A low-cost on-board mixing circuit board for millimeter wave radar chip testing

By designing a low-cost onboard mixer circuit board and using up-and-down mixer chips and high-frequency RF switches, the problems of line spacing and insertion loss in millimeter-wave radar chip testing were solved, realizing automated chip installation and improving production efficiency.

CN224401732UActive Publication Date: 2026-06-23SUZHOU XINYIHENG TECHNOLOGY CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUZHOU XINYIHENG TECHNOLOGY CO LTD
Filing Date
2025-06-04
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

In existing millimeter-wave radar chip testing, passive mixers suffer from issues such as shortened line spacing and insertion loss. Furthermore, manual installation can easily lead to pin wear, affecting production efficiency.

Method used

Design a low-cost onboard mixer circuit board that uses up- and down-mixer chips and high-frequency RF switches to simplify the RF path and achieve automated chip installation through mechanical structure, reducing manual operation.

Benefits of technology

Shortening the RF path improves production efficiency, reduces assembly defects, and is suitable for large-scale factory production.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224401732U_ABST
    Figure CN224401732U_ABST
Patent Text Reader

Abstract

The utility model provides a low cost on -board mixing circuit board for millimeter wave radar chip test relates to current detection technical field, including module mechanism, the module mechanism upper side is installed with dismounting mechanism, the module mechanism includes circuit board body, the circuit board body upper surface side electric connection has test base, test chip is electrically connected in test base, test base both sides electric connection has the connecting wire, the connecting wire one end electric connection has high radio frequency module group, every high radio frequency module group electric connection is in the circuit board body upper surface, through above -mentioned technical scheme, its purpose lies in: through the design of up and down mixing chip and high frequency radio frequency switch, the transmitting end of radio frequency test machine, receiving measurement end, only need a cable and test board connection, not only shorten radio frequency path, also more easily worker assembly, reduce the production problem introduction because of the bad assembly, be applicable to factory mass production.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of current detection technology, and in particular to a low-cost onboard mixer circuit board for testing millimeter-wave radar chips. Background Technology

[0002] In the manufacturing and testing of millimeter-wave TRX chips, up and down mixers need to be connected to the TX and RX sides of the chip, respectively. The up mixer converts the low-frequency signal sent by the RF tester into a high-frequency signal for use as the test input of the millimeter-wave chip under test, while the down mixer converts the high-frequency signal into a low-frequency signal for down-converting the output signal of the millimeter-wave chip under test so that the RF tester can measure it.

[0003] Currently, existing passive mixers have limitations in shortening line spacing and reducing insertion loss from cables and connectors during testing. However, the manual insertion and removal of test chips during installation can easily cause wear on the connection pins. Therefore, this invention proposes a low-cost onboard mixer circuit board for testing millimeter-wave radar chips. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing passive mixers in the testing process, such as the need to shorten the line spacing and reduce insertion loss from cables and connectors, while the manual insertion and removal of test chips during installation can easily cause wear on the connection pins.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a low-cost onboard mixer circuit board for testing millimeter-wave radar chips, comprising a module mechanism, wherein a disassembly and assembly mechanism is installed on one side of the module mechanism; the module mechanism comprises a circuit board body, a test base is electrically connected to one side of the upper surface of the circuit board body, a test chip is electrically connected inside the test base, connecting wires are electrically connected to both sides of the test base, one end of the connecting wire is electrically connected to a high-frequency module, and each high-frequency module is electrically connected to the upper surface of the circuit board body.

[0006] Preferably, each of the high-frequency modules is electrically connected to an upmixer chip and a downmixer chip on one side via connecting wires, and the upmixer chip and downmixer chip are electrically connected to the upper surface of the circuit board body.

[0007] Preferably, the upmixer chip and the downmixer chip are electrically connected to a connection module on the same side. The connection module of the upmixer chip is equipped with a high-frequency transmitter, and the connection module of the downmixer chip is equipped with a high-frequency receiver.

