A heat dissipation structure for automated testing of semiconductor modules

Abstract

This application provides a heat dissipation structure for automated testing of semiconductor modules, used to dissipate heat during the testing process. The heat dissipation structure includes: a heat dissipation bracket, vertically mounted; a movable pressure plate, movably connected to the heat dissipation bracket, forming a testing space below the movable pressure plate for placing the semiconductor module; a driving component, mounted on the heat dissipation bracket and connected to the movable pressure plate; and a liquid cooling plate, fixedly mounted on the movable pressure plate. The movable pressure plate moves vertically via the driving component, causing the liquid cooling plate to press against the semiconductor module located in the testing space. This solves the problem in existing technologies where the heat dissipation structure is located at the bottom of the testing device, requiring operators to manually remove and flip the semiconductor module, resulting in cumbersome operation and reduced testing efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor module testing technology, and more specifically, to a heat dissipation structure for automated testing of semiconductor modules. Background Technology

[0002] A power semiconductor module is a combination of components configured with specific functions and modes. It consists of high-power electronic devices combined and encapsulated into a single unit. Different components within the package can perform different functions, such as semiconductor field-effect transistors, insulated-gate bipolar transistors, and power integrated circuits. As electronic components, power semiconductor modules undergo power-on testing before leaving the factory to ensure their circuitry functions correctly.

[0003] Existing semiconductor modules generate heat during normal operation and testing, necessitating a heat dissipation structure. This structure is typically located at the bottom of the testing setup. Personnel must apply thermal adhesive to the semiconductor module, then flip it over so the adhesive-coated surface faces down before placing it onto the heat dissipation structure. This process is cumbersome, requiring manual removal and flipping of the semiconductor module, thus reducing testing efficiency.

[0004] Therefore, existing technologies still need to be improved and developed. Utility Model Content

[0005] The purpose of this application is to provide a heat dissipation structure for automated testing of semiconductor modules, which solves the problem that in the prior art, the heat dissipation structure is located at the bottom of the testing device, requiring operators to manually remove and flip the semiconductor module, resulting in a cumbersome operation process and reduced testing efficiency.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0007] This application provides a heat dissipation structure for automated testing of semiconductor modules, used to dissipate heat during the testing process of semiconductor modules. The heat dissipation structure includes: a heat dissipation bracket, which is vertically arranged.

[0008] The movable pressure plate is movably connected to the heat dissipation bracket, and a test space for placing semiconductor modules is formed below the movable pressure plate.

[0009] The drive assembly is mounted on the heat sink bracket and connected to the movable pressure plate.

[0010] Liquid cooling plate, which is fixedly mounted on the movable pressure plate;

[0011] The movable pressure plate moves vertically by being driven by the drive component, so as to bring the liquid cooling plate against the semiconductor module located in the test space.

[0012] In an optional embodiment, the movable pressure plate includes: a movable plate body, which is connected to the drive assembly and moves in the vertical direction by being driven by the drive assembly;

[0013] A partition platform is set on the upper surface of the movable plate.

[0014] In an optional embodiment, the spacer platform is located at the middle position in the width direction of the movable plate and extends along the length direction to both sides of the length direction of the movable plate.

[0015] The edges of the upper surfaces at both ends of the spacer platform along its length are rounded.

[0016] In an optional embodiment, the heat dissipation bracket includes a support plate, which is horizontally disposed above the movable plate.

[0017] Multiple support rods are installed vertically below the support plate.

[0018] In one optional embodiment, the movable plate is provided with multiple guide slides; the multiple guide slides are matched with multiple support rods, and the guide slides are sleeved on the support rods so that the movable plate can slide in the vertical direction.

[0019] In an optional embodiment, the guide slide includes: a sliding sleeve, which is embedded in the movable plate, and a support rod passes through the sliding sleeve;

[0020] The slide flange is fixedly mounted on the slide sleeve and connected to the movable plate body by screws.

[0021] In an optional embodiment, the drive assembly includes a drive cylinder, which is fixedly mounted on the upper surface of the support plate, and the push rod of the drive cylinder passes through the support plate and is connected to the movable plate.

