Modular semiconductor tank cleaning box

Abstract

The utility model discloses a modularization semiconductor tank type cleaning box relates to semiconductor cleaning technical field, and it is including: box, the outer wall on the both sides of box is all provided with L type first guide displacement passage, the inner wall on the both sides of box is all installed with guide displacement subassembly, the guide displacement subassembly includes spacing displacement board, the outer wall on spacing displacement board is provided with second guide displacement passage, be provided with guide pulley between second guide displacement passage and first guide displacement passage, the end of guide pulley is connected with end frame through bearing, and the end frame between two installs loading and unloading subassembly, and the below of loading and unloading subassembly is installed with conveying assembly. The semiconductor cleaning tank of existing solution only can put into the semiconductor manually when using, does not have the function of conveying and displacement, cannot conveniently send in and send out semiconductor for user, and the problem of inconvenient cleaning efficiency is brought.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning technology, specifically a modular semiconductor tank cleaning box. Background Technology

[0002] Semiconductors are materials whose electrical conductivity lies between that of conductors and insulators. They have wide applications in electronics and optoelectronics, including integrated circuits, optoelectronic devices, and solar cells. During semiconductor processing, cleaning equipment is required to help ensure the electrical performance, structural integrity, and long-term stability of the devices.

[0003] For example, publication number CN222785264U, entitled "A Semiconductor Cleaning Tank," includes a cleaning tank. A drive mechanism is mounted on the outer wall of the cleaning tank via a bracket. A fixing block is fixedly connected to the outer wall of the drive mechanism. A pressing plate contacts the outer wall of the fixing block. A connecting frame is fixedly connected to the outer wall of the pressing plate. A cleaning frame is fixedly connected to the bottom end of the connecting frame. A circular hole is formed on the outer wall of the cleaning frame. A guide plate is fixedly connected to the top of the cleaning tank. A circulation pipe is provided on the left side wall of the cleaning tank. A support plate is fixedly connected to the inner wall of the cleaning tank. In this invention, a turntable continuously rotates the fixing block, which presses the pressing plate, causing the pressing plate, connecting frame, and cleaning frame to move left and right. This allows the cleaning water to pass through the circular hole and impact the semiconductor material, making it easier for impurities on the semiconductor material to detach, thus improving the cleaning efficiency to a certain extent.

[0004] The existing semiconductor cleaning tanks mentioned above can only be used by manually placing semiconductors in, and do not have the function of conveying and displacing semiconductors. This makes it inconvenient for users to put semiconductors in and out, which brings inconvenience to the cleaning efficiency. Therefore, they do not meet the current needs, so a modular semiconductor tank cleaning box is proposed. Utility Model Content

[0005] The purpose of this utility model is to provide a modular semiconductor tank cleaning box to solve the problem mentioned in the background art that existing semiconductor cleaning tanks can only be used by manually placing semiconductors in, and do not have the function of conveying and displacing semiconductors, which makes it inconvenient for users to send semiconductors in and out, thus causing inconvenience to cleaning efficiency.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a modular semiconductor tank cleaning box, comprising: a box body, with L-shaped first guide displacement channels provided on the outer walls of both sides of the box body, and guide displacement assemblies installed on the inner walls of both sides of the box body, each guide displacement assembly including a limiting displacement plate, a second guide displacement channel opened on the outer wall of the limiting displacement plate, a guide wheel provided between the second guide displacement channel and the first guide displacement channel, an end frame connected to the end of the guide wheel via a bearing, a loading and unloading assembly installed between the two end frames, a conveying assembly installed below the loading and unloading assembly, a placement assembly for placing semiconductors provided at the middle position of the conveying assembly, an ultrasonic cleaner installed at one end of the conveying assembly, and a lead screw module installed below the limiting displacement plate.

[0007] Preferably, the lead screw module includes a first lead screw and a first guide rod, a first motor is installed at the end of the first lead screw, and a first slider is installed on the outer wall of both the first lead screw and the first guide rod, and the limiting displacement plate is installed on the first slider.

[0008] Preferably, a limiting frame is installed above the limiting displacement plate, and a limiting groove is formed on the lower surface of the limiting frame.

[0009] Preferably, the loading and unloading assembly includes a mounting frame, and two sets of electric telescopic rods are symmetrically mounted on the lower left and right sides of the mounting frame, with electromagnets installed at the telescopic ends of the electric telescopic rods.

[0010] Preferably, the conveying assembly includes a second lead screw and a second guide rod. A second motor is installed at the end of the second lead screw. A second slider is installed on the outer wall of both the second lead screw and the second guide rod. A plurality of slots are provided on the outer wall of the second slider.

[0011] Preferably, the placement component includes a placement box, the interior of which is provided with a plurality of horizontally spaced placement slots, the outer wall of which is provided with a plurality of water filtering holes, and a mesh cover is installed on the top of the placement box.

