A full-coverage built-in heating semiconductor film heating wood floor
By employing a fully covered built-in heating semiconductor film in heated wood flooring, combined with conductive sheets and insulating hole design, the problems of insufficient structural strength and low thermal efficiency are solved, achieving high strength, excellent impregnation and peeling performance, and full-coverage heating effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU CHANGXIN WOODEN PROD CO LTD
- Filing Date
- 2025-06-03
- Publication Date
- 2026-06-23
Smart Images
Figure CN224395980U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a heated wood floor, and more particularly to a fully covered heated wood floor with an internal heating semiconductor film, belonging to the field of building decoration materials technology. Background Technology
[0002] With the application of graphene-embedded solid wood electric heating floors in home heating, they offer a new experience of comfort, energy saving, and environmental friendliness by combining the high electrical and thermal conductivity of graphene with the natural texture of solid wood flooring and enabling intelligent temperature control systems. However, the heating elements in traditional built-in heating floors are generally carbon fiber wires or graphite paper. my country has strict national standards for multi-layer or solid wood flooring, requiring compliance with three criteria: elastic modulus, static bending strength, and immersion peel strength; otherwise, it is considered a defective product. Traditional products with built-in carbon fiber wire heating elements require numerous grooves to be densely engraved into the substrate. This process significantly compromises the original substrate's static bending strength and elastic modulus. Furthermore, floors using graphene paper as the built-in heating element perform poorly in immersion peel tests, posing a quality risk. Additionally, traditional products, due to the limitations of the wires at both ends, cannot achieve full-coverage heating, resulting in suboptimal thermal performance. Summary of the Invention
[0003] The purpose of this invention is to provide a fully covered heated wood floor with an internal heating semiconductor film to solve the problems of insufficient structural strength, poor impregnation and peeling performance, and low thermal efficiency in existing heated floor technologies.
[0004] The above-mentioned technical problems of this utility model are mainly solved by the following technical solution: a fully covered heated wood floor with built-in heating semiconductor film, comprising a substrate and a heating semiconductor film fixed on the substrate, characterized in that a surface panel is provided on the heating semiconductor film, and the area of the substrate and the surface panel is larger than the area of the heating semiconductor film; the heating semiconductor film includes two conductive sheets, and the substrate is provided with solder holes that respectively cooperate with the two conductive sheets; the two conductive sheets on the heating semiconductor film are respectively provided with insulating holes.
[0005] In the aforementioned fully covered built-in heating semiconductor film heated wood flooring, preferably, the substrate has welding holes at both ends, and a wire storage compartment and a wire groove are respectively provided between the two welding holes at each end.
[0006] In the aforementioned fully covered built-in heating semiconductor film heated wood flooring, preferably, the wire storage compartment is connected to the wire groove and the welding hole, and the diameter of the welding hole is larger than the width of the wire groove.
[0007] In the aforementioned fully covered built-in heating semiconductor film heated wood flooring, preferably, a cover is provided in conjunction with the wire storage compartment; the cover is a transparent cover structure.
[0008] In the aforementioned fully covered, built-in heating semiconductor film heated wood flooring, preferably, the wire storage compartment is a recessed structure on the substrate body, and the compartment cover and the wire storage compartment form an interference fit. This firmly fixes the welding wire inside the wire storage compartment, preventing the welding wire from falling off during subsequent processing and causing defective products.
[0009] In the aforementioned fully covered heated wood flooring with an integrated heating semiconductor film, preferably, the diameter of the insulating hole is larger than the width of the conductive sheet to improve insulation safety.
[0010] In the aforementioned fully covered heated wood flooring with a built-in heating semiconductor film, preferably, blank spaces are left on the outer sides of the two conductive strips on the heating semiconductor film. This serves as insulation and moisture protection.
[0011] In the aforementioned fully covered heated wood flooring with a built-in heating semiconductor film, preferably, a bottom decorative panel is provided on the opposite side of the substrate from the heating semiconductor film. This makes the flooring more aesthetically pleasing and durable.
