A type of iron substrate

Abstract

This utility model relates to the field of substrate technology, and in particular to a metal substrate, comprising a substrate body, an insulating layer on the top of the substrate body, a wiring layer bonded to the top of the insulating layer, and pads on the top of the wiring layer, on which chips are soldered. A mounting groove is formed at the bottom of the substrate body, and a heat pipe is installed inside the mounting groove. Both ends of the heat pipe extend out of the bottom of the substrate body and are connected to a heat sink. Several heat-conducting holes are formed at the top of the substrate body, and the bottom of each heat-conducting hole is connected to the mounting groove. This application utilizes the heat-conducting holes and thermally conductive silicone blocks to transfer the heat generated by the chip to the heat pipe. The cooling medium flowing inside the heat pipe absorbs the heat and transports it to the heat sink for cooling. The cooled medium then flows back from the heat sink to the heat pipe, circulating heat to cool the chip, resulting in rapid heat dissipation and improved heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of carrier plate technology, and in particular to an iron substrate. Background Technology

[0002] Iron substrate is a type of metal-based copper clad laminate, which is composed of three layers of composite material: a circuit layer, a thermally conductive and insulating layer, and a metal base layer.

[0003] In existing iron-based substrates, the heat generated by the chip during operation is typically dissipated through the copper metal on the circuit layer and through the thermally conductive insulating layer to the metal substrate. This process is slow and ineffective. Furthermore, the iron-based substrate is generally a single plate structure, exposing its edges to the external environment. This makes the edges susceptible to damage from impacts, or the thermally conductive insulating layer and wiring layers on the metal substrate may be damaged by impacts, causing the edges to warp. Therefore, we propose a new iron-based substrate. Utility Model Content

[0004] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing a new type of iron substrate.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a metal substrate is designed, including a substrate body, an insulating layer is provided on the top of the substrate body, and a wiring layer is bonded to the top of the insulating layer, a solder pad is provided on the top of the wiring layer, and a chip is soldered on the solder pad.

[0006] A mounting groove is provided at the bottom of the substrate body, and a heat pipe is provided inside the mounting groove. Both ends of the heat pipe extend out of the bottom of the substrate body and are connected to the heat sink.

[0007] The top of the substrate body has several heat conduction holes, the bottom of each heat conduction hole is connected to the mounting groove, and the top of each heat conduction hole penetrates the insulating layer, the wiring layer and the solder pad.

[0008] A first guard edge and a second guard edge are symmetrically provided on the edge of the substrate body. The edges of the adjacent surfaces of the first guard edge and the second guard edge are both curved and their adjacent ends abut each other. When the adjacent ends of the first guard edge and the second guard edge abut each other, a groove is formed between the first guard edge and the second guard edge, and the edge of the substrate body is located in the groove.

[0009] Preferably, the heat pipe is arranged in an "S" shape.

[0010] Preferably, the heat pipe is made of aluminum alloy or copper.

[0011] Preferably, the edge of the first guard edge extends to form a first perimeter, and the edge of the second guard edge extends to form a second perimeter, with the first perimeter overlapping the second perimeter.

[0012] Preferably, the top of the first perimeter has several mounting holes, each with a fixing bolt inside; the top of the second perimeter has several threaded through holes, the bottom end of each fixing bolt extends into the corresponding threaded through hole, and each fixing bolt is threadedly connected to the threaded through hole.

[0013] Preferably, each heat-conducting hole is filled with a heat-conducting silicone block, and the bottom of each heat-conducting silicone block is in contact with the side of the heat-conducting pipe.

[0014] Preferably, the outer surface of the substrate body is provided with an anti-rust coating.

[0015] Preferably, a receiving groove is provided on one side of the adjacent surface of the first and second perimeters, and one end of the heat-conducting pipe passes through the corresponding receiving groove.

[0016] The design scheme proposed in this utility model has the following beneficial effects in application:

[0017] 1. The heat generated by the chip during operation can be transferred to the heat pipe through the heat-conducting holes and thermal silicone blocks. The cooling medium flowing in the heat pipe can absorb the heat and transfer it to the heat sink for cooling. After cooling, the cooling medium flows back from the heat sink to the heat pipe, thus circulating heat to the chip. The heat dissipation speed is fast and the heat dissipation effect is improved.

