Converter heat dissipation structure and converter device

By employing a liquid-cooled unit supplied with a refrigerant source and a heat dissipation structure with thermally conductive connections in the converter equipment, the problem of dispersed arrangement of different heat-generating devices is solved, achieving a compact and efficient heat dissipation effect and a simplified assembly process.

CN224356480UActive Publication Date: 2026-06-12HOYMILES POWER ELECTRONICS INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HOYMILES POWER ELECTRONICS INC
Filing Date
2025-04-07
Publication Date
2026-06-12

AI Technical Summary

Technical Problem

In converter equipment, different heat-generating devices are scattered, making it difficult to dissipate heat efficiently at the same time. Existing heat dissipation systems are complex in structure and difficult to assemble.

Method used

The liquid cooling unit, which is supplied by a refrigerant source, the power conversion unit and the energy storage inductor are stacked along the direction of the liquid cooling unit and are thermally connected through the first and second cooling surfaces. Combined with the heat conduction box and the support frame, they form a compact heat dissipation structure.

Benefits of technology

Simultaneous heat dissipation of the power conversion unit and energy storage inductor is achieved, the structural layout is optimized, the assembly difficulty and space occupation are reduced, and the heat dissipation efficiency is improved.

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Abstract

This utility model provides a converter heat dissipation structure and converter device. The converter heat dissipation structure includes a refrigerant source, a liquid cooling unit, a power conversion unit, and an energy storage inductor. The liquid cooling unit has a liquid cooling channel connected to the refrigerant source. The power conversion unit, the liquid cooling unit, and the energy storage inductor are stacked sequentially along a first direction of the liquid cooling unit. The liquid cooling unit includes a first cooling surface thermally connected to the power conversion unit and a second cooling surface thermally connected to the energy storage inductor. The converter device includes a power circuit board, an EMI board, and the converter heat dissipation structure. The power circuit board and the EMI board are arranged in layers along the first direction.
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Description

Technical Field

[0001] This utility model relates to the field of electrical equipment technology, and in particular to a converter heat dissipation structure and converter equipment. Background Technology

[0002] Converter equipment generates significant heat during operation, with numerous heat-generating components that are dispersed and geographically dispersed. For example, the energy storage inductor and power switch in an inverter both generate substantial heat and require urgent cooling. However, due to their distance from each other, it is difficult to use a single cooling system to cool both simultaneously. In short, existing cooling systems for converter equipment are complex in structure, difficult to assemble, and have limited cooling effectiveness. Utility Model Content

[0003] In view of this, the present invention provides a converter heat dissipation structure suitable for simultaneously cooling the power conversion unit and the energy storage inductor in a converter device.

[0004] The converter heat dissipation structure of this utility model includes a refrigerant source, a liquid cooling unit, a power conversion unit, and an energy storage inductor. The liquid cooling unit has a liquid cooling channel connected to the refrigerant source. The power conversion unit, the liquid cooling unit, and the energy storage inductor are stacked sequentially along a first direction of the liquid cooling unit. The liquid cooling unit includes a first cooling surface that is thermally connected to the power conversion unit and a second cooling surface that is thermally connected to the energy storage inductor.

[0005] The converter heat dissipation structure of this utility model has the following beneficial effects: when the refrigerant source supplies cooling medium to the liquid cooling unit, the power conversion unit and the energy storage inductor in the converter equipment are cooled down by the liquid cooling unit through the first cooling surface and the second cooling surface. The stacked arrangement of the power conversion unit, the liquid cooling unit and the energy storage inductor not only realizes the simultaneous heat dissipation of the power conversion unit and the energy storage inductor, but also makes the whole structure more compact and occupies less space, thus optimizing the structural layout of the converter equipment, reducing the assembly difficulty of the converter heat dissipation structure and reducing assembly time.

[0006] In some implementations, the power conversion unit includes:

[0007] Power switches, multiple power switches thermally connected to a first cooling surface, and;

[0008] The drive circuit board has multiple power switches arranged along the second direction of the liquid cooling unit between the drive circuit board and the first cooling surface.

