A kind of adhesive bonding equipment of circuit board
By designing automated adhesive application, gluing, and pressing components for circuit board gluing, the problem of low efficiency in manual gluing has been solved, achieving safe and efficient circuit board gluing operations, making it suitable for small workshops.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUBEI RIXIN ELECTRONIC TECHNOLOGY CO LTD
- Filing Date
- 2025-07-15
- Publication Date
- 2026-06-23
AI Technical Summary
The existing circuit board adhesive application process relies on manual operation, which is inefficient and poses safety hazards. Automated equipment is expensive and difficult to adapt to the diverse needs of small workshops.
A circuit board adhesive application device was designed, comprising an adhesive dispensing component, an adhesive application component, and an adhesive pressing component. The automated adhesive application operation of the circuit board is achieved through the coordinated work of these components, including clamping, cutting, and pressing processes.
It improves adhesive application efficiency, ensures worker safety, and reduces equipment costs, making it suitable for small workshops.
Smart Images

Figure CN224401767U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board processing technology, specifically to a circuit board adhesive application device. Background Technology
[0002] In the electronics manufacturing industry, circuit boards are core components, and the adhesive application process is crucial. Applying adhesive to circuit boards enables version or batch marking, facilitating production management, quality traceability, and product identification. However, in many small workshops, circuit board adhesive application is mostly done manually. Manual application is not only inefficient and unable to meet the ever-increasing production demands, but also poses safety hazards such as hand injuries, seriously affecting worker safety and production continuity. Although there are some automated adhesive application machines on the market, these machines are often expensive, complex in structure, and difficult to adapt to the diverse circuit board production needs of small workshops, thus preventing their widespread application. Utility Model Content
[0003] To achieve the above objectives, the present invention provides the following technical solution: a circuit board gluing device, comprising an operating table and a frame and a rotating table mounted on the operating table, wherein four clamping stations are mounted on the rotating table, characterized in that: a table plate is mounted on the operating table, and a glue dispensing component and a glue applying component are mounted on the table plate, located on the periphery of the rotating table corresponding to one of the clamping stations; and a glue pressing component is also mounted on the frame above one of the clamping stations.
[0004] The glue dispensing assembly includes a vertical plate that slides on the platform and a fixed vertical block. The vertical plate is equipped with four sets of glue dispensing devices, multiple guide rods, a front-push cylinder, and four sets of columns. A horizontal plate is also installed on the vertical plate. A pulling part is installed on one side of the horizontal plate. A top-cutting part located below the columns is installed on the vertical plate. The piston rod of the front-push cylinder is fixed to the vertical block.
[0005] The adhesive application assembly includes a stand, with a rotating rod rotatably connected to the inner side of the stand and a rotating part for driving the rotating rod to rotate installed on the outer side. An adhesive clamping part is installed on the outer side of the rotating rod.
[0006] Furthermore, the conveying unit includes a push cylinder installed on one side of the horizontal plate, and a slide plate that is fixed to the piston rod of the push cylinder. Four sets of lower plates that pass through the horizontal plate and slide are fixed on one side of the slide plate. An upper cylinder is installed on one side of the slide plate, and a lifting plate that is fixed to the piston rod of the upper cylinder slides on one side of the lifting plate. Four upper plates that are respectively opposite to the corresponding lower plates are fixed on one side of the lifting plate.
[0007] Furthermore, the top cutting section includes an ejector cylinder mounted on the vertical plate, the piston rod of the ejector cylinder is fixed to an ejector plate, and four sets of cutters are mounted on the ejector plate.
[0008] Furthermore, the rotating part includes a concave plate fixed to the side of the upright, a rack sliding in the concave plate, a gear meshing with the rack fixed at one end of the rotating rod, and a push cylinder installed on the upright, the piston rod of the push cylinder being fixed to the rack.
[0009] Furthermore, a protrusion is fixed to the other end of the rotating rod, and two sets of buffers are installed on the other side of the frame, with the top of one of the buffers abutting the protruding end of the protrusion.
[0010] Furthermore, the clamping part includes four sets of lower clamps fixed on one side of the rotating rod, and four sets of push-clamp cylinders hinged on the other side. An upper clamp is hinged to the lower clamps, and the upper clamp is hinged to the piston rod of the push-clamp cylinder.
