A board-mounted pressure sensor with temperature compensation

Abstract

The utility model discloses a kind of on-board pressure sensors with temperature compensation, including upper shell and lower shell, the upper shell is connected with lower shell by detachable sealing structure, the sealing cavity inside has pressure sensing module, and the lower shell is integrally formed with pin group by injection molding process, the pin group extends to the sealing cavity inside;The sealing cavity inside is also provided with pluggable electrical connection component, which includes male end connecting end and female end connecting end fixed to the bottom of pressure sensing module, the male end connecting end includes several spring needle and insulating base, the female end connecting end includes elastic spring piece and guide slot;Wherein, the male end connecting end and female end connecting end are electrically connected by plug-in mode, and the pressure sensing module is formed with pin group by pluggable electrical connection component and detachable signal transmission path.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and in particular to an onboard pressure sensor with temperature compensation. Background Technology

[0002] Temperature-compensated onboard pressure sensors are high-precision pressure measurement devices that integrate MEMS (Micro-Electro-Mechanical Systems) sensor chips with dedicated signal conditioning circuitry (ASICs). Their core function is to perform real-time processing and temperature compensation of the MEMS chip's output signal through the onboard ASIC, eliminating the impact of drastic environmental temperature fluctuations or extreme high and low temperatures on pressure measurement accuracy. Existing onboard pressure sensors are generally monolithic, requiring complete replacement of internal components (such as MEMS diaphragms or ASIC chips) when damaged, resulting in high maintenance costs. Utility Model Content

[0003] The main purpose of this invention is to provide an onboard pressure sensor with temperature compensation, which is intended to provide a modular pressure sensor that is easy to disassemble and maintain.

[0004] To achieve the above objectives, the present invention proposes an onboard pressure sensor with temperature compensation, comprising an upper housing and a lower housing, wherein the upper housing and the lower housing are connected by a detachable sealing structure to form a sealed cavity, wherein a pressure sensing module is located inside the sealed cavity, and wherein a pin group is integrally formed on the lower housing by injection molding process, wherein the pin group extends into the interior of the sealed cavity.

[0005] The sealed cavity is also provided with a pluggable electrical connection assembly, which includes a male connection end fixed to the bottom of the pressure sensing module and a female connection end integrated into the top of the pin group of the lower housing. The male connection end includes several spring pins and an insulating base, and the female connection end includes an elastic spring and a guide groove that match the spring pins.

[0006] The male and female terminals are electrically connected via a plug-in connection, and the pressure sensing module forms a detachable signal transmission path with the pin group through a pluggable electrical connection component.

[0007] In one possible implementation, the removable sealing structure includes an annular groove and an annular protrusion that are interference-fitted with the mating surface of the upper and lower housings. The annular groove contains a sealing ring, and at least two sets of locating pins and locating holes are distributed around the circumference of the housing. The locating pins and locating holes are clearance-fitted.

[0008] In one possible implementation, a guide plug-in assembly is provided between the inner wall of the sealed cavity and the pluggable electrical connection assembly, which includes a guide post vertically fixed to the bottom of the sealed cavity and guide slide rails symmetrically distributed on both sides of the inner wall of the cavity, and can slide and engage with the insulating base sidewall of the male connection end.

[0009] In one possible implementation, the elastic spring of the female end connection is made of beryllium copper alloy, and the elastic spring has a multi-contact redundant structure.

[0010] In one possible implementation, the cavity is filled with thermally conductive silicone, which covers the non-contact area between the pressure sensing module and the pin group, and the thermally conductive silicone forms a physical isolation between the insulating base of the male terminal connection.

[0011] This utility model's technical solution utilizes a modular plug-in design, enabling rapid replacement of the pressure sensing module without compromising the housing's sealing. When repair or replacement is required, after separating the upper and lower housings, the pressure sensing module, along with its male connector, can be directly pulled out of the cavity, separating the spring pin from the female spring plate. A new module can then be installed, and the housing reassembled. This modular, rapid replacement allows for independent replacement of the pressure sensing module, reducing maintenance costs. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0014] Figure 2 This is an exploded view of an embodiment of the present invention.

