LED package structure and LED module

Abstract

The utility model discloses a kind of LED packaging structure and LED module, including substrate, and located at the light source of spotlight area and floodlight area light source of the front of the substrate, the spotlight area light source is located in the center of the substrate, the floodlight area light source surrounds the spotlight area light source, the floodlight area light source includes even floodlight chip, the geometric center of the figure surrounded by the center of the spotlight area light source and the center line of each floodlight chip coincides, the heat dissipation structure is equipped below the spotlight area light source, the heat dissipation structure is columnar and extends to the substrate, and the isolation device is arranged between the spotlight area light source and the floodlight area light source. Realize the multifunctional compatibility of internal spotlight and external floodlight, reduce system volume, adopt split type heat dissipation path, and the heat dissipation effect is good.

Description

Technical Field

[0001] This utility model belongs to the field of lighting equipment technology, specifically relating to an LED packaging structure and module. Background Technology

[0002] Traditional LED packaging typically employs a single emitting surface design, making it difficult to achieve zoned control of focusing and floodlighting functions within a single light source. Existing technologies, on the one hand, employ multi-chip integration or optical lens combinations to achieve different beam angles, but suffer from low luminous efficiency, complex circuit control, and excessive size. For example, focusing and floodlighting require different luminaire combinations, leading to high costs and poor light field uniformity. On the other hand, high temperature is a major factor causing LED failure, including accelerated light decay, phosphor degradation, chip failure, packaging material aging, and solder joint failure. Therefore, an integrated, zonal controllable LED packaging solution is needed, along with effective heat dissipation. Utility Model Content

[0003] To address the aforementioned problems in the existing technology, this application proposes an integrated, controllable, and heat-dissipating LED packaging solution. The present invention adopts the following technical solution:

[0004] According to a first aspect of this application, an LED packaging structure is proposed, including a substrate, and a focusing area light source and a floodlight area light source located on the front side of the substrate. The focusing area light source is located at the center of the substrate, and the floodlight area light source surrounds the focusing area light source. The floodlight area light source includes an even number of floodlight chips. The center of the focusing area light source coincides with the geometric center of the shape formed by the lines connecting the centers of the floodlight chips. A heat dissipation structure is provided below the focusing area light source. The heat dissipation structure is columnar and extends to the substrate. An isolation device is provided between the focusing area light source and the floodlight area light source. This design achieves multi-functional compatibility of focusing and floodlighting within a single package, reducing system size. It also employs a split heat dissipation path, with the internal focusing area conducting heat through the columnar heat dissipation structure and the external floodlight area relying on the substrate for heat dissipation. This reduces cost while avoiding efficiency degradation caused by thermal coupling. The isolation device enhances the individual luminous effect of the focusing area light source and the floodlight area light source.

[0005] Preferably, the center of the focusing area light source coincides with the center of the circle formed by the lines connecting the centers of each floodlight chip; the central angle subtended by the centers of two adjacent floodlight chips is larger than the central angle subtended by the centers of other adjacent floodlight chips. This improves the light emission effect, facilitates independent control of the circuit traces of the focusing area light source and the floodlight area light source, and is beneficial for device miniaturization.

[0006] More preferably, ten floodlight chips are provided; on a circle formed by connecting the centers of all the floodlight chips with the center of the focusing light source as the center, the central angle subtended by the centers of two adjacent floodlight chips is 45 degrees, and the central angle subtended by the centers of the remaining adjacent floodlight chips is 35 degrees. This facilitates individual control of the circuitry of the floodlight chips and the circuitry of the focusing chips, and results in better light emission performance of the floodlight source.

[0007] Preferably, the heat dissipation structure is a copper pillar. The back side of the substrate includes a positive electrode region, a negative electrode region, and a heat dissipation region. The positive electrode region is located on one side of the substrate, the negative electrode region is located on the other side of the substrate, and the heat dissipation region is located between the positive electrode region and the negative electrode region. The positive electrode region includes a focusing area positive electrode and a floodlight area positive electrode, and the negative electrode region includes a focusing area negative electrode and a floodlight area negative electrode. A split heat dissipation path is adopted, with the internal focusing area conducting heat through the copper pillar and the external floodlight area relying on the substrate for heat dissipation. This reduces costs while avoiding efficiency degradation caused by thermal coupling. The central area of ​​the back side of the substrate is used for heat dissipation and is not charged, while the edge area of ​​the back side of the substrate is used for conductivity, achieving thermoelectric separation and separating the conductive path from the heat conduction path, significantly improving heat dissipation performance.

