Sn wire forming machine's tin melting channel structure
By introducing a wide-mouth feed hopper, a sloped solder channel, and a buffered, gentle solder channel into the solder wire forming machine, combined with an intelligent control system using an electrically heated copper plate and a temperature sensor, the problems of cumbersome operation and inaccurate temperature control in traditional solder wire forming machines have been solved, achieving efficient production and improved stability of solder wire.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN BAODA TIN IND CO LTD
- Filing Date
- 2025-07-25
- Publication Date
- 2026-06-23
AI Technical Summary
Traditional solder wire forming machines lack intelligent control and monitoring methods, resulting in cumbersome operation and difficulty in accurately controlling the molten solder temperature and time, which affects the quality and stability of the solder wire.
It adopts a wide-mouth feed hopper, a sloped solder channel and a buffered and gentle solder channel structure, combined with an electric heating copper plate, temperature sensor and control box to achieve intelligent temperature control and monitoring.
It improves the production efficiency and quality of solder wire, ensures precise control of molten solder temperature, reduces solder wire damage, and enhances the stability and precision of solder wire.
Smart Images

Figure CN224389969U_ABST