Electroplating float and electroplating device

Abstract

The utility model discloses a kind of electroplating floating frame and electroplating device, it is related to circuit board manufacturing technical field, wherein, electroplating floating frame includes two side plates, connecting plate, multiple first reinforcing plates and draw strip, two side plates are vertically arranged and are arranged along horizontal direction interval, two side plates are equipped with multiple round holes, connecting plate is horizontally arranged and is connected between two side plates, multiple first reinforcing plates connect the inner side wall of side plate with the upper side wall of connecting plate, the upper side wall between each first reinforcing plate and connecting plate forms clamping groove, multiple first reinforcing plates are arranged interval along the length direction of electroplating floating frame, draw strip is transversely inserted in clamping groove, draw strip extends along the length direction of electroplating floating frame, the top of draw strip is equipped with limit slot, electroplating floating frame positions circuit board through the limit slot of draw strip, draw strip can be worn with circuit board scratch, since draw strip is detachable replacement, only draw strip needs to be replaced each time, entire electroplating floating frame does not need to be replaced, so as to can reduce production cost.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and in particular to an electroplating float and an electroplating device. Background Technology

[0002] Electroplating is an important process in circuit board manufacturing. The electroplating process generally uses a vertical gantry electroplating device. The vertical gantry electroplating device uses clamps to hold the circuit board and sets up an electroplating float in the electroplating tank. The electroplating float is usually made of PP board, so it floats on the surface of the electroplating solution. During the circuit board electroplating process, the circuit board presses down on the electroplating float, and the electroplating float is pressed into the electroplating solution. The baffles on both sides of the electroplating float block the electric current lines, thereby preventing the current at the lower end of the circuit board from being too large and causing it to be too thick.

[0003] The existing electroplating float is worn out due to frequent rubbing against the bottom of the circuit board, requiring frequent replacement of the entire electroplating float, which results in high production costs. Utility Model Content

[0004] This utility model aims to solve the technical problems existing in the prior art. To this end, this utility model proposes an electroplating float and an electroplating device. The electroplating float positions the circuit board through a pull strip. The pull strip will scratch the circuit board and cause wear. Since the pull strip is detachable and replaceable, only the pull strip needs to be replaced each time, thereby reducing production costs.

[0005] According to a first aspect of the present invention, an electroplating float includes:

[0006] Two side plates are vertically arranged and spaced apart in the horizontal direction, and both side plates are provided with multiple round holes;

[0007] A connecting plate, horizontally positioned and connected between the two side plates;

[0008] Multiple first reinforcing plates connect the inner sidewall of the side plate to the upper sidewall of the connecting plate. A groove is formed between each first reinforcing plate and the upper sidewall of the connecting plate. The multiple first reinforcing plates are spaced apart along the length direction of the electroplating float.

[0009] A drawbar is inserted laterally into the slot. The drawbar extends along the length of the electroplating float. A limiting groove is provided at the top of the drawbar, which is used to cooperate with the lower end of the circuit board.

[0010] The electroplating float according to the present utility model has at least the following beneficial effects: When in use, the electroplating float is suspended on the electroplating liquid in the electroplating tank, and the lower end of the circuit board is inserted into the limiting groove of the pull strip to position the circuit board. During the electroplating process, the pull strip will scrape against the circuit board and cause wear. Since the pull strip can be disassembled and replaced, it is only necessary to pull out and replace the pull strip each time, without replacing the entire electroplating float, thereby reducing production costs.

[0011] In some embodiments, the electroplating float further includes two second reinforcing plates, which are vertically arranged and spaced apart in the horizontal direction. The second reinforcing plates extend along the length of the electroplating float and are connected to a plurality of first reinforcing plates as a whole.

[0012] In some embodiments, the plurality of circular holes are divided into four groups, and the plurality of circular holes in each group are arranged at intervals along the length direction of the side plate, and the four groups of circular holes are arranged along the height direction of the side plate.

[0013] In some embodiments, the first reinforcing plate is triangular.

[0014] In some embodiments, the electroplating float further includes two end plates, which are located at both ends of the side plate along its length. The two end plates are vertically arranged and connected between the two side plates. One of the end plates is provided with an insertion hole, and the pull strip is inserted laterally into the insertion hole.

[0015] In some embodiments, the upper inner wall of the insertion hole is provided with a first protrusion, the bottom of the first protrusion is provided with a first guide slope facing the pull strip, the distance between the first guide slope and the pull strip gradually decreases along the direction in which the pull strip is inserted into the insertion hole, the top of the pull strip is provided with a second protrusion, the top of the second protrusion is provided with a second guide slope, the second guide slope is parallel to the first guide slope, and the second protrusion abuts against the first protrusion to restrict the pull strip from leaving the insertion hole.

