Edge computing device case protection structure suitable for wide temperature environment

Abstract

The utility model discloses an edge computing device machine case protection structure suitable for wide temperature environment, include: shell body, upper cover body, exhaust component and heat dissipation component, the upper cover body is installed to the upper of shell body, the rear end surface of shell body is installed with exhaust component, the inside installation of shell body has heat dissipation component, heat dissipation component includes heat conduction board, the lower surface of heat conduction board is provided with a plurality of transverse interval arrangement distribution's heat conduction cavity, the end of heat conduction cavity installs the assembly pipe for with multiple sets of heat conduction cavity communication, the assembly pipe is U type structure, and the end of heat conduction cavity is installed with liquid inlet pipe and liquid outlet pipe respectively, and one end of liquid inlet pipe and liquid outlet pipe is connected with circulating pump box. It has realized to make edge computing device machine case protection structure can be suitable for wide temperature environment, has effectively improved the heat dissipation effect, has strengthened the adaptability of equipment to wide temperature environment.

Description

Technical Field

[0001] This utility model relates to the field of equipment chassis technology, and in particular to a protective structure for edge computing equipment chassis suitable for wide temperature environments. Background Technology

[0002] Edge computing devices are physical hardware located close to the data source or user end, used for local data processing, storage, and computation to reduce latency, improve response speed, and optimize bandwidth utilization. The control chipset of these edge computing devices is installed inside the chassis, which protects it.

[0003] Chinese Patent Publication No. CN220357547U discloses an edge computing device with enhanced heat dissipation, comprising a motherboard, a chassis, and a heat dissipation module. The motherboard includes a motherboard and a core board. The motherboard has a core board slot, and the core board is detachably mounted on the motherboard. The core board includes at least one processing unit module and a connector. The core board can be inserted into the core board slot on the motherboard via the connector. The motherboard is fixed inside the chassis, and the heat dissipation module is connected to the outside of the chassis. This invention further enhances the heat dissipation of the edge computing device by adding a heat dissipation module to the outside of the chassis. Through simultaneous internal and external heat dissipation, it can achieve better cooling efficiency and is better suited for use in high-temperature edge environments.

[0004] While existing edge computing devices can dissipate heat and cool down through external heat sinks, this heat dissipation structure is limited to certain temperature environments. If the ambient temperature is too high, the heat dissipation structure cannot cool down quickly, leading to heat accumulation inside the device and affecting its safety. To address this, we propose an edge computing device chassis protection structure suitable for a wide temperature range. Utility Model Content

[0005] One object of this invention is to solve at least the problems described above and to provide at least the advantages that will be explained later.

[0006] Another objective of this invention is to provide a protective structure for the chassis of edge computing devices suitable for wide temperature environments. This structure enables the protective structure of edge computing devices to be used in wide temperature environments, effectively improving heat dissipation and enhancing the adaptability of the devices to wide temperature environments.

[0007] To achieve the above objectives and some other objectives, the present invention adopts the following technical solution:

[0008] A protective structure for an edge computing device chassis suitable for wide temperature environments includes: an outer shell, a top cover, an exhaust assembly, and a heat dissipation assembly. The top cover is installed on the top of the outer shell, the exhaust assembly is installed on the rear end face of the outer shell, and the heat dissipation assembly is installed inside the outer shell.

[0009] Preferably, the heat dissipation assembly includes a heat-conducting plate, and the lower surface of the heat-conducting plate is provided with a plurality of heat-conducting cavities arranged laterally at intervals. The ends of the heat-conducting cavities are equipped with assembly pipes for connecting the plurality of heat-conducting cavities. The assembly pipes are U-shaped, and the ends of the heat-conducting cavities at both ends are respectively equipped with liquid inlet pipes and liquid outlet pipes. One end of the liquid inlet pipe and the liquid outlet pipe is connected to the circulating pump box.

[0010] Preferably, the outer wall of the heat-conducting plate is provided with a plurality of first heat dissipation channels arranged horizontally at intervals, and the bottom of the circulating pump box is provided with a plurality of second heat dissipation channels.

[0011] Preferably, the exhaust assembly includes an assembly plate installed at the opening on the rear end face of the housing, and a plurality of exhaust fans arranged laterally at intervals are installed on the outer wall of the assembly plate.

[0012] Preferably, heat dissipation channels are provided on both sides of the upper cover, heat dissipation mesh is installed inside the heat dissipation channels, a shielding eave is installed above the heat dissipation channels, and an inclined guide platform is installed at the bottom of the heat dissipation channels. The inclination angle between the shielding eave and the inclined guide platform is 35°~45°.