[0009] In some embodiments, the converter heat dissipation structure further includes a heat-conducting box that is thermally connected to the second cooling surface. The heat-conducting box has a cavity and is filled with thermally conductive adhesive. At least a portion of the energy storage inductor is disposed in the cavity and is covered by the thermally conductive adhesive.

[0010] In some implementations, multiple energy storage inductors and heat conduction boxes are configured, with each heat conduction box containing a portion of an energy storage inductor, and the multiple heat conduction boxes are arranged along the second direction of the liquid cooling unit.

[0011] In some embodiments, the converter heat dissipation structure further includes a support frame, with an installation space between the second cooling surface and the support frame, and multiple heat conduction boxes arranged within the installation space.

[0012] In some embodiments, the support frame is provided with a first positioning pin, and the heat-conducting box has a first positioning hole adapted to the first positioning pin, the first positioning pin being inserted into the first positioning hole; or...

[0013] The heat conduction box is equipped with a second positioning pin, and the support frame is provided with a second positioning hole that is adapted to the second positioning pin. The second positioning pin is inserted into the second positioning hole.

[0014] In some embodiments, the support frame includes a support beam extending along a second direction and spaced apart from the second cooling surface, and two support seats connecting the liquid cooling unit and the support beam, wherein the second cooling surface, the support seats and the support beam enclose an installation space.

[0015] In some embodiments, the liquid cooling unit includes a liquid cooling plate, the first direction being the thickness direction of the liquid cooling plate, the first cooling surface and the second cooling surface being opposite sides of the liquid cooling plate, and the length direction of the liquid cooling plate being the second direction of the liquid cooling plate.

[0016] In some embodiments, the liquid cooling unit further includes an inlet pipe and a return pipe. The same end of the liquid cooling plate has an inlet and an outlet. The inlet pipe is connected to the refrigerant source, and the return pipe is connected to the outlet and the refrigerant source.

[0017] The converter device of this utility model includes a power circuit board, an EMI board, and a converter heat dissipation structure.

[0018] In some embodiments, the power circuit board and the EMI board are arranged in layers along a first direction; and / or,

[0019] The power circuit board covers and connects the side of the liquid cooling unit that is relatively far from the energy storage inductor to the power conversion unit; and / or,

[0020] The converter equipment also includes a partition plate, and the power circuit board, partition plate and EMI board are arranged in layers along the first direction. Attached Figure Description

[0021] Figure 1 This is a first perspective view of a converter heat dissipation structure according to an embodiment of the present invention;

[0022] Figure 2 This is a second perspective view of a converter heat dissipation structure according to an embodiment of the present invention;

[0023] Figure 3 This is a side view of a converter heat dissipation structure according to an embodiment of the present invention;

[0024] Figure 4 This is a perspective view of a converter device according to an embodiment of the present invention;

[0025] Figure 5 This is a side view of a converter device according to an embodiment of the present invention;

[0026] Figure 6 This is a partial structural schematic diagram of a converter heat dissipation structure according to an embodiment of the present invention;

[0027] Figure 7 This is a partial structural schematic diagram of a converter heat dissipation structure according to an embodiment of the present invention;

[0028] Figure 8 This is a schematic diagram of the heat-conducting box of a converter heat dissipation structure according to an embodiment of the present invention;

[0029] Figure 9 This is a schematic diagram of the support frame of the converter heat dissipation structure according to an embodiment of the present invention.

[0030] Explanation of reference numerals in the attached drawings: 10, Liquid cooling unit; 11, Liquid cooling plate; 111, First cooling surface; 112, Second cooling surface; 113, Wing; 1131, First mounting hole; 12, Liquid inlet pipe; 13, Liquid return pipe; 20, Power conversion unit; 21, Power switch; 22, Drive circuit board; 30, Energy storage inductor; 31, Cable; 32, Terminal; 33, Inverter inductor; 40, Heat conduction box; 41, Cavity; 42, Second mounting hole; 43, First positioning hole; 50, Support frame; 51, Support beam; 52, Support base; 53, First positioning pin; 60, Power circuit board; 70, Partition plate; 80, EMI board. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] This utility model provides a converter heat dissipation structure, and also provides a converter device including a power circuit board 60, an EMI board 80, and the converter heat dissipation structure of this utility model. This utility model does not limit the type of converter device to which the converter heat dissipation structure is applicable. The converter device can be an inverter, a rectifier, a DC converter, an AC converter, etc.