[0016] In some embodiments, the first boss has a first arc-shaped surface near the edge of the second boss, and the second boss has a second arc-shaped surface near the edge of the first boss, with the first arc-shaped surface abutting against the second arc-shaped surface.

[0017] In some embodiments, the outer side wall of the end plate is provided with a horizontally arranged positioning lug, the positioning lug being provided with a U-shaped positioning groove, the U-shaped positioning groove being used to cooperate with the positioning rod.

[0018] An electroplating apparatus according to a second aspect embodiment of the present invention includes:

[0019] Electroplating tank;

[0020] An electroplating rack is located above the electroplating tank and is used to suspend circuit boards;

[0021] The electroplating float described in the first aspect embodiment is disposed within the electroplating tank.

[0022] The electroplating apparatus according to the embodiments of the present utility model, since it includes the electroplating float of the first aspect embodiment, has at least the above-mentioned beneficial effects, which will not be repeated here.

[0023] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0025] Figure 1 This is a schematic diagram of the structure of the electroplating float according to some embodiments of the present invention;

[0026] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0027] Figure 3 This is a schematic diagram of the electroplating float in the pulled-out state according to some embodiments of the present invention;

[0028] Figure 4 This is a cross-sectional view of an electroplating float according to some embodiments of the present invention;

[0029] Figure 5 This is a front view of an electroplating float according to some embodiments of the present invention;

[0030] Figure 6 This is a top view of an electroplating float according to some embodiments of the present invention;

[0031] Figure 7 This is a cross-sectional view of an electroplating float according to some embodiments of the present invention;

[0032] Figure 8 for Figure 7 Enlarged view of point B in the middle;

[0033] Figure 9 This is a cross-sectional view of an electroplating apparatus according to some embodiments of the present invention.

[0034] Figure label:

[0035] Electroplating floating frame 1000;

[0036] Side plate 10, round hole 11;

[0037] Connecting plate 20;

[0038] First reinforcing plate 30, slot 31;

[0039] 40, a pull strip; 41, a limiting groove; 42, a second boss; 43, a second guide slope; 44, a second arc-shaped surface.

[0040] Second reinforcing plate 50;

[0041] End plate 60, insertion hole 61, first boss 62, first guide slope 63, first arc surface 64, positioning lug 65, U-shaped positioning groove 66;

[0042] Electroplating tank 70;

[0043] Electroplating hangers 80. Detailed Implementation

[0044] In PCB manufacturing, electroplating uniformity is a crucial indicator of plating quality. For production, the uniformity of copper plating directly impacts the subsequent fabrication and formation of precision circuitry. With the increasing demand for high-density PCBs, the requirements for copper thickness uniformity are inevitably rising. Improving and enhancing electroplating uniformity has become an urgent issue. While traditional vertical gantry electroplating lines offer advantages in capacity and control, they have inherent limitations in plating uniformity. The rationality of equipment design significantly influences plating uniformity. When designing and purchasing an electroplating line, we should consider plating uniformity issues in advance, or explore the feasibility of small-scale modifications during later stages to meet the requirements of maintaining or improving uniformity during mass production. Smaller copper thickness variations and better uniformity mean better quality and more stable product performance for customers, lower production costs for the company, fewer customer complaints, and higher customer satisfaction.

[0045] The existing floating frame has a radius (R) of ≤15µm and a COV (average error) of ≤12%, but the range and COV are relatively high. As the line width / spacing of the boards decreases, the requirements for the boards become increasingly stringent, and the range has a growing impact on board quality. A smaller range results in better quality and lower costs associated with wasted copper balls. Furthermore, the existing floating frame design is prone to damage after prolonged use due to break-in with the production boards, leading to a shorter service life and wasted costs when replacing it with a new one.

[0046] Based on this, refer to Figure 1 and Figure 4 As shown, this utility model embodiment provides an electroplating float 1000, which is made of PP material and includes two side plates 10, a connecting plate 20, multiple first reinforcing plates 30, and drawstrings 40.