[0013] Preferably, an assembly rack is installed inside the outer shell, and inserts are installed at the four corners of the assembly rack. A sealing groove is provided on the upper surface of the outer shell, and inserts are installed at the four corners of the upper cover. A sealing strip is provided on the lower surface of the upper cover.

[0014] This utility model has at least the following beneficial effects:

[0015] 1. Compared with existing devices, this edge computing device chassis protection structure suitable for wide-temperature environments incorporates a heat dissipation component inside the outer shell. This component connects multiple heat-conducting cavities via a combination of heat-conducting chambers and assembly pipes. Coolant is pumped from the inlet pipe into the heat-conducting cavities at the end via a circulation pump box. The internal liquid flows along the assembly pipes and heat-conducting cavities at the bottom of the heat-conducting plate. During this flow, the heat-conducting plate transfers heat to the upper control layer, lowering its temperature. After heat transfer, the internal liquid enters the circulation pump box for a new cycle. Compared to finned cooling, this bottom-based heat transfer method is more efficient and, combined with liquid cooling, enables rapid heat transfer, making it more suitable for wide-temperature environments.

[0016] 2. Compared with existing devices, this edge computing device chassis protection structure suitable for wide temperature environments, based on heat transfer at the heat-conducting plate, can draw hot air from inside the shell outward through the exhaust fan. The hot air reaches the heat-conducting plate from the control layer, moves down along multiple first heat dissipation channels on the heat-conducting plate, and then exhausts the heat from the inside through the second heat dissipation channel. This structure can accelerate the internal heat dissipation efficiency and improve the internal heat dissipation effect. In addition, during the exhaust process, it can also dissipate heat from the liquid area, improving the heat dissipation effect there. The exhaust fans are arranged in multiple sets with horizontal spacing, which can effectively expand the exhaust area and improve the exhaust and cooling efficiency.

[0017] 3. The heat dissipation channel is used for top heat dissipation. The heat dissipation mesh is used to block external impurities while dissipating heat. When the exhaust fan is drawing air, it can draw external cold air into the interior from this position to cool the inside of the casing. There is a shielding eave above the heat dissipation channel. Since the heat dissipation channel is opened on the side and the shielding eave has an inclined angle, it is more difficult for dust to enter. In addition, the inclined guide platform can allow some dust particles to slide naturally to the bottom, extending the cleaning cycle of the heat dissipation mesh.

[0018] Other advantages, objectives and features of this invention will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of this invention. Attached Figure Description

[0019] Figure 1 This is a perspective view of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the internal structure of the outer shell of this utility model;

[0021] Figure 3 This is a schematic diagram of the heat dissipation component structure of this utility model;

[0022] Figure 4 This is a schematic diagram of the overall heat-conducting plate structure of this utility model;

[0023] Figure 5 This is a schematic diagram of the overall upper cover structure of this utility model. Detailed Implementation

[0024] The present invention will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can implement it after referring to this specification.

[0025] like Figure 1-5As shown, a protective structure for an edge computing device chassis suitable for wide temperature environments includes: an outer shell 1, a top cover 2, an exhaust assembly 3, and a heat dissipation assembly 4. The top cover 2 is installed on the top of the outer shell 1, the exhaust assembly 3 is installed on the rear end face of the outer shell 1, and the heat dissipation assembly 4 is installed inside the outer shell 1. The heat dissipation assembly 4 includes a heat-conducting plate 401. The lower surface of the heat-conducting plate 401 is provided with a plurality of horizontally spaced heat-conducting cavities 402. The ends of the heat-conducting cavities 402 are equipped with assembly pipes 404 for connecting the plurality of heat-conducting cavities 402. The assembly pipes 404 have a U-shaped structure, and the ends of the heat-conducting cavities 402 at both ends are respectively equipped with an inlet pipe 405 and an outlet pipe 406. One end of the inlet pipe 405 and the outlet pipe 406 is connected to a circulating pump box 407.

[0026] In the above solution, a heat dissipation component is installed inside the outer casing. The heat dissipation component connects multiple heat conduction cavities through a combination of heat conduction chambers and assembly pipes. This allows coolant to be pumped from the inlet pipe into the heat conduction chamber at the end of the circulating pump box. The internal liquid flows along the assembly pipe and heat conduction chamber at the bottom of the heat conduction plate. During the flow, the heat conduction plate transfers heat to the upper control layer, reducing the temperature of the upper control area. After heat transfer, the internal liquid enters the circulating pump box for a new cycle. Compared to finned heat dissipation, this structure uses a heat transfer method at the bottom, which is more efficient. Combined with liquid cooling, it can quickly transfer heat, making it more suitable for wide temperature environments.