[0011] Furthermore, the pressing assembly includes a pressing cylinder, a pressing plate is fixed to the bottom of the pressing cylinder, two sets of uprights are inserted through the upper limit of the pressing plate, a pressure plate is fixed between the uprights, and a spring is sleeved on the outside of the uprights.
[0012] Compared with the prior art, the technical solution of this application has the following beneficial effects:
[0013] This circuit board adhesive application equipment automates the adhesive application process by coordinating the adhesive dispensing, application, and pressing components. This significantly improves application efficiency and solves the problem of low efficiency in manual application. It also offers good safety by avoiding the risk of hand injuries during manual operation, ensuring worker safety. The equipment features a reasonable structural design with tightly integrated components, enabling stable and reliable adhesive application. Furthermore, its relatively low cost makes it suitable for small workshops. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the structure of this utility model;
[0015] Figure 2 This is a three-dimensional schematic diagram of the connection structure between the adhesive dispensing component and the adhesive application component in this utility model;
[0016] Figure 3 This utility model Figure 2 Right-side 3D structural schematic diagram of the intermediate-release adhesive assembly;
[0017] Figure 4 This is a three-dimensional schematic diagram of the horizontal plate connection structure in convex 2 of this utility model;
[0018] Figure 5 This utility model Figure 2 A three-dimensional structural diagram of the adhesive-coated assembly;
[0019] Figure 6 This is a three-dimensional structural diagram of the pressure adhesive assembly in this utility model.
[0020] In the diagram: 1. Operating table; 2. Frame; 3. Adhesive pressing assembly; 31. Pressing cylinder; 32. Push plate; 33. Upright pole; 34. Pressure plate; 35. Spring; 4. Rotating table; 5. Clamping station; 6. Adhesive dispensing assembly; 61. Table; 62. Upright plate; 63. Adhesive roll dispensing mechanism; 64. Guide rod; 65. Column; 66. Horizontal plate; 67. Slide plate; 68. Pushing cylinder; 69. Lower plate 610. Lifting plate; 611. Top-mounting cylinder; 612. Upper plate; 613. Front-push cylinder; 614. Standing block; 615. Ejection cylinder; 616. Ejection plate; 617. Cutter; 7. Adhesive application assembly; 71. Stand; 72. Rotating rod; 73. Gear; 74. Concave plate; 75. Push-mounting cylinder; 76. Rack; 77. Lower clamp; 78. Upper clamp; 79. Push-clamp cylinder. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0022] Please see Figure 1-6 The circuit board adhesive application equipment in this embodiment includes an operating table 1, a frame 2 mounted on the operating table 1, and a rotating table 4 mounted below the frame 2. Four sets of clamping stations 5 are mounted on the table surface of the rotating table 4. A table plate 61 is fixed on the table surface of the operating table 1. An adhesive application component 7 and an adhesive dispensing component 6 are horizontally mounted on the top of the table plate 61. An adhesive pressing component 3 is mounted on one side of the frame 2 above one of the clamping stations 5.
[0023] In the above structure, the circuit board is clamped and fixed by the clamping station. The feeding method is through an external transfer device. The rotating table rotates, which drives the clamping station to change position and is located below the pressure adhesive assembly. Then, the glue dispensing assembly dispenses and cuts the glue. In cooperation with the adhesive application assembly, the glue is applied to the circuit board. The pressure adhesive assembly presses down to press the glue paper on top tightly, thus realizing the automated operation of circuit board adhesive application. This greatly improves the adhesive application efficiency, solves the problem of low efficiency of manual adhesive application, and is also safe, avoiding the risk of hand cuts during manual operation and ensuring the personal safety of workers.
[0024] like Figure 2-4 ,by Figure 2As shown, the adhesive dispensing assembly 6 includes a vertical plate 62 that slides on the top of a platform 61, and a vertical block 614 fixed on the platform 61. A forward-pushing cylinder 613 is mounted on the vertical plate 62, and the piston rod of the forward-pushing cylinder 613 is fixed to the vertical block 614. Four sets of adhesive rolls 63 are mounted on the left side of the vertical plate 62, and a guide rod 64 for guiding the adhesive tape to the corresponding adhesive roll 63 is rotatably mounted, as well as a column 65 corresponding to the guide rod 64. A horizontal plate 66 is also mounted on the left side of the vertical plate 62, and a push cylinder 68 is mounted on the left side of the horizontal plate 66. A sliding plate 67 fixed to the piston rod of the push cylinder 68 is slidably connected to the horizontal plate 66. An opening is also provided on the horizontal plate 66. The slide plate 67 has elongated holes. Four sets of lower plates 69, all passing through the elongated holes, are fixed to the right side of the slide plate 67. An upper cylinder 611 is installed on the left side of the slide plate 67, and a lifting plate 610 is slidably connected to the piston rod of the upper cylinder 611. One end of the lifting plate 610 is fixed with an upper plate 612, which is the same number as the lower plates 69 and opposite to the corresponding lower plates 69. An ejection cylinder 615 is installed on the upright plate 62. The piston rod of the ejection cylinder 615 is fixed to an ejection plate 616 located below the column 65. Four sets of cutters 617 are fixed to the top of the ejection plate 616. Two sets of buffers are installed on the top of the platform 61, located on the left and right sides of the upright plate 62 respectively.