[0034] See Figures 1-3 , Figures 4-6 The converter heat dissipation structure of this utility model includes a refrigerant source (not shown), a liquid cooling unit 10, a power conversion unit 20, and an energy storage inductor 30. The refrigerant source provides the refrigerant required for cooling to the liquid cooling unit 10 and forms a refrigerant circulation loop with the liquid cooling unit 10. The liquid cooling unit 10 is responsible for cooling the power conversion unit 20 and the energy storage inductor 30, and has a liquid cooling channel connected to the refrigerant source. Given that different heat-generating devices in existing converter equipment are dispersed and far apart, in the converter heat dissipation structure of this utility model, the power conversion unit 20, the liquid cooling unit 10, and the energy storage inductor 30 are stacked sequentially along a first direction of the liquid cooling unit 10. The liquid cooling unit 10 includes a first cooling surface 111 and a second cooling surface 112 arranged back-to-back. The power conversion unit 20 is thermally connected to the first cooling surface 111, and the energy storage inductor 30 is thermally connected to the second cooling surface 112.

[0035] Specifically, a thermally conductive connection between two physical structures means that the heat of one physical structure can be transferred to the other physical structure in the form of thermal conduction. The thermally conductive connection can be either direct contact between the two physical structures or the placement of other thermally conductive structures between the two physical structures, with the thermally conductive structure acting as an intermediate thermally conductive medium to conduct the heat of one physical structure to the other physical structure.

[0036] With this configuration, the converter heat dissipation structure of this utility model cools the power conversion unit 20 and the energy storage inductor 30 together through the liquid cooling unit 10, achieving efficient utilization of the cooling surface of the liquid cooling unit 10, thereby allowing the refrigerant to fully exert its cooling effect. In addition, the power conversion unit 20 and the energy storage inductor 30 are closer together, and the assembly formed by the two and the energy storage inductor 30 is more compact and occupies less space. The assembly difficulty of the converter heat dissipation structure is reduced and the assembly time required is shortened. Therefore, when the converter heat dissipation structure is used in converter equipment, the structure of the converter equipment and the layout of each functional unit are optimized.

[0037] See Figures 2-3 , Figures 5-6 In some embodiments, the liquid cooling unit 10 includes a liquid cooling plate 11 with a cuboid plate structure. The refrigerant source, liquid cooling channel, and liquid cooling plate 11 form a refrigerant circulation loop. The first direction of the liquid cooling unit 10 is the thickness direction of the liquid cooling plate 11. The direction indicated by arrow F in the figure is the first direction of the liquid cooling unit 10. The first cooling surface 111 and the second cooling surface 112 are the two largest cooling surfaces of the liquid cooling plate 11, which are opposite to each other along the thickness direction of the liquid cooling plate 11. This greatly improves the heat transfer rate between the power conversion unit 20 and the liquid cooling plate 11, and the heat transfer rate between the energy storage inductor 30 and the liquid cooling plate 11. Optionally, the liquid cooling plate 11 is horizontally arranged with its length direction horizontal. The first cooling surface 111 and the second cooling surface 112 are arranged vertically. The refrigerant entering the liquid cooling plate 11 flows horizontally. This arrangement can avoid the refrigerant from being unevenly distributed in the liquid cooling plate 11 due to gravity, ensuring uniform cooling of the power conversion unit 20 and the energy storage inductor 30. In other embodiments, the liquid cooling plate 11 may not be horizontally arranged, and the length direction of the liquid cooling plate 11 may not be horizontal.

