Matrix superconducting heat pipe radiator

Abstract

This utility model relates to a matrix-type superconducting heat pipe radiator, including gravity heat pipes and sunflower-shaped heat sinks. Multiple gravity heat pipes are vertically arranged, with their lower ends concentrated on a substrate. Each gravity heat pipe is attached to a heat-generating device. Multiple sunflower-shaped heat sinks are spaced apart from bottom to top on each gravity heat pipe. Various capillary guiding structures are provided on the inner wall of the gravity heat pipes. The beneficial effects achieved by this utility model are: more stable heat dissipation quality control, improved heat dissipation effect, and stable and reliable structure.

Description

Technical Field

[0001] This utility model relates to the technical field of heat pipe radiators, and in particular to matrix superconducting heat pipe radiators. Background Technology

[0002] Of the three modes of heat transfer (radiation, convection, and conduction), heat conduction is the fastest, and heat pipes are a practical example of heat conduction.

[0003] A heat pipe utilizes the principles of heat conduction and the rapid heat transfer properties of a phase change medium to quickly transfer heat from a heat-generating object to the outside of the heat source. Its thermal conductivity exceeds that of any known metal. A heat pipe employs evaporative cooling, using the temperature difference between its two ends to facilitate rapid heat transfer. The inside of the heat pipe is evaporated into a negative pressure state and filled with a suitable liquid with a low boiling point and easy evaporation. The pipe wall has a wick composed of a capillary porous material. The principle is as follows: one end of the heat pipe is the evaporator, and the other end is the condenser. When the evaporator end of the heat pipe is heated, the liquid in the capillary rapidly evaporates. The vapor flows to the condenser end under a small pressure difference, releasing heat, and then condenses back into liquid. The liquid then flows back to the evaporator end along the porous material due to capillary force, and this cycle continues, transferring heat from the evaporator end to the condenser end.

[0004] Therefore, due to the excellent thermal conductivity of heat pipes, they are often used in the field of heat sinks. However, the existing heat pipe heat sinks have a simple structure and are still in the rudimentary form of the original heat pipe heat sink. In particular, they cannot be applied to high-power heat dissipation applications, which affects their ability to dissipate heat in a timely manner through conduction and convection, resulting in poor heat dissipation performance and failure to meet heat dissipation requirements. In addition, the heat dissipation efficiency of traditional heat pipes has not been significantly improved, and their quality is very uncontrollable.

[0005] Therefore, based on the demand for high-power heat sinks, our company has designed a matrix-type superconducting heat pipe heat sink. Utility Model Content

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a matrix-type superconducting heat pipe radiator, which solves the problems of uncontrollable quality and unsatisfactory heat dissipation effect in existing radiators.

[0007] The purpose of this utility model is achieved through the following technical solution: a matrix-type superconducting heat pipe radiator, including gravity heat pipes and sunflower heat sinks;

[0008] Multiple gravity heat pipes are vertically arranged, with the lower ends of each gravity heat pipe concentrated on the substrate, and each gravity heat pipe is attached to the heating device.

[0009] On each of the gravity heat pipes, multiple sunflower-shaped heat sinks are arranged at intervals from bottom to top;

[0010] The gravity heat pipe comprises a copper tube and a layer of copper powder particles. The copper powder particle layer consists of copper powder particles, metal particles with a melting point lower than copper, and polystyrene particles, which are fixed to the inner wall of the copper tube by sintering. When the copper powder particles are sintered and fixed to the inner wall of the copper tube, gaps are formed between the copper powder particles. These gaps, when connected, form capillary channels—that is, the first capillary guiding structure.

[0011] As a preferred technical solution of this application, a second capillary guiding structure is also included; the second capillary guiding structure includes multiple copper wires, the multiple thick copper wires being arranged circumferentially on the inner wall of the copper tube, and a recessed groove A is formed on the cylindrical surface of the thick copper wires from one end to the other. When the thick copper wires are arranged on the inner wall of the copper tube and the copper powder particles are sintered and fixed on the inner wall of the copper tube, the recessed groove A can form a capillary channel—that is, the second capillary guiding structure.