[0025] The tape roll is guided downwards by a guide rod and a column. The top surface of the tape adheres to the column. When the tape is between the upper and lower plates, the upper cylinder retracts, causing the lifting plate to move downwards, clamping the tape between the upper and lower plates. Then, the push cylinder pushes out, moving the sliding plate to pull the tape out to a certain length. The forward cylinder, in conjunction with the upright block, moves the upright plate closer to the tape application assembly. When the tape application assembly fixes the tape, the push cylinder drives the push plate to cut the tape with a cutter. The cutter maintains a certain distance from the column during cutting, ensuring that the tape's adhesive surface remains in contact with the column after cutting. This makes the bottom of the tape horizontal, facilitating the next pull of the tape by the upper and lower plates, thus achieving automated tape retrieval.
[0026] like Figure 5 The adhesive application assembly 7 includes a stand 71 fixed on a platform 61. A rotating rod 72 and a push-top cylinder 75 are rotatably connected to the inner side of the stand 71, and a concave plate 74 is fixed on the right side. The piston rod of the push-top cylinder 75 is fixed with a rack 76 that slides with the concave plate 74. The rotating rod 72 is cubic, and a gear 73 that meshes with the rack 76 is fixed at the right end of the rotating rod 72. A protrusion is fixed at the other end of the rotating rod 72. Two sets of buffers are installed on the left side of the stand 71. The top of one of the buffers is in contact with the protruding end of the protrusion. A lower clamp 77 is fixed on the front of the rotating rod 72, and a push-clamp cylinder 79 is hinged to the bottom. An upper clamp 78 is hinged to the lower clamp 77. The upper clamp 78 is L-shaped, and the bottom of the upper clamp 78 is hinged to the piston rod of the push-clamp cylinder 79. The head end of the lower clamp 77 protrudes and is not on the same horizontal line as the head end of the upper clamp 78.
[0027] The concave plate guides the rack to move stably. The rack and gear drive the rotating rod to rotate, which allows the clamping end on the rotating rod to flip. At the same time, the buffer and the protrusion limit the rotating rod. When the glue dispensing assembly pulls the glue to the moving length and pushes it forward between the upper and lower clamps, the push-clamp cylinder runs. The upper clamp moves and cooperates with the lower clamp to clamp the glue. The glue dispensing assembly completes the cutting. Therefore, by flipping, the tape can be adhered to the circuit board. At the same time, because the heads of the upper and lower clamps are not on the same horizontal line, when flipping and adhering, the top of the circuit board will adhere to the lower clamp, and the tail end of the circuit board will adhere to the head end of the upper clamp to complete the adhesion.
[0028] like Figure 6 The adhesive application assembly 3 includes a pressing cylinder 31 fixed to the frame 2. A pressing plate 32 is fixed to the piston rod of the pressing cylinder 31. Two sets of uprights 33 are inserted through the upper limit of the pressing plate 32. A pressure plate 34 is fixed between the bottoms of the uprights 33. A spring 35 is sleeved on the outer side of the uprights 33, located between the pressing plate 32 and the pressure plate 34. When the adhesive application assembly applies the tape to the designated position on the circuit board, the pressing cylinder drives the pressing plate downwards, causing the pressure plate to press the corresponding tape tightly. Simultaneously, it drives the uprights upwards and compresses the spring, thus providing a buffering effect and preventing damage to the circuit board from excessive downward pressure.