[0008] More preferably, the focusing area light source is electrically connected to the positive and negative electrodes of the focusing area via metallized wiring on the substrate, and the floodlight area light source is electrically connected to the positive and negative electrodes of the floodlight area via metallized wiring on the substrate. By controlling the focusing area light source and the floodlight area light source separately via separate paths, independent regulation of internal focusing and external floodlight can be achieved. The separate driving can dynamically adjust the light field distribution, such as projecting long-distance focused light at night and activating floodlight for daytime supplemental lighting. This has a wide range of applications and solves the problem that traditional solutions cannot simultaneously consider projection distance and illumination range.

[0009] Preferably, the focusing area light source further includes a focusing chip for providing focusing light and a wavelength conversion layer located above the focusing chip, and the floodlight area light source further includes a sealing protective layer located above the floodlight chip, wherein the sealing protective layer is provided with isolation devices on the inner side near the focusing area light source and on the outer side away from the focusing area light source.

[0010] More preferably, the light source in the focusing area further includes a light-focusing die-bonding layer located below the light-focusing chip, and the light source in the floodlight area further includes a floodlight die-bonding layer located below the floodlight chip.

[0011] More preferably, the wavelength conversion layer is circular, and the sealing protective layer is annular, covering all the floodlight chips.

[0012] Preferably, the substrate is one of DPC ceramic substrate, copper substrate, aluminum substrate and IMS substrate.

[0013] According to a second aspect of this application, an LED module is proposed, including a lens or reflector, and an LED packaging structure as described above, wherein the lens or reflector is connected to the LED packaging structure. When used with a lens or reflector, focusing the light spot and switching the floodlight effect can be achieved simply by controlling the current in the internal focusing area and the external floodlight area, eliminating the need for complex structural components of focusing equipment and significantly reducing system costs.

[0014] Compared with the prior art, the beneficial results of this utility model are as follows:

[0015] This invention provides an LED packaging structure and module that enables independent control of focused and floodlight beams within a single package, reducing system size. Both the focused and floodlight beams exhibit good luminous efficacy, and a split heat dissipation path is employed. The internal focused beam utilizes a columnar heat dissipation structure, while the external floodlight relies on the substrate for heat dissipation. This approach reduces cost while avoiding efficiency degradation caused by thermal coupling. It can be applied to flashlights, vehicle lights (focused high beam + floodlight low beam), projectors, industrial and mining lighting, and other scenarios, solving the problem of traditional solutions failing to balance projection distance and illumination range. Attached Figure Description

[0016] The accompanying drawings provide further illustration of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and, together with the description, serve to explain the principles of the present invention. Other embodiments and many anticipated advantages of the embodiments will be readily recognized as they become better understood through reference to the following detailed description. Other features, objects, and advantages of this application will become more apparent from reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0017] Figure 1 This is a schematic diagram of an LED packaging structure according to a specific embodiment of the present invention;

[0018] Figure 2 This is a top view of an LED packaging structure according to a specific embodiment of the present invention;

[0019] Figure 3 This is a side view of an LED packaging structure according to a specific embodiment of the present invention;

[0020] Figure 4 This is a bottom view of an LED packaging structure according to a specific embodiment of the present invention;

[0021] Figure 5 This is a top view of the internal structure of an LED packaging structure according to a specific embodiment of the present invention;

[0022] Figure 6This is an exploded view of an LED packaging structure according to a specific embodiment of the present invention;

[0023] Figure 7 This is a light distribution curve diagram of an LED module in floodlight mode according to a specific embodiment of the present invention;

[0024] Figure 8 This is a 1-meter distance light spot diagram of an LED module in floodlight mode according to a specific embodiment of the present invention;

[0025] Figure 9 This is a light distribution curve diagram of an LED module in a focused light mode according to a specific embodiment of the present invention;

[0026] Figure 10 This is a light spot diagram of an LED module at a distance of 1 meter in a focused light mode according to a specific embodiment of the present invention.

