A base station radio frequency power amplifier module sealing protection structure
By designing a combined structure of a protective upper box, a protective lower box, and a heat dissipation component in the base station RF power amplifier module, the problem of poor heat dissipation effect of the sealed protective structure in the prior art is solved, and stable operation and efficient heat dissipation in complex environments are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHENJIANG LIDA INFORMATION TECH CO LTD
- Filing Date
- 2025-06-18
- Publication Date
- 2026-06-19
AI Technical Summary
While the existing sealed protection structure of base station RF power amplifier modules increases the buffering effect, it has poor heat dissipation.
A structure including a protective upper box, a protective lower box, a heat dissipation component, and auxiliary components was designed. The glue injection space is separated by a partition plate and a glue injection groove. Heat transfer plates and heat sinks are installed. The sealing is increased by using film gaskets and snap-fit connections, and the modules are fixed with bolts to achieve buffering and heat dissipation.
This approach enhances the buffering effect while improving the installation firmness and sealing of the heat sink, ensuring the module's heat dissipation performance and stable operation in complex environments.
Smart Images

Figure CN224385895U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of base station module technology, specifically a sealed protection structure for a base station radio frequency power amplifier module. Background Technology
[0002] The sealed protection structure of a base station RF power amplifier module refers to a functional structure that protects key components such as internal chips, circuits, and connecting wires of the module through physical isolation, material sealing, and structural design to ensure stable operation of the base station RF power amplifier module in complex outdoor environments or harsh working conditions. Its core objective is to prevent harmful factors such as moisture, dust, salt spray, electromagnetic interference, and mechanical shock from entering the module, while also considering performance aspects such as heat dissipation, electromagnetic compatibility, and mechanical strength to ensure long-term reliable operation of the RF power amplifier module.
[0003] However, while the existing sealed protection structure of base station RF power amplifier modules increases the buffering effect, it also easily leads to poor heat dissipation. Utility Model Content
[0004] The purpose of this invention is to provide a sealed and protective structure for a base station radio frequency power amplifier module to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a sealed protection structure for a base station radio frequency power amplifier module, comprising a protective upper box and a heat dissipation assembly. A protective lower box is provided below the protective upper box. The heat dissipation assembly for buffering and heat dissipation is disposed inside the protective upper box. The heat dissipation assembly includes a partition plate, an injection groove, a mounting groove, a heat transfer plate, and a heat sink. An injection groove is provided inside the partition plate and the protective upper box. A mounting groove is provided on the surface of the partition plate. A heat transfer plate is installed inside the mounting groove, and a heat sink is installed on the side of the heat transfer plate.
[0006] Furthermore, a fixing frame is installed on the outside of the protective lower box, and a film pad is provided on the surface of the fixing frame.
[0007] Furthermore, the interior of the protective lower box is provided with internal components for module fixing, and the number of internal components is set to two sets.
[0008] Furthermore, the internal assembly includes an inner frame and an adjustable mounting plate, and the adjustable mounting plate is installed on the inner side of the inner frame.
[0009] Furthermore, an external interface is installed on the front side of the protective upper box, and an auxiliary component for auxiliary connection is installed at the lower end of the front side of the protective upper box.
[0010] Furthermore, the auxiliary component includes a connecting plate and a retaining strip, and the retaining strip is installed on the outer side of the connecting plate.
[0011] Furthermore, the auxiliary component also includes a card slot and a sealing film. The card slot is provided on the outside of the card strip, and a sealing film is provided on the front side of the card slot.
[0012] Furthermore, the connecting plate and the card strip are fixedly connected, and the card strip and the card slot are engaged.
[0013] This utility model provides a sealed protection structure for a base station radio frequency power amplifier module, which has the following beneficial effects:
[0014] 1. This utility model uses a partition plate to separate the glue injection space inside the upper and lower protective boxes. After the glue is injected into the glue injection groove, the buffer effect of the protective box is increased, and the firmness and sealing of the heat sink installation are also increased. The mounting groove is used for the installation of the heat transfer plate. The heat transfer plate transfers the heat generated by the module during operation to the heat sink, and the heat sink dissipates the heat.
