Lead frame and light emitting package element
By introducing a wave-shaped structural unit on the periphery of the electrode pad of the lead frame and connecting it to the lead frame, the problem of easy peeling of the reflector cup of the lead frame is solved, and the structural strength and reliability of the light-emitting package element are improved.
CN224386061UActive Publication Date: 2026-06-19CHANG WAH TECH
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Patent Information
- Authority / Receiving Office
- CN ยท China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHANG WAH TECH
- Filing Date
- 2025-07-09
- Publication Date
- 2026-06-19
AI Technical Summary
Technical Problem
The existing lead frame's reflector cup has poor heterogeneous bonding with the chip holder and electrode pad, making the reflector cup easy to peel off and affecting product reliability.
Method used
The design of the lead frame incorporates wave-shaped structural units on the periphery of the electrode pads to enhance the stability of the connection, and connects them to the lead frame through connecting units to form a tight connection.
Benefits of technology
This improves the structural strength of the light-emitting packaging element, reduces the risk of reflector cup peeling, and enhances product reliability and lifespan.
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Figure CN224386061U_ABST
Abstract
A lead frame and a light-emitting packaging element are disclosed. The lead frame includes a lead frame and a plurality of lead frame units located within the lead frame and integrally connected to it, arranged periodically and interconnected. Each lead frame unit includes a chip mount and a connecting unit. The chip mount has a first electrode pad and a second electrode pad spaced apart along a first direction. The connecting unit is used to connect the lead frame and the chip mount integrally. The first electrode pad and the second electrode pad each have a top surface and a bottom surface facing away from each other, and a peripheral surface connecting the top surface and the bottom surface. At least one of the first electrode pads and the second electrode pad has a wave-shaped structural unit on its peripheral surface. The wave-shaped structural unit on at least one of the first electrode pads and the second electrode pad provides stress resistance in different directions, thereby improving the structural strength of the light-emitting packaging element.
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