[0047] Specifically, refer to Figure 1 and Figure 4 As shown, two side plates 10 are vertically arranged and spaced apart horizontally. The two side plates 10 are made of PP material and can block some of the electric field lines. Since the electric field lines are relatively dense at the bottom of the circuit board during electroplating, the two side plates 10 can weaken some of the electric field lines, thereby improving the uniformity of the electric field lines. Each side plate 10 has multiple circular holes 11. The position of the circular holes 11 is adjusted according to the distribution of electric field lines in the magnetic field at the bottom, thus adjusting the uniformity of the electric field lines. Based on the density of the magnetic field distribution at the anode and cathode and the corresponding area of ​​the anode, the side plates 10 can adjust the density of the electric field lines. The electroplating solution can also enter the electroplating float through the circular holes 11. A connecting plate 20 is horizontally arranged and connected between the two side plates 10. Multiple first reinforcing plates 30 connect the inner wall of the side plate 10 to the upper wall of the connecting plate 20. A groove 31 is formed between each first reinforcing plate 30 and the upper wall of the connecting plate 20. Two of the first reinforcing plates 30 are spaced apart along the width direction of the electroplating float, and the groove 31 is located between the two first reinforcing plates 30. (Refer to...) Figure 6 As shown, multiple first reinforcing plates 30 are spaced apart along the length of the electroplating float. The first reinforcing plates 30 are mainly used to strengthen the structural strength of the electroplating float.

[0048] Reference Figure 4 As shown, the drawer 40 is horizontally inserted into the slot 31. The drawer 40 extends along the length of the electroplating float. A limiting groove 41 is provided at the top of the drawer 40, which is used to engage with the lower end of the circuit board (production board). Figure 3 As shown, strip 40 can be pulled out laterally.

[0049] Reference Figure 9 As shown, this embodiment of the present invention also provides an electroplating apparatus, which includes an electroplating tank 70, an electroplating rack 80, and the aforementioned electroplating float. The electroplating rack 80 is located above the electroplating tank 70 and is used to suspend the circuit board, while the electroplating float is disposed within the electroplating tank 70. The cathode and anode are respectively located on both sides of the electroplating float along its width direction.

[0050] Reference Figure 9 As shown, when using the electroplating float of this embodiment, the electroplating float is suspended on the electroplating liquid in the electroplating tank 70. The lower end of the circuit board is inserted into the limiting groove 41 of the pull strip 40 to position the circuit board. During the electroplating process, the pull strip 40 will scrape against the circuit board and cause wear. Since the pull strip 40 can be pulled out for replacement, only the pull strip 40 needs to be replaced each time, instead of replacing the entire electroplating float, thereby reducing production costs.

[0051] The existing electroplating float has a radius (R) of 15µm (Max-Min) and a COV (Coefficient of Variation) of 6.2%, which are relatively high. As the line width / spacing of existing circuit boards becomes increasingly smaller, the requirements for the boards become more stringent, and the range of variation has a greater impact on board quality. A smaller range of variation results in better quality and lower costs associated with wasted copper balls. In contrast, the electroplating float in this embodiment has a radius of 12µm and a COV of 4.7%, representing a significant improvement.

[0052] Reference Figure 4 As shown, in some embodiments, the electroplating float further includes two second reinforcing plates 50. The two second reinforcing plates 50 are vertically arranged and spaced apart in the horizontal direction. The bottom of the second reinforcing plate 50 is integrally connected to the connecting plate 20. The second reinforcing plate 50 extends along the length direction of the electroplating float and is integrally connected to a plurality of first reinforcing plates 30. The second reinforcing plates 50 and the first reinforcing plates 30 work together to further improve the overall structural strength of the electroplating float.

[0053] Reference Figure 1 and Figure 5 As shown, in some embodiments, the plurality of circular holes 11 are divided into four groups, which can be understood as four rows of circular holes 11. The plurality of circular holes 11 in each group are arranged at intervals along the length direction of the side plate 10, and the four groups of circular holes 11 are arranged at intervals along the height direction of the side plate 10. This makes the position of the circular holes 11 better match the electric field lines of the magnetic field at the bottom position.

[0054] Reference Figure 4 As shown, in some embodiments, the first reinforcing plate 30 is triangular and has greater structural strength. For two first reinforcing plates 30 arranged opposite each other along the width direction of the electroplating float, the distance between the two first reinforcing plates 30 gradually decreases from top to bottom, thereby avoiding the circuit board and increasing the distance between the first reinforcing plate 30 and the circuit board.

[0055] Reference Figure 1 and Figure 2 As shown, in some embodiments, the electroplating float also includes two end plates 60, which are located at both ends of the side plate 10 along the length direction. The two end plates 60 are vertically arranged and connected between the two side plates 10. One of the end plates 60 is provided with an insertion hole 61, and the pull strip 40 is inserted laterally into the insertion hole 61. The other end plate 60 can limit the pull strip 40.

[0056] Reference Figure 7 and Figure 8As shown, in some embodiments, the upper inner wall of the insertion hole 61 is provided with a first protrusion 62, the bottom of the first protrusion 62 is provided with a first guide slope 63 facing the pull tab 40, and the distance between the first guide slope 63 and the pull tab 40 gradually decreases along the direction in which the pull tab 40 is inserted into the insertion hole 61. The top of the pull tab 40 is provided with a second protrusion 42, the top of the second protrusion 42 is provided with a second guide slope 43, the second guide slope 43 is parallel to the first guide slope 63, and the second protrusion 42 abuts against the first protrusion 62 to restrict the pull tab 40 from leaving the insertion hole 61.