[0015] Explanation of icon numbers:

[0016] 1. Upper housing; 2. Lower housing; 3. Sealed cavity; 41. Pressure sensing module; 42. Temperature compensation module; 5. Pin group; 6. Pluggable electrical connection assembly; 61. Male connection terminal; 611. Spring pin; 612. Insulating base; 62. Female connection terminal; 621. Elastic spring; 7. Detachable sealing structure; 71. Annular groove; 72. Annular protrusion; 73. Sealing ring; 74. Locating pin; 75. Locating hole; 81. Guide post; 82. Guide slide rail.

[0017] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0019] To address the problems in the background technology, this utility model proposes an onboard pressure sensor with temperature compensation, including an upper housing 1 and a lower housing 2. The upper housing 1 and the lower housing 2 are connected by a detachable sealing structure 7 to form a sealed cavity 3. The sealed cavity 3 contains a pressure sensing module 41, and the lower housing 2 is integrally formed with a pin group 5 by injection molding, which extends into the sealed cavity 3.

[0020] The sealed cavity 3 is also provided with a pluggable electrical connection assembly 6, which includes a male connection end 61 fixed to the bottom of the pressure sensing module 41 and a female connection end 62 integrated on the top of the pin group 5 of the lower housing 2. The male connection end 61 includes a plurality of spring pins 611 and an insulating base 612, and the female connection end 62 includes an elastic spring 621 that matches the spring pins 611 and a guide groove.

[0021] The male terminal 61 and the female terminal 62 are electrically connected by a plug-in connection, and the pressure sensing module 41 forms a detachable signal transmission path with the pin group 5 through the pluggable electrical connection component 6.

[0022] Combined with reference Figures 1 to 2As shown, in this embodiment, the core structure of this application includes detachable upper and lower housings 2, an injection-molded pin group 5, and a modular pressure sensing component. The signal transmission path is detachably connected via a connector-type electrical interface. Specifically, the pressure sensor consists of an upper housing 1 and a lower housing 2 connected by a detachable sealing structure 7. The upper housing 1 is made of cylindrical aluminum alloy, with a pressure inlet port at the top. An isolation diaphragm is welded to the inside of the port, and the surface is electrolytically polished to enhance corrosion resistance. The lower housing 2 is made of liquid crystal polymer material and integrally molded using injection molding. It has an integrally embedded metal pin group 5 arranged in a ring array. The pins are made of iron-nickel alloy, with one end extending to the outside of the lower housing 2 to connect to an external circuit, and the other end extending into the cavity to form an electrical connection interface. A sealed cavity 3 is formed inside the lower housing 2, and a pressure sensing module 41 is installed inside the cavity. This module is a rectangular ceramic substrate, with a MEMS piezoresistive pressure-sensitive element and a platinum thin-film temperature sensor integrated on the front side of the substrate. The MEMS element can be a silicon-based SOI piezoresistive diaphragm, and the platinum thin-film temperature sensor is located at the edge of the MEMS element. The cavity is integrated with a temperature compensation component, which includes a platinum thin film temperature sensor integrated on the pressure sensing module 41, the distance between the sensor and the MEMS pressure sensing element, an onboard ASIC chip, and a spring pin 611 directly connected to the male terminal 61 through a metallized through-hole. The ASIC chip has a built-in nonlinear temperature compensation algorithm and an EEPROM storage unit.