[0012] In the aforementioned fully covered heated wood flooring with an integrated heating semiconductor film, preferably, the two conductive sheets of the heating semiconductor film are arranged in parallel, and uniformly arranged heating semiconductors are disposed between the two conductive sheets. This ensures uniform heating.
[0013] In the aforementioned fully covered heated wood flooring with a built-in heating semiconductor film, preferably, the substrate, the heating semiconductor film, the surface panel, and the bottom panel are tightly bonded together to form an integrated panel structure. This improves the overall strength and stability.
[0014] Compared with the prior art, the beneficial effects of this utility model are:
[0015] 1. High structural strength: Using a semiconductor film as the heating element eliminates the need for slotting on the substrate, thus avoiding damage to the static bending strength and elastic modulus of the substrate and meeting national standards.
[0016] 2. Excellent immersion and peel performance: The semiconductor film is tightly bonded to the substrate and the surface panel, providing thermal insulation and overall structural stability, and has passed the immersion and peel test.
[0017] 3. Full-coverage heating: The heating semiconductor film is evenly laid out, combined with an optimized wire connection method, to achieve uniform heating of the entire floor and high thermal efficiency.
[0018] 4. Easy installation: The wire storage compartment and wire channel design facilitates wire concealment and connection, improving construction efficiency.
[0019] 5. Safe and reliable: The design of the insulating hole blocks the power supply and prevents leakage. In the manufacturing process, it can be used as a basis for adjusting whether the whole board can fully cover the nodes. The limit position of the heating semiconductor film is built into the hole position; the cover structure ensures the wires are stable and improves the safety of use. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of a combined structure of this utility model.
[0021] Figure 2 This is a schematic diagram of the structure of the back side (facing the bottom decorative panel) of the substrate of this utility model.
[0022] Figure 3 This is a schematic diagram of the front side (facing the heating semiconductor film) of the substrate of this utility model.
[0023] Figure 4 yes Figure 2 A magnified schematic diagram of the structure at point M in the middle.
[0024] Figure 5 yes Figure 4 Schematic diagram of the AA-direction structure.
[0025] Figure 6 This is a schematic diagram of the front structure of the heating semiconductor film of this utility model.
[0026] In the diagram: 1-substrate, 101-wire storage compartment, 102-solder hole, 103-wire groove, 104-compartment cover, 2-heating semiconductor film, 201-conductive sheet, 202-insulating hole, 203-solder point, 3-surface panel, 4-bottom panel. Detailed Implementation
[0027] The technical solution of this utility model will be further described in detail below through embodiments and in conjunction with the accompanying drawings.
[0028] like Figure 1 As shown, this embodiment of a fully covered heated wood floor with an internal heating semiconductor film includes a substrate 1, a heating semiconductor film 2, a surface panel 3, and a bottom panel 4. The heating semiconductor film 2 is fixed to the substrate 1, the surface panel 3 covers the heating semiconductor film 2, and the bottom panel 4 is attached to the back of the substrate 1. The areas of the substrate 1 and the surface panel 3 are larger than the area of the heating semiconductor film 2.
[0029] See Figures 1 to 4 The substrate 1 has solder holes 102 at both ends, and a wire storage compartment 101 and a wire groove 103 are respectively provided between the two solder holes 102 at each end. The wire storage compartment 101 communicates with the solder hole 102 through the wire groove 103, and the diameter of the solder hole 102 is larger than the width of the wire groove 103. The wire storage compartment 101 is a recessed structure on the substrate 1 body, which facilitates the inspection of the wire connection status, such as... Figure 5As shown, a cover 104 is provided to cooperate with the wire storage compartment 101. The cover 104 is a transparent cover structure, and the cover 104 and the wire storage compartment 104 form an interference fit.