[0012] Preferably, the lower surfaces on both sides of the placement box are provided with locking blocks, which engage with the locking slots.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] (1) In this utility model, the limit displacement plate is moved forward and backward by the screw module. When moving forward, the guide wheel moves in the first guide displacement channel and the second guide displacement channel, which moves the loading and unloading assembly to the end of the first guide displacement channel. The loading and unloading assembly assembles the semiconductor placement assembly below. After assembly, the screw module moves the limit displacement plate backward, which moves the guide wheel to the bottom of the first guide displacement channel, which moves the placement assembly into the ultrasonic cleaner. The semiconductors placed in the placement assembly are cleaned by ultrasonic waves. The above structure, through various modular components, enables the equipment to have functions such as displacement, cleaning, conveying, loading and unloading, which effectively improves the functionality and practicality of the equipment.

[0015] (2) In this utility model, the loading and unloading component is magnetically connected to the placement component by an electromagnet. When the power is on, the electromagnet is attracted above the placement box and is used to move the placement box into the ultrasonic cleaner. When the power is off, the electromagnet loses its magnetic attraction and separates from the placement box. The above structure facilitates loading and unloading operations at the placement component.

[0016] (3) In this utility model, the second slider is moved by the second motor and the second lead screw at the conveying component. Before the displacement, the placement box is engaged with the slot on the second slider by the card block to improve its stability. The subsequent loading and unloading component is attracted and fixed by magnetic attraction, so that the card block and the slot are separated. The placement box is provided with spaced placement slots to separate the semiconductors. After the placement box moves into the ultrasonic cleaner, water enters into the placement slot from the water filter hole to clean the semiconductors. After cleaning, the placement box moves upward and the water in the placement slot is discharged from the water filter hole. The above structure enables the equipment to have the function of conveying semiconductor placement components. It can move the cleaned semiconductors and the uncleaned semiconductors by conveying, which effectively improves the cleaning efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall external structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the overall internal structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the guiding displacement component and loading / unloading component of this utility model;

[0020] Figure 4 This is a schematic diagram of the conveying and placing components of this utility model;

[0021] In the diagram: 1. Box body; 101. First guide displacement channel; 2. Guide displacement assembly; 201. First lead screw; 202. First motor; 203. First slider; 204. First guide rod; 205. Limiting displacement plate; 206. Second guide displacement channel; 207. Guide wheel; 208. Limiting frame; 209. Limiting slide groove; 210. End frame; 3. Loading and unloading assembly; 301. Electric telescopic rod; 302. Electromagnet; 303. Mounting frame; 4. Ultrasonic cleaner; 5. Conveying assembly; 501. Second lead screw; 502. Second motor; 503. Second slider; 504. Slot; 505. Second guide rod; 6. Placement assembly; 601. Placement box; 602. Placement groove; 603. Mesh cover; 604. Filter hole; 605. Locking block. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Please see Figure 1-4 This utility model provides an embodiment of a modular semiconductor tank cleaning box, comprising: a box body 1, with L-shaped first guide displacement channels 101 provided on the outer walls of both sides of the box body 1, and guide displacement assemblies 2 installed on the inner walls of both sides of the box body 1. Each guide displacement assembly 2 includes a limiting displacement plate 205, with a second guide displacement channel 206 formed on the outer wall of the limiting displacement plate 205. A guide wheel 207 is provided between the second guide displacement channel 206 and the first guide displacement channel 101. The end of the guide wheel 207 is connected to an end frame 210 via a bearing. A loading / unloading assembly 3 is installed between the two end frames 210. A conveying assembly 5 is installed below the loading / unloading assembly 3, and a placement assembly for placing semiconductors is provided at the middle position of the conveying assembly 5. 6. An ultrasonic cleaner 4 is installed at one end of the conveying component 5, and a lead screw module is installed below the limiting displacement plate 205. The lead screw module drives the limiting displacement plate 205 to move back and forth. When moving forward, the guide wheel 207 moves within the first guide displacement channel 101 and the second guide displacement channel 206, driving the loading and unloading component 3 to move to the end of the first guide displacement channel 101. The loading and unloading component 3 assembles the placement component 6 containing semiconductors below. After assembly, the lead screw module drives the limiting displacement plate 205 to move backward, causing the guide wheel 207 to move to the bottom of the first guide displacement channel 101, moving the placement component 6 into the ultrasonic cleaner 4. The semiconductors placed in the placement component 6 are cleaned by ultrasonic waves.

[0024] The lead screw module includes a first lead screw 201 and a first guide rod 204. A first motor 202 is installed at the end of the first lead screw 201. A first slider 203 is installed on the outer wall of both the first lead screw 201 and the first guide rod 204. A limiting displacement plate 205 is installed on the first slider 203. A limiting frame 208 is installed above the limiting displacement plate 205. A limiting groove 209 is formed on the lower surface of the limiting frame 208. The first motor 202 and the first lead screw 201 are used to drive the first slider 203 to move. When the limiting displacement plate 205 moves, its upper part slides in the limiting groove 209 and is limited by the limiting frame 208.