[0015] 2. This utility model uses bolts to assemble the upper and lower protective boxes using a fixed frame. The film gasket increases the sealing degree during the assembly of the upper and lower protective boxes. The inner frame and adjustable mounting plate are used for the installation of the RF power amplifier module. The adjustable mounting plate is adjusted on the inner frame to adjust the installation position. The connecting plate is assembled with the upper and lower protective boxes, and its end clips are snapped into the slots. After the sealing film is pasted, it increases the sealing degree of the connection between the clips and the slots. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the overall structure of a sealing and protection structure for a base station radio frequency power amplifier module according to the present invention.
[0017] Figure 2 This is a schematic diagram of the heat dissipation component structure of a sealed protection structure for a base station radio frequency power amplifier module according to the present invention;
[0018] Figure 3 This is a schematic diagram of the auxiliary component structure of the sealing and protection structure of a base station radio frequency power amplifier module according to the present invention.
[0019] In the diagram: 1. Upper protective box; 2. Lower protective box; 3. Fixing frame; 4. Film pad; 5. Heat dissipation assembly; 501. Divider plate; 502. Glue injection groove; 503. Mounting groove; 504. Heat transfer plate; 505. Heat sink; 6. Internal components; 601. Internal connecting frame; 602. Adjustable mounting plate; 7. External interface; 8. Auxiliary components; 801. Connecting plate; 802. Clip; 803. Clip groove; 804. Sealing film. Detailed Implementation
[0020] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.
[0021] like Figure 1 As shown, a sealed protection structure for a base station RF power amplifier module includes a protective upper box 1 and a heat dissipation component 5. A protective lower box 2 is provided below the protective upper box 1. A fixing frame 3 is used to assemble the protective upper box 1 and the protective lower box 2 with bolts. A fixing frame 3 is installed on the outside of the protective lower box 2, and a film gasket 4 is provided on the surface of the fixing frame 3. The film gasket 4 increases the sealing degree when the protective upper box 1 and the protective lower box 2 are assembled. An internal mounting component 6 for module fixing is provided inside the protective lower box 2, and the number of internal mounting components 6 is set in two sets. The internal mounting component 6 includes an inner frame 601 and an adjustable mounting plate 602. The inner frame 601 and the adjustable mounting plate 602 are used for the installation of the RF power amplifier module, and the adjustable mounting plate 602 is installed on the inner side of the inner frame 601. The adjustable mounting plate 602 is adjusted on the inner frame 601 for the adjustment of the installation position. An external interface 7 is installed on the front side of the protective upper box 1.
[0022] like Figure 2 As shown, the heat dissipation component 5 for buffering and heat dissipation is disposed inside the upper protective box 1. The heat dissipation component 5 includes a partition plate 501, an injection groove 502, a mounting groove 503, a heat transfer plate 504, and a heat sink 505. The partition plate 501 and the upper protective box 1 are provided with an injection groove 502. The partition plate 501 divides the upper protective box 1 and the lower protective box 2 into injection spaces. After injection of glue into the injection groove 502, the buffering effect of the protective box is increased, and the firmness and sealing of the heat sink 505 are also increased. The surface of the partition plate 501 is provided with a mounting groove 503 for the installation of the heat transfer plate 504. The heat transfer plate 504 is installed inside the mounting groove 503. The heat transfer plate 504 transfers the heat generated when the module is working to the heat sink 505 and dissipates the heat through the heat sink 505. The heat sink 505 is installed on the side of the heat transfer plate 504.
[0023] like Figure 3 As shown, an auxiliary component 8 for auxiliary connection is installed at the lower front end of the upper protective box 1. The auxiliary component 8 includes a connecting plate 801 and a retaining strip 802. The retaining strip 802 is installed on the outer side of the connecting plate 801. The connecting plate 801 and the retaining strip 802 are fixedly connected, and the retaining strip 802 and the retaining groove 803 are snap-fit connected. The retaining strip 802 at the end of the connecting plate 801 is snapped into the retaining groove 803 as the upper protective box 1 and the lower protective box 2 are assembled. The auxiliary component 8 also includes a retaining groove 803 and a sealing film 804. The retaining groove 803 is provided on the outside of the retaining strip 802, and the sealing film 804 is provided on the front side of the retaining groove 803. After the sealing film 804 is pasted, it increases the sealing degree of the connection between the retaining strip 802 and the retaining groove 803.
