, the coverage area is increased but the deposition rate decreases, which is beneficial for large-area uniform coating. By dynamically adjusting the position and angle of the magnetic core 320 through the drive adjustment mechanism, the uniformity and integrity of the film layer on the workpiece 2000 with different structures to be coated are improved.

[0053] It is understandable that coordinated control refers to the synchronous and correlated adjustment of three parameters—sputtering distance, sputtering angle, and magnetic field distribution—of multiple target groups 300 by the drive adjustment mechanism, rather than independent control of a single parameter. Three-dimensional space refers to the three-dimensional spatial range centered on the workpiece holder 200, encompassing the vertical and circumferential axes. Dynamic matching refers to the real-time adjustment of sputtering parameters by the drive adjustment mechanism based on the real-time geometry of the workpiece 2000 to be coated, such as planes, curved surfaces, and grooves, so that the motion characteristics of the sputtered particles are adapted to the surface shape of the workpiece 2000 in real time. The surface morphology of the workpiece 2000 to be coated refers to its geometric shape and surface structure characteristics, including three-dimensional structural features such as planes, curved surfaces, inclined surfaces, grooves, and protrusions. Uniform coverage refers to the uniform deposition of sputtered particles across all areas of the surface of the workpiece 2000, without localized areas of excessive thickness, thinness, or deposition blind spots, ensuring consistent film thickness, composition, and performance across the surface of the workpiece 2000.

[0054] According to the coating equipment 1000 of this application embodiment, the sputtering distance, sputtering angle and magnetic field distribution of multiple target group mechanisms 300 are controlled in coordination by a drive adjustment mechanism, so that the sputtered particles of each target group mechanism 300 surrounding the workpiece holder 200 dynamically match the surface morphology of the workpiece 2000 to be coated in three-dimensional space, so as to achieve uniform coverage of sputtered particles on the surface of the workpiece 2000 to be coated, thereby improving the uniformity of the film layer.

[0055] See Figure 2In some embodiments, the target assembly 300 includes a target tube 310, a target material, and a magnetic core 320. The target tube 310 is movably connected within the vacuum coating chamber 100. The target material is disposed on the outer surface of the target tube 310 and is used to provide the coating material. The magnetic core 320 is rotatably connected within the target tube 310 and is used to generate a magnetic field to control the trajectory of sputtered particles. The target tube 310 provides physical support, the target material generates the coating material through sputtering, and the magnetic core 320 regulates the particle trajectory through the magnetic field, together realizing the complete process from material sputtering and particle transport to uniform deposition.

[0056] In some embodiments, depending on the requirements of different processes and different film layers, the target material can be sprayed or welded onto the outer surface of the target tube 310, or the target tube 310 can be made of the same material as the target material and integrally formed.

[0057] In some embodiments, four target assembly mechanisms 300 are provided, each containing two twinned target tubes 310. It is understood that the number of target assembly mechanisms 300 can be increased or decreased, and their positions adjusted for coordinated use, as needed. The twinned target tubes 310 are two target tubes 310 that are completely symmetrical in structure, size, and function, and can work synchronously or independently, facilitating precise control of the material deposition amount and uniformity during sputtering. The layout of the four target assembly mechanisms 300 is typically based on a uniform circumferential distribution of the workpiece holder 200, such as arranging one target assembly mechanism 300 every 90°, forming a symmetrical sputtering environment for the workpiece 2000 to be coated, ensuring consistent particle flux received by the workpiece 2000 in all directions.

[0058] It is understood that the number of target group mechanisms 300 in the above embodiments can be flexibly adjusted according to actual process requirements.

[0059] In some embodiments, the drive adjustment mechanism includes a distance adjustment member, which is drivenly connected to the target tube 310. The distance adjustment member is used to drive the target tube 310 closer to or further away from the workpiece holder 200 to adjust the sputtering distance.