[0030] The heating semiconductor film 2 includes two conductive sheets 201, such as Figure 6 As shown, the two conductive sheets 201 of the heating semiconductor film 2 are arranged in parallel, and a uniformly arranged heating semiconductor is disposed between the two conductive sheets 201. The solder holes 102 provided on the substrate 1 correspond to the positions of the two conductive sheets 201. The two conductive sheets 201 on the heating semiconductor film 2 are respectively provided with insulating holes 202, and the diameter of the insulating holes 202 is larger than the width of the conductive sheets 201.
[0031] Furthermore, blank spaces are left on the outer sides of the two conductive sheets 201 on the heating semiconductor film 2, which has the function of insulation and moisture protection.
[0032] The substrate 1, the heating semiconductor film 2, the surface decorative plate 3, and the bottom decorative plate 4 are tightly bonded together into an integrated plate structure through an adhesive bonding process.
[0033] In this embodiment, the surface panel 3 is a decorative heat dissipation functional panel, closely attached to the heating semiconductor film 2. The position of the insulating hole on the heating semiconductor film 2 can be determined according to the specifications of the specific finished board. Two solder points 203 are located at each end of the copper sheet, serving as soldering positions for the welding wires. Welding is performed through the solder holes at both ends of the substrate. The welding wires are placed in the wire groove 102 and wire storage compartment 101 on the back of the substrate 1. The compartment cover 104 secures the welding wires in the wire storage compartment 101, preventing them from falling off during subsequent processing. This embodiment optimizes the heating element structure and wiring method, achieving efficient, uniform, and safe heating while ensuring the mechanical properties of the floor.
[0034] The above embodiments are illustrative of the present invention and not intended to limit the present invention. The described embodiments are merely some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present invention.
Claims
1. A fully covered heated wood floor with an internal heating semiconductor film, comprising a substrate (1) and a heating semiconductor film (2) fixed on the substrate, characterized in that... The heating semiconductor film is provided with a decorative plate (3), and the area of the substrate and the decorative plate is larger than the area of the heating semiconductor film; the heating semiconductor film includes two conductive sheets (201), and the substrate is provided with solder holes (102) that respectively cooperate with the two conductive sheets; the two conductive sheets on the heating semiconductor film are respectively provided with insulating holes (202).
2. The fully covered, built-in heating semiconductor film heated wood flooring according to claim 1, characterized in that, The substrate has solder holes (102) at both ends, and a wire storage compartment (101) and a wire groove (103) are provided between the two solder holes at each end.
3. The fully covered, built-in heating semiconductor film heated wood flooring according to claim 2, characterized in that, The wire storage compartment (101) is connected to the wire groove (103) and the welding hole (102), and the diameter of the welding hole is larger than the width of the wire groove.
4. A fully covered, built-in heating semiconductor film heated wood flooring according to claim 2 or 3, characterized in that, A cover (104) is provided in conjunction with the wire storage compartment (101); the cover is a transparent cover plate structure.
5. The fully covered, built-in heating semiconductor film heated wood flooring according to claim 4, characterized in that, The wire storage compartment (101) is a recessed structure on the substrate (1) body, and the compartment cover (104) forms an interference fit with the wire storage compartment.
6. The fully covered, built-in heating semiconductor film heated wood flooring according to claim 1, characterized in that, The diameter of the insulating hole (202) is larger than the width of the conductive sheet (201).
7. The fully covered, built-in heating semiconductor film heated wood flooring according to claim 1, characterized in that, The outer sides of the two conductive sheets (201) on the heating semiconductor film (2) are left blank.
8. The fully covered, built-in heating semiconductor film heated wood flooring according to claim 1, characterized in that, The substrate (1) has a bottom decorative plate (4) on the other side opposite to the heating semiconductor film (2).
9. The fully covered, built-in heating semiconductor film heated wood flooring according to claim 1, characterized in that, The two conductive sheets (201) of the heating semiconductor film (2) are arranged in parallel, and a uniformly arranged heating semiconductor is provided between the two conductive sheets.
10. A fully covered, built-in heating semiconductor film heated wood flooring according to claim 8, characterized in that, The substrate (1), the heating semiconductor film (2), the surface panel (3) and the bottom panel (4) are tightly bonded together to form an integrated plate structure.