A biomimetic honeycomb microchannel and cylindrical pin fin hybrid heat sink

Abstract

This invention discloses a biomimetic honeycomb microchannel and cylindrical pin-fin hybrid heat sink, comprising: a housing with a working fluid inlet and an outlet spaced apart thereon; a plurality of first diversion protrusions, divided into two longitudinally spaced groups, with each group of first diversion protrusions spaced apart from each other within the housing; a plurality of second diversion protrusions, arranged in a honeycomb pattern between the two groups of first diversion protrusions; and a plurality of cylindrical pin-fins, spaced apart from each other in the center of the honeycomb pattern formed by the plurality of second diversion protrusions. This invention, by arranging the first diversion protrusions, second diversion protrusions, and cylindrical pin-fins within the housing to create a flow-disrupting structure, can significantly improve the heat transfer performance of the microchannel heat sink in handling chip hotspots, thereby improving the reliability and lifespan of electronic devices.

Description

Technical Field

[0001] This utility model relates to the field of radiator technology, and in particular to a biomimetic honeycomb microchannel and cylindrical needle fin hybrid radiator. Background Technology

[0002] With the rapid development of electronic technology, the increasing complexity of single-core processor design and the rising dynamic power consumption have driven the development of microprocessor design frameworks towards multi-core technology. The heat flux generated at the core is significantly higher than that in other areas of the microprocessor. These high heat flux areas are called hotspots. The difference in heat flux density between hotspots and other areas creates a large temperature gradient, leading to a significant reduction in the lifespan of the microprocessor. Approximately 55% of electronic device failures are due to inadequate thermal management. The extreme operating temperature of a microprocessor is generally between 86 and 100°C. Literature indicates that beyond this extreme temperature, the processor begins to throttle to reduce heat generation, which limits processor performance. Currently, air cooling technology has reached its limit for electronic devices with high heat dissipation requirements. Some early researchers analyzed the impact of fluid flow properties and heat transfer performance within simple microchannel structures. Due to the dramatic increase in heat flux density in microprocessors and the growing prominence of hotspot problems, simple microchannel heat sinks can no longer meet the heat dissipation demands. Utility Model Content

[0003] The purpose of this invention is to solve the above-mentioned technical problems by providing a biomimetic honeycomb microchannel and cylindrical needle fin hybrid radiator.

[0004] The technical solution of this utility model: a biomimetic honeycomb microchannel and cylindrical needle-fin hybrid radiator, comprising:

[0005] The housing has a working fluid inlet and a working fluid outlet spaced apart on it.

[0006] Several first diversion protrusions are divided into two longitudinally spaced groups, and the first diversion protrusions in each group are arranged in the housing at intervals.

[0007] Several second diversion protrusions are arranged in a honeycomb pattern between the two sets of first diversion protrusions;

[0008] Several cylindrical needle-shaped fins are spaced apart and arranged in the middle of the honeycomb structure formed by several second diversion protrusions.

[0009] Preferably, the box body is provided with a cover plate.

[0010] Preferably, the size of the second diversion protrusion is larger than the size of the cylindrical needle fin.

[0011] Preferably, the first diversion protrusion is a square diversion protrusion.

[0012] Preferably, the second diversion protrusion is a hexagonal diversion protrusion.

[0013] The beneficial effects of this utility model are: by arranging the first diversion protrusion, the second diversion protrusion, and the cylindrical needle fins and other turbulence structures in the housing, this utility model can significantly improve the heat transfer performance of the microchannel heat sink in dealing with chip hotspots, thereby improving the reliability and service life of electronic devices. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0015] Figure 2 This is a cross-sectional view of the internal structure of this utility model;

[0016] Figure 3 This is a partially enlarged view of the hexagonal prism structure array of this utility model;

[0017] Figure 4 This is a partial enlarged view of the central cylindrical needle-wing array of this utility model.

[0018] Reference numerals: Box body 10, working medium inlet 101, working medium outlet 102, cover plate 103, first diversion protrusion 2, second diversion protrusion 3, cylindrical needle fin 4, honeycomb microchannel 5, hot spot area microchannel 6. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Reference Figures 1 to 4 A biomimetic honeycomb microchannel and cylindrical needle-fin hybrid radiator, comprising:

[0021] The housing 10 has a working medium inlet 101 and a working medium outlet 102 spaced apart on it;

[0022] Several first diversion protrusions 2 are divided into two groups with longitudinal spacing, and the first diversion protrusions 2 in each group are arranged in the housing 10 with spacing between each other.