[0022] In an optional embodiment, the liquid cooling plate protrudes from both sides of the movable plate body in the width direction.

[0023] In an optional embodiment, connecting lugs are provided on both sides along the length of the liquid cooling plate, and the connecting lugs are used to pass screws through them to connect to the lower surface of the movable plate.

[0024] In an optional embodiment, one end of the liquid cooling plate along its length is provided with an inlet pipe and an outlet pipe, both of which penetrate the movable plate.

[0025] The septum platform has multiple solid tube holes that extend through the width direction, and the inlet and outlet pipes are both inserted through the solid tube holes and limited in position.

[0026] The beneficial effects of the heat dissipation structure for automated testing of semiconductor modules provided in this application are at least as follows: By vertically arranging the heat dissipation bracket, a movable pressure plate can be connected to the heat dissipation bracket via a drive assembly. A liquid cooling plate is placed below the movable pressure plate. After the upper surface of the semiconductor module to be tested is coated with a thermally conductive adhesive layer, it is energized in the test space, thus placing the semiconductor module below the liquid cooling plate. During testing, the movable pressure plate moves vertically via the drive assembly, causing the lower surface of the liquid cooling plate to press against the semiconductor module in the test space, thereby dissipating heat from the semiconductor module during testing. This arrangement, with the heat dissipation surface of the semiconductor module facing upwards, allows for direct application of the thermally conductive adhesive layer, replacing the original scheme where the heat dissipation surface of the semiconductor module faces downwards. The downward-pressing liquid cooling plate then presses against the heat dissipation surface of the semiconductor module for effective heat dissipation. This eliminates the need for manual rotation of the semiconductor module to face downwards for heat dissipation, simplifying the operation and improving testing efficiency. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A schematic diagram of a heat dissipation structure for automated testing of a semiconductor module provided in an embodiment of this application;

[0029] Figure 2 An exploded view of a heat dissipation structure for automated testing of a semiconductor module, provided in an embodiment of this application;

[0030] Figure 3 This is a partial cross-sectional view of a heat dissipation structure for automated testing of a semiconductor module, provided as an embodiment of this application.

[0031] The following are the labeling elements in the figure:

[0032] 10. Base; 100. Heat dissipation bracket; 110. Support plate; 120. Support rod; 130. Test space; 200. Movable pressure plate; 210. Movable plate body; 220. Spacing platform; 221. Rounded corner; 222. Left pipe clamp; 223. Right pipe clamp; 224. Fixed pipe hole; 230. Guide slide; 231. Sliding sleeve; 232. Sliding flange; 300. Drive assembly; 310. Drive cylinder; 400. Liquid cooling plate; 410. Connecting lug; 420. Liquid inlet pipe; 421. Liquid outlet pipe. Detailed Implementation

[0033] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0034] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0035] like Figure 1 , Figure 2 As shown, this embodiment proposes a heat dissipation structure for automated testing of semiconductor modules, used to dissipate heat during the testing process of semiconductor modules. For ease of structural description, the heat dissipation structure for automated testing of semiconductor modules is vertically mounted on a workbench, wherein the left-right direction of the workbench is the length direction, the direction facing and away from the operator (front-back direction) is the width direction, and the up-down direction of the workbench is the up-down direction of the structure description. All components in this embodiment are described with reference to the above directions.