[0024] In summary, the sealed protection structure of the base station's RF power amplifier module is first based on... Figures 1-3The structure shown depicts an RF power amplifier module mounted on an adjustable mounting plate 602. To adjust its position, the screws at the end of the adjustable mounting plate 602 can be loosened to allow for adjustment on the inner frame 601. After assembly and wiring setup, the upper protective box 1 and lower protective box 2 are joined together and secured with bolts. During securing, the film gasket 4 increases the sealing of the upper and lower protective boxes 1 and 2 during assembly. During assembly, the connecting plate 801, along with the upper and lower protective boxes 1 and 2, has its end clip 802 snapped into the slot 803. Then, the sealing film 804 is pasted to increase the sealing of the connection between the card strip 802 and the card slot 803. Then, glue is injected into the glue injection grooves 502 that are separated inside the partition plate 501 in the upper protective box 1 and the lower protective box 2 through the glue injection hole on the left. After the glue is injected into the glue injection grooves 502, the buffering effect of the protective box is increased, and the firmness and sealing of the heat sink 505 are also increased. This allows the heat transfer plate 504 to transfer the heat generated by the module during operation to the heat sink 505, and dissipate the heat through the heat sink 505.
[0025] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.
Claims
1. A sealed protective structure for a base station radio frequency power amplifier module, comprising a protective upper box (1) and a heat dissipation assembly (5), characterized in that, A protective lower box (2) is provided below the protective upper box (1). The heat dissipation assembly (5) for buffering and heat dissipation is provided inside the protective upper box (1). The heat dissipation assembly (5) includes a partition plate (501), an injection groove (502), a mounting groove (503), a heat transfer plate (504), and a heat sink (505). An injection groove (502) is provided inside the partition plate (501) and the protective upper box (1). A mounting groove (503) is provided on the surface of the partition plate (501). A heat transfer plate (504) is installed inside the mounting groove (503), and a heat sink (505) is installed on the side of the heat transfer plate (504).
2. The sealed protection structure for a base station radio frequency power amplifier module according to claim 1, characterized in that, A fixing frame (3) is installed on the outside of the protective lower box (2), and a film pad (4) is provided on the surface of the fixing frame (3).
3. The sealed protection structure for a base station radio frequency power amplifier module according to claim 1, characterized in that, The protective lower box (2) is equipped with a module-fixed internal component (6), and the number of internal components (6) is set to two sets.
4. The sealed protection structure for a base station radio frequency power amplifier module according to claim 3, characterized in that, The internal component (6) includes an inner frame (601) and an adjustable mounting plate (602), and the adjustable mounting plate (602) is installed on the inner side of the inner frame (601).
5. The sealed protection structure for a base station radio frequency power amplifier module according to claim 1, characterized in that, An external interface (7) is installed on the front side of the protective upper box (1), and an auxiliary component (8) for auxiliary connection is installed at the lower end of the front side of the protective upper box (1).
6. The sealed protection structure for a base station radio frequency power amplifier module according to claim 5, characterized in that, The auxiliary component (8) includes a connecting plate (801) and a retaining strip (802), and the retaining strip (802) is installed on the outer side of the connecting plate (801).
7. The sealed protection structure for a base station radio frequency power amplifier module according to claim 6, characterized in that, The auxiliary component (8) further includes a card slot (803) and a sealing film (804). The card slot (803) is provided on the outside of the card strip (802), and the sealing film (804) is provided on the front side of the card slot (803).
8. The sealed protection structure for a base station radio frequency power amplifier module according to claim 7, characterized in that, The connecting plate (801) and the card strip (802) are fixedly connected, and the card strip (802) and the card slot (803) are snap-fit connected.