[0023] Several second diversion protrusions 3 are arranged in a honeycomb pattern between two sets of first diversion protrusions 2;

[0024] Several cylindrical needle-fin components 4 are spaced apart and arranged in the honeycomb-like center formed by several second diversion protrusions 3. In this invention, the area where the cylindrical needle-fin components 4 are located is the hot spot area. The gaps between the walls of the several second diversion protrusions 3 form a honeycomb-like microchannel 5. The second diversion protrusions 3 can disrupt the stability of the thermal boundary layer, causing fluid to separate and re-attach within the channels, further disrupting the continuity of the thermal boundary layer. The coolant will continuously separate and re-merge, ensuring thorough mixing of the coolant during flow. Furthermore, due to its multi-walled characteristics, it increases the heat exchange area, thereby significantly improving the overall thermal performance. The several cylindrical needle-fin components 4 form the hot spot area microchannel 6. During heat dissipation, the bottom of the housing 10 is in close contact with the heat dissipation surface of the electronic components. With close contact, the heat from the chip is conducted into the housing 10. The cooling medium flows into the housing 10 from the medium inlet 101, passing through the honeycomb microchannels 5 and the hot spot microchannels 6. The honeycomb microchannels 5 disturb the fluid flow and disrupt the stability of the thermal boundary layer, causing the fluid to separate and reattach within the channel, thus enhancing the mixing effect of the fluid. The cylindrical needle fins 4 further accelerate the fluid flow in the hot spot area, thin the thermal boundary layer, and significantly improve the local heat exchange efficiency. When the cooling medium flows through these structures, it fully absorbs the heat conducted to the heat sink and finally flows out from the medium outlet 102, completing the heat dissipation process.

[0025] As a preferred embodiment of this utility model, it may also have the following additional technical features:

[0026] In this embodiment, the housing 10 is provided with a cover plate 103. Specifically, the bottom of the cover plate 103 is provided with a sealing strip, and the cover plate 103 is detachably connected to the housing 10 by bolts, which facilitates the installation of the first diversion protrusion 2, the second diversion protrusion 3 and the cylindrical needle fin 4.

[0027] In this embodiment, the size of the second diversion protrusion 3 is larger than the size of the cylindrical needle fin 4. Since the size of the cylindrical needle fin structure 4 is smaller than the size of the second diversion protrusion 3, a smaller microchannel structure will be formed in the hot spot area. This will significantly increase the surface area of ​​the hot spot area, thereby enhancing the local heat exchange capacity. The smaller microchannel structure will accelerate fluid flow and reduce the thickness of the thermal boundary layer.

[0028] In this embodiment, the first diversion protrusion 2 is a square diversion protrusion.

[0029] In this embodiment, the second diversion protrusion 3 is a hexagonal diversion protrusion, and the multi-wall characteristic of the second diversion protrusion 3 increases the heat exchange area.

[0030] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A biomimetic honeycomb microchannel and cylindrical needle-fin hybrid radiator, characterized in that, include: The housing (10) has a working medium inlet (101) and a working medium outlet (102) spaced apart on it; Several first diversion protrusions (2) are divided into two groups with longitudinal spacing, and the first diversion protrusions (2) in each group are arranged in the housing (10) with spacing between each other; Several second diversion protrusions (3) are arranged in a honeycomb pattern between two sets of first diversion protrusions (2); Several cylindrical needle-shaped fins (4) are arranged at intervals in the honeycomb-shaped center formed by several second diversion protrusions (3).

2. The biomimetic honeycomb microchannel and cylindrical needle-fin hybrid radiator according to claim 1, characterized in that: The box (10) is provided with a cover plate (103).

3. The biomimetic honeycomb microchannel and cylindrical needle-fin hybrid radiator according to claim 1, characterized in that: The size of the second diversion protrusion (3) is larger than the size of the cylindrical needle fin (4).

4. The biomimetic honeycomb microchannel and cylindrical needle-fin hybrid radiator according to claim 1, characterized in that: The first diversion protrusion (2) is a square diversion protrusion.

5. The biomimetic honeycomb microchannel and cylindrical needle-fin hybrid radiator according to claim 1, characterized in that: The second diversion protrusion (3) is a hexagonal diversion protrusion.

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