[0025] Please see Figure 3 The loading and unloading assembly 3 includes a mounting frame 303. Two sets of electric telescopic rods 301 are symmetrically installed on the left and right sides below the mounting frame 303. Electromagnets 302 are installed at the telescopic ends of the electric telescopic rods 301. The loading and unloading assembly 3 is magnetically connected to the placement assembly 6 through the electromagnets 302. When the power is on, the electromagnets 302 are attracted above the placement box 601 and are used to move the placement box 601 into the ultrasonic cleaner 4. When the power is off, the electromagnets 302 lose their magnetic attraction and separate from the placement box 601.

[0026] Please see Figure 4 The conveying assembly 5 includes a second lead screw 501 and a second guide rod 505. A second motor 502 is installed at the end of the second lead screw 501. A second slider 503 is installed on the outer wall of both the second lead screw 501 and the second guide rod 505. Multiple slots 504 are provided on the outer wall of the second slider 503. The placement assembly 6 includes a placement box 601. Multiple horizontally spaced placement slots 602 are provided inside the placement box 601. Several filter holes 604 are provided on the outer wall of the placement slots 602. A mesh cover 603 is installed on the top of the placement box 601. Locking blocks 605 are provided on the lower surfaces of both sides of the placement box 601. The locking blocks 605 engage with the slots 504. The conveying assembly 5 is connected to the first... The second motor 502 and the second lead screw 501 drive the second slider 503 to move. Before the movement, the placement box 601 is engaged with the slot 504 on the second slider 503 by the locking block 605 to improve its stability. The subsequent loading and unloading assembly 3 uses magnetic attraction to fix the placement box 601, so that the locking block 605 is separated from the slot 504. The placement box 601 is provided with spaced placement slots 602 for separating semiconductors. After the placement box 601 moves into the ultrasonic cleaner 4, water enters the placement slots 602 from the filter hole 604 to clean the semiconductors. After cleaning, the placement box 601 moves upward and the water in the placement slots 602 is discharged from the filter hole 604.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A modular semiconductor tank cleaning box, comprising a box body (1), characterized in that: L-shaped first guide displacement channels (101) are provided on the outer walls of both sides of the housing (1). Guide displacement assemblies (2) are installed on the inner walls of both sides of the housing (1). The guide displacement assembly (2) includes a limiting displacement plate (205). A second guide displacement channel (206) is opened on the outer wall of the limiting displacement plate (205). A guide wheel (207) is provided between the second guide displacement channel (206) and the first guide displacement channel (101). The end of the guide wheel (207) is connected to an end frame (210) through a bearing. A loading and unloading assembly (3) is installed between the two end frames (210). A conveying assembly (5) is installed below the loading and unloading assembly (3). A placement assembly (6) for placing semiconductors is provided at the middle position of the conveying assembly (5). An ultrasonic cleaner (4) is installed at one end of the conveying assembly (5). A lead screw module is installed below the limiting displacement plate (205).

2. The modular semiconductor tank cleaning box according to claim 1, characterized in that: The lead screw module includes a first lead screw (201) and a first guide rod (204). A first motor (202) is installed at the end of the first lead screw (201). A first slider (203) is installed on the outer wall of both the first lead screw (201) and the first guide rod (204). The limiting displacement plate (205) is installed on the first slider (203).

3. The modular semiconductor tank cleaning box according to claim 1, characterized in that: A limiting frame (208) is installed above the limiting displacement plate (205), and a limiting groove (209) is formed on the lower surface of the limiting frame (208).

4. The modular semiconductor tank cleaning box according to claim 1, characterized in that: The loading and unloading assembly (3) includes a mounting frame (303), and two sets of electric telescopic rods (301) are symmetrically installed on the lower left and right sides of the mounting frame (303). Electromagnets (302) are installed at the telescopic ends of the electric telescopic rods (301).

5. A modular semiconductor tank cleaning box according to claim 1, characterized in that: The conveying assembly (5) includes a second lead screw (501) and a second guide rod (505). A second motor (502) is installed at the end of the second lead screw (501). A second slider (503) is installed on the outer wall of both the second lead screw (501) and the second guide rod (505). A plurality of slots (504) are provided on the outer wall of the second slider (503).

6. A modular semiconductor tank cleaning box according to claim 5, characterized in that: The placement component (6) includes a placement box (601), the interior of which is provided with a plurality of horizontally spaced placement slots (602), the outer wall of which is provided with a plurality of water filter holes (604), and a mesh cover (603) is installed on the top of the placement box (601).

7. A modular semiconductor tank cleaning box according to claim 6, characterized in that: The lower surfaces on both sides of the placement box (601) are provided with locking blocks (605), which engage with the slots (504).

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