[0008] Preferably, the disassembly and assembly mechanism includes two lower mounting sheet metals, which are fixed to the two side surfaces of the test base. An upper mounting sheet metal is provided above the lower mounting sheet metals, and a first support sheet metal is rotatably mounted on the outer side wall of the lower mounting sheet metals.

[0009] Preferably, a second support sheet metal is rotatably mounted on the upper end of each of the first support sheet metals, and each of the second support sheet metals is rotatably mounted on the upper mounting sheet metal. A central shaft is rotatably mounted between the lower mounting sheet metal and the upper mounting sheet metal.

[0010] Preferably, a drive bracket is fixedly connected to the outer side of the central shaft, a pull handle is fixedly connected to one side of the drive bracket, a rotating seat is fixedly connected to one side of the test base, an L-shaped clamping plate is rotatably installed inside the rotating seat, and an upper pressure plate is fixedly connected between the upper mounting sheet metal.

[0011] Preferably, a connector is rotatably mounted on the outer side wall of the upper mounting sheet metal, a side transmission link is rotatably mounted on the lower end of the connector, one end of the side transmission link is rotatably mounted on the outer side of the lower mounting sheet metal, and a support link is also rotatably mounted on the lower end of the connector, the support link being rotatably mounted on the outer side wall of the drive bracket.

[0012] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0013] With the use of up and down mixer chips and high-frequency RF switches, this design allows the transmitter and receiver measurement ends of the RF tester to be connected to the test board via only one cable. This not only shortens the RF path but also makes it easier for workers to assemble, reducing production problems caused by poor assembly and making it suitable for large-scale factory production.

[0014] When installing the test chip, pushing or pulling the handle will cause the drive bracket and the central shaft to move horizontally. The connecting parts on both sides of the drive bracket, the side transmission rod and the support rod will provide support and transmission between the upper mounting sheet metal, the drive bracket and the lower mounting sheet metal. The upper mounting sheet metal and the lower mounting sheet metal will rotate around the central shaft, which will cause the upper mounting sheet metal to fold or support, and then drive the upper pressure plate to rise and fall, so as to install the test chip in the test base. Then, pushing the L-shaped clamping plate will firmly install the test chip in the test base. Attached Figure Description

[0015] Figure 1 This document pertains to the overall structure of a low-cost onboard mixer circuit board for testing millimeter-wave radar chips.

[0016] Figure 2 This is a schematic diagram of the modular mechanism.

[0017] Figure 3 This is a schematic diagram of the disassembly and assembly mechanism.

[0018] Figure 4 This is a schematic diagram of the disassembly and assembly mechanism.

[0019] Legend: 100, Module mechanism; 200, Disassembly and assembly mechanism; 101, Circuit board body; 102, Test base; 103, Test chip; 104, High-frequency module; 105, Connecting wire; 106, Upper mixer chip; 107, Connecting module; 108, Lower mixer chip; 201, Support rod; 202, Lower mounting sheet metal; 203, First support sheet metal; 204, Drive bracket; 205, Second support sheet metal; 206, Upper pressure plate; 207, Upper mounting sheet metal; 208, Rotating seat; 209, L-shaped clamping plate; 210, Pull handle; 211, Connector; 212, Side transmission rod; 213, Central shaft. Detailed Implementation

[0020] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0021] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0022] Implementation examples, based on Figures 1-4 This utility model provides a low-cost onboard mixer circuit board for millimeter-wave radar chip testing, including a module mechanism 100, on one side of which a disassembly and assembly mechanism 200 is mounted; as shown in the following embodiment. Figure 2 As shown, the module mechanism 100 includes a circuit board body 101. A test base 102 is electrically connected to one side of the upper surface of the circuit board body 101. A test chip 103 is electrically connected inside the test base 102. Connecting wires 105 are electrically connected to both sides of the test base 102. One end of the connecting wires 105 is electrically connected to a high-frequency module 104. Each high-frequency module 104 is electrically connected to the upper surface of the circuit board body 101.

