A high-efficiency heat-dissipation DC-DC power module
By adopting a structure combining an aluminum substrate and a copper heat sink in the DC-DC power module, setting up a heat dissipation array and through holes, and combining passive and active heat dissipation, the circuit layout is optimized, which solves the problems of low heat dissipation efficiency and difficulty in achieving electromagnetic compatibility, and realizes efficient and stable operation of the power module.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NANJING NENZHI ELECTRONICS TECH CO LTD
- Filing Date
- 2025-07-24
- Publication Date
- 2026-06-09
AI Technical Summary
Existing DC-DC power modules have low heat dissipation efficiency during high-frequency conversion, resulting in high hot spot temperature, reduced lifespan, and difficulty in meeting stringent electromagnetic compatibility standards.
It adopts a structure combining an aluminum substrate and a copper heat sink, with a heat dissipation array and through holes. It combines passive and active heat dissipation, optimizes the circuit layout, and uses a high-frequency half-bridge PWM drive topology and synchronous rectification technology to enhance EMI control.
It significantly improves heat dissipation efficiency and electromagnetic compatibility, ensuring stable operation of the module in high-temperature environments, achieving higher power output, and meeting stringent standards.
Smart Images

Figure CN224343097U_ABST