[0023] Furthermore, the pluggable electrical connection assembly 6 in this embodiment includes a male connection terminal 61 and a female connection terminal 62. The male connection terminal 61 is fixed to the bottom of the pressure sensing module 41 and consists of an insulating base 612 (such as PBT or LCP material) and multiple miniature spring pins 611. The spring pins 611 are made of gold-plated copper alloy and are arranged in an array. They are fixed to the circuit board of the pressure sensing module 41 with conductive adhesive, or the tail of the spring pins 611 is connected to the metallized through-hole of the ceramic substrate by laser welding. The female connection terminal 62 is integrated on the top of the pin group 5 of the lower housing 2 and includes an elastic spring 621 and a guide groove structure. The elastic spring 621 is made of beryllium copper alloy and is designed with a dual-contact redundant structure. Each contact independently contacts the spring pin 611 to reduce the risk of failure. The guide groove adopts a beveled guide design to ensure automatic alignment when the male terminal is inserted.

[0024] During assembly, the pressure sensing module 41 is connected to the elastic spring 621 of the female connection end 62 via the spring pin 611 of the male connection end 61, forming an electrical path. Specifically, after the male spring pin 611 is inserted into the female guide groove, it contacts the multi-contact area of ​​the elastic spring 621, generating constant contact pressure through the elastic deformation of the spring to ensure a low-impedance connection. When maintenance or replacement is required, after separating the upper and lower housings 2, the pressure sensing module 41, along with the male connection end 61, can be directly pulled out of the cavity, separating the spring pin 611 from the female spring. Then, a new module can be replaced and the housing can be reassembled. This allows for modular and rapid replacement. Compared to traditional sensors where internal components are integrated and any component (such as a broken MEMS diaphragm or damaged ASIC) requires complete scrapping, this application allows for independent replacement of the pressure sensing module 41 through a detachable housing and pluggable terminals, reducing maintenance costs.

[0025] In one possible implementation, the detachable sealing structure 7 includes an annular groove 71 and an annular protrusion 72 that are interference-fitted with the mating surface of the upper housing 1 and the lower housing 2. The annular groove 71 is embedded with a sealing ring 73, and at least two sets of positioning pins 74 and positioning holes 75 are distributed around the housing. The positioning pins 74 and positioning holes 75 are clearance-fitted.

[0026] The detachable sealing structure 7 achieves high reliability through a synergistic design of mechanical positioning and elastic sealing. Specifically, the mating surfaces of the upper housing 1 and the lower housing 2 are respectively machined with complementary annular grooves 71 and annular protrusions 72. The grooves have rectangular cross-sections, and the protrusions are press-fitted with them, forcing radial compression when the protrusions are embedded in the grooves. An O-ring or X-ring made of fluororubber is embedded within it, filling the microscopic gaps between the housings through compression and rebound force, ensuring an airtightness meeting the IP67 standard. At least two sets of locating pins 74 and locating holes 75 are symmetrically distributed circumferentially on the housings. The locating pins 74 are made of PEEK (polyetheretherketone), and the locating holes 75 and locating pins 74 form a clearance fit, limiting lateral misalignment between the housings. During assembly, the operator inserts the locating pins 74 into the locating holes 75, applies axial pressure to uniformly compress the sealing rings 73, and then tightens the stainless steel screws circumferentially on the housings to complete the fixation.

[0027] In one possible implementation, a guide plug-in assembly is provided between the inner wall of the sealed cavity 3 and the pluggable electrical connection assembly 6. The guide assembly includes a guide post 81 vertically fixed to the bottom of the sealed cavity 3 and guide slide rails 82 symmetrically distributed on both sides of the inner wall of the cavity, which can slide and engage with the side wall of the insulating base 612 of the male end connection 61.

[0028] Reference Figure 2As shown, in this embodiment, a guide insertion assembly is provided between the inner wall of the sealed cavity 3 and the pluggable electrical connection assembly 6, including a guide post 81 vertically fixed to the bottom of the sealed cavity 3 and guide rails 82 symmetrically distributed on both sides of the inner wall of the cavity. The guide post 81 is clearance-fitted with the guide hole reserved at the bottom of the insulating base 612 of the male connection end 61 to ensure axial self-centering during insertion. The guide rail 82 has a dovetail-shaped cross-section, is fixed to both sides of the inner wall of the cavity, and its length is the same as the side wall of the insulating base 612. It slides in cooperation with the dovetail groove of the side wall of the insulating base 612 to limit the lateral displacement of the male connection end 61.

