Ejection mechanism for wafer heating plate

Abstract

This utility model relates to the field of semiconductor component manufacturing technology, and particularly to an ejection mechanism for a wafer heating plate, comprising a heating plate, a base plate, a vertical plate, a sliding cylinder, a connecting plate, and support columns. The heating plate is positioned above the base plate, and the sliding cylinder is positioned below it. A central circle is located in the middle of the heating plate, where the wafer is placed. The center of the central circle is concentric with the center of a circular hole. The sliding cylinder is connected to the base plate via the vertical plate, and the vertical plate and base plate are connected by a locating pin. Three support columns are positioned above the connecting plate at the top of the sliding cylinder, with the tops of the columns inserted into through holes in the heating plate. This utility model uses ceramic support columns to lift the wafer from below. Ceramic material has excellent high-temperature resistance and minimal thermal deformation, improving the stability of the mechanism. The sliding cylinder is connected to the base plate and located away from the heating plate area, avoiding the impact of the high temperature of the heating plate on the performance of the sliding cylinder. A speed control valve controls the lifting speed of the support columns, improving the smoothness of the lifting process.

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