Highly thermally conductive ceramic substrate

Abstract

The utility model discloses a kind of high-thermal-conductivity ceramic substrates, including ceramic plate, the upper surface of the ceramic plate is fixedly connected with heat transfer mechanism, the lower surface of the heat transfer mechanism is fixedly connected with heat dissipation mechanism, the heat transfer mechanism includes fixedly connected with the heat-conducting copper plate of the upper surface of the ceramic plate, the lower surface of the heat-conducting copper plate is fixedly connected with multiple groups of heat transfer column, the lower surface of the heat transfer column is pasted with mobile shell through the lower surface of the ceramic plate, this is convenient for a kind of high-thermal-conductivity ceramic substrate belongs to ceramic substrate technical field;This is convenient for a kind of high-thermal-conductivity ceramic substrate, heat-conducting copper plate efficiently gathers heat, and heat transfer column of red copper material quality rapidly conducts heat to mobile shell;Two groups of mobile shell are communicated by connecting pipeline, internal heat-conducting oil circulates and flows, can evenly spread heat to entire shell, avoid local heat accumulation, while mobile shell and heat transfer column closely adhere to reduce thermal resistance, realize heat efficient transmission and uniform distribution.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrate technology, specifically a high thermal conductivity ceramic substrate. Background Technology

[0002] Ceramic substrates are special boards made by directly bonding copper foil to the surface (single-sided or double-sided) of an alumina or aluminum nitride ceramic substrate at high temperatures. The resulting ultra-thin composite substrates possess excellent electrical insulation properties, high thermal conductivity, excellent solderability, and high adhesion strength. Like PCB boards, they can be etched with various patterns and have a large current-carrying capacity. Therefore, ceramic substrates have become a fundamental material for high-power power electronic circuit structure and interconnection technologies.

[0003] Chinese utility model patent CN222869114U discloses a high thermal conductivity ceramic substrate, comprising a ceramic plate, an alumina layer fixedly connected to the upper surface of the ceramic plate, a copper foil layer fixedly connected to the upper surface of the alumina layer, a U-shaped plate fixedly connected to the bottom of the ceramic plate, and several grooves evenly spaced on the lower surface of the ceramic plate. Each groove has several through holes at its top, and a heat-conducting rod passing through the through holes is fixed to the lower surface of the alumina layer. This utility model comprises a ceramic plate, an alumina layer, a copper foil layer, a U-shaped plate, a heat-conducting rod, and a duct. The bottom of the ceramic plate has several ventilation grooves. The heat-conducting rods guide the heat from the copper foil layer and the alumina layer into the grooves, and the duct blows out air, accelerating airflow within the grooves, thereby achieving better physical heat conduction and dissipation. This ceramic substrate has a simpler structure and is easier to manufacture. The U-shaped plate, secured to the bottom of the ceramic plate, increases the strength of the ceramic plate.

[0004] In existing high thermal conductivity ceramic substrates, the heat-conducting rods are dispersed and independent structures. After heat is introduced into the groove through a single heat-conducting rod, it is easy to form local heat accumulation. The area near the air outlet of the air duct cools down quickly due to the direct effect of airflow, while the end of the groove far from the air outlet accumulates heat due to the attenuation of airflow, forming a significant temperature difference. Therefore, it is not easy to transfer heat evenly.

[0005] Therefore, this invention provides a high thermal conductivity ceramic substrate to solve the above problems. Utility Model Content

[0006] To address the shortcomings of existing technologies, this invention provides a high thermal conductivity ceramic substrate, which solves the aforementioned problems.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a high thermal conductivity ceramic substrate, comprising a ceramic plate, a heat transfer mechanism fixedly connected to the upper surface of the ceramic plate, and a heat dissipation mechanism fixedly connected to the lower surface of the heat transfer mechanism. The heat transfer mechanism includes a thermally conductive copper plate fixedly connected to the upper surface of the ceramic plate, and multiple sets of heat transfer columns fixedly connected to the lower surface of the thermally conductive copper plate. The lower surfaces of the heat transfer columns pass through the lower surface of the ceramic plate and are attached to a movable outer shell. The heat dissipation mechanism includes heat dissipation dorsal fins fixedly connected to the lower surface of the movable outer shell, the heat dissipation dorsal fins being spaced apart on the lower surface of the movable outer shell, and a support plate fixedly connected to the lower surface of the movable outer shell.