[0012] As a preferred technical solution of this application, it also includes a third capillary guiding structure; a plurality of recessed grooves B are circumferentially formed on the inner wall of the copper tube from one end to the other. When copper powder particles are sintered and fixed on the inner wall of the copper tube, the recessed grooves B can form capillary channels—that is, the third capillary guiding structure.

[0013] As a preferred technical solution of this application, the sunflower heat sink includes a central tube section, and multiple heat-conducting plates are arranged radially on the cylindrical surface of the central tube section, with heat-conducting fins provided on the heat-conducting plates.

[0014] The central pipe section, heat-conducting plate, and heat-conducting fins are integrally formed.

[0015] As a preferred technical solution of this application, the lower end of the gravity heat pipe is curved, and each gravity heat pipe is centrally arranged on the substrate by means of bending.

[0016] As a preferred technical solution of this application, the heat sink has multiple heat dissipation units; each heat dissipation unit includes multiple gravity heat pipes and two substrates, with corresponding sunflower-shaped heat sinks disposed on the gravity heat pipes; the two substrates are arranged opposite each other, and multiple semi-circular recessed grooves C are formed on the opposite surfaces of the substrates; the lower ends of the multiple gravity heat pipes are clamped by the two substrates and locked with small bolts, so that the lower ends of each gravity heat pipe are pressed into the corresponding recessed grooves C one by one. A heat dissipation unit is disposed on each of the left and right sides of the heating device, and the substrate is attached to the outer surface of the heating device to form a fitted heat dissipation structure. Clamping plates are disposed on the outer sides of the two heat dissipation units, and the left and right clamping plates are connected by large bolts, with the large bolts passing through the substrates, forming a structure in which the heating device is clamped and locked by the two heat dissipation units. An elastic element is also disposed between the clamping plates and the heating device to form a structure in which the heating device is elastically fixed.

[0017] Furthermore, the sunflower-shaped heat sink has mounting holes A along the parallel axial direction and mounting holes B along the radial direction. The sunflower-shaped heat sinks on a single gravity heat pipe are connected by connecting rods passing through mounting holes A, forming a stable structure. Sunflower-shaped heat sinks at the same height on different gravity heat pipes are fixedly connected to mounting holes B by screws via connecting blocks, forming a stable structure.

[0018] It should be noted that:

[0019] In existing related technologies, when heat pipes are manufactured: a) Copper tubes with good thermal conductivity are usually selected, and irregular copper powder particles of a certain particle size (usually 50-200 μm) and metal particles with a melting point lower than copper are loaded into the copper tubes. Polyvinyl alcohol (a bonding agent) is also injected into the copper tubes; b) The copper tubes are then placed vertically and rotated. Under the action of centrifugal force, the copper powder and metal particles with a melting point lower than copper adhere to the wall of the copper tubes; c) Sintering is then carried out in a vacuum sintering furnace. During the sintering process, the metal particles with a melting point lower than copper melt to a certain extent, thus adhering the copper powder particles to each other and to the inner wall of the copper tubes. The copper powder does not melt during the sintering process, and the polyvinyl alcohol is decomposed into water and carbon dioxide and volatilizes; d) After cooling, the copper powder particles adhere to the inner wall of the copper tubes, and there are tiny gaps between the copper powder particles; e) The copper tubes are then evacuated, injected with water, and then sealed.

[0020] However, the problem is that the prepared heat pipe cannot guarantee the existence of gaps between the copper powder particles (they may be blocked by metal particles with a melting point lower than copper). This means that the gaps between the copper powder adhering to the inner wall of the copper pipe may be blocked. Consequently, the condensed water cannot effectively flow capillarily through these gaps. (When a heat pipe is used in a radiator for actual cooling, one end is the evaporation end and the other end is the condensation end. When the evaporation end is heated, water evaporates. When the evaporated water flows to the condensation end, the water vapor comes into contact with the low-temperature copper powder particles at the condensation end—thus the water vapor is cooled into liquid water. The cooled liquid water then flows capillarily through the gaps between the copper powder particles—allowing the water to flow from the condensation end to the evaporation end along the gaps.) Therefore, the quality of the produced heat pipes is highly uncontrollable.