[0018] 2. The first and second protective edges can shield the edges of the substrate body, thus protecting the edges of the substrate body. At the same time, the edges of the insulating layer and wiring layer on the substrate body will not lift up, improving the protection effect. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a side view of the structure of the first and second edge guards of this utility model;

[0021] Figure 3 This is a schematic diagram of the bottom structure of the substrate body of this utility model;

[0022] Figure 4 This is a side cross-sectional view of the substrate body structure of this utility model.

[0023] In the figure: 1. Substrate body; 2. First edge protector; 3. First perimeter edge; 4. Second perimeter edge; 5. Second edge protector; 6. Heat pipe; 7. Receiving groove; 8. Threaded through hole; 9. Mounting hole; 10. Fixing bolt; 11. Solder pad; 12. Heat-conducting hole; 13. Mounting groove; 14. Thermal conductive silicone block; 15. Insulating layer; 16. Wiring layer. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0025] Reference Figures 1-4 A type of iron substrate includes a substrate body 1, an insulating layer 15 is provided on the top of the substrate body 1, and a wiring layer 16 is bonded to the top of the insulating layer 15. A pad 11 is provided on the top of the wiring layer 16, and a chip is soldered on the pad 11.

[0026] like Figure 1 and Figure 4 As shown, the top of the substrate body 1 is provided with a number of heat conduction holes 12. The bottom of each heat conduction hole 12 is connected to the mounting groove 13, and the top of each heat conduction hole 12 penetrates the insulating layer 15, the wiring layer 16 and the pad 11. The heat generated by the chip during operation can be transferred to the bottom of the substrate body 1 through the heat conduction holes 12 for vertical heat dissipation.

[0027] like Figure 4 As shown, each heat-conducting hole 12 is filled with a heat-conducting silicone block 14. The bottom of each heat-conducting silicone block 14 is in contact with the side of the heat-conducting pipe 6. The heat-conducting silicone block 14 can accelerate the heat transfer efficiency of the chip, so that the heat generated by the chip can be quickly transferred to the bottom of the substrate body 1 through the heat-conducting hole 12.

[0028] like Figure 3 and Figure 4 As shown, a mounting groove 13 is provided at the bottom of the substrate body 1. A heat pipe 6 is provided inside the mounting groove 13. Both ends of the heat pipe 6 extend out of the bottom of the substrate body 1 and are connected to the heat sink. In actual use, the heat-conducting hole 12 transfers the heat generated by the chip to the heat pipe 6. The cooling medium in the heat pipe 6 expands when heated and absorbs the heat generated by the chip. Then the cooling medium is transported to the heat sink for cooling. After cooling, it flows back to the heat pipe 6 for circulating heat dissipation, which can achieve rapid heat dissipation.

[0029] It should be noted that, as Figure 3 As shown, the heat pipe 6 is arranged in an "S" shape. The heat pipe 6 is made of aluminum alloy or copper, which increases the contact area between the heat pipe 6 and the heat conduction hole 12, thereby improving the heat conduction efficiency.

[0030] It should be noted that the cooling medium inside the heat pipe 6 is either coolant or air.

[0031] like Figure 1 and Figure 2As shown, a first protective edge 2 and a second protective edge 5 are symmetrically provided on the edge of the substrate body 1. The edges of the adjacent surfaces of the first protective edge 2 and the second protective edge 5 are both curved and their adjacent ends abut each other. When the adjacent ends of the first protective edge 2 and the second protective edge 5 abut each other, a groove is formed between the first protective edge 2 and the second protective edge 5. The edge of the substrate body 1 is located in the groove. Through the cooperation of the first protective edge 2 and the second protective edge 5, the edge of the substrate body 1 can be blocked. In this way, the edge of the substrate body 1 will not be damaged by collision with external objects, thus improving the protection effect.

[0032] like Figure 1 and Figure 2 As shown, the edge of the first guard 2 extends to form a first perimeter 3, and the edge of the second guard 5 extends to form a second perimeter 4. The first perimeter 3 is stacked on the second perimeter 4. The top of the first perimeter 3 has several mounting holes 9, and each mounting hole 9 has a fixing bolt 10 inside. The top of the second perimeter 4 has several threaded through holes 8, and the bottom end of each fixing bolt 10 extends into the corresponding threaded through hole 8. Each fixing bolt 10 is threadedly connected to the threaded through hole 8. Through the cooperation of the fixing bolt 10 and the threaded through hole 8, the first perimeter 3 and the second perimeter 4 can be fixed together, thereby fixing the first guard 2 and the second guard 5 together, covering the edge of the substrate body 1, and ensuring a stable installation.