[0008] Furthermore, limiting rods are fixedly connected to both sides of the movable housing, the outer surface of the limiting rods is slidably connected to the inner surface of the ceramic plate, and a connecting plate is fixedly connected to the outer surface of the movable housing.

[0009] By adopting the above technical solution, the limiting rod slides on the inner side of the ceramic plate, thereby facilitating the support and limiting of the outer surface of the movable shell.

[0010] Furthermore, the outer surface of the connecting plate is threaded with bolts, the outer surface of the bolts is threaded to the outer surface of the ceramic plate, and the movable housing is provided in two sets, the outer surfaces of the two sets of movable housings are connected by connecting pipes.

[0011] By adopting the above technical solution, the connecting plate can be easily fixed to the outer surface of the ceramic plate by rotating the bolts, thus preventing the connecting plate and the movable outer shell from separating from the ceramic plate.

[0012] Furthermore, an inlet is fixedly connected to the outer surface of the connecting plate, and the other end of the inlet is connected to the inner wall of the movable housing. An outlet is fixedly connected to the outer surface of another set of the connecting plates, and the other end of the outlet is connected to the inner wall of another set of the movable housing. The inner wall of the movable housing is filled with heat-conducting oil.

[0013] Using the above technical solution, heat transfer oil is injected into a set of movable housings from the inlet by an external circulation pump. The heat transfer oil is then easily introduced into another set of movable housings through a connecting pipe. Finally, the excess heat transfer oil is discharged from the outlet. The outlet is connected to the inlet of the external circulation pump to facilitate the circulation of the heat transfer oil between the inlet and outlet, thereby distributing the heat of the ceramic plate evenly.

[0014] Furthermore, the upper surface of the ceramic plate has multiple sets of through grooves, and the inner wall of the through grooves is slidably connected to the outer surface of the heat transfer column.

[0015] By adopting the above technical solution, the heat transfer area is increased by the through grooves opened on the upper surface of the heat transfer column and the ceramic plate, which facilitates the rapid transfer of heat to the outer surface of the moving shell.

[0016] Furthermore, a heat dissipation pipe is fixedly connected to the outer surface of the ceramic plate. A through hole is opened on the outer surface of the heat dissipation pipe, the through hole faces the outer surface of the heat dissipation dorsal fin, and one end of the heat dissipation pipe passes through the outer surface of the ceramic plate and is fixedly connected to an air inlet. An air pump outlet is connected to the outer surface of the air inlet.

[0017] By adopting the above technical solution, the air pump is started to blow air into the through hole from the air inlet, so that the air flow in the through hole blows towards the outer surface of the heat dissipation dorsal fin, which increases the air flow at the heat dissipation dorsal fin and facilitates the removal of heat from the outer surface of the heat dissipation dorsal fin.

[0018] Beneficial effects

[0019] This invention provides a high thermal conductivity ceramic substrate. Compared with the prior art, it has the following advantages:

[0020] 1. This high thermal conductivity ceramic substrate efficiently gathers heat through a thermally conductive copper plate, and the copper heat transfer column quickly conducts heat to the movable outer shell; the two movable outer shells are connected by connecting pipes, and the internal heat transfer oil circulates, which can evenly diffuse heat to the entire shell and avoid local heat accumulation. At the same time, the movable outer shell and the heat transfer column are closely fitted to reduce thermal resistance, so as to achieve efficient heat transfer and uniform distribution.

[0021] 2. This high thermal conductivity ceramic substrate uses aluminum alloy heat dissipation fins with spaced distribution to increase the heat dissipation area. After the heat dissipation pipes are connected to the air pump, the gas is blown directionally towards the back fins through the through holes, accelerating the airflow on the surface to quickly remove heat. The airflow and the back fins work together to significantly improve heat dissipation efficiency, ensure timely heat dissipation, and maintain a stable operating temperature of the substrate. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a perspective view of the external structure of this utility model;

[0024] Figure 2 This is a front sectional view of the structure of this utility model;

[0025] Figure 3 yesFigure 2 A magnified structural diagram of A in the middle;

[0026] Figure 4 This is a side sectional view of the structure of this utility model;

[0027] Figure 5 This is a top sectional view of the structure of this utility model.

