Wafer cleaning device

Abstract

The utility model discloses a wafer cleaning device, it includes the body and the built -in deflection mechanism, spray liquid mechanism, first cleaning mechanism and second cleaning mechanism in the body, deflection mechanism is used for supporting wafer, and rotates wafer, spray liquid mechanism is used for spraying liquid medicine to the upper surface and the lower surface place of wafer, first cleaning mechanism is placed in the upper of wafer, and is used for cleaning the upper surface of wafer, second cleaning mechanism is placed in the lower of wafer, and is used for cleaning the lower surface of wafer, realizes the cleaning of the upper and lower surface of wafer, improves the cleanliness of wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment, and in particular to a wafer cleaning device. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon ingot. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer. As semiconductor feature sizes shrink and processing and measurement equipment becomes more advanced, new data characteristics have emerged in wafer processing. Simultaneously, the reduction in feature size increases the impact of airborne particles on the quality and reliability of the processed wafer, and with improved cleanliness, the particle count also exhibits new data characteristics.

[0003] To ensure the cleanliness of wafers, there are cleaning devices on the market specifically designed for wafer surfaces. However, existing cleaning devices can only clean a single surface of the wafer, requiring multiple devices to complete the cleaning process. This increases the cost of equipment configuration and also occupies too much space. Utility Model Content

[0004] The purpose of this invention is to address the technical problems existing in the background art by proposing a wafer cleaning device.

[0005] To achieve the above-mentioned technical objectives, the technical solution adopted by this utility model is as follows:

[0006] A wafer cleaning apparatus is provided for cleaning the upper and lower surfaces of a wafer. The wafer cleaning apparatus includes a body and a deflection mechanism, a spraying mechanism, a first cleaning mechanism, and a second cleaning mechanism built into the body. The deflection mechanism supports and rotates the wafer. The spraying mechanism sprays a cleaning solution onto the upper and lower surfaces of the wafer. The first cleaning mechanism is positioned above the wafer and is used to clean the upper surface of the wafer. The second cleaning mechanism is positioned below the wafer and is used to clean the lower surface of the wafer.

[0007] Preferably, the machine body includes a cover and a mounting platform. The cover covers the mounting platform, and the deflection mechanism, the spraying mechanism, the first cleaning mechanism and the second cleaning mechanism are all mounted on the mounting platform and placed inside the cover. The cover is provided with at least one transport window.

[0008] Preferably, the wafer cleaning apparatus further includes at least one set of door assemblies, each door assembly is mounted on the mounting platform and is used to open and close the corresponding transport window. The door assembly includes a first lifting member and a baffle. The first lifting member is connected to the baffle and drives the baffle to cover or open the transport window.

[0009] Preferably, the first cleaning mechanism includes a dual-axis drive assembly, a first crossbeam frame, a first shaft drive component, and a first cleaning drum. The first crossbeam frame is drivenly connected to the dual-axis drive assembly and moves within the machine body under the drive of the dual-axis drive assembly. The first shaft drive component is mounted on the first crossbeam frame. The first cleaning drum is rotatably mounted on the first crossbeam frame and drivenly connected to the first shaft drive component.

[0010] Preferably, the first cleaning mechanism further includes a grinding table and a cleaning nozzle. The grinding table is used to grind the first cleaning roller, and the cleaning nozzle is used to spray cleaning liquid onto the grinding table to clean the first cleaning roller.

[0011] Preferably, the second cleaning mechanism includes a second lifting member, a second crossbeam, a second shaft drive member, and a second cleaning roller. The second crossbeam is mounted on the drive end of the second lifting member, and under the drive of the second lifting member, the second crossbeam moves closer to or further away from the wafer. The second shaft drive member is mounted on the second crossbeam. The second cleaning roller is rotatably mounted on the second crossbeam and is driven and connected to the second shaft drive member.

[0012] Preferably, the deflection mechanism includes at least two clamping assemblies. Each clamping assembly includes a first driving part, a second driving part, and at least one clamping part. Each clamping part and the second driving part are mounted on the first driving part, and each clamping part is drivenly connected to the second driving part. Under the drive of the first driving part in each clamping assembly, the clamping parts in each clamping assembly move closer or further apart to clamp the wafer. Under the drive of each second driving part, each clamping part rotates in the same direction about its own axis to drive the wafer to rotate.