[0036] like Figure 1 , Figure 2As shown, the heat dissipation structure of this embodiment mainly includes: a heat dissipation bracket 100, a movable pressure plate 200, a drive assembly 300, and a liquid cooling plate 400. The heat dissipation bracket 100 can be vertically mounted on a workbench or base 10. The movable pressure plate 200 is movably connected to the heat dissipation bracket 100 and can move vertically. A test space 130 for placing a semiconductor module is formed below the movable pressure plate 200. The test space 130 has corresponding connectors. The semiconductor module to be tested is located in the test space 130 and is detachably connected to the corresponding connectors, thereby enabling power-on testing of the semiconductor module. The heat dissipation surface of the semiconductor module located in the test space 130 faces upward, and a layer of thermally conductive adhesive is provided on the heat dissipation surface to facilitate heat conduction during the testing process. The drive assembly 300 is mounted on the heat dissipation bracket 100 and connected to the movable pressure plate 200, and can provide power to drive the movable pressure plate 200 to move vertically. A liquid cooling plate 400 is fixedly mounted on a movable pressure plate 200, with the liquid cooling plate 400 located on the lower surface of the movable pressure plate 200, thus positioning the liquid cooling plate 400 above the semiconductor module. The movable pressure plate 200 is driven vertically by the drive assembly 300, causing the liquid cooling plate 400 to press against the semiconductor module located in the test space 130. This causes the liquid cooling plate 400 to move downwards and directly press against the thermally conductive adhesive layer on the upper surface of the semiconductor module. During testing, the heat generated by the semiconductor module's power-on operation is conducted from the thermally conductive adhesive layer to the liquid cooling plate 400, where it is dissipated. After testing is completed, the drive assembly 300 drives the movable pressure plate 200 upwards, moving the liquid cooling plate 400 away from the semiconductor module, facilitating the removal of the tested semiconductor module from the test space 130.

[0037] like Figure 1 , Figure 2As shown in this embodiment, a heat dissipation structure for automated testing of a semiconductor module is provided. By vertically setting the heat dissipation bracket 100, a movable pressure plate 200 can be connected to the heat dissipation bracket 100 via a drive assembly 300. A liquid cooling plate 400 is disposed below the movable pressure plate 200. After the upper surface of the semiconductor module to be tested is coated with a thermally conductive adhesive layer, it is powered on in the test space 130, thereby placing the semiconductor module below the liquid cooling plate 400. During the testing process, the movable pressure plate 200 moves vertically by being driven by the drive assembly 300, so that the lower surface of the liquid cooling plate 400 abuts against the semiconductor module located in the test space 130, thereby dissipating heat from the semiconductor module during the testing process. This allows the thermally conductive adhesive layer to be directly applied to the semiconductor module with its heat dissipation surface facing upwards, replacing the original solution where the heat dissipation surface of the semiconductor module faced downwards. The downward-pressing liquid cooling plate 400 then moves downwards to press against the heat dissipation surface of the semiconductor module for effective heat dissipation. This eliminates the need for manually flipping the semiconductor module so that the heat dissipation surface faces downwards, making the operation process simpler and improving testing efficiency.

[0038] like Figure 1 , Figure 2 As shown, the movable pressure plate 200 in this embodiment further includes a movable plate body 210 and a spacer platform 220. The movable plate body 210 is connected to the drive assembly 300 and moves vertically by the drive assembly 300. The spacer platform 220 is disposed on the upper surface of the movable plate body 210. In the specific structure, the drive assembly 300 passes through the spacer platform 220 and is connected to the movable plate body 210. The spacer platform 220 can be fixed to the movable plate body 210, thereby increasing the thickness of the movable plate body 210 and the drive assembly 300 at the connection. Furthermore, the spacer platform 220 separates the movable plate body 210 from the heat dissipation bracket 100, which can limit the upper limit position of the movable plate body 210 and buffer the upward pulling force applied when the drive assembly 300 pulls the movable plate body 210 upward, thereby enabling the movable plate body 210 to stably press down and move up in the vertical direction.

[0039] like Figure 1 , Figure 2As shown, in this embodiment, the partition platform 220 is located at the middle position in the width direction of the movable plate 210 and extends along the length direction to both sides of the movable plate 210. By setting the partition platform 220 as a long strip, extending and fixing it to the upper surface of the movable plate 210 in the left and right directions, the structural weight of the entire movable pressure plate 200 can be reduced while limiting the upper limit position of the movable plate 210. Furthermore, by setting a single partition platform 220, the middle part connected to the drive assembly 300 and the left and right ends form a whole, improving structural strength and ensuring the load-bearing capacity of the movable pressure plate 200. The edges of the upper surfaces at both ends of the partition platform 220 in the length direction are rounded with corners 221. The rounded corners 221 prevent the left and right sides of the partition platform 220 from protruding, making the structure more stable, and also prevent sharp points from causing injury to operators.