[0060] In some embodiments, a sliding mechanism is provided inside the vacuum coating chamber 100. One end of the sliding mechanism is close to the workpiece holder 200, and the other end extends away from the workpiece holder 200. The target assembly mechanism 300 is slidably connected to the sliding mechanism. The distance adjustment component includes a linear transmission mechanism, which can drive the target assembly mechanism 300 to move closer to or further away from the workpiece holder 200 along the sliding mechanism to adjust the sputtering distance.

[0061] Specifically, the sliding mechanism includes a slide rail disposed within the vacuum coating chamber 100, with the target tube 310 slidably connected to the slide rail. One end of the slide rail approaches the workpiece holder 200, and the other end moves away from the workpiece holder 200. Driven by the distance adjustment component, the target tube 310 is driven to slide infinitely on the slide rail, thereby achieving infinite adjustment of the sputtering distance.

[0062] In some embodiments, the workpiece holder 200 is disposed in the central region of the vacuum coating chamber 100, the target assembly mechanism 300 is disposed at the edge of the vacuum coating chamber 100, and the slide rail is disposed radially along the vacuum coating chamber 100.

[0063] In some embodiments, the drive adjustment mechanism further includes an angle adjustment member, which is drivenly connected to the magnetic core 320. The angle adjustment member can drive the magnetic core 320 to rotate within the target tube 310 to adjust the sputtering angle of the magnetic core 320 relative to the workpiece holder 200 and the magnetic field distribution.

[0064] Specifically, when the distance adjustment component is configured as a servo motor or linear motor, it is installed on the inner wall of the vacuum coating chamber 100. Its output end is connected to the target tube 310 through a transmission mechanism, such as a ball screw or linear guide rail, driving the target tube 310 to move linearly along the slide rail towards or away from the workpiece holder 200. The target tube 310 can achieve stepless sliding under the drive of the distance adjustment component via the slide rail. The sputtering distance can be continuously adjusted within a set range to meet the personalized needs of different materials and film thicknesses.

[0065] In some embodiments, a rotating shaft is rotatably connected inside the target tube 310, and the magnetic core 320 is mounted on the rotating shaft; the angle adjustment component includes a rotation transmission mechanism, which drives the magnetic core 320 to rotate around the axis of the rotating shaft to synchronously adjust the sputtering angle and the magnetic field distribution.

[0066] Specifically, the rotation axis of the rotating shaft is vertically set. When the angle adjustment component drives the magnetic core 320 to rotate, the magnetic core 320 can rotate to a side closer to the workpiece 2000 to be coated, or to a side away from the workpiece 2000 to be coated. It can be understood that by controlling the rotation angle of the magnetic core 320 through the angle adjustment component, the required angle adjustment of the workpiece 2000 to be coated can be precisely achieved. Through the angle adjustment component, the magnetic core 320 is driven to rotate around the vertical rotation axis within the target tube 310, thereby achieving dual adjustment of the sputtering angle and magnetic field distribution.

[0067] Specifically, when the angle adjustment mechanism is configured to operate as a stepper motor or servo motor, the magnetic core 320 can rotate clockwise or counterclockwise around its rotation axis within the target tube 310, causing one end to face or move away from the workpiece 2000 to be coated, thereby changing the spatial angular relationship between the magnetic core 320 and the workpiece 2000. By precisely controlling the rotation angle of the magnetic core 320 through the angle adjustment mechanism, optimal sputtering conditions can be dynamically matched for different shapes of the workpiece 2000 and film layer requirements.

[0068] In some embodiments, the magnetic core 320 has a scanning mode and a stationary mode. In the scanning mode, the angle adjustment member drives the magnetic core 320 to reciprocate within a preset range; in the stationary mode, the angle adjustment member drives the magnetic core 320 to remain stationary. In the scanning mode, the magnetic core 320 can perform a magnetic field scanning function.

[0069] Specifically, during the scanning process, the angle adjustment component drives the magnetic core 320 to reciprocate within a preset angle range, causing the magnetic field to periodically scan the target surface as the magnetic core 320 moves. This dynamic magnetic field distribution can homogenize the plasma density, avoid localized over-etching of the target material caused by a fixed magnetic field, and simultaneously cause the energy and incident angle of the sputtered particles to change regularly with the magnetic field scanning.