[0013] Preferably, the first driving unit includes a guide rail, a first driving member, and a slide. The guide rail is mounted on the mounting platform, the first driving member is mounted on the mounting platform, and the slide is slidably mounted on the guide rail and drivenly connected to the first driving member. Under the drive of the first driving member, the slide moves along the direction of the guide rail. Each clamping part is rotatably mounted on the slide, and the second driving unit is mounted on the slide.

[0014] Preferably, the clamping part includes a rotating shaft, a transmission wheel, and a clamping wheel. The rotating shaft is rotatably mounted on a slide table, and the transmission wheel and the clamping wheel are respectively mounted on the two ends of the rotating shaft. The clamping wheel is used to abut against the edge of the wafer. The second driving part includes a driving motor, which is drivenly connected to the transmission wheel to drive the rotating shaft to rotate.

[0015] Preferably, the spraying mechanism includes multiple sprayers for spraying cleaning fluid, each sprayer being installed inside a housing and positioned above and below the wafer, respectively, to spray the cleaning fluid onto the upper and lower surfaces of the wafer.

[0016] Compared with the prior art, the utility model has the following beneficial technical effects: it includes a body and a deflection mechanism, a spraying mechanism, a first cleaning mechanism, and a second cleaning mechanism built into the body; the deflection mechanism is used to support the wafer and rotate the wafer; the spraying mechanism is used to spray the liquid onto the upper and lower surfaces of the wafer; the first cleaning mechanism is placed above the wafer and is used to clean the upper surface of the wafer; the second cleaning mechanism is placed below the wafer and is used to clean the lower surface of the wafer, thereby achieving cleaning of both the upper and lower surfaces of the wafer and improving the cleanliness of the wafer. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0018] Figure 2 This is a schematic diagram of the internal structure of an embodiment of the present utility model. Figure 1 ;

[0019] Figure 3 This is a schematic diagram of the internal structure of an embodiment of the present utility model. Figure 2 ;

[0020] Figure 4 This is a schematic diagram of the structure of the first cleaning mechanism and the second cleaning mechanism in the embodiments of this utility model;

[0021] Figure 5 This is a diagram showing the usage state of the deflection mechanism in the embodiments of this utility model;

[0022] Figure 6 This is a schematic diagram of the deflection mechanism in an embodiment of the present invention;

[0023] Figure 7 This is a schematic diagram of the clamping component in an embodiment of the present invention.

[0024] Icon labels:

[0025] 100. Body, 101. Shell, 1011. Transport window, 102. Mounting platform;

[0026] 200 Deflection mechanism, 201 Clamping assembly, 2011 First drive unit, 20111 Guide rail, 20112 First drive component, 20113 Slide table, 2012 Second drive unit, 2013 Clamping unit, 20131 Rotating shaft, 20132 Transmission wheel, 20133 Clamping wheel;

[0027] 300 spray mechanism, 301 sprayer;

[0028] 400 First cleaning mechanism, 401 Dual-axis drive assembly, 402 First crossbeam frame, 403 First shaft drive component, 404 First cleaning drum, 405 Grinding table, 406 Cleaning nozzle;

[0029] 500 Second cleaning mechanism, 501 Second lifting component, 502 Second crossbeam frame, 503 Second shaft drive component, 504 Second cleaning drum;

[0030] 600 sets of door components, 601 first lifting component, 602 baffle. Detailed Implementation

[0031] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0032] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or assembly referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more features. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0033] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a link, or a specific connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the connection within two groups. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0035] like Figures 1-7As shown, this utility model proposes a wafer cleaning device for cleaning the upper and lower surfaces of a wafer. The wafer cleaning device includes a body 100 and a deflection mechanism 200, a spraying mechanism 300, a first cleaning mechanism 400, and a second cleaning mechanism 500 built into the body 100. The deflection mechanism 200 is used to support and rotate the wafer. The spraying mechanism 300 is used to spray a cleaning solution onto the upper and lower surfaces of the wafer. The first cleaning mechanism 400 is positioned above the wafer and is used to clean the upper surface of the wafer. The second cleaning mechanism 500 is positioned below the wafer and is used to clean the lower surface of the wafer.