[0038] Further, see Figures 1-3 The liquid cooling channel includes an inlet pipe 12 and a return pipe 13. An inlet and an outlet are located at the same end of the liquid cooling plate 11. The two ends of the inlet pipe 12 are connected to the inlet and the refrigerant source, respectively. The two ends of the return pipe 13 are connected to the outlet and the refrigerant source, respectively. The inlet pipe 12 and the return pipe 13 are arranged side-by-side. With this configuration, the refrigerant source, inlet pipe 12, liquid cooling plate 11, and return pipe 13 form a refrigerant circulation loop. The refrigerant flows sequentially from the refrigerant source through the inlet pipe 12, liquid cooling plate 11, and return pipe 13 before returning to the refrigerant source. This results in a more compact overall structure for the converter's heat dissipation, a smaller footprint, and easier integration into the converter equipment.

[0039] See Figures 1-2 , Figure 4 and Figure 5In some embodiments, the power conversion unit 20 includes a drive circuit board 22 and a plurality of power switches 21. The drive circuit board 22 covers the side of the liquid cooling plate 11 facing away from the second cooling surface 112. The plurality of power switches 21 are arranged between the drive circuit board 22 and the first cooling surface 111 along the second direction of the liquid cooling unit 10. The first cooling surface 111 and the plurality of power switches 21 are thermally connected. The second direction of the liquid cooling unit 10 is the length direction of the liquid cooling plate 11, and the direction indicated by arrow S in the figure is the second direction of the liquid cooling unit 10. Optionally, the first direction of the liquid cooling unit 10 is perpendicular to the second direction, the liquid cooling plate 11 and the drive circuit board 22 are arranged horizontally, and the plurality of power switches 21 are arranged in a row along the horizontal direction. With this arrangement, the liquid cooling plate 11 can support more power switches 21, and the power switches 21 can be cooled more directly, effectively and quickly.

[0040] See Figure 2 , Figure 4 , Figures 6-7 In some embodiments, the converter heat dissipation structure further includes a heat-conducting box 40 thermally connected to the second cooling surface 112. The heat-conducting box 40 has a cavity 41 filled with thermally conductive adhesive. At least a portion of the energy storage inductor 30 is located within the cavity 41. The thermally conductive adhesive covers the portion of the energy storage inductor 30 located within the cavity 41 and adheres to and fixes it to the inner wall of the cavity 41. The heat-conducting box 40 can be in direct contact with the second cooling surface 112, or a thermally conductive sheet layer can be attached to it. This configuration creates a larger heat conduction area between the energy storage inductor 30 and the thermally conductive adhesive, and between the thermally conductive adhesive and the heat-conducting box 40. The thermally conductive adhesive, acting as a heat-conducting medium, can more effectively absorb the heat emitted by the energy storage inductor 30, resulting in faster heat dissipation from the energy storage inductor 30. Specifically, Figures 1-3 , Figures 6-8 The converter heat dissipation structure shown is the inverter heat dissipation structure. Figures 4-5 The converter device shown is an inverter device. The energy storage inductor 30 includes a cable 31 and a terminal 32 located outside the cavity 41, and also includes an inverter inductor 33 located inside the cavity 41 and covered with thermally conductive adhesive. The terminal 32 and the inverter inductor 33 are connected by the cable 31.

[0041] Furthermore, multiple energy storage inductors 30 and heat conduction boxes 40 are configured in equal numbers. These multiple heat conduction boxes 40 are arranged along the second direction of the liquid cooling unit 10. The inverter inductor 33 of each energy storage inductor 30 is individually housed within the cavity 41 of a heat conduction box 40 and is covered by thermally conductive adhesive within that heat conduction box 40. This configuration ensures that each heat conduction box 40 and the thermally conductive adhesive within it are solely responsible for absorbing and conducting the heat of its own inverter inductor 33, thus preventing the inverter inductor 33 of each energy storage inductor 30 from being affected by the heat of other energy storage inductors 30. Multiple heat-conducting boxes 40 respectively accommodate multiple inverter inductors 33, overcoming the difficulty of forming a thermally conductive connection between the inverter inductors 33 and the second cooling surface 112 due to the irregular shape of the inverter inductors 33. Therefore, the second cooling surface 112 can be set as a plane, and the surface of the heat-conducting box 40 used to contact the second cooling surface 112 can also be set as a plane to obtain a better heat dissipation effect. The heat-conducting box 40 can also more stably support the liquid cooling plate 11 and the power conversion unit 20.