[0070] In the fixed operating condition, the angle adjustment component drives the magnetic core 320 to remain stationary. At this time, the magnetic field generated by the magnetic core 320 acts stably on a specific area of ​​the target surface, forming a fixed plasma distribution. In this mode, the ejection direction and energy distribution of sputtered particles are relatively constant, making it suitable for scenarios requiring a stable deposition rate.

[0071] See Figure 2 In some embodiments, the workpiece holder 200 is rotatably disposed in the vacuum coating chamber 100, and the coating equipment 1000 further includes a first driving member, which is drivenly connected to the workpiece holder 200 and drives the workpiece holder 200 to rotate. Specifically, the rotation axis of the workpiece holder 200 is vertically arranged, and the first driving member can drive the workpiece holder 200 to rotate.

[0072] With the above configuration, the workpiece holder 200 and the vacuum coating chamber 100 are assembled by a rotatable connection, allowing the workpiece holder 200 to rotate within the vacuum coating chamber 100, providing a dynamic support platform for the workpiece 2000 to be coated. The first drive component equipped in the coating equipment 1000 forms a drive connection with the workpiece holder 200. As a power source, the first drive component can transmit its own power to the workpiece holder 200, thereby driving the workpiece holder 200 to rotate. The rotation axis of the workpiece holder 200 is vertically set, so that the rotation of the workpiece holder 200 is around the vertical central axis. The function of the first driving component is to drive the workpiece holder 200 to rotate around this vertical axis. Through the rotation of the workpiece holder 200, the workpiece 2000 to be coated can rotate in the vacuum coating chamber 100, thereby uniformly receiving sputtered particles from the target assembly 300. This helps to improve the uniformity of film deposition on the surface of the workpiece 2000 to be coated, and avoids the problem of excessive or insufficient local deposition caused by the workpiece 2000 being stationary. This provides a basic motion guarantee for achieving high-quality coating.

[0073] See Figure 3In some embodiments, the workpiece holder 200 is provided with a plurality of workpiece turntables 210, which are rotatably connected to the workpiece holder 200. The workpiece turntables 210 are used to support the workpieces 2000 to be coated. The coating equipment 1000 also includes a second driving member, which is drivenly connected to the workpiece turntables 210 and drives the workpiece turntables 210 to rotate. The second driving member can drive the workpiece turntables 210 to rotate.

[0074] With the above configuration, the workpiece turntable 210 and the workpiece holder 200 are assembled via a rotatable connection, allowing the workpiece turntable 210 to rotate independently relative to the workpiece holder 200. The workpiece turntable 210 provides a placement carrier for the workpiece 2000 to be coated. The second driving component configured in the coating equipment 1000 forms a driving connection with the workpiece turntable 210, serving as the power source for the rotation of the workpiece turntable 210. The second driving component can transmit power to the workpiece turntable 210, thereby driving the workpiece turntable 210 to rotate. The second driving component can drive the workpiece turntable 210 to rotate around its own axis. Through the rotation of the workpiece turntable 210, the workpiece 2000 to be coated on it can change its orientation during the rotation process. In conjunction with the rotation of the workpiece holder 200 around its vertically set rotation axis, the various areas of the surface of the workpiece 2000 to be coated are more evenly exposed to the sputtered particle beam of the target group mechanism 300, which further improves the uniformity and consistency of the coating. It is especially suitable for the all-round coating needs of complex-shaped or multi-faceted workpieces 2000 to be coated, and effectively solves the problems of coating dead angles and poor uniformity caused by a single fixed bearing method.