[0036] The specific implementation method is as follows: the wafer is transported to the deflection mechanism 200 in the wafer cleaning device by an external robotic arm or an automated device with wafer transport function. The deflection mechanism 200 receives the wafer and supports and fixes the wafer inside the body 100. It should be noted that the body 100 is also equipped with a variety of identification sensors (not shown in the figure) for participating in the overall process. Some of these identification sensors are used to identify whether the wafer has entered the body 100, some are used to identify whether the wafer is placed at the deflection mechanism 200 and notify the deflection mechanism 200 to fix the wafer, and some are used to identify the cleanliness of the upper and lower surfaces of the wafer to ensure that the wafer is effectively cleaned.

[0037] The first cleaning unit 400 and the second cleaning unit 500 are respectively placed above and below the wafer to clean the upper and lower surfaces of the wafer. During the cleaning process, the spraying unit 300 will also spray cleaning fluid and other cleaning solutions to improve the cleanliness of the wafer.

[0038] It should be noted that the deflection mechanism 200, the liquid spraying mechanism 300, the first cleaning mechanism 400 and the second cleaning mechanism 500 are all built into the body 100. The body 100 protects these mechanisms and prevents external dust and other impurities from entering the body 100 and affecting the cleaning effect of the wafer.

[0039] In one embodiment of this application, the body 100 includes a cover 101 and a mounting platform 102. The cover 101 covers the mounting platform 102. The deflection mechanism 200, the spraying mechanism 300, the first cleaning mechanism 400 and the second cleaning mechanism 500 are all mounted on the mounting platform 102 and placed inside the cover 101. The cover 101 is provided with at least one transport window 1011.

[0040] In one embodiment of this application, the cleaning mechanism further includes at least one set of door assemblies 600. Each door assembly is mounted on the mounting platform 102 and is used to open and close the corresponding transport window 1011. The door assembly includes a first lifting member 601 and a baffle 602. The first lifting member 601 is connected to the baffle 602 and drives the baffle 602 to cover or open the transport window 1011.

[0041] It should be noted that the housing 101 is provided with two transport windows 1011. These two transport windows 1011 are respectively located on two adjacent side walls of the housing 101. These two transport windows 1011 serve as the window for receiving wafers and the window for outputting wafers, respectively. In actual application, the wafer is input into the housing 101 through one transport window 1011. After the wafer has completed the cleaning process, the wafer is output out of the housing 101 through the other transport window 1011. It should be noted that the wafer transport operation is realized by a robotic arm or automated equipment with wafer transport function outside the equipment. Moreover, the input and output of the wafer do not interfere with each other. By adjusting the transport speed, it can be ensured that the next wafer is input at the same time as the wafer is output, thereby improving the wafer transport efficiency and thus improving the wafer cleaning efficiency.

[0042] In one embodiment of this application, the first cleaning mechanism 400 includes a dual-axis drive assembly 401, a first crossbeam frame 402, a first shaft drive member 403, and a first cleaning roller 404. The first crossbeam frame 402 is drivenly connected to the dual-axis drive assembly 401 and moves within the machine body 100 under the drive of the dual-axis drive assembly 401. The first shaft drive member 403 is mounted on the first crossbeam frame 402. The first cleaning roller 404 is rotatably mounted on the first crossbeam frame 402 and drivenly connected to the first shaft drive member 403.

[0043] See appendix Figure 1 and appendix Figure 4 It should be noted that the dual-axis drive assembly 401 consists of drive components for the X-axis and Z-axis. Its structure mainly consists of a linear motor and a conveyor rail. The first crossbeam 402 is fixed on the Z-axis drive component and passes through the inside of the housing 101 and is mounted above the wafer. The first crossbeam 402 is respectively equipped with a first axis drive component 403 and a first cleaning roller 404. The first cleaning roller 404 is drivenly connected to the first axis drive component 403 to realize the axis rotation of the first cleaning roller 404. Under the combined drive of the X-axis drive component and the Z-axis drive component, the first cleaning roller 404 approaches the upper surface of the wafer to perform cleaning operations. The wafer rotates under the drive of the deflection mechanism 200, so that the first cleaning roller 404 can completely clean the entire upper surface of the wafer, improving the cleaning effect of the wafer.