[0042] Further, see Figure 2 , Figure 4 , Figures 6-9 The converter heat dissipation structure also includes a support frame 50, with an installation space between the support frame 50 and the second cooling surface 112. Multiple heat conduction boxes 40 are arranged in the installation space along the second direction of the liquid cooling unit 10. Specifically, the support frame 50 includes a support beam 51, a support base 52, and a first positioning pin 53. The support beam 51 is a rectangular plate beam structure. The liquid cooling plate 11 and the support beam 51 extend along the second direction. The second cooling surface 112 is spaced apart from the support beam 51. There are two support bases 52, which are respectively installed at both ends of the support beam 51. The end of each support base 52 that is relatively far from the support beam 51 is connected to the liquid cooling plate 11. The second cooling surface 112, the support base 52, and the support beam 51 together enclose the installation space. One side of each heat conduction box 40 is thermally connected to the second cooling surface 112, and the other side has a first positioning hole 43 adapted to the first positioning pin 53. The first positioning pin 53 is inserted into the first positioning hole 43. With this configuration, the support frame 50 can more stably support the heat conduction box 40, the energy storage inductor 30, the liquid cooling plate 11 and the power conversion unit 20, and the support base 52, the support beam 51 and the first positioning pin 53 can position the heat conduction box 40.

[0043] In some embodiments not shown in the figure, the heat conduction box 40 is fixedly provided with a second positioning pin, and at least one of the support beam 51 and the support base 52 is provided with a second positioning hole adapted to the second positioning pin. The second positioning pin is inserted into the second positioning hole, and the heat conduction box 40 and the support frame 50 are locked and fixed.

[0044] Optionally, see Figures 6-7The liquid cooling plate 11 includes a lateral edge that extends along the second direction of the liquid cooling unit 10. The lateral edge connects the first cooling surface 111 and the second cooling surface 112. The lateral edge has an outwardly protruding wing 113. The wing 113 has a first mounting hole 1131. The heat conduction box 40 has a second mounting hole 42 on the side that is away from the support beam 51 and close to the liquid cooling plate 11. The first mounting hole 1131 and the second mounting hole 42 can be passed through by fasteners. The wing 113 and the heat conduction box 40 can thus be fixedly connected by fasteners. With this configuration, the heat conduction box 40 and the liquid cooling plate 11 are connected by fasteners, and the fasteners restrict the degree of freedom of movement of the heat conduction box 40 relative to the liquid cooling plate 11.

[0045] See Figure 4 and Figure 5 In some embodiments, the converter device further includes a partition plate 70 located between the power circuit board 60 and the EMI board 80. The power circuit board 60, the partition plate 70, and the EMI board 80 are arranged in layers along a first direction of the liquid cooling plate 11. A portion of the power circuit board 60 covers the side of the liquid cooling plate 11 that is relatively far from the energy storage inductor 30 and connects to the power conversion unit 20. Optionally, a portion of the power circuit board 60 is in direct contact with the first cooling surface 111 of the liquid cooling plate 11. The power conversion unit 20 includes a power switch 21 and a drive circuit board 22. The power switch 21 is in direct contact with the power circuit board 60, and the drive circuit board 22 is located on the side of the power switch 21 that is far from the power circuit board 60. The portion of the power circuit board 60 located between the liquid cooling plate 11 and the first cooling surface 111 acts as a heat transfer medium to conduct heat from the power switch 21 to the liquid cooling plate 11. With this arrangement, the liquid cooling plate 11 can simultaneously dissipate heat and cool the power conversion unit 20 and the power circuit board 60, further utilizing the heat absorption capacity of the refrigerant and expanding the cooling efficiency of the liquid cooling unit 10.

[0046] The technical features of the above-described embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present utility model and are not intended to limit the present utility model. Any appropriate changes and variations made to the above embodiments within the scope of the essential spirit of the present utility model shall fall within the scope of protection claimed by the present utility model.