[0021] In this scheme, multiple thick copper wires are circumferentially arranged on the inner wall of the copper tube (the two ends of the thick copper wires are welded to the two ends of the copper tube). On the outer cylindrical surface of the thick copper wires, grooves A are engraved from one end to the other, and there are multiple grooves A on the cylindrical surface of one thick copper wire. During sintering, the grooves A are filled with polyvinyl alcohol. Copper powder particles, metal particles with a melting point lower than copper, and polyvinyl alcohol are loaded into the copper tube. After centrifugation, the polyvinyl alcohol in the grooves A evaporates during sintering, and the copper powder particles adhere to the cylindrical surface of the thick copper wires. Even if the gaps between the copper powder particles are blocked, the grooves A always exist - always able to play a capillary role (thereby enabling the condensed liquid to be quickly capillarily drawn from the condensation end to the evaporation end). Alternatively, grooves B can be opened on the inner wall of the copper tube from one end to the other, and then polyvinyl alcohol is filled in grooves B (the principle of groove B is the same as that of groove A).

[0022] In addition, in this scheme, copper powder particles, metal particles with a melting point lower than copper, polystyrene particles (evaporation temperature of 300~500°C), and polyvinyl alcohol (bonding aid, evaporation temperature of 200–300°C) are packed inside the copper tube. During the sintering process, the polystyrene particles volatilize, leaving voids. The voids left by the volatilization of polystyrene particles help to increase the porosity between the copper powder particles on the inner wall of the heat pipe, thereby improving the capillary effect.

[0023] This utility model has the following advantages:

[0024] (1) It can ensure that capillary channels always exist, thereby ensuring stable quality control of the radiator;

[0025] Specifically, in a heat pipe, even if some blockage occurs in the gaps between the copper powder particles on the inner wall of the copper pipe, resulting in a large amount of blockage in the capillary channels formed between the gaps, normal capillary action can still be carried out through the capillary channels formed by the recessed grooves A and B. This ensures that water continuously circulates in the heat pipe along the "evaporation end - condensation end - evaporation end", thus ensuring good heat dissipation effect of the radiator and stable quality control of the radiator.

[0026] (2) Improved heat dissipation;

[0027] a. The heat pipe is set vertically (evaporator end at the bottom and condenser end at the top). When water vapor is cooled at the condenser end and forms liquid water, the liquid water flows downwards not only under capillary action but also under gravity, which promotes the flow speed of the liquid water and thus increases the circulation speed of water in the entire heat pipe, thereby improving the heat dissipation effect of the heat pipe.

[0028] b. Multiple sunflower-shaped heat sinks are spaced apart on a vertically installed heat pipe. Water vapor easily cools into liquid at the section of the heat pipe where the sunflower-shaped heat sink is located, while the sections of the heat pipe adjacent to the sunflower-shaped heat sink have very little liquid. This alternating arrangement of sections with more and less liquid allows the sections with less liquid to easily draw away the liquid from the sections with more liquid (through capillary action – the liquid flows from the more liquid to the less liquid) – thus accelerating the capillary effect (compared to a system where the entire section has a large amount of liquid). This promotes the flow rate of liquid in the heat pipe, thereby increasing the circulation speed of water within the heat pipe and improving the heat dissipation effect (e.g., from top to bottom, the first section, second section, third section, and so on). The system consists of four, five, and six pipe sections. The first, third, and fifth pipe sections are fitted with sunflower-shaped heat exchange fins. As a result, a significant amount of liquid water condenses on the inner walls of these sections, with the liquid water concentration in the first section being greater than that in the third section, which is greater than that in the fifth section. Consequently, the capillary action of the second section on the first section is very strong. The second section also exerts capillary action on the third section—which is actually disadvantageous. However, because the capillary action of the fourth section on the third section is greater than that of the second section on the third section (due to gravity), and as long as the capillary action of the second section on the first section is rapid, once the liquid water in the third section is quickly absorbed by the fourth section, the third section can quickly absorb the liquid water from the second section.

[0029] c. After sunflower-shaped heat sinks are installed at intervals on the vertical heat pipe, the structure of the sunflower-shaped heat sinks can facilitate rapid heat exchange on the section of the heat pipe where they are located. This allows a large amount of liquid water to condense quickly on the inner wall of the heat pipe section where the sunflower-shaped heat sink is located, which is beneficial for subsequent capillary absorption and also helps to increase the circulation speed of the water in the heat pipe, thereby improving the heat dissipation effect.