[0075] In some embodiments, the rotation axis of the workpiece turntable 210 is vertically arranged, or the rotation axis of the workpiece turntable 210 forms an angle with the rotation axis of the workpiece holder 200. When the second driving member is activated, it drives the workpiece turntable 210 to rotate on the workpiece holder 200. The rotation axis of the workpiece turntable 210 can be arranged in two ways: one is vertically arranged, i.e., parallel to the rotation axis of the workpiece holder 200, such as both extending vertically; the other is that it forms a certain angle with the rotation axis of the workpiece holder 200. When the second driving member is activated, regardless of the arrangement of the axis of the workpiece turntable 210, it can be driven to rotate on the workpiece holder 200 around its own axis.

[0076] If the rotation axis is vertically set, the rotation direction of the workpiece turntable 210 is the same as that of the workpiece holder 200. If both are horizontal rotations, it is suitable for uniform coating of planar or symmetrical workpieces 2000 to be coated. If there is an angle between the rotation axis and the axis of the workpiece holder 200, the workpiece turntable 210 will form an inclined rotation trajectory when it rotates, which allows different angle areas on the surface of the workpiece 2000 to be coated to receive sputtered particles sequentially, which is especially suitable for curved, inclined, or irregularly shaped workpieces 2000 to be coated. Furthermore, in some embodiments, the angle between the rotation axis of the workpiece holder 200 and the rotation axis of the workpiece turntable 210 is adjustable. By adjusting the angle, the coating coverage of complex structures can be improved in a targeted manner, the deposition blind zone caused by parallel axes can be eliminated, and the uniformity of the film layer can be further improved.

[0077] With the above settings, the workpiece turntable 210 can achieve basic homogenization in the traditional parallel manner, and can also meet the personalized coating requirements of special structures by angular offset, thus expanding the equipment's adaptability to a variety of workpieces 2000 to be coated.

[0078] In some embodiments, the workpiece turntable 210 is radially arrayed around the rotation axis of the workpiece holder 200. When the first and second driving components are activated simultaneously, the workpiece turntable 210 can both rotate and revolve. Specifically, the workpiece turntable 210 can be evenly distributed in the circumferential space of the workpiece holder 200, making full use of the internal space of the vacuum coating chamber 100. When the first and second driving components are activated simultaneously, the workpiece turntable 210 will perform two movements simultaneously: rotation around its own axis and revolution around the rotation axis with the workpiece holder 200. This combined rotation and revolution motion mode allows the workpiece 2000 to be coated, supported on the workpiece turntable 210, to change the orientation of its surface through rotation and to perform circular motion within the circumferential space of the vacuum coating chamber 100 through revolution. Through this composite motion, each point on the surface of the workpiece 2000 to be coated will experience different sputtering angles and positions, avoiding the problems of deposition dead zones or local oversputtering that may occur in a single motion mode.

[0079] In some embodiments, the first driving element and the second driving element may be a combination of a servo motor and a transmission mechanism to achieve high-precision motion control.

[0080] In some embodiments, a plurality of target groups 300 are provided, which are distributed circumferentially and axially around the workpiece holder 200. Specifically, the workpiece 2000 to be coated is placed in the center of the vacuum coating chamber 100, and the plurality of target groups 300 surround the workpiece 2000. Not limited to 360° circumferential surrounding, they can also be arranged vertically on the workpiece 2000, i.e., on the top and bottom surfaces of the workpiece 2000. The circumferentially arranged target groups 300 can achieve uniform sputtering on the sides of the workpiece 2000, while the axially arranged target groups 300 can directly sputter on the top and bottom surfaces of the workpiece 2000, eliminating the coating blind spots caused by traditional single-sided or planar layouts. The plurality of target groups 300 form a three-dimensional distribution. With the multi-directional distribution of target groups 300, each surface of the workpiece 2000 to be coated can directly face the corresponding target group 300, ensuring that sputtered particles can be deposited onto the surface of the workpiece 2000 from different angles and directions. This is particularly suitable for the needs of three-dimensional structure workpieces 2000 or multilayer film deposition. This three-dimensional layout significantly improves the comprehensiveness and uniformity of the coating, avoiding the problems of insufficient local deposition or uneven thickness caused by the single-direction setting of the target group 300, and providing structural guarantee for achieving dead-angle-free coating of complex workpieces 2000.