[0028] In the diagram: 1. Ceramic plate; 2. Heat transfer mechanism; 201. Bolt; 202. Liquid inlet; 203. Connecting plate; 204. Connecting pipe; 205. Liquid outlet; 206. Thermally conductive copper plate; 207. Movable outer shell; 208. Heat transfer column; 209. Limiting rod; 3. Heat dissipation mechanism; 301. Heat dissipation pipe; 302. Support plate; 303. Through hole; 304. Heat dissipation dorsal fin; 305. Air inlet. Detailed Implementation

[0029] It should be noted that in the description of the embodiments of this application, the terms "front," "rear," "left," "right," "up," "down," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0030] The present application will be further described in detail below with reference to the accompanying drawings and embodiments.

[0031] Reference Figures 1 to 5 This application provides a high thermal conductivity ceramic substrate, including a ceramic plate 1. A heat transfer mechanism 2 is fixedly connected to the upper surface of the ceramic plate 1, and a heat dissipation mechanism 3 is fixedly connected to the lower surface of the heat transfer mechanism 2. The heat transfer mechanism 2 includes a thermally conductive copper plate 206 fixedly connected to the upper surface of the ceramic plate 1. Multiple sets of heat transfer columns 208 are fixedly connected to the lower surface of the thermally conductive copper plate 206. The lower surface of the heat transfer columns 208 passes through the lower surface of the ceramic plate 1 and is attached to a movable housing 207. The heat dissipation mechanism 3 includes heat dissipation back fins 304 fixedly connected to the lower surface of the movable housing 207. The heat dissipation back fins 304 are spaced apart on the lower surface of the movable housing 207, and a support plate 302 is fixedly connected to the lower surface of the movable housing 207.

[0032] Furthermore, limit rods 209 are fixedly connected to both sides of the movable housing 207. The outer surface of the limit rods 209 is slidably connected to the inner surface of the ceramic plate 1. A connecting plate 203 is fixedly connected to the outer surface of the movable housing 207. Bolts 201 are threadedly connected to the outer surface of the connecting plate 203. The outer surface of the bolts 201 is threadedly connected to the outer surface of the ceramic plate 1. Two sets of movable housings 207 are provided. The outer surfaces of the two sets of movable housings 207 are connected through a connecting pipe 204. An inlet 202 is fixedly connected to the outer surface of the connecting plate 203. The other end of the inlet 202 is connected to the inner wall of the movable housing 207. An outlet 205 is fixedly connected to the outer surface of the other set of connecting plates 203. The other end of the outlet 205 is connected to the inner wall of the other set of movable housings 207. The inner wall of the movable housing 207 is filled with heat-conducting oil.

[0033] In this embodiment, heat is efficiently gathered by the heat-conducting copper plate 206, and the heat transfer column 208 made of copper quickly conducts the heat to the movable shell 207; the two movable shells 207 are connected by the connecting pipe 204, and the internal heat-conducting oil circulates, which can evenly diffuse the heat to the entire shell and avoid local heat accumulation. At the same time, the movable shell 207 and the heat transfer column 208 are closely attached to reduce thermal resistance, so as to achieve efficient heat transfer and uniform distribution.

[0034] Reference Figures 1 to 5 In one aspect of this embodiment, the upper surface of the ceramic plate 1 is provided with multiple sets of through grooves, and the inner wall of the through grooves is slidably connected to the outer surface of the heat transfer column 208.

[0035] Furthermore, a heat dissipation pipe 301 is fixedly connected to the outer surface of the ceramic plate 1. A through hole 303 is opened on the outer surface of the heat dissipation pipe 301. The through hole 303 faces the outer surface of the heat dissipation dorsal fin 304. One end of the heat dissipation pipe 301 passes through the outer surface of the ceramic plate 1 and is fixedly connected to an air inlet 305. An air pump outlet is connected to the outer surface of the air inlet 305.

[0036] In this embodiment, the heat dissipation dorsal fin 304 is made of aluminum alloy and is spaced apart to increase the heat dissipation area. After the heat dissipation pipe 301 is connected to the air pump, the gas is blown directionally toward the dorsal fin through the through hole 303, which accelerates the air flow on the surface to quickly remove heat. The airflow and the dorsal fin work together to significantly improve the heat dissipation efficiency, ensure that the heat is dissipated in time, and maintain the stable operating temperature of the substrate.