[0030] (3) Through appropriate structural design, the structure of the entire radiator is made more robust. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of this utility model;

[0032] Figure 2 This is a structural schematic diagram of the present invention from another angle;

[0033] Figure 3 for Figure 2 Schematic diagram of the lower middle section;

[0034] Figure 4 This is a schematic diagram of the heat dissipation unit.

[0035] Figure 5A schematic diagram of the structure between multiple gravity heat pipes and corresponding solar heat dissipation fins in a single heat dissipation unit;

[0036] Figure 6 A schematic diagram of the structure of a solar heat dissipation fin;

[0037] Figure 7 This is a schematic diagram of the second capillary guide structure at the copper tube.

[0038] Figure 8 This is a schematic diagram of the second and third capillary guiding structures at the copper tube.

[0039] In the diagram: 10-gravity heat pipe, 11-copper pipe, 1101-recessed groove B, 12-copper powder particle layer, 13-coarse copper wire, 1301-recessed groove A;

[0040] 20-Solar heat dissipation fins, 2001-Mounting hole A, 2002-Mounting hole B, 21-Central pipe section, 22-Heat conduction plate, 23-Heat conduction fins, 24-Connecting block;

[0041] 30-Substrate, 31-Clamping plate, 32-Elastic element, 40-Heating device, 50-Heat dissipation unit. Detailed Implementation

[0042] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited to the following description.

[0043] It should be noted that the orientation or positional relationship indicated by terms such as "left" and "right" is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this utility model is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art. Such terms are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0044] It should be noted that in existing related technologies, the structure of a heat pipe radiator includes a base plate and multiple heat pipes, with one end of each heat pipe concentrated on the base plate. The base plate is in contact with the heat-generating device (for example, the heatsink for a desktop computer CPU chip uses this structure). Furthermore, a layer of copper powder particles is fixed inside the heat pipes via sintering (using a copper tube, with the upper end open and the lower end closed; copper powder particles, metal particles with a melting point lower than copper, and polyvinyl alcohol are loaded into the copper tube; under centrifugal force, the copper powder particles and metal particles with a melting point lower than copper are adhered to the inner wall of the copper tube through the polyvinyl alcohol; then, it is placed in a furnace for sintering; after removal, water is added to the copper tube, then a vacuum is created, and finally, the upper end of the copper tube is sealed). The working principle of a heat pipe radiator is as follows: When a heat-generating device (such as a desktop computer CPU chip) generates heat, the heat is transferred to the base unit, which then transfers the heat to one end of the heat pipe (called the evaporation end). The evaporation end is heated, causing the water to evaporate (evaporation is easy in a vacuum). The evaporated water vapor then flows to the other end of the copper pipe (called the condensation end). During this flow, the water vapor comes into contact with the copper powder particle layer on the inner wall of the copper pipe (the copper powder particles are at a low temperature, allowing for good heat exchange with the external environment through the copper pipe). The water vapor is then cooled, forming liquid water. Because there are gaps between the copper powder particles (the copper powder particles are not melted, only metal particles below the melting point of copper melt), and because there is no water at the evaporation end, the liquid water flows from the condensation end through these gaps to the evaporation end. The liquid water flowing to the evaporation end evaporates again under high temperature, thus forming a cycle.

[0045] However, the problem is that during the sintering process of the heat pipe, due to the inability to effectively control the copper powder particles and metal particles with a melting point lower than copper, the gaps formed between the copper powder particles can extend from one end of the copper pipe to the other (i.e., blockage may occur in the middle of the formed gap channels - the formation of gaps cannot be controlled). This results in poor capillary effect through the gaps (poor effect on the condensed liquid water flowing from the condensing end to the evaporating end under capillary action). If the downward capillary action is not good, the water circulation effect in the heat pipe will be poor, which in turn leads to poor heat dissipation effect of the entire radiator.

[0046] To address the aforementioned issues, this solution offers the following approach: In the heat pipe, a capillary structure is artificially designed at the copper powder particle layer of the copper pipe (the challenge lies in achieving this structure). Even if the copper powder particle layer on the inner wall of the copper pipe becomes clogged, it can still perform normal capillary absorption, thereby promoting water circulation.

