A three-dimensional interconnection honeycomb circuit board structure

Abstract

The utility model provides a kind of interlayer three-dimensional interconnection's honeycomb circuit board structure, including shell, plate body, film key, the inside fixedly connected with plate body of shell, the plate body is multilayer, the top of shell is fixedly connected with several film keys;Several wire bands are installed on the plate body, and the front end of wire band is fixedly connected with via hole;The plate body is successively top layer, interlayer, middle layer, interlayer and bottom layer from top to bottom.The utility model has the advantages that: by drilling and copper plating process, create multiple "step" shaped connection point.A hole can connect top layer ruling line to middle layer, different depth position of same hole connects top layer, middle layer to bottom layer, realize three-dimensional vertical interconnection.Interlayer is reinforced, the wall of honeycomb hole can be used for vertical support, interlayer provides lightweight structure support, and allows via hole to pass through, form three-dimensional interconnection channel.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a honeycomb circuit board structure with three-dimensional interconnection between layers. Background Technology

[0002] In modern electronic devices, especially high-density, high-performance, and space-constrained devices (such as industrial controllers, portable medical instruments, and aerospace electronic equipment), the circuit board (PCB) serves as the core carrier, facing increasingly stringent requirements for space utilization, structural strength, signal integrity, and thermal management. While traditional multilayer PCB technology has achieved a certain degree of integration improvement by increasing the number of layers, significant bottlenecks remain in terms of interlayer interconnect density, structural stability, and lightweight design.

[0003] Vertical interconnects are inefficient and wasteful of space: Traditional multilayer PCBs rely on numerous vias to connect different layers. Each via typically only achieves a single-point connection (such as connecting the top layer to the bottom layer). To connect intermediate layers, additional drilling or buried / blind vias are required, resulting in low wiring density, large via footprint, and limited component layout flexibility. Furthermore, the "via piling" effect created by dense vias increases board thickness, occupies valuable Z-axis space, and hinders further miniaturization of devices.

[0004] Interlayer stress and potential structural reliability issues:

[0005] Under thermal cycling (such as welding, ambient temperature changes) or mechanical shock, the difference in the coefficient of thermal expansion (CTE) of different material layers (such as FR-4 dielectric layer, copper foil conductor layer, and metal substrate) in multilayer boards can lead to interlayer shear stress. Long-term stress accumulation can easily cause interlayer microcracks, copper wire breakage, or solder joint failure, especially when the board thickness increases or when it contains a high-power metal substrate (such as an aluminum substrate). While conventional interlayer fillers (such as prepreg) have adhesive properties, their effectiveness in releasing CTE mismatch stress and providing structural support is limited. Therefore, a honeycomb circuit board structure with three-dimensional interlayer interconnection is proposed to address these issues. Utility Model Content

[0006] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0007] Therefore, one objective of this utility model is to propose a honeycomb circuit board structure with interlayer three-dimensional interconnection to solve the problems mentioned in the background art and overcome the shortcomings of the existing technology.

[0008] To achieve the above objectives, one embodiment of the present invention provides a honeycomb circuit board structure with interlayer three-dimensional interconnection, including a shell, a board body, and membrane buttons. The board body is fixedly connected inside the shell, and the board body is multi-layered. Several membrane buttons are fixedly connected to the top of the shell.

[0009] Several wire strips are installed on the plate, and the front end of each wire strip is fixedly connected to a through hole.

[0010] The plate consists of a top layer, a middle layer, another middle layer, and a bottom layer from top to bottom. The top layer, middle layer, middle layer, and bottom layer are pressed together. The middle layer is a honeycomb layer with a number of honeycomb holes.

[0011] The via passes through the top layer, the interlayer, the middle layer and then directly to the bottom layer. The inside of the via is stepped, and the via is interconnected with the middle layer and the bottom layer at the steps.

[0012] Preferably, of any of the above solutions, the outer shell is made of plastic, and the plate is bonded to the outer shell with adhesive.

[0013] The above technical solution is adopted: The main body of this circuit board is a board, and an outer shell is installed on the outside of the board. The top of the outer shell has several membrane buttons.

[0014] The board consists of a top layer, a middle layer, another middle layer, and a bottom layer, arranged from top to bottom. Multiple "step-like" connection points are created inside the vias through drilling and copper plating. A single hole connects the top layer to the middle layer, and different depths of the same hole connect the top, middle, and bottom layers, achieving three-dimensional vertical interconnection.

[0015] Interlayer reinforcement is used, the walls of the honeycomb cells can be used for vertical support, the interlayer provides lightweight structural support and allows through-holes to pass through, forming a three-dimensional interconnected channel.

[0016] Preferably, the material of the strip is copper foil, and the top layer is a composite layer of FR-4 and a conductive coating.

[0017] This device includes: Housing: A molded plastic housing providing mechanical protection and external interface mounting positions. Board: A multi-layer composite circuit board fixed to the inner cavity of the housing with adhesive. Membrane Keys: An array distributed on the top of the housing, electrically connected to the board. Signal Transmission Strip: A signal transmission strip formed by copper foil etching, with integrated vias at the front end.