[0081] In some embodiments, the coating apparatus 1000 further includes a shielding mechanism, which includes a shielding member and a shielding drive member. The shielding member is movably connected to the outside of the target material and has a shielding position and a non-shielding position. The shielding drive member is driven to switch the shielding member between the shielding position and the non-shielding position. With the above configuration, during coating, the shielding mechanism can be used to adjust and control online whether the target material needs shielding protection to avoid contamination by other target materials. That is, the target material in the target assembly mechanism 300 in this embodiment is not limited to using the same material, and multiple different target material materials can be used according to process requirements.

[0082] Specifically, the shielding component is a sheet or plate-like structure, movably mounted on the outside of the target material, such as at the opening at the front end of the target tube 310, and can switch between a shielded and unshielded position. A shielding drive, such as a pneumatic cylinder or electric push rod, drives the shielding component to completely cover the target surface, blocking the ejection path of sputtered particles. At this time, the target material stops participating in the coating process, preventing its particles from sputtering onto the workpiece 2000 or other target surfaces. The shielding drive then moves the shielding component away, fully exposing the target surface and allowing sputtered particles to eject normally. At this point, the target material is deposited onto the surface of the workpiece 2000 according to the process requirements.

[0083] Through the above settings, the target assembly 300 can be compatible with a variety of target materials, such as metals, ceramics, and polymers. It can achieve customized production of composite films through flexible shielding logic, while avoiding cross-contamination of particles from different materials and improving the purity and performance stability of the film composition.

[0084] In some embodiments, when coating is performed using the coating equipment in any of the above embodiments, the coating method includes:

[0085] Step S100: Provide a coating apparatus 1000 according to any of the above embodiments. The coating apparatus 1000 includes a vacuum coating chamber 100, a workpiece holder 200, a target assembly mechanism 300, and a drive adjustment mechanism. The workpiece holder 200 is disposed inside the vacuum coating chamber 100 and is used to support the workpiece 2000 to be coated. Multiple target assemblies 300 are disposed around the workpiece holder 200 inside the vacuum coating chamber 100. The target assemblies 300 are used to sputter coating material particles onto the surface of the workpiece 2000 to be coated. The drive adjustment mechanism is disposed on the target assembly mechanism 300 and is used to adjust the sputtering parameters of the target assembly mechanism 300. The sputtering parameters include sputtering distance, sputtering angle, and magnetic field distribution.

[0086] Step S200: Load the workpiece 2000 to be coated onto the workpiece holder 200;

[0087] Step S300: Start the coating equipment and control the sputtering distance, sputtering angle and magnetic field distribution of multiple target group mechanisms 300 through the drive adjustment mechanism, so that the sputtered particles of each target group mechanism 300 surrounding the workpiece holder 200 dynamically match the surface morphology of the workpiece 2000 to be coated in three-dimensional space, so as to achieve uniform coverage of sputtered particles on the surface of the workpiece 2000 to be coated.

[0088] In step S300, according to the film type, the target tube 310 is driven to move along the slide rail by the distance adjustment component to adjust the sputtering distance; the magnetic core 320 is rotated by the angle adjustment component to adjust the angle between the sputtering direction and the surface of the workpiece 2000 to be coated, and to adjust the sputtering angle and magnetic field distribution; the working mode of the magnetic core 320 is selected as either scanning mode or fixed mode; if multiple targets are involved in co-sputtering, the position of the shielding component is switched by the shielding drive component to ensure that the current working target is exposed and the other targets are closed to avoid cross-contamination.

[0089] In step S300, the first driving component and the second driving component work together to make the workpiece holder 200 drive the workpiece turntable 210 to perform a composite motion of rotation and revolution, ensuring that each area of ​​the surface of the workpiece 2000 to be coated receives sputtered particles uniformly; at the same time, the target group mechanism 300 is activated to achieve coating.

