A processing jig suitable for ultra-thin sheet material

By designing a processing fixture suitable for ultra-thin sheets, and utilizing laser roughening to increase friction and a flip-up structure, the warping and alignment problems of ultra-thin sheets during processing were solved, thus improving processing quality and efficiency.

CN224419023UActive Publication Date: 2026-06-26ZHUHAI YISHENGSHUN ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ZHUHAI YISHENGSHUN ELECTRONICS CO LTD
Filing Date
2025-07-30
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Ultra-thin sheets are prone to warping and deformation of the clamping plate before pressing, which makes alignment difficult during processing, affects processing quality and may lead to scrap.

Method used

Design a processing fixture suitable for ultra-thin sheet metal, which adopts an upper clamping plate and a lower clamping plate. The surface of the clamping plate is laser roughened to increase the friction and is connected by tape to form a flip-up structure. The clamping plate is provided with through holes to facilitate alignment and identification.

Benefits of technology

It effectively reduces the movement of ultra-thin sheet materials during processing, prevents warping and misalignment, ensures accurate pressing and alignment, and reduces scrap rate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to high multilayer thin medium PCB press fit process technical field, especially suitable for the processing fixture of super thin plate material, the technical problem to be solved is to provide a kind of increase the friction of jig and super thin plate material, reduce the movement of super thin plate material in processing process, the processing fixture suitable for super thin plate material is not seriously warped when punching before press fit, including upper clamping plate and lower clamping plate etc.;Upper clamping plate and lower clamping plate surface are opened with several matrix concaves, and the several matrix concaves on the surface of upper clamping plate and lower clamping plate jointly constitute laser roughening surface.Through the laser roughening surface on the surface of upper clamping plate and lower clamping plate, the friction of jig and super thin plate material is increased, the movement of super thin plate material in processing process is reduced, so that super thin plate material is not easy to punch deviation when punching, and subsequent press fit alignment is not affected;Through upper clamping plate and lower clamping plate clamping support super thin plate material, so that super thin plate material is not seriously warped when punching before press fit.
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Description

Technical Field

[0001] This utility model relates to the field of high-multilayer thin dielectric PCB lamination technology, and in particular to a processing fixture suitable for ultra-thin boards. Background Technology

[0002] The minimum dielectric thickness used in conventional PCBs is 89um. With the continuous upgrading of the industry and the influence of the demand for high-end PCBs, the wiring space of PCBs is limited. Some high-end PCBs need to compress the dielectric layer thickness to 50um, and the residual copper rate of the same core board varies greatly, generally by about 60% (for example, the residual copper rate of the ground layer is ≥90%, and the residual copper rate of the signal layer is about 30%). Because the ultra-thin board material is prone to severe warping when punching before lamination, and because the ultra-thin board material is too thin, its own strength is poor, and it is very easy to be punched off-center, which affects the lamination alignment. In addition, the ultra-thin board material is prone to jamming and deformation during processing, which leads to direct scrap. Utility Model Content

[0003] In order to overcome the shortcomings of the above-mentioned background technology, the present invention provides a processing fixture suitable for ultra-thin sheet metal that increases the friction between the fixture and the ultra-thin sheet metal, reduces the movement of the ultra-thin sheet metal during the processing, and prevents the ultra-thin sheet metal from warping severely when punching holes before pressing.

[0004] The technical solution is as follows: A processing fixture suitable for ultra-thin boards includes an upper clamping plate and a lower clamping plate, the upper clamping plate and the lower clamping plate are provided with a number of through holes, and the number of through holes corresponds one-to-one with the target holes of the PCB.

[0005] The upper and lower clamps are flipped together on one side so that the two clamps can be opened and fitted together; and the mating surfaces of the upper and lower clamps are both laser-roughened surfaces.

[0006] Preferably, the laser roughened surface is composed of several matrix-shaped pits.

[0007] Preferably, the thickness of the upper and lower clamping plates is ≤0.5mm.

[0008] Preferably, the width of the matrix-shaped recesses on the surfaces of the upper and lower clamping plates is 4 mil, and the distance between two adjacent matrix-shaped recesses is 10 mil.

[0009] As a preferred embodiment, both the upper and lower clamping plates are punched with four through holes.

[0010] Preferably, the diameter of the through hole is 5mm.

[0011] Preferably, the device also includes adhesive tape, which extends along the same side edge of the upper and lower clamping plates and connects one side edge of the two clamping plates by bonding to form a reversible hinge structure.

[0012] The beneficial effects of this utility model are as follows: by laser roughening the surfaces of the upper and lower clamping plates, the friction between the fixture and the ultra-thin sheet material is increased, reducing the movement of the ultra-thin sheet material during processing, making it less likely to be punched off-center when punching the ultra-thin sheet material, and not affecting the subsequent pressing alignment; by clamping and supporting the ultra-thin sheet material with the upper and lower clamping plates, the ultra-thin sheet material will not warp severely when punching before pressing.

[0013] The upper and lower clamping plates have four 5mm diameter through holes punched at the positions corresponding to the ultra-thin sheet metal target, which facilitates the subsequent punching equipment to find the target and perform alignment identification. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model.