[0018] Board Structure: Top Layer: FR-4 substrate and conductive coating composite layer, with integrated wire strips and membrane key contacts. Middle Layer: Polyimide honeycomb layer, thinner than the top layer, with hexagonal honeycomb holes. Aluminum-based power layer, providing high-current channels and heat conduction. Second Layer: Symmetrically arranged second polyimide honeycomb layer. Bottom Layer: FR-4 substrate signal layer, processing high-speed logic signals.

[0019] Each layer is solidified through a hot-pressing process, and honeycomb holes penetrate the interlayer to form a three-dimensional support network.

[0020] Preferably, in any of the above embodiments, the thickness of the interlayer is less than the thickness of the top layer, and the material of the interlayer is polyimide.

[0021] Preferably, in any of the above embodiments, the middle layer is a power supply layer, and the substrate of the middle layer is an aluminum base.

[0022] Preferably, in any of the above schemes, the bottom layer is a signal layer, and the substrate of the bottom layer is FR-4.

[0023] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0024] This honeycomb circuit board structure features three-dimensional interconnection between layers. From top to bottom, the board consists of a top layer, a middle layer, another middle layer, and a bottom layer. Multiple "step-like" connection points are created within the vias through drilling and copper plating. A single hole can connect the top layer to the middle layer, and different depths of the same hole can connect the top, middle, and bottom layers, achieving three-dimensional vertical interconnection and enabling further miniaturization of the board.

[0025] The interlayer is reinforced with a sandwich structure, and the walls of the honeycomb cells can be used for vertical support. The sandwich structure provides lightweight structural support, is stable, and allows through-holes to pass through, forming a three-dimensional interconnected channel.

[0026] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0027] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0028] Figure 1 This is a first-view structural schematic diagram of the present invention;

[0029] Figure 2 This is a structural schematic diagram of the present invention from a second perspective;

[0030] Figure 3 This is a schematic diagram of the sandwich structure of this utility model;

[0031] Figure 4 This is a schematic diagram of the layer structure of this utility model.

[0032] In the diagram: 1-outer shell, 2-board body, 3-membrane button, 4-wire strip, 5-via, 6-top layer, 7-interlayer, 8-middle layer, 9-bottom layer, 10-honeycomb hole. Detailed Implementation

[0033] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0034] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0035] like Figure 1-4 As shown, the honeycomb circuit board structure with three-dimensional interconnection between layers includes a shell 1, a board 2, and membrane buttons 3. The board 2 is fixedly connected inside the shell 1. The board 2 is multi-layered. Several membrane buttons 3 are fixedly connected to the top of the shell 1.

[0036] Several wire strips 4 are installed on the plate 2, and the front end of the wire strips 4 is fixedly connected to the through hole 5;

[0037] The plate 2 consists of a top layer 6, a middle layer 7, a middle layer 8, a middle layer 7, and a bottom layer 9 from top to bottom. The top layer 6, the middle layer 7, the middle layer 8, the middle layer 7, and the bottom layer 9 are pressed together. The middle layer 7 is a honeycomb layer, and several honeycomb holes 10 are opened on the middle layer 7.

[0038] Via 5 passes through the top layer 6, the interlayer 7, the middle layer 8, and then directly to the bottom layer 9. The interior of via 5 is stepped, and via 5 is interconnected with the middle layer 8 and the bottom layer 9 at the steps.

[0039] Example 1: The outer casing 1 is made of plastic, and the board 2 is bonded to the outer casing 1 with adhesive. The cable strip 4 is made of copper foil, and the top layer 6 is specifically a composite layer of FR-4 and a conductive coating. The thickness of the interlayer 7 is less than that of the top layer 6, and the interlayer 7 is made of polyimide. The middle layer 8 is specifically a power layer, and the substrate of the middle layer 8 is aluminum. The bottom layer 9 is a signal layer, and the substrate of the bottom layer 9 is FR-4.

[0040] Example 2: This circuit board structure consists of a main board 2, with an outer shell 1 mounted on the outside of the main board 2. The top of the outer shell 1 contains several membrane buttons. The device includes: Outer shell 1: A molded plastic housing providing mechanical protection and external interface mounting positions. Main board 2: A multilayer composite circuit board fixed to the inner cavity of the outer shell 1 with adhesive. Membrane buttons 3: Arrayed on the top of the outer shell 1, electrically connected to the main board 2. Cable strip 4: A signal transmission strip formed by copper foil etching, with a via 5 integrated at the front end.

[0041] Board 2 Structure: Top Layer 6: FR-4 substrate and conductive coating composite layer, with integrated wire strip 4 and membrane key 3 contacts on the surface. Middle Layer 7: Polyimide honeycomb layer, less thick than the top layer 6, with hexagonal honeycomb holes 10. Middle Layer 8: Aluminum-based power layer, providing high current channels and heat conduction. Secondary Layer 7: Symmetrically arranged second polyimide honeycomb layer. Bottom Layer 9: FR-4 substrate signal layer, processing high-speed logic signals.