Claims

1. A converter heat dissipation structure, characterized in that, The device includes a refrigerant source, a liquid cooling unit (10), a power conversion unit (20), and an energy storage inductor (30). The liquid cooling unit (10) has a liquid cooling channel connected to the refrigerant source. The power conversion unit (20), the liquid cooling unit (10), and the energy storage inductor (30) are stacked sequentially along a first direction of the liquid cooling unit (10). The liquid cooling unit (10) includes a first cooling surface (111) that is thermally connected to the power conversion unit (20) and a second cooling surface (112) that is thermally connected to the energy storage inductor (30).

2. The converter heat dissipation structure as described in claim 1, characterized in that, The power conversion unit (20) includes: Multiple power switches (21), the multiple power switches (21) being thermally connected to the first cooling surface (111), and; A drive circuit board (22) and a plurality of power switches (21) are arranged along the second direction of the liquid cooling unit (10) between the drive circuit board (22) and the first cooling surface (111).

3. The converter heat dissipation structure as described in claim 1, characterized in that, The converter heat dissipation structure also includes a heat-conducting box (40) that is thermally connected to the second cooling surface (112). The heat-conducting box (40) has a cavity (41) and the cavity (41) is filled with thermally conductive adhesive. At least part of the energy storage inductor (30) is disposed in the cavity (41) and is covered by the thermally conductive adhesive.

4. The converter heat dissipation structure as described in claim 3, characterized in that, Multiple energy storage inductors (30) and multiple heat conduction boxes (40) are configured. Each heat conduction box (40) contains a portion of an energy storage inductor (30). Multiple heat conduction boxes (40) are arranged along the second direction of the liquid cooling unit (10).

5. The converter heat dissipation structure as described in claim 4, characterized in that, The converter heat dissipation structure also includes a support frame (50), and there is an installation space between the second cooling surface (112) and the support frame (50), and a plurality of the heat conduction boxes (40) are arranged in the installation space.

6. The converter heat dissipation structure as described in claim 5, characterized in that, The support frame (50) is provided with a first positioning pin (53), and the heat conduction box (40) is provided with a first positioning hole (43) adapted to the first positioning pin (53), and the first positioning pin (53) is inserted into the first positioning hole (43); or, The heat-conducting box (40) is provided with a second positioning pin, and the support frame (50) is provided with a second positioning hole adapted to the second positioning pin, and the second positioning pin is inserted into the second positioning hole.

7. The converter heat dissipation structure as described in claim 5, characterized in that, The support frame (50) includes a support beam (51) extending along the second direction and spaced apart from the second cooling surface (112), and also includes two support seats (52) connecting the liquid cooling unit (10) and the support beam (51). The second cooling surface (112), the support seats (52) and the support beam (51) enclose the installation space.

8. The converter heat dissipation structure as described in any one of claims 1 to 7, characterized in that, The liquid cooling unit (10) includes a liquid cooling plate (11), the first direction is the thickness direction of the liquid cooling plate (11), the first cooling surface (111) and the second cooling surface (112) are opposite sides of the liquid cooling plate (11), and the length direction of the liquid cooling plate (11) is the second direction of the liquid cooling plate (11).

9. The converter heat dissipation structure as described in claim 8, characterized in that, The liquid cooling unit (10) also includes an inlet pipe (12) and a return pipe (13). The liquid cooling plate (11) has an inlet and an outlet at the same end. The inlet pipe (12) connects the inlet to the refrigerant source, and the return pipe (13) connects the outlet to the refrigerant source.

10. A converter device, characterized in that, Includes a power circuit board (60), an EMI board (80), and a converter heat dissipation structure as described in any one of claims 1 to 9, wherein: The power circuit board (60) and the EMI board (80) are arranged in layers along the first direction; and / or, The power circuit board (60) covers and connects to the power conversion unit (20) on the side of the liquid cooling unit (10) that is relatively away from the energy storage inductor (30); and / or, The converter device also includes a partition plate (70), and the power circuit board (60), the partition plate (70) and the EMI board (80) are arranged in layers along the first direction.