[0029] In one possible implementation, the elastic spring 621 of the female connection end 62 is made of beryllium copper alloy and has a multi-contact redundant structure. Specifically, the elastic spring 621 of the female connection end 62 is made of beryllium copper alloy and is processed into a multi-contact redundant structure through stamping to improve the reliability and durability of the electrical connection. The main body of a single elastic spring 621 has a "W"-shaped folded structure, forming two independent contact arms. Each contact arm has a hemispherical protruding contact at its end and is electroplated with a nickel layer. The spring is fixed to the copper alloy base of the female connection end 62 by laser welding. When the spring pin 611 of the male connection end 61 is inserted, the two contact arms of the "W"-shaped spring are simultaneously subjected to elastic deformation, generating a bidirectional clamping force, so that the two contacts form a four-point contact with the surface of the spring pin 611, realizing a redundant conduction path.

[0030] In one possible implementation, the cavity is filled with thermally conductive silicone, which covers the non-contact area between the pressure sensing module 41 and the pin group 5, and the thermally conductive silicone forms a physical isolation between itself and the insulating base 612 of the male terminal connection 61. Specifically, the non-contact area of ​​the cavity is filled with thermally conductive silicone, which, after curing, forms a coating layer that completely fills the air gap between the pressure sensing module 41 and the pin group 5, while maintaining an isolation distance from the insulating base 612 of the male terminal. This design achieves three functions: ① rapidly conducts heat from the MEMS component to the housing; ② buffers the impact of mechanical vibration on the electrical connection interface; ③ prevents moisture from entering the cavity along the pin gaps.

[0031] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0032] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A board-mounted pressure sensor with temperature compensation, characterized in that, The application relates to a pressure sensor, which comprises an upper shell and a lower shell connected through a detachable sealing structure to form a sealed cavity, wherein a pressure sensing module is arranged in the sealed cavity, and a pin group is integrally formed on the lower shell through an injection molding process and extends into the sealed cavity. A pluggable electrical connection assembly is arranged in the sealed cavity, which comprises a male connection end fixed to the bottom of the pressure sensing module and a female connection end integrated on the top of the pin group of the lower shell, the male connection end comprises a plurality of spring pins and an insulating base, and the female connection end comprises elastic spring sheets matched with the spring pins and guide grooves. The male connection end and the female connection end are electrically connected through plugging, and the pressure sensing module and the pin group form a detachable signal transmission path through the pluggable electrical connection assembly.

2. The on-board pressure sensor with temperature compensation of claim 1, wherein, The detachable sealing structure comprises an annular groove arranged on the joint surface of the upper shell and the lower shell, an annular protrusion in interference fit with the annular groove, a sealing ring embedded in the annular groove, and at least two groups of positioning pins and positioning holes distributed in the circumferential direction of the shell.

3. The on-board pressure sensor with temperature compensation of claim 1, wherein, A guide plugging assembly is arranged between the inner wall of the sealed cavity and the pluggable electrical connection assembly, which comprises a guide column fixed vertically on the bottom of the sealed cavity and guide sliding rails symmetrically distributed on the two sides of the inner wall of the cavity and capable of being slidably matched with the side wall of the insulating base of the male connection end.

4. The on-board pressure sensor with temperature compensation of claim 1, wherein, The elastic spring sheets of the female connection end are made of beryllium copper alloy and have a multi-contact redundant structure.

5. The on-board pressure sensor with temperature compensation according to any one of claims 1 to 3, characterized in that, The cavity is filled with heat-conducting silica gel, the heat-conducting silica gel is wrapped in a non-contact area between the pressure sensing module and the pin group, and the heat-conducting silica gel is physically isolated from the insulating base of the male connection end.

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