[0042] Each layer is solidified by hot pressing, and the honeycomb holes 10 penetrate the interlayer 7 to form a three-dimensional support network.

[0043] The working principle of this utility model is as follows:

[0044] This device works in conjunction with cellular mechanical enhancement through a three-dimensional interconnected channel:

[0045] Signal transmission process: The user presses the membrane button 3 → triggers a change in the capacitance of the top conductive coating 6 → the signal is transmitted to the via 5 via the cable strip 4.

[0046] Stepped via 5 interconnect path:

[0047]

[0048] Signals can be transmitted across layers in the vertical direction, reducing the path length by 40% (compared to traditional through-holes).

[0049] The honeycomb structure provides functional and mechanical support: the walls of the honeycomb cells 10 in layer 7 withstand interlaminar shear stress, increasing flexural strength by 35%.

[0050] Enhanced heat dissipation: Heat from the aluminum-based middle layer 8 → diffuses through the honeycomb pores 10 wall → to the polyimide interlayer 7;

[0051] Lightweighting: The honeycomb holes 10 reduce the density of the sandwich layer 7, resulting in a decrease in the overall board weight.

[0052] Dynamic operating characteristics, under high frequency conditions (>1GHz): Stepped vias 5 reduce impedance abrupt changes, signal reflection attenuation is 12dB, and the honeycomb via structure suppresses interlayer resonance and improves electromagnetic compatibility.

[0053] Example 3: Stepped hole machining: Drilling is performed in three stages using a UV laser (to depths of 8 for the middle layer and 9 for the bottom layer respectively);

[0054] Pulse electroplating copper: Forms a uniform copper layer of 15μm at the edge of the step;

[0055] Cellular layer integration: Polyimide interlayer 7 pre-punched cell 10 (cell diameter 0.3mm).

[0056] Compared with the prior art, the present invention has the following advantages:

[0057] This honeycomb circuit board structure with three-dimensional interconnection between layers consists of board 2, which, from top to bottom, comprises a top layer 6, a middle layer 7, a middle layer 8, another middle layer 7, and a bottom layer 9. Multiple "step-like" connection points are created inside vias 5 through drilling and copper plating. A single via can connect the top layer 6 to the middle layer 8, and different depths of the same via connect the top layer 6, middle layer 8, and bottom layer 9, achieving three-dimensional vertical interconnection and enabling more miniaturized boards.

[0058] The interlayer is reinforced with a sandwich layer 7, and the walls of the honeycomb holes 10 can be used for vertical support, providing stable support. The sandwich layer 7 provides lightweight structural support and allows the through holes 5 to pass through, forming a three-dimensional interconnected channel.

Claims

1. A honeycomb circuit board structure with interlayer three-dimensional interconnection, characterized in that, It includes a shell (1), a plate (2), and membrane buttons (3). The plate (2) is fixedly connected inside the shell (1). The plate (2) is multi-layered. Several membrane buttons (3) are fixedly connected to the top of the shell (1). A plurality of wire strips (4) are installed on the plate (2), and the front end of the wire strips (4) is fixedly connected to a through hole (5); The plate (2) consists of a top layer (6), a sandwich layer (7), a middle layer (8), a sandwich layer (7) and a bottom layer (9) from top to bottom. The top layer (6), the sandwich layer (7), the middle layer (8), the sandwich layer (7) and the bottom layer (9) are pressed together. The sandwich layer (7) is a honeycomb layer and has a number of honeycomb holes (10) on it. The via (5) passes through the top layer (6), the interlayer (7), the middle layer (8) and then directly to the bottom layer (9). The inside of the via (5) is stepped, and the via (5) is interconnected with the middle layer (8) and the bottom layer (9) at the steps.

2. The honeycomb circuit board structure with interlayer three-dimensional interconnection as described in claim 1, characterized in that: The outer shell (1) is made of plastic, and the plate (2) is bonded to the outer shell (1) with adhesive.

3. The honeycomb circuit board structure with interlayer three-dimensional interconnection as described in claim 2, characterized in that: The material of the strip (4) is copper foil, and the top layer (6) is specifically a composite layer of FR-4 and conductive coating.

4. The honeycomb circuit board structure with interlayer three-dimensional interconnection as described in claim 3, characterized in that: The thickness of the interlayer (7) is less than the thickness of the top layer (6), and the material of the interlayer (7) is polyimide.

5. The honeycomb circuit board structure with interlayer three-dimensional interconnection as described in claim 4, characterized in that: The middle layer (8) is specifically a power supply layer, and the substrate of the middle layer (8) is aluminum.

6. The honeycomb circuit board structure with interlayer three-dimensional interconnection as described in claim 5, characterized in that: The bottom layer (9) is a signal layer, and the substrate of the bottom layer (9) is FR-4.

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