[0047] The following specific embodiments further illustrate the concept of this solution (it should be noted that, without conflict, the embodiments and features and technical solutions in this utility model can be combined with each other).

[0048] See Figure 1 , Figure 2 and Figure 7 This embodiment discloses a matrix-type superconducting heat pipe radiator, including a gravity heat pipe 10 and a sunflower heat sink 20;

[0049] In this configuration, multiple gravity heat pipes 10 are arranged vertically, and the lower ends of each gravity heat pipe 10 are concentrated on the substrate 30.

[0050] Furthermore, for each gravity heat pipe 10, multiple sunflower-shaped heat sinks 20 are arranged at intervals from bottom to top;

[0051] In addition, the gravity heat pipe 10 includes a copper pipe 11 and a copper powder particle layer 12; wherein, the copper powder particles, metal particles with a melting point lower than copper, and polystyrene particles in the copper powder particle layer 12 are fixed to the inner wall of the copper pipe 11 by sintering; when the copper powder particles are sintered and fixed to the inner wall of the copper pipe 11, gaps are formed between the copper powder particles, and the gaps are connected to form capillary channels - i.e., the first capillary guiding structure.

[0052] In addition, in order to dissipate heat from the heating device 40, the substrate 30 is attached to the heating device 40 (the lower end of the gravity heat pipe 10 is the evaporation end and the upper end is the condensation end).

[0053] During operation, the heating device 40 transfers heat to the substrate 30, which in turn transfers heat to the lower end of the gravity heat pipe 10. The water inside the lower end of the gravity heat pipe 10 evaporates due to the vacuum inside the heat pipe, making it easy for the water to evaporate. After evaporation, the water vapor carries away the heat. When the water vapor flows to the upper condensing end, it is cooled by the low-temperature copper powder particles, thus forming liquid water. Under the influence of gravity and the first capillary guiding structure (capillary channel), the liquid water flows back from the condensing end to the evaporating end. The liquid water flowing back to the evaporating end is evaporated again, thus realizing the circulation of water. During the water circulation process, heat is carried from the evaporating end to the condensing end and released, thereby cooling the heating device 40.

[0054] It should be noted that the fabrication of the heat pipe in the first capillary guiding structure of this scheme is the same as that of a conventional heat pipe—see the prior art description above for details. The difference between the first capillary structure in this scheme and the prior art is that polystyrene particles are used in the fabrication of the heat pipe. During the sintering process, the polystyrene particles volatilize, leaving larger and more numerous voids between the copper powder particle layers 12. These more numerous and larger voids are more likely to connect with each other—making it easier to form capillary channels, and resulting in a greater number of capillary channels (the prior art has fewer voids, thus forming fewer capillary channels). This increases the water circulation speed in the evaporator, thereby increasing the heat dissipation speed of the radiator.

[0055] This design also includes a second capillary guiding structure.

[0056] Specifically, see Figure 7 The second capillary guiding structure includes multiple thick copper wires 13, which are arranged circumferentially on the inner wall of the copper tube 11 (the two ends of the thick copper wires 13 are located at the two ends of the copper tube 11 respectively), and a recessed groove A1301 is opened on the cylindrical surface of the thick copper wires 13 from one end to the other.

[0057] During preparation, polyvinyl alcohol is filled into the recessed groove A1301 of the coarse copper wire 13; then the coarse copper wire 13 is placed on the inner wall of the copper tube 11, and its two ends are welded to the two ends of the copper tube 11 respectively, and then the lower end of the copper tube 11 is welded and sealed; then copper powder particles, metal particles with a melting point lower than copper, polystyrene particles and polyvinyl alcohol are loaded into the copper tube, and then centrifuged—allowing the copper powder particles, metal particles with a melting point lower than copper and polystyrene particles to adhere to the inner wall of the copper tube 11 through polyvinyl alcohol; then sintering is performed; after sintering, the copper tube 11 is evacuated, then water is added, and the upper end of the copper tube 11 is sealed; when the copper powder particles are sintered and fixed to the inner wall of the copper tube 11, the recessed groove A1301 can form a capillary channel—that is, a second capillary guiding structure.