[0037] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0038] Working principle: When this high thermal conductivity ceramic substrate is working, heat is first efficiently conducted by the heat transfer mechanism 2. After the heat is received by the heat-conducting copper plate 206 on the upper surface of the ceramic plate 1, it passes through multiple sets of heat transfer columns 208 on its lower surface. The heat transfer columns 208 are made of copper, which has a high thermal conductivity and can quickly transfer heat. The heat passes through the slots on the ceramic plate 1 and is transferred to the movable outer shell 207 attached to the lower surface of the heat transfer columns 208. The two sets of movable outer shells 207 are connected by a connecting pipe 204. The interior is filled with thermally conductive oil, which has good fluidity and can evenly diffuse and circulate heat within the shell, distributing the heat evenly throughout the entire movable outer shell 207 and avoiding heat loss. Localized heat accumulation occurs, and the heat dissipation mechanism 3 operates synchronously. The heat dissipation back fin 304 on the lower surface of the movable outer shell 207 is made of aluminum alloy. Aluminum alloy has excellent heat dissipation performance and is lightweight, increasing the heat dissipation area. The heat dissipation pipe 301 on the outer surface of the ceramic plate 1 is connected to the air pump through the air inlet 305. The gas is blown directionally towards the heat dissipation back fin 304 through the through hole 303 on the pipe, accelerating the air flow on the surface of the back fin and quickly removing heat. The movable outer shell 207 is stably supported by sliding on the inner side of the ceramic plate 1 through the limiting rod 209, and then fixed by the connecting plate 203 and bolts 201 to ensure that the heat transfer column 208 is tightly attached to the movable outer shell 207.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0040] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high thermal conductivity ceramic substrate, comprising a ceramic plate (1), characterized in that: A heat transfer mechanism (2) is fixedly connected to the upper surface of the ceramic plate (1), and a heat dissipation mechanism (3) is fixedly connected to the lower surface of the heat transfer mechanism (2). The heat transfer mechanism (2) includes a heat-conducting copper plate (206) fixedly connected to the upper surface of the ceramic plate (1). Multiple sets of heat transfer columns (208) are fixedly connected to the lower surface of the heat-conducting copper plate (206). The lower surface of the heat transfer column (208) passes through the lower surface of the ceramic plate (1) and is attached to a movable shell (207). The heat dissipation mechanism (3) includes a heat dissipation back fin (304) fixedly connected to the lower surface of the movable shell (207). The heat dissipation back fin (304) is spaced apart on the lower surface of the movable shell (207), and a support plate (302) is fixedly connected to the lower surface of the movable shell (207).

2. The high thermal conductivity ceramic substrate according to claim 1, characterized in that: Limiting rods (209) are fixedly connected to both sides of the movable housing (207). The outer surface of the limiting rods (209) is slidably connected to the inner side of the ceramic plate (1), and a connecting plate (203) is fixedly connected to the outer surface of the movable housing (207).

3. The high thermal conductivity ceramic substrate according to claim 2, characterized in that: The outer surface of the connecting plate (203) is threaded with a bolt (201), the outer surface of the bolt (201) is threaded to the outer surface of the ceramic plate (1), and the movable housing (207) is provided in two sets, the outer surfaces of the two sets of movable housings (207) are connected by a connecting pipe (204).

4. The high thermal conductivity ceramic substrate according to claim 3, characterized in that: The outer surface of the connecting plate (203) is fixedly connected to a liquid inlet (202), the other end of which is connected to the inner wall of the movable housing (207), and the outer surface of another set of the connecting plates (203) is fixedly connected to a liquid outlet (205), the other end of which is connected to the inner wall of another set of the movable housing (207), and the inner wall of the movable housing (207) is filled with heat-conducting oil.

5. A high thermal conductivity ceramic substrate according to claim 1, characterized in that: The upper surface of the ceramic plate (1) has multiple sets of through grooves, and the inner wall of the through grooves is slidably connected to the outer surface of the heat transfer column (208).

6. The high thermal conductivity ceramic substrate according to claim 5, characterized in that: A heat dissipation pipe (301) is fixedly connected to the outer surface of the ceramic plate (1). A through hole (303) is opened on the outer surface of the heat dissipation pipe (301). The through hole (303) faces the outer surface of the heat dissipation dorsal fin (304). One end of the heat dissipation pipe (301) passes through the outer surface of the ceramic plate (1) and is fixedly connected to an air inlet (305). An air pump outlet is connected to the outer surface of the air inlet (305).

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