A multi-layer circuit board stackable
By using a threaded connection method that inserts pins into the fixing components, the problem of complex structure and cumbersome operation of existing PCB circuit boards is solved, and the installation of multi-layer circuit boards is simplified and the fixing effect is enhanced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHUHAI PLATINUM CIRCUIT CO LTD
- Filing Date
- 2025-07-31
- Publication Date
- 2026-06-26
AI Technical Summary
Existing PCB circuit boards that can be spliced together are connected by soldering, which results in a complex structure, cumbersome operation, and reduced work efficiency.
By using pins to insert into the fixing components, and with the cooperation of limiting and elastic components, a threaded connection is achieved between the pins and the fixing components, simplifying the splicing process and enhancing the fixing effect.
It simplifies the stacking and installation process of multi-layer circuit boards, making it more convenient and providing a more secure fixation.
Smart Images

Figure CN224419013U_ABST