[0057] In this embodiment, when the pull strip 40 is inserted into the socket 61, the first guide slope 63 and the second guide slope 43 abut against each other, which plays a guiding role and facilitates the insertion of the pull strip 40 into the socket 61. After the pull strip 40 is inserted into place, the second boss 42 abuts against the first boss 62 and locks it in place, thereby limiting the pull strip 40 and making it difficult for the pull strip 40 to fall out of the socket 61.

[0058] Reference Figure 8 As shown, in some embodiments, the first boss 62 has a first arc-shaped surface 64 near the edge of the second boss 42, and the second boss 42 has a second arc-shaped surface 44 near the edge of the first boss 62. The first arc-shaped surface 64 and the second arc-shaped surface 44 abut against each other. Both the first arc-shaped surface 64 and the second arc-shaped surface 44 can be circular arc surfaces or other transitional curved surfaces. This arrangement allows for less resistance from the second boss 42 to the pull strip 40 when it is pulled out, facilitating the pull strip 40's removal while simultaneously maintaining a certain limiting force to prevent the pull strip 40 from disengaging from the insertion hole 61 during the electroplating process.

[0059] Reference Figure 3 As shown, in some embodiments, the outer side wall of the end plate 60 is provided with a horizontally arranged positioning lug 65, and the positioning lug 65 is provided with a U-shaped positioning groove 66. The U-shaped groove is used to cooperate with the positioning rod. The positioning rod is set vertically and its position is fixed, so that the electroplating float can be positioned and the electroplating float can be prevented from moving arbitrarily along the width direction of the electroplating float.

[0060] The embodiments of this utility model have been described in detail above. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0061] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0062] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0063] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0064] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. An electroplating floating frame, characterized in that, include: Two side plates are vertically arranged and spaced apart in the horizontal direction, and both side plates are provided with multiple round holes; A connecting plate, horizontally positioned and connected between the two side plates; Multiple first reinforcing plates connect the inner sidewall of the side plate to the upper sidewall of the connecting plate. A groove is formed between each first reinforcing plate and the upper sidewall of the connecting plate. The multiple first reinforcing plates are spaced apart along the length direction of the electroplating float. A drawbar is inserted laterally into the slot. The drawbar extends along the length of the electroplating float. A limiting groove is provided at the top of the drawbar, which is used to cooperate with the lower end of the circuit board.

2. The electroplating floating frame according to claim 1, characterized in that, The electroplating float also includes two second reinforcing plates, which are vertically arranged and spaced apart in the horizontal direction. The second reinforcing plates extend along the length of the electroplating float and are connected to multiple first reinforcing plates as a whole.

3. The electroplating floating frame according to claim 1, characterized in that, The plurality of circular holes are divided into four groups, and the plurality of circular holes in each group are arranged at intervals along the length direction of the side plate, and the four groups of circular holes are arranged along the height direction of the side plate.

4. The electroplating floating frame according to claim 1, characterized in that, The first reinforcing plate is triangular.

5. The electroplating floating frame according to claim 1, characterized in that, The electroplating float also includes two end plates, which are located at both ends of the side plate along its length. The two end plates are vertically arranged and connected between the two side plates. One of the end plates is provided with an insertion hole, and the pull strip is inserted horizontally into the insertion hole.

6. The electroplating floating frame according to claim 5, characterized in that, The upper inner wall of the insertion hole is provided with a first protrusion. The bottom of the first protrusion is provided with a first guide slope facing the pull strip. Along the direction in which the pull strip is inserted into the insertion hole, the distance between the first guide slope and the pull strip gradually decreases. The top of the pull strip is provided with a second protrusion. The top of the second protrusion is provided with a second guide slope. The second guide slope is parallel to the first guide slope. The second protrusion abuts against the first protrusion to prevent the pull strip from leaving the insertion hole.

7. The electroplating floating frame according to claim 6, characterized in that, The first boss has a first arc-shaped surface near the edge of the second boss, and the second boss has a second arc-shaped surface near the edge of the first boss. The first arc-shaped surface abuts against the second arc-shaped surface.

8. The electroplating floating frame according to claim 5, characterized in that, The outer side wall of the end plate is provided with a horizontally arranged positioning lug, and the positioning lug is provided with a U-shaped positioning groove, which is used to cooperate with the positioning rod.

9. An electroplating apparatus, characterized in that, include: Electroplating tank; An electroplating rack is located above the electroplating tank and is used to suspend circuit boards; The electroplating float according to any one of claims 1 to 8 is disposed in the electroplating tank.

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