[0058] It should be noted that during the preparation of the second capillary guiding structure, the polyvinyl alcohol in the recessed groove A1301 volatilizes after sintering. Therefore, in the formed gravity heat pipe 10, regardless of the number of gaps between copper powder particles or the degree of interconnection between these gaps, the recessed groove A1301 always functions as a capillary channel. This second capillary guiding structure not only increases the speed of water circulation—thus improving heat dissipation—but also ensures the quality control of the gravity heat pipe 10 (because the capillary channel is always present).

[0059] This design also includes a third capillary guiding structure.

[0060] Specifically, see Figure 8 Multiple recessed grooves B1101 are circumferentially formed on the inner wall of the copper tube 11 from one end to the other. When copper powder particles are sintered and fixed on the inner wall of the copper tube 11, the recessed grooves B1101 can form capillary channels - that is, the third capillary guiding structure.

[0061] It should be noted that during preparation, polyvinyl alcohol also needs to be filled into the recessed groove B1101. The rest of the preparation process and principle are the same as those of the second capillary guiding structure.

[0062] The structure of the sunflower heat sink will be explained below.

[0063] See Figure 6The sunflower-shaped heat sink 20 includes a central tube section 21. Multiple heat-conducting plates 22 are radially arranged on the cylindrical surface of the central tube section 21, and heat-conducting fins 23 are provided on the heat-conducting plates 22. Furthermore, the central tube section 21, heat-conducting plates 22, and heat-conducting fins 23 are integrally formed. This method provides excellent heat dissipation, making it easy to cool the copper powder particles within the section corresponding to the copper pipe 11 fitted onto the central tube section 21. This improves the condensation effect when water vapor comes into contact with the copper powder particles, thus promoting water circulation in the gravity heat pipe 10 and enhancing the heat dissipation effect.

[0064] The following section provides a further explanation of the mounting structure between the gravity heat pipes, the substrate, and the heat-generating components in the radiator.

[0065] See Figures 1-5 The radiator has multiple heat dissipation units 50.

[0066] The heat dissipation unit 50 includes multiple gravity heat pipes 10 and two substrates 30. The gravity heat pipes 10 are provided with corresponding sunflower heat sinks 20. The two substrates 30 are arranged opposite each other, and multiple semi-circular recessed grooves C are opened on the opposite surfaces of the substrates 30. The lower ends of the multiple gravity heat pipes 10 are clamped by the two substrates 30 and locked by small bolts, so that the lower ends of each gravity heat pipe 10 are pressed into the corresponding recessed grooves C one by one.

[0067] In addition, in order to concentrate the gravity heat pipes 10 on the substrate 30, the lower end of the gravity heat pipes 10 is bent, and the gravity heat pipes 10 are concentrated on the substrate 3 by bending.

[0068] A heat dissipation unit 50 is provided on the left and right sides of the heat-generating device 40, and the substrate 30 is attached to the outer side of the heat-generating device 40 to form a heat dissipation structure. In addition, a clamping plate 31 is provided on the outer side of the two heat dissipation units 50, and the two clamping plates 31 are connected by a large bolt, which passes through the substrate 30 to form a structure in which the heat-generating device 40 is clamped and locked by the two heat dissipation units 50. Furthermore, an elastic element 32 (e.g., a spring) is provided between the clamping plate 31 and the heat-generating device 40 to form a structure in which the heat-generating device 40 is elastically fixed.

[0069] Further, see Figure 1 , Figure 2 and Figure 6To ensure the overall reliability of the heat sink, mounting holes A2001 are provided along the parallel axial direction and mounting holes B2002 are provided radially on the sunflower heat sink 20. During assembly, the sunflower heat sinks 20 on a single gravity heat pipe 10 are connected by connecting rods passing through mounting holes A2001 to form a stable structure; the sunflower heat sinks 20 at the same height on different gravity heat pipes 10 are fixedly connected to mounting holes B2002 by screws through connecting blocks 24 to form a stable structure.

[0070] The above embodiments only illustrate preferred implementation methods, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model.