[0040] like Figure 1 , Figure 2 As shown, the heat dissipation bracket 100 of this embodiment further includes a support plate 110 and a plurality of support rods 120. The support plate 110 is horizontally disposed above the movable plate 210, and the plurality of support rods 120 are all disposed vertically below the support plate 110. In a specific structure, four support rods 120 can be provided, which are arranged at four points along a rectangle and vertically disposed in the up-down direction. The four support rods 120 can be fixed on the base 10, and the support plate 110 is fixed on the top of the four support rods 120, thereby achieving stable support for the support plate 110.

[0041] like Figure 1 , Figure 2 As shown, in this embodiment, the movable plate 210 is further provided with multiple guide slides 230; the multiple guide slides 230 are matched with multiple support rods 120, and the guide slides 230 are sleeved on the support rods 120 to allow the movable plate 210 to slide in the vertical direction. The precision requirements of the central hole of the guide slide 230 and the precision requirements of the outer wall of the support rod 120 are relatively high, and the matching of the two allows the movable plate 210 to slide stably in the vertical direction.

[0042] like Figure 1 , Figure 2 As shown, the guide slide 230 of this embodiment further includes: a slide sleeve 231, which is embedded in the movable plate 210, and a support rod 120 passing through the slide sleeve 231; and a slide flange 232, which is fixedly mounted on the slide sleeve 231 and connected to the movable plate 210 by screws. The slide sleeve 231 penetrates the movable plate 210 and is fixed by the upper slide flange 232, ensuring the connection stability of the guide slide 230.

[0043] like Figure 1 , Figure 2 As shown, the driving assembly 300 in this embodiment further includes a driving cylinder 310, which is fixedly mounted on the upper surface of the support plate 110. The push rod of the driving cylinder 310 passes through the support plate 110 and is connected to the movable plate 210. Using the driving cylinder 310 for driving, the pneumatic method makes the up-and-down movement of the movable plate 210 faster and the driving response quicker.

[0044] like Figure 1 , Figure 2 As shown, in this embodiment, the liquid cooling plate 400 protrudes from both sides of the movable plate 210 in the width direction. This protrusion of the liquid cooling plate 400 in the width direction indicates that the length of the movable plate 210 in the front-to-back direction is relatively small. This reduces the weight of the movable plate 210 and concentrates the pressure in the middle. The middle section is further reinforced by the spacer platform 220, ensuring the stability of the liquid cooling plate 400 under pressure.

[0045] like Figure 1 , Figure 2 As shown, in this embodiment, the liquid cooling plate 400 is further provided with connecting ears 410 on both sides along its length. The connecting ears 410 are used to pass screws through to connect to the lower surface of the movable plate 210. The liquid cooling plate 400 is connected to the movable plate 210 by screws through the connecting ears 410 on both sides, and the connection method is simple and stable.

[0046] like Figure 2 , Figure 3 As shown, further, in this embodiment, one end of the liquid cooling plate 400 in the length direction is provided with an inlet pipe 420 and an outlet pipe 421, both of which penetrate the movable plate 210. The spacer platform 220 has multiple fixed pipe holes 224 extending along its width direction, and the inlet pipe 420 and outlet pipe 421 are both inserted into and limited by these holes. By securing the inlet pipe 420 and outlet pipe 421 within the spacer platform 220, the pipes can move synchronously during the movement of the movable plate 210, preventing them from being crushed or damaged by the movable plate 210 or other moving parts. Furthermore, by limiting the inlet pipe 420 and outlet pipe 421 with the spacer platform 220, the inlet pipe 420 and outlet pipe 421 can be arranged in a standardized manner, reducing the likelihood of tangling.