[0015] Reference numerals: 11_Upper clamping plate, 12_Lower clamping plate, 2_Matrix-shaped recesses, 3_Laser roughened surface, 4_Through hole, 5_Adhesive tape. Detailed Implementation

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments. Example

[0017] A processing fixture suitable for ultra-thin sheet metal, such as Figure 1 As shown, it includes an upper clamping plate 11 and a lower clamping plate 12. The surfaces of the upper clamping plate 11 and the lower clamping plate 12 are each provided with a number of matrix-shaped recesses 2. The matrix-shaped recesses 2 on the surfaces of the upper clamping plate 11 and the lower clamping plate 12 together form a laser roughening surface 3. The laser roughening surface 3 on the surfaces of the upper clamping plate 11 and the lower clamping plate 12 increases the friction between the fixture and the ultra-thin sheet material, reduces the movement of the ultra-thin sheet material during the processing, and makes it less likely to be punched off-center when the ultra-thin sheet material is punched. The upper clamping plate 11 and the lower clamping plate 12 are stacked and bonded together, and the bonding surfaces of the upper clamping plate 11 and the lower clamping plate 12 are both laser roughening surfaces 3.

[0018] Both the upper clamping plate 11 and the lower clamping plate 12 have four through holes 4 punched on them. The through holes 4 facilitate the subsequent punching equipment to find the target and perform alignment identification.

[0019] It also includes an adhesive tape 5, which extends along the same side edge of the upper clamping plate 11 and the lower clamping plate 12, and connects one side edge of the two clamping plates by bonding to form a hinged structure that can be flipped.

[0020] The upper clamping plate 11 and lower clamping plate 12 are selected to have a certain strength, and their thickness is ≤0.5mm. While providing support for the ultra-thin sheet material, the upper clamping plate 11 and lower clamping plate 12 will not create an excessive drop between the sheet material and the equipment table. Workers use laser processing to create matrix-shaped recesses 2 on the surfaces of the upper clamping plate 11 and lower clamping plate 12. The laser processing parameters are a spot length of 4mil, a spacing width of 10mil, and an energy of 3MJ. Therefore, the upper clamping plate 11 and lower clamping plate 12... The matrix-shaped recesses 2 on the surface of clamping plate 12 are 4 mil wide, and the distance between two adjacent matrix-shaped recesses 2 is 10 mil. By laser roughening the surfaces 3 on the upper clamping plate 11 and the lower clamping plate 12, the friction between the fixture and the ultra-thin sheet is increased, reducing the movement of the ultra-thin sheet during processing. This makes it less likely for the ultra-thin sheet to be punched off-center, and will not affect the subsequent pressing alignment. The upper clamping plate 11 and the lower clamping plate 12 clamp and support the ultra-thin sheet, so that the ultra-thin sheet will not warp severely when punching before pressing.

[0021] The upper clamping plate 11 and the lower clamping plate 12 punch four through holes 4 with a diameter of 5mm at the positions corresponding to the ultra-thin sheet metal target, so that the subsequent punching equipment can find the target and perform alignment identification.

[0022] Using tape 5, fix one side of the punching equipment in the plate feeding direction to form a book-like shape with the upper clamping plate 11 and the lower clamping plate 12 bound on one side and pages that can be turned on three sides. The ultra-thin plate is placed inside the upper clamping plate 11 and the lower clamping plate 12, and the target is exposed for processing.

[0023] Although the present invention has been described in detail with reference to the above embodiments, it will be apparent to those skilled in the art that various changes or modifications can be made to the present invention without departing from the principles and spirit of the present invention as defined by the claims. Therefore, the detailed description of the embodiments in this disclosure is for explanation only and not for limiting the present invention, but rather the scope of protection is defined by the content of the claims.

Claims

1. A processing fixture suitable for ultra-thin sheet metal, characterized in that: It includes an upper clamping plate (11) and a lower clamping plate (12), and the upper clamping plate (11) and the lower clamping plate (12) are provided with a number of through holes (4), and the number of through holes (4) corresponds one-to-one with the target holes of the PCB; The upper clamp (11) and the lower clamp (12) are flipped and connected on one side so that the two clamps can be opened and fitted relative to each other; and the mating surfaces of the upper clamp (11) and the lower clamp (12) are both laser roughened surfaces (3).

2. The processing fixture for ultra-thin sheet metal according to claim 1, characterized in that: The laser roughened surface (3) is composed of several matrix-shaped pits (2).

3. The processing fixture for ultra-thin sheet metal according to claim 1, characterized in that: The thickness of the upper clamping plate (11) and the lower clamping plate (12) is ≤0.5mm.

4. A processing fixture suitable for ultra-thin sheet metal according to claim 1, characterized in that: The width of the matrix-shaped pits (2) on the surface of the upper clamping plate (11) and the lower clamping plate (12) is 4mil, and the distance between two adjacent matrix-shaped pits (2) is 10mil.

5. A processing fixture suitable for ultra-thin sheet metal according to claim 1, characterized in that: Both the upper clamping plate (11) and the lower clamping plate (12) have four through holes (4).

6. A processing fixture suitable for ultra-thin sheet metal according to claim 5, characterized in that: The diameter of the through hole (4) is 5 mm.

7. A processing fixture suitable for ultra-thin sheet metal according to claim 6, characterized in that: It also includes tape (5), which extends along the same side edge of the upper clamping plate (11) and the lower clamping plate (12) and connects one side edge of the two clamping plates by bonding to form a hinged structure that can be flipped.