[0023] like Figure 2As shown, each of the high-frequency modules 104 is electrically connected to an upmixer chip 106 and a downmixer chip 108 on one side via connecting wires 105. The upmixer chip 106 and the downmixer chip 108 are electrically connected to the upper surface of the circuit board body 101. Both the upmixer chip 106 and the downmixer chip 108 are electrically connected to a connection module 107 on the same side. The connection module 107 of the upmixer chip 106 contains a high-frequency transmitter, and the connection module 107 of the downmixer chip 108 contains a high-frequency receiver.

[0024] The up and down mixer chips are the E-band wireless transmitter chip and receiver chip, respectively. The transmitter chip integrates a differential IQ mixer, a frequency multiplier, and a medium power amplifier, while the receiver chip integrates a differential IQ mixer, a frequency multiplier, and an intermediate frequency low noise amplifier.

[0025] A high-frequency RF switch is used to switch the TRX channels of the chip under test, supporting the reuse of RF test resources to complete multi-channel testing of millimeter-wave TRX chips;

[0026] The socket of the DUT is used in the mass production process to form a signal connection with the test board (LoadBoard) by the sorting machine switching chips through crimping;

[0027] With this design, the transmitter and receiver measurement ends of the RF tester only need one cable to connect to the test board, which not only shortens the RF path but also makes it easier for workers to assemble, reducing the production problems caused by poor assembly, and is suitable for large-scale factory production.

[0028] like Figures 3-4As shown, the disassembly and assembly mechanism 200 includes two lower mounting sheet metals 202, which are fixed to the two side surfaces of the test base 102. An upper mounting sheet metal 207 is provided above the lower mounting sheet metals 202. A first support sheet metal 203 is rotatably mounted on the outer wall of the lower mounting sheet metal 202. A second support sheet metal 205 is rotatably mounted on the upper end of each first support sheet metal 203. Each second support sheet metal 205 is rotatably mounted on the upper mounting sheet metal 207. The lower mounting sheet metal 202... A central shaft 213 is rotatably mounted between the upper mounting sheet metal 207 and the test base 102. A drive bracket 204 is fixedly connected to the outer side of the central shaft 213. A pull handle 210 is fixedly connected to one side of the drive bracket 204. A rotating seat 208 is fixedly connected to one side of the test base 102. An L-shaped clamping plate 209 is rotatably mounted inside the rotating seat 208. An upper pressure plate 206 is fixedly connected between the upper mounting sheet metal 207. A connector 211 is rotatably mounted on the outer wall of the upper mounting sheet metal 207. A side transmission link 212 is rotatably mounted at the lower end, with one end of the side transmission link 212 rotatably mounted on the outer side of the lower mounting sheet metal 202. A support link 201 is also rotatably mounted at the lower end of the connector 211, and the support link 201 is rotatably mounted on the outer wall of the drive bracket 204. Pushing and pulling the handle 210 can drive the drive bracket 204 and the central shaft 213 to move horizontally. The upper mounting can be adjusted through the connectors 211, the side transmission link 212, and the support link 201 on both sides of the drive bracket 204. The upper mounting sheet 207, drive bracket 204, and lower mounting sheet 202 provide support and transmission. The upper mounting sheet 207 and lower mounting sheet 202 will rotate around the central axis 213, which can drive the upper mounting sheet 207 and lower mounting sheet 202 to fold or support, thereby driving the upper pressure plate 206 to rise and fall, so as to install the test chip 103 into the test base 102. Then, by pushing the L-shaped card plate 209, the test chip 103 can be firmly installed into the test base 102.