[0027] In a preferred embodiment, the outer wall of the heat-conducting plate 401 is provided with a plurality of first heat dissipation channels 403 arranged horizontally at intervals, the bottom of the circulating pump box 407 is provided with a plurality of second heat dissipation channels 408, and the exhaust assembly 3 includes an assembly plate 301 installed at the opening of the rear end face of the outer casing 1, and a plurality of sets of exhaust fans 302 arranged horizontally at intervals are installed on the outer wall of the assembly plate 301.

[0028] In the above scheme, based on heat transfer at the heat-conducting plate, the exhaust fan can draw the hot air inside the shell outward. The hot air reaches the heat-conducting plate from the control layer, moves down along the multiple first heat dissipation channels on the heat-conducting plate, and then exhausts the heat from the inside through the second heat dissipation channel. This structure can accelerate the internal heat dissipation efficiency and improve the internal heat dissipation effect. In addition, during the exhaust process, it can also dissipate heat from the liquid area, improving the heat dissipation effect there. The exhaust fans are arranged in multiple sets with horizontal spacing, which can effectively expand the exhaust area and improve the exhaust and cooling efficiency.

[0029] In a preferred embodiment, heat dissipation channels 201 are provided on both sides of the upper cover 2. Heat dissipation mesh 202 is installed inside the heat dissipation channel 201. A shielding eaves 204 is installed above the heat dissipation channel 201. An inclined guide platform 203 is installed at the bottom of the heat dissipation channel 201. The inclination angle between the shielding eaves 204 and the inclined guide platform 203 is 35°~45°.

[0030] In the above scheme, the heat dissipation channel is used for top heat dissipation, and the heat dissipation mesh is used to block external impurities while dissipating heat. When the exhaust fan is drawing air, it can draw external cold air from this position into the interior to cool the inside of the shell. There is a shielding eave above the heat dissipation channel. Since the heat dissipation channel is opened on the side and the shielding eave has an inclined angle, it is more difficult for dust to enter. In addition, the setting of the inclined guide platform can allow some dust particles to slide naturally to the bottom, extending the cleaning cycle of the heat dissipation mesh.

[0031] In a preferred embodiment, an assembly rack 101 is installed inside the outer casing 1, and inserts 102 are installed at the four corners of the assembly rack 101. A sealing groove 103 is provided on the upper surface of the outer casing 1. Inserts 205 are installed at the four corners inside the upper cover 2, and a sealing strip 206 is provided on the lower surface of the upper cover 2.

[0032] In the above solution, the upper cover can be inserted into the corresponding insertion tube through the insertion rod, so that the upper cover and the outer shell are combined together. At the same time, during the insertion process, the sealing strip will be inserted into the sealing groove to improve the sealing between the upper cover and the outer shell.

[0033] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A protective structure for the chassis of an edge computing device suitable for wide temperature environments, wherein, include: The device comprises an outer casing, a top cover, an exhaust assembly, and a heat dissipation assembly. The top cover is mounted on top of the outer casing, the exhaust assembly is mounted on the rear end face of the outer casing, and the heat dissipation assembly is mounted inside the outer casing. The heat dissipation assembly includes a heat-conducting plate, the lower surface of which has multiple horizontally spaced heat-conducting cavities. The ends of the heat-conducting cavities are fitted with assembly pipes for connecting the multiple heat-conducting cavities. The assembly pipes are U-shaped, and the ends of the heat-conducting cavities at both ends are respectively fitted with inlet pipes and outlet pipes. One end of the inlet pipes and outlet pipes is connected to a circulating pump box. The outer wall of the heat-conducting plate has multiple horizontally spaced first heat dissipation channels, and the bottom of the circulating pump box has multiple second heat dissipation channels. The exhaust assembly includes an assembly plate installed at the opening on the rear end face of the outer casing, and the outer wall of the assembly plate has multiple horizontally spaced exhaust fans.

2. The edge computing device chassis protection structure suitable for wide temperature environments as described in claim 1, wherein, Heat dissipation channels are provided on both sides of the upper cover. Heat dissipation mesh is installed inside the heat dissipation channels. A shielding eave is installed above the heat dissipation channels. An inclined guide platform is installed at the bottom of the heat dissipation channels. The inclination angle between the shielding eave and the inclined guide platform is 35°~45°.

3. The edge computing device chassis protection structure suitable for wide temperature environments as described in claim 1, wherein, An assembly rack is installed inside the outer shell, and inserts are installed at the four corners of the assembly rack. A sealing groove is provided on the upper surface of the outer shell, and inserts are installed at the four corners of the upper cover. A sealing strip is provided on the lower surface of the upper cover.

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