[0090] The coating method according to the embodiments of this application allows for precise control of the coating process, especially in the preparation of multilayer superimposed optical interference PVD films, which significantly improves the yield and performance consistency of high-end optical components. It is applicable to fields with stringent requirements for coating precision, such as semiconductors, precision optics, and high-end electronic displays.

[0091] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A coating equipment, characterized in that, include: Vacuum coating chamber; A workpiece holder, which is disposed in the vacuum coating chamber, is used to support the workpiece to be coated; A target assembly, comprising multiple target assemblies arranged around the workpiece holder within the vacuum coating chamber, wherein the target assemblies are used to sputter coating material particles onto the surface of the workpiece to be coated. A drive adjustment mechanism is disposed on the target assembly mechanism and is used to adjust the sputtering parameters of the target assembly mechanism, including sputtering distance, sputtering angle and magnetic field distribution; The drive adjustment mechanism coordinates the sputtering distance, sputtering angle, and magnetic field distribution of multiple target groups to dynamically match the surface morphology of the workpiece to be coated in three-dimensional space with the sputtered particles of each target group surrounding the workpiece holder, thereby achieving uniform coverage of sputtered particles on the surface of the workpiece to be coated.

2. The coating equipment according to claim 1, characterized in that, The target assembly mechanism includes: The target tube is movably connected to the vacuum coating chamber; The target material is disposed on the outer surface of the target tube and is used to provide coating material; A magnetic core, rotatably connected inside the target tube, is used to generate a magnetic field to control the trajectory of sputtered particles.

3. The coating equipment according to claim 2, characterized in that, The drive adjustment mechanism includes: A distance adjustment component is driven and connected to the target tube, and the distance adjustment component can drive the target tube to move closer to or further away from the workpiece holder to adjust the sputtering distance; An angle adjustment component is connected to the magnetic core drive and can drive the magnetic core to rotate inside the target tube to adjust the sputtering angle of the magnetic core relative to the workpiece holder and the magnetic field distribution.

4. The coating equipment according to claim 3, characterized in that, The vacuum coating chamber is provided with a sliding mechanism. One end of the sliding mechanism is close to the workpiece holder, and the other end extends away from the workpiece holder. The target assembly mechanism is slidably connected to the sliding mechanism. The distance adjustment component includes a linear transmission mechanism that drives the target assembly mechanism to move closer to or further away from the workpiece holder along the sliding mechanism to adjust the sputtering distance.

5. The coating equipment according to claim 3, characterized in that, A rotating shaft is rotatably connected inside the target tube, and the magnetic core is mounted on the rotating shaft; The angle adjustment component includes a rotary transmission mechanism that drives the magnetic core to rotate around the axis of the rotation shaft to synchronously adjust the sputtering angle and the magnetic field distribution.

6. The coating equipment according to claim 3, characterized in that, The magnetic core has both scanning and stationary operating conditions; During the scanning process, the angle adjustment component drives the magnetic core to reciprocate within a preset range. When the magnetic core is in the fixed working condition, the angle adjustment component drives the magnetic core to remain stationary.

7. The coating equipment according to claim 2, characterized in that, The coating equipment further includes a shielding mechanism, which comprises: A shielding member is movably connected to the outside of the target material, and the shielding member has a shielding position and a non-shielding position; A blocking drive is provided, which is driven to the blocking member, and drives the blocking member to switch between the blocking position and the non-blocking position.

8. The coating equipment according to claim 2, characterized in that, The target assembly is provided in four parts, and each target assembly is provided with two twin pairs of target tubes.

9. The coating equipment according to claim 1, characterized in that, The workpiece holder is rotatably mounted in the vacuum coating chamber. The coating equipment also includes a first driving component, which is droningly connected to the workpiece holder and drives the workpiece holder to rotate.

10. The coating equipment according to claim 1, characterized in that, The workpiece rack is provided with a plurality of workpiece turntables, which are rotatably connected to the workpiece rack. The workpiece turntables are used to carry the workpieces to be coated. The coating equipment also includes a second driving component, which is drivenly connected to the workpiece turntables and drives the workpiece turntables to rotate.

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