[0044] In one embodiment of this application, the first cleaning mechanism 400 further includes a grinding table 405 and a cleaning nozzle 406. The grinding table 405 is used to grind the first cleaning roller 404, and the cleaning nozzle 406 is used to spray cleaning liquid onto the grinding table 405 to clean the first cleaning roller 404.

[0045] It should be noted that after cleaning multiple wafers, the first cleaning roller 404 will have some dirt and even wear on it. If it continues to be used, the cleaning effect of subsequent wafers will be greatly reduced, affecting the yield of subsequent wafers. Therefore, the first cleaning roller 404 will be moved to the grinding table 405 for grinding periodically, and cleaning solution will be sprayed onto the first cleaning roller 404 through the cleaning nozzle 406 to maintain and clean the first cleaning roller 404, improve its service life, and ensure the cleanliness of the wafers, thus guaranteeing the yield of subsequent wafers.

[0046] In one embodiment of this application, the second cleaning mechanism 500 includes a second lifting member 501, a second crossbeam frame 502, a second shaft drive member 503, and a second cleaning roller 504. The second crossbeam frame 502 is mounted on the drive end of the second lifting member 501, and under the drive of the second lifting member 501, the second crossbeam frame 502 moves closer to or further away from the wafer. The second shaft drive member 503 is mounted on the second crossbeam frame 502, and the second cleaning roller 504 is rotatably mounted on the second crossbeam frame 502 and drivenly connected to the second shaft drive member 503.

[0047] It should be noted that when the wafer enters the machine body 100 and is fixed on the deflection mechanism 200, it is detected by the identification sensor and the first cleaning mechanism 400 and the second cleaning mechanism 500 are activated to approach the wafer and perform the cleaning operation. The second cleaning mechanism 500 is located below the wafer. When it needs to approach the wafer, the second lifting member 501 drives the second crossbeam 502 to rise, and the second cleaning roller 504 is attached to the lower surface of the wafer. The second crossbeam 502, the second shaft drive member 503, and the second cleaning roller 504 in the second cleaning mechanism 500 are the same as those in the first cleaning mechanism 400, which will not be described in detail here. The second lifting member 501 is formed by a combination of a telescopic cylinder and a guide structure. The guide structure may include a guide rail, a slide, etc., to ensure the stability of the rising or falling movement of the second crossbeam 502. The telescopic cylinder may also be a screw motor, a hydraulic telescopic cylinder, or other structure that drives the second crossbeam 502 to rise and fall.

[0048] In one embodiment of this application, the deflection mechanism 200 includes at least two clamping components 201. Each clamping component 201 includes a first driving part 2011, a second driving part 2012, and at least one clamping part 2013. Each clamping part 2013 and the second driving part 2012 are mounted on the first driving part 2011, and each clamping part 2013 is drivenly connected to the second driving part 2012. Under the drive of the first driving part 2011 in each clamping component 201, the clamping parts 2013 in each clamping component 201 move closer or further away from each other to clamp the wafer. Under the drive of each second driving part 2012, each clamping part 2013 rotates in the same direction about its own axis to drive the wafer to rotate.

[0049] See appendix Figure 5 -Appendix Figure 7 It should be noted that when the wafer is placed at the deflection mechanism 200, it can be clamped and fixed by at least two clamping components 201. In this embodiment, there are two clamping components 201, which are arranged opposite to each other, so that the two clamping components 201 are like claws. When they are close to each other, they clamp the wafer. When they are far apart, the wafer loses its clamping. Of course, here the wafer only loses its clamping, and the supporting force of the two clamping components 201 on the wafer still exists.

[0050] There are two clamping parts 2013, so that the two clamping components 201 have four clamping parts 2013. The four clamping parts 2013 are located at the four ends of the wafer. The clamping parts 2013 rotate independently under the drive of the second drive part 2012. It should be noted that the four clamping parts 2013 rotate in the same direction to ensure that the wafer is driven to rotate in one direction.