[0029] The working principle of this utility model is as follows: Through the design of the up and down mixing chip and the high-frequency radio frequency switch, the transmitter and receiver measurement ends of the radio frequency tester only need one cable and test board for connection. This not only shortens the radio frequency path, but also makes it easier for workers to assemble, reducing the production problems caused by poor assembly. It is suitable for large-scale factory production. When installing the test chip 103, pushing and pulling the handle 210 can drive the drive bracket 204 and the central shaft 213 to move horizontally. Through the connectors 211, side transmission rods 212 and support rods 201 on both sides of the drive bracket 204, the upper mounting sheet metal 207, the drive bracket 204 and the lower mounting sheet metal 202 can play a supporting and transmission role. The upper mounting sheet metal 207 and the lower mounting sheet metal 202 will rotate around the central shaft 213, which can drive the upper mounting sheet metal 207 and the lower mounting sheet metal 202 to fold or support, thereby driving the upper pressure plate 206 to rise and fall, so as to install the test chip in the test base 102. Then, pushing the L-shaped card plate 209 can firmly install the test chip in the test base 102.

[0030] The above are merely preferred embodiments of this utility model and are not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from the technical solution of this utility model shall still fall within the protection scope of this utility model.

Claims

1. A low-cost onboard mixer circuit board for millimeter-wave radar chip testing, comprising a module mechanism, characterized in that: A disassembly and assembly mechanism is installed on one side of the module mechanism; The module structure includes a circuit board body, a test base electrically connected to one side of the upper surface of the circuit board body, a test chip electrically connected inside the test base, connecting wires electrically connected to both sides of the test base, and a high-frequency module electrically connected to one end of the connecting wires. Each high-frequency module is electrically connected to the upper surface of the circuit board body.

2. The low-cost onboard mixer circuit board for millimeter-wave radar chip testing according to claim 1, characterized in that: Each of the high-frequency modules has an upmixer chip and a downmixer chip electrically connected to one side via connecting wires. The upmixer chip and the downmixer chip are electrically connected to the upper surface of the circuit board body.

3. The low-cost onboard mixer circuit board for millimeter-wave radar chip testing according to claim 2, characterized in that: Both the upmixer chip and the downmixer chip are electrically connected to a connection module on the same side. The connection module of the upmixer chip contains a high-frequency transmitter, and the connection module of the downmixer chip contains a high-frequency receiver.

4. The low-cost onboard mixer circuit board for millimeter-wave radar chip testing according to claim 1, characterized in that: The disassembly and assembly mechanism includes two lower mounting sheet metals, which are fixed to the two side surfaces of the test base. An upper mounting sheet metal is provided above the lower mounting sheet metals, and a No. 1 support sheet metal is rotatably mounted on the outer side wall of the lower mounting sheet metals.

5. A low-cost onboard mixer circuit board for millimeter-wave radar chip testing according to claim 4, characterized in that: Each of the first support sheet metals is rotatably mounted on the upper end of a second support sheet metal, and each of the second support sheet metals is rotatably mounted on an upper mounting sheet metal. A central shaft is rotatably mounted between the lower mounting sheet metal and the upper mounting sheet metal.

6. A low-cost onboard mixer circuit board for millimeter-wave radar chip testing according to claim 5, characterized in that: A drive bracket is fixed to the outside of the central shaft, a pull handle is fixed to one side of the drive bracket, a rotating seat is fixed to one side of the test base, an L-shaped clamping plate is rotatably installed inside the rotating seat, and an upper pressure plate is fixed between the upper mounting sheet metal.

7. A low-cost onboard mixer circuit board for millimeter-wave radar chip testing according to claim 6, characterized in that: A connector is rotatably mounted on the outer wall of the upper mounting sheet metal. A side transmission link is rotatably mounted on the lower end of the connector. One end of the side transmission link is rotatably mounted on the outer side of the lower mounting sheet metal. A support link is also rotatably mounted on the lower end of the connector. The support link is rotatably mounted on the outer wall of the drive bracket.