[0033] Specifically, in the installation process of this utility model, the chip is soldered onto the pad 11, and then other components are installed in the preset positions on the wiring layer 16. After that, the operator places the substrate body 1 inside the second guard 5, and then covers the top of the second guard 5 with the first guard 2, so that the mounting hole 9 is aligned with the threaded through hole 8. At this time, the first guard 2 and the second guard 5 can cover the edge of the substrate body 1. Then, the operator passes one end of the fixing bolt 10 through the mounting hole 9 and screws it into the corresponding threaded through hole 8 to fix the first guard 2 and the second guard 5 together. This fixes the first guard 2 and the second guard 5 to the edge of the substrate body 1, thus protecting the substrate body 1 and improving the protection effect.

[0034] During use, the heat generated by the chip is transferred to the heat pipe 6 through the thermally conductive silicone block 14 in the thermally conductive hole 12. The cooling medium in the heat pipe 6 can absorb the heat transferred to the heat pipe 6 through the thermally conductive silicone block 14 and transport it to the external heat sink for cooling. Afterward, the cooling medium flows back into the heat pipe 6 to circulate and dissipate the heat generated by the chip, thereby improving the heat dissipation effect.

[0035] Furthermore, the outer surface of the substrate body 1 is provided with an anti-rust coating, which can be polyurethane paint or other paints with insulating and antioxidant properties. This prevents the substrate body 1 from being oxidized and corroded by external oxygen, thus improving its performance.

[0036] Furthermore, a receiving groove 7 is provided on the adjacent side of the first perimeter 3 and the second perimeter 4, and one end of the heat pipe 6 passes through the corresponding receiving groove 7. In this way, when the first protective edge 2 and the second protective edge 5 are fixed on the edge of the substrate body 1, both ends of the heat pipe 6 can pass through the receiving groove 7, so that the first protective edge 2 and the second protective edge 5 will not hinder the connection between the heat pipe 6 and the heat sink.

[0037] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A type of iron substrate, comprising a substrate body (1), characterized in that: An insulating layer (15) is provided on the top of the substrate body (1), and a wiring layer (16) is bonded to the top of the insulating layer (15). A pad (11) is provided on the top of the wiring layer (16), and a chip is soldered on the pad (11). The bottom of the substrate body (1) is provided with a mounting groove (13), and a heat pipe (6) is provided inside the mounting groove (13). Both ends of the heat pipe (6) extend out of the bottom of the substrate body (1), and both ends of the heat pipe (6) are connected to the heat sink. The top of the substrate body (1) is provided with several heat conduction holes (12), the bottom of each heat conduction hole (12) is connected to the mounting groove (13), and the top of each heat conduction hole (12) penetrates the insulating layer (15), the wiring layer (16) and the pad (11). A first guard edge (2) and a second guard edge (5) are symmetrically provided on the edge of the substrate body (1). The edges of the adjacent surfaces of the first guard edge (2) and the second guard edge (5) are bent and their adjacent ends abut each other. When the adjacent ends of the first guard edge (2) and the second guard edge (5) abut each other, a groove is formed between the first guard edge (2) and the second guard edge (5), and the edge of the substrate body (1) is located in the groove.

2. The iron substrate according to claim 1, characterized in that: The heat pipe (6) is set in an "S" shape.

3. The iron substrate according to claim 2, characterized in that: The heat pipe (6) is made of aluminum alloy or copper.

4. The iron substrate according to claim 1, characterized in that: The edge of the first guard (2) extends to provide a first perimeter (3), and the edge of the second guard (5) extends to provide a second perimeter (4). The first perimeter (3) is stacked on the second perimeter (4).

5. The iron substrate according to claim 4, characterized in that: The top of the first perimeter (3) is provided with several mounting holes (9), and each mounting hole (9) is provided with a fixing bolt (10). The top of the second perimeter (4) is provided with several threaded through holes (8), and the bottom end of each fixing bolt (10) extends into the corresponding threaded through hole (8), and each fixing bolt (10) is threadedly connected to the threaded through hole (8).

6. The iron substrate according to claim 1, characterized in that: Each heat-conducting hole (12) is filled with a heat-conducting silicone block (14), and the bottom of each heat-conducting silicone block (14) is in contact with the side of the heat-conducting pipe (6).

7. The iron substrate according to claim 1, characterized in that: The outer surface of the substrate body (1) is provided with an anti-rust coating.

8. The iron substrate according to claim 1, characterized in that: A receiving groove (7) is provided on one side of the first perimeter (3) and the second perimeter (4), and one end of the heat pipe (6) passes through the corresponding receiving groove (7).

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