[0029] The working principle of the above embodiments is as follows:
[0030] First, the external transfer device places the circuit board onto the clamping station. Then, the rotating table rotates, moving the adhesive applicator downwards. Next, the upper cylinder drives the lifting plate downwards, clamping the corresponding tape through the upper and lower plates. Then, the push cylinder pushes the sliding plate, pulling the tape to a certain length. The forward push cylinder moves the upright plate, positioning the tape between the upper and lower clamps. The push clamp cylinder moves the upper clamp, which, in conjunction with the lower clamp, holds the tape. The ejection cylinder drives the cutter to cut the tape. The push cylinder, through a rack and pinion mechanism, drives the sliding rod to rotate, smoothly applying the tape to the designated position on the circuit board. This automates the circuit board adhesive application process, significantly improving efficiency and solving the problem of low efficiency in manual adhesive application. It also ensures safety, avoiding the risk of hand injuries during manual operation and protecting worker safety.
[0031] The entire workflow is now complete, and anything not described in detail in this specification is existing technology known to those skilled in the art.
[0032] It should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A circuit board bonding device, comprising an operating table (1) and a frame (2) and a rotating table (4) mounted on the operating table (1), wherein the rotating table (4) is equipped with four sets of clamping stations (5), characterized in that: The operating table (1) is equipped with a table plate (61), and the table plate (61) is equipped with a glue-dispensing component (6) and a glue-applying component (7) located on the periphery of the rotating table (4) corresponding to one of the clamping stations (5). The frame (2) is also equipped with a glue-pressing component (3) located above one of the clamping stations (5). The glue dispensing assembly (6) includes a vertical plate (62) that slides on a platform (61) and a fixed block (614). The vertical plate (62) is equipped with four sets of glue dispensing rolls (63), multiple guide rods (64), a front push cylinder (613), and four sets of columns (65). A horizontal plate (66) is also installed on the vertical plate (62). A pulling part is installed on one side of the horizontal plate (66). A top cutting part located below the column (65) is installed on the vertical plate (62). The piston rod of the front push cylinder (613) is fixed to the block (614). The adhesive application assembly (7) includes a stand (71), a rotating rod (72) is rotatably connected to the inner side of the stand (71), and a rotating part for driving the rotating rod (72) to rotate is installed on the outer side. An adhesive clamping part is installed on the outer side of the rotating rod (72).
2. The apparatus according to claim 1, wherein: The conveying unit includes a push cylinder (68) installed on one side of the horizontal plate (66) and a slide plate (67) that is fixed to the piston rod of the push cylinder (68). Four sets of lower plates (69) that pass through the horizontal plate (66) and slide are fixed on one side of the slide plate (67). An upper cylinder (611) is installed on one side of the slide plate (67) and a lifting plate (610) that is fixed to the piston rod of the upper cylinder (611) slides on one side. Four upper plates (612) that are respectively opposite to the corresponding lower plates (69) are fixed on one side of the lifting plate (610).
3. The apparatus according to claim 2, wherein: The top cutting part includes an ejector cylinder (615) mounted on a vertical plate (62), the piston rod of the ejector cylinder (615) is fixed with an ejector plate (616), and four sets of cutters (617) are mounted on the ejector plate (616).
4. The apparatus according to claim 1, wherein: The rotating part includes a concave plate (74) fixed to the side of the upright (71), a rack (76) sliding in the concave plate (74), a gear (73) meshing with the rack (76) fixed at one end of the rotating rod (72), and a push cylinder (75) also installed on the upright (71), the piston rod of the push cylinder (75) being fixed to the rack (76).
5. The circuit board adhesive application equipment according to claim 4, characterized in that: The other end of the rotating rod (72) is fixed with a protrusion, and two sets of buffers are installed on the other side of the stand (71), with the top of one of the buffers in contact with the protruding end of the protrusion.
6. The adhesive bonding equipment for circuit boards according to claim 4, characterized in that: The clamping part includes four sets of lower clamps (77) fixed on one side of the rotating rod (72), and four sets of push clamp cylinders (79) hinged on the other side. An upper clamp (78) is hinged on the lower clamps (77), and the upper clamp (78) is hinged to the piston rod of the push clamp cylinder (79).
7. The circuit board adhesive application equipment according to claim 1, characterized in that: The pressing assembly (3) includes a pressing cylinder (31), a pressing plate (32) is fixed at the bottom of the pressing cylinder (31), two sets of uprights (33) are inserted through the upper limit of the pressing plate (32), a pressure plate (35) is fixed between the uprights (33), and a spring (34) is sleeved on the outside of the uprights (33).