[0051] In one embodiment of this application, there is a guide rail 20111, a first driving member 20112, and a slide 20113. The guide rail 20111 is mounted on the mounting platform 102, the first driving member 20112 is mounted on the mounting platform 102, and the slide 20113 is slidably mounted on the guide rail 20111 and drivenly connected to the first driving member 20112. Under the drive of the first driving member 20112, the slide 20113 moves along the direction of the guide rail 20111. Each clamping part 2013 is rotatably mounted on the slide 20113, and the second driving part 2012 is mounted on the slide 20113.

[0052] In one embodiment of this application, the clamping part 2013 includes a rotating shaft 20131, a transmission wheel 20132, and a clamping wheel 20133. The rotating shaft 20131 is rotatably mounted on the slide table 20113. The transmission wheel 20132 and the clamping wheel 20133 are respectively mounted on the two ends of the rotating shaft 20131. The clamping wheel 20133 is used to abut against the edge of the wafer. The second driving part 2012 includes a driving motor. The driving motor is drivenly connected to the transmission wheel 20132 to drive the rotating shaft 20131 to rotate.

[0053] It should be noted that a support platform is provided on one end of the rotating shaft 20131 where the clamping wheel 20133 is installed. This support platform is used to abut against the lower edge of the wafer. The support platform has a certain width to ensure that when the clamping part 2013 is away from the wafer, the support platform still has an area that abuts against the lower surface of the wafer, thus maintaining support for the wafer. Each clamping part 2013 is close to each other, and the clamping wheel 20133 on it is close to and abuts against the edge of the wafer. When the entire rotating shaft 20131 is driven to rotate, the clamping wheel 20133 drives the wafer to rotate, so as to cooperate with the first cleaning mechanism 400 and the second cleaning mechanism 500 to clean the wafer and ensure the cleaning effect of the wafer.

[0054] In one embodiment of this application, the spraying mechanism 300 includes a plurality of sprayers 301 for spraying cleaning fluid. Each sprayer 301 is installed inside the housing 101 and is respectively positioned above and below the wafer to spray the cleaning fluid onto the upper and lower surfaces of the wafer.

[0055] See appendix Figure 3 It should be noted that the sprayer 301 can be a nozzle or a spray pipe with multiple spray holes, which are respectively set above and below the wafer to spray the corresponding cleaning solution onto the upper and lower surfaces of the wafer, and cooperate with the first cleaning mechanism 400 and the second cleaning mechanism 500 to perform the cleaning operation.

[0056] In this embodiment, an ultrasonic instrument is also included. The ultrasonic instrument is set inside the machine body 100 and placed next to the wafer. Together with the liquid spraying mechanism 300, the first cleaning mechanism 400 and the second cleaning mechanism 500, the ultrasonic instrument cleans the wafer to remove micro and nano particles on the wafer and improve the cleaning effect of the wafer.

[0057] The above description provides one or more embodiments in conjunction with specific content, but it is not intended that the specific implementation of this utility model is limited to these descriptions. Any methods or structures that are similar to or identical to those of this utility model, or any technical deductions or substitutions made based on the concept of this utility model, should be considered within the scope of protection of this utility model.

Claims

1. A wafer cleaning apparatus for cleaning the upper and lower surfaces of a wafer, characterized in that, It includes a body (100) and a deflection mechanism (200), a liquid spraying mechanism (300), a first cleaning mechanism (400) and a second cleaning mechanism (500) built into the body (100); The deflection mechanism (200) is used to support the wafer and rotate the wafer; The spraying mechanism (300) is used to spray liquid onto the upper and lower surfaces of the wafer; The first cleaning mechanism (400) is positioned above the wafer and is used to clean the upper surface of the wafer; The second cleaning mechanism (500) is positioned below the wafer and is used to clean the lower surface of the wafer.