Claims

1. A matrix-type superconducting heat pipe radiator, characterized in that: Includes gravity heat pipe (10) and sunflower heat sink (20); Multiple gravity heat pipes (10) are vertically arranged, and the lower ends of each gravity heat pipe (10) are concentrated on the substrate (30). Each gravity heat pipe (10) is attached to the heating device (40). On each of the gravity heat pipes (10), a plurality of sunflower heat sinks (20) are arranged at intervals from bottom to top. Various capillary guiding structures are provided on the inner wall of the gravity heat pipe (10); The gravity heat pipe (10) includes a copper pipe (11) and a copper powder particle layer (12); wherein, the copper powder particle layer (12) is copper powder particles, metal particles with a melting point lower than copper, and polystyrene particles fixed to the inner wall of the copper pipe (11) by sintering; when the copper powder particles are sintered and fixed to the inner wall of the copper pipe (11), gaps are formed between the copper powder particles, and the gaps are connected to form capillary channels - i.e., the first capillary guiding structure.

2. The matrix-type superconducting heat pipe radiator according to claim 1, characterized in that: It also includes a second capillary guiding structure; The second capillary guide knot includes multiple copper wires (13), multiple thick copper wires (13) are arranged circumferentially on the inner wall of the copper tube (11), and a recessed groove A (1301) is opened on the cylindrical surface of the thick copper wires (13) from one end to the other. When the coarse copper wire (13) is placed on the inner wall of the copper tube (11) and the copper powder particles are sintered and fixed on the inner wall of the copper tube (11), the recessed groove A (1301) can form a capillary channel - that is, a second capillary guiding structure.

3. The matrix-type superconducting heat pipe radiator according to claim 1 or 2, characterized in that: It also includes a third capillary guiding structure; Multiple recessed grooves B (1101) are circumferentially formed on the inner wall of the copper tube (11) from one end to the other. When copper powder particles are sintered and fixed on the inner wall of the copper tube (11), the recessed grooves B (1101) can form capillary channels - that is, the third capillary guiding structure.

4. The matrix-type superconducting heat pipe radiator according to claim 1, characterized in that: The sunflower heat sink (20) includes a central tube section (21), and multiple heat-conducting plates (22) are arranged radially on the cylindrical surface of the central tube section (21), and heat-conducting fins (23) are provided on the heat-conducting plates (22). The central pipe section (21), heat-conducting plate (22), and heat-conducting fins (23) are integrally formed.

5. The matrix-type superconducting heat pipe radiator according to claim 1, characterized in that: The lower end of the gravity heat pipe (10) is curved, and each gravity heat pipe (10) is concentrated on the substrate (30) by bending.

6. The matrix-type superconducting heat pipe radiator according to claim 1 or 5, characterized in that: The radiator has multiple heat dissipation units (50). The heat dissipation unit (50) includes multiple gravity heat pipes (10) and two substrates (30). Corresponding sunflower heat sinks (20) are provided on the gravity heat pipes (10). The two substrates (30) are arranged opposite each other, and multiple semi-circular recessed grooves C are opened on the opposite surfaces of the substrates (30). The lower ends of the multiple gravity heat pipes (10) are clamped by the two substrates (30) and locked by small bolts, so that the lower ends of each gravity heat pipe (10) are pressed into the corresponding recessed grooves C one by one. A heat dissipation unit (50) is provided on the left and right sides of the heating device (40), and the substrate (30) is attached to the outer side of the heating device (40) to form a heat dissipation structure. Clamping plates (31) are respectively provided on the outer side of the two heat dissipation units (50) on the left and right. The clamping plates (31) on the left and right are connected by large bolts and the large bolts pass through the substrate (30) to form a structure in which the heat-generating device (40) is clamped and locked by the two heat dissipation units (50). An elastic element (32) is also provided between the clamping plate (31) and the heating device (40) to form a structure in which the heating device (40) is elastically fixed.

7. The matrix-type superconducting heat pipe radiator according to claim 6, characterized in that: The sunflower heat sink (20) is provided with mounting holes A (2001) along the parallel axial direction and mounting holes B (2002) along the radial direction. Each sunflower heat sink (20) on a gravity heat pipe (10) is connected by a connecting rod passing through the mounting hole A (2001) to form a stable structure; The sunflower heat sink (20) at the same height between the heat pipes (10) of different gravity is fixedly connected to the mounting hole B (2002) by screws through the connecting block (24) to form a stable structure.

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