Wafer welding machine anti-camera thermal drift heat dissipation device
By designing a heat dissipation device with connecting pipes and air channels on the wafer bonding machine, and using compressed gas for air cooling, the problem of camera thermal displacement due to high temperature was solved, and the bonding accuracy was improved.
CN224390287UActive Publication Date: 2026-06-23JIANGSU SUXIN SEMICON CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU SUXIN SEMICON CO LTD
- Filing Date
- 2025-07-09
- Publication Date
- 2026-06-23
AI Technical Summary
Technical Problem
During wafer soldering, the camera experiences thermal displacement due to high temperatures, affecting the recognition accuracy of the solder joints.
Method used
A heat dissipation device for preventing thermal displacement of the camera in a wafer bonding machine is designed. By setting three connecting pipes and two air channels on the substrate, compressed gas is used for air cooling. The airflow is discharged through a specially designed air outlet and groove structure to ensure uniform heat dissipation.
Benefits of technology
It effectively prevents the camera from shifting due to high temperatures, improves welding precision, and ensures the accuracy of welding points.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224390287U_ABST
Abstract
The utility model discloses a kind of heat dissipation devices of wafer welding machine anti camera thermal deviation, it is related to wafer processing technical field, including substrate, substrate side top adjacent connection has connecting pipe one and extension plate, another side top adjacent connection has connecting pipe two and connecting pipe three, extension plate end installs strong magnetic fixed frame, substrate bottom center position is equipped with trapezoidal recess, trapezoidal recess is formed inclined plane one and inclined plane two in substrate bottom surface both sides, the bottom surface of the side of substrate close to inclined plane one is equipped with air outlet one, air outlet two is equipped on inclined plane two, air passage one and air passage two are respectively equipped in substrate inner portion, air passage one top is communicated with connecting pipe one, bottom is communicated with air outlet one;Air passage two top is communicated with connecting pipe two and connecting pipe three, bottom is communicated with air outlet two. Connecting pipe is connected air pipe in substrate top, air passage is set up inside, air outlet is set up in bottom, compressed gas is discharged through air outlet, carries out air cooling heat dissipation, prevent camera from high temperature and produce thermal deviation.
Need to check novelty before this filing date? Find Prior Art