2. The wafer cleaning apparatus according to claim 1, characterized in that, The body (100) includes a cover (101) and a mounting platform (102). The cover (101) covers the mounting platform (102). The deflection mechanism (200), the spraying mechanism (300), the first cleaning mechanism (400) and the second cleaning mechanism (500) are all mounted on the mounting platform (102) and placed inside the cover (101). The cover (101) is provided with at least one transport window (1011).

3. The wafer cleaning apparatus according to claim 2, characterized in that, It also includes at least one set of door assemblies (600), each of which is mounted on the mounting platform (102) and used to open and close the corresponding transport window (1011). Each door assembly includes a first lifting member (601) and a baffle (602). The first lifting member (601) is connected to the baffle (602) and drives the baffle (602) to cover or open the transport window (1011).

4. The wafer cleaning apparatus according to claim 2, characterized in that, The first cleaning mechanism (400) includes: Dual-axis drive assembly (401); The first crossbeam frame (402) is drivenly connected to the dual-axis drive assembly (401) and moves within the body (100) under the drive of the dual-axis drive assembly (401). The first shaft drive unit (403) is mounted on the first crossbeam frame (402); The first cleaning roller (404) is rotatably mounted on the first crossbeam frame (402) and is drivenly connected to the first shaft drive (403).

5. A wafer cleaning apparatus according to claim 4, characterized in that, The first cleaning mechanism (400) further includes a grinding table (405) and a cleaning nozzle (406). The grinding table (405) is used to grind the first cleaning roller (404), and the cleaning nozzle (406) is used to spray cleaning liquid onto the grinding table (405) to clean the first cleaning roller (404).

6. A wafer cleaning apparatus according to claim 2, characterized in that, The second cleaning mechanism (500) includes: Second lifting component (501); The second crossbeam (502) is installed on the drive end of the second lifting member (501), and under the drive of the second lifting member (501), the second crossbeam (502) moves closer to or further away from the wafer. The second shaft drive unit (503) is mounted on the second crossbeam frame (502); The second cleaning roller (504) is rotatably mounted on the second crossbeam frame (502) and drivenly connected to the second shaft drive member (503).

7. A wafer cleaning apparatus according to claim 2, characterized in that, The deflection mechanism (200) includes at least two clamping assemblies (201). Each clamping assembly (201) includes a first driving part (2011), a second driving part (2012), and at least one clamping part (2013). Each clamping part (2013) and the second driving part (2012) are mounted on the first driving part (2011). Each clamping part (2013) is driven to connect with the second driving part (2012). Under the drive of the first driving part (2011) in each clamping assembly (201), the clamping parts (2013) in each clamping assembly (201) move closer or further away from each other to clamp the wafer. Under the drive of each second driving part (2012), each clamping part (2013) rotates in the same direction around its own axis to drive the wafer to rotate.

8. A wafer cleaning apparatus according to claim 7, characterized in that, The first drive unit (2011) includes: The guide rail (20111) is mounted on the mounting platform (102); The first driving component (20112) is mounted on the mounting platform (102); A slide table (20113) is slidably mounted on the guide rail (20111) and drivenly connected to the first driving member (20112), wherein the slide table (20113) moves along the direction of the guide rail (20111) under the drive of the first driving member (20112). Each of the clamping parts (2013) is rotatably mounted on the slide (20113), and the second driving part (2012) is mounted on the slide (20113).

9. A wafer cleaning apparatus according to claim 8, characterized in that, The clamping part (2013) includes a rotating shaft (20131), a transmission wheel (20132), and a clamping wheel (20133). The rotating shaft (20131) is rotatably mounted on the slide table (20113). The transmission wheel (20132) and the clamping wheel (20133) are respectively mounted on the two ends of the rotating shaft (20131). The clamping wheel (20133) is used to abut against the edge of the wafer. The second driving part (2012) includes a driving motor. The driving motor is drivenly connected to the transmission wheel (20132) to drive the rotating shaft (20131) to rotate.

10. A wafer cleaning apparatus according to claim 2, characterized in that, The spraying mechanism (300) includes a plurality of sprayers (301) for spraying cleaning fluid. Each sprayer (301) is installed inside the housing (101) and is respectively positioned above and below the wafer to spray the cleaning fluid onto the upper and lower surfaces of the wafer.

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