[0047] like Figure 2 , Figure 3As shown, the specific structure is illustrated using the inlet pipe 420 as an example. The inlet pipe 420 passes vertically through the movable plate 210 and then horizontally through the septum platform 220 to achieve a locking mechanism. Some fixing structures are also provided on the upper surface of the movable plate 210 to fix the inlet pipe 420 to the upper surface of the movable plate 210. These fixing structures need not exceed the height of the septum platform 220. A left pipe clamp 222 and a right pipe clamp 223 are provided on the septum platform 220, forming a fixed pipe hole 224 between the left pipe clamp 222 and the right pipe clamp 223. Both the left pipe clamp 222 and the right pipe clamp 223 are elastic and can open or close the fixed pipe hole 224, thereby locking the liquid inlet pipe 420 in the fixed pipe hole 224 for limitation. In addition, a retaining ring can be fixed on the outside of the liquid inlet pipe 420. The diameter of the retaining ring is slightly larger than the outer diameter of the liquid inlet pipe 420. The retaining ring is located on the front and rear sides of the fixed pipe hole 224 and abuts against the left pipe clamp 222 and the right pipe clamp 223. This can limit the forward and backward movement of the liquid inlet pipe 420. During the up and down movement of the movable pressure plate 200, the liquid inlet pipe 420 can move synchronously with the movable pressure plate 200. The locking structure of the liquid outlet pipe 421 is the same as that of the liquid inlet pipe 420, thereby preventing the pipe from getting tangled or broken.

[0048] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heat dissipating structure for an automated test of a semiconductor module for dissipating heat during a test of a semiconductor module, characterized by, The heat dissipation structure includes: a heat dissipation bracket, which is vertically arranged; A movable pressure plate is movably connected to the heat dissipation bracket, and a test space for placing a semiconductor module is formed below the movable pressure plate; A drive assembly, which is mounted on the heat sink bracket and connected to the movable pressure plate; A liquid cooling plate, which is fixedly mounted on the movable pressure plate; The movable pressure plate moves vertically under the drive of the drive assembly, thereby causing the liquid cooling plate to press against the semiconductor module located in the test space.

2. The heat dissipation structure for automated testing of semiconductor modules as described in claim 1, characterized in that, The movable pressure plate includes: a movable plate body, which is connected to the drive assembly and moves in the up-down direction by the drive assembly; A septum platform is disposed on the upper surface of the movable plate.

3. The heat dissipating structure for automated testing of semiconductor modules according to claim 2, wherein The partition platform is located at the middle position in the width direction of the movable plate and extends along the length direction to both sides of the length direction of the movable plate. The edges of the upper surfaces at both ends of the septum platform along its length are rounded.

4. The heat dissipating structure for automated testing of semiconductor modules according to claim 2, wherein The heat dissipation bracket includes a support plate, which is horizontally disposed above the movable plate. Multiple support rods are provided, all of which are arranged vertically below the support plate.

5. The heat dissipating structure for automated testing of semiconductor modules according to claim 4, wherein The movable plate is provided with multiple guide slides; the multiple guide slides are matched with multiple support rods, and the guide slides are sleeved on the support rods so that the movable plate can slide in the vertical direction.

6. The heat dissipating structure for automated testing of semiconductor modules according to claim 5, wherein The guide slide includes: a sliding sleeve, which is embedded in the movable plate, and the support rod passes through the sliding sleeve; A sliding flange is fixedly mounted on the sliding sleeve and connected to the movable plate body by screws.

7. The heat dissipating structure for automated testing of semiconductor modules according to Claim 4, wherein The driving assembly includes a driving cylinder, which is fixedly mounted on the upper surface of the support plate, and the push rod of the driving cylinder passes through the support plate and is connected to the movable plate.

8. The heat dissipating structure for automated testing of semiconductor modules according to claim 3, wherein, The liquid cooling plate protrudes beyond both sides of the movable plate in the width direction.

9. The heat dissipating structure for automated testing of semiconductor modules according to claim 8, wherein, The liquid cooling plate has connecting lugs on both sides along its length. The connecting lugs are used to insert screws to connect to the lower surface of the movable plate.

10. The heat dissipation structure for automated testing of semiconductor modules according to Claim 9, wherein, One end of the liquid cooling plate along its length is provided with an inlet pipe and an outlet pipe, both of which penetrate the movable plate body; The septum platform has multiple solid tube holes that extend through the width direction, and the liquid inlet pipe and the liquid outlet pipe are both inserted through the solid tube holes and limited in position.

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