[0027] The meanings of the numbers in the diagram are as follows: 1-substrate, 2-focusing light source, 21-focusing chip, 22-focusing die bonding layer, 23-wavelength conversion layer, 3-floodlight light source, 31-floodlight chip, 32-floodlight die bonding layer, 33-sealing protective layer, 4-heat dissipation area, 5-focusing positive electrode, 6-focusing negative electrode, 7-floodlight positive electrode, 8-floodlight negative electrode, 9-isolation device, 10-focusing connection line. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] In the description of this utility model, it should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Directional terms such as "top," "bottom," "left," "right," "upper," and "lower" are used with reference to the orientation of the described figures. Because components of the embodiments can be positioned in several different orientations, directional terms are used for illustrative purposes and are not intended to be limiting. Terms such as "installed," "equipped," "sleeved / connected," and "connected" should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0030] Figure 1 This is a schematic diagram of an LED (Light Emitting Diode) packaging structure according to a specific embodiment of the present invention. Figure 2 This is a top view of an LED packaging structure according to a specific embodiment of the present invention, as shown below. Figure 1 and Figure 2 As shown, an LED packaging structure includes a substrate 1, and a focusing light source 2 and a floodlight source 3 located on the front side of the substrate 1. The focusing light source 2 is located at the center of the substrate 1, and the floodlight source 3 surrounds the focusing light source 2.

[0031] In a specific embodiment, the floodlight 3 includes an even number of floodlight chips 31, and the center of the focusing light source 2 coincides with the geometric center of the shape formed by connecting the centers of all the floodlight chips 31. Optionally, the center of the focusing light source 2 coincides with the center of the circle formed by connecting the centers of all the floodlight chips 31. In other embodiments, the focusing light source 2 can be square, and the geometric center of the focusing light source 2 coincides with the geometric center of the floodlight 3; in other embodiments, when the floodlight 3 is not a standard circle, the geometric center of the shape formed by connecting the geometric center points of the multiple floodlight chips 31 in the floodlight 3 coincides with the geometric center of the focusing light source 2.

[0032] In a specific embodiment, a heat dissipation structure is provided below the light source 2 in the focusing area. The heat dissipation structure is columnar and extends to the substrate 1. Optionally, the columnar heat dissipation structure is a copper column. This split heat dissipation path, where the internal focusing area conducts heat through the copper column and the external floodlight area relies on the substrate 1 for heat dissipation, reduces costs while avoiding efficiency degradation caused by thermal coupling.

[0033] Optionally, the substrate 1 is one of a DPC (Direct Plating Copper) ceramic substrate 1, a copper substrate 1, an aluminum substrate 1, and an IMS (Insulated Metal Substrate) substrate 1. The internal focusing area conducts heat through copper pillars, while the external floodlight area relies on the ceramic substrate 1 or the copper-clad substrate 1 for heat dissipation, thereby achieving optimized thermal management.

[0034] Preferably, the substrate 1 is a DPC (Direct Plating Copper) ceramic substrate 1.

[0035] In a specific embodiment, the focusing area light source 2 further includes a focusing chip 21 and a wavelength conversion layer 23 located above the focusing chip 21. The floodlight area light source 3 further includes a sealing protective layer 33 located above the floodlight chip 31. Isolation devices 9 are provided on both the inner side of the sealing protective layer 33 near the focusing area light source 2 and the outer side away from the focusing area light source 2. This improves the luminous efficacy of the zoned light emission.

[0036] It should be noted that the wavelength conversion layer 23 refers to the light-emitting material layer coated or bonded to the surface of the LED chip, including phosphor particles, and is composed of epoxy resin, silicone, or ceramic / glass substrate. It functions to convert single-wavelength LED light into multi-band broadband white light, and is used to adjust the spectrum and optical parameters, and protect the light-emitting surface. Optionally, the LED chip is a blue light chip with a wavelength of 445-465nm; the sealing and protective layer 33 enables both wavelength conversion and sealing protection.

[0037] In a specific embodiment, an isolation device 9 is provided between the focusing area light source 2 and the floodlight area light source 3. This effectively reduces optical crosstalk, optimizes light distribution, and can prevent heat conduction interference to a certain extent.

[0038] In a specific embodiment, the wavelength conversion layer 23 is circular, and the sealing and protective layer 33 is annular, covering all the floodlight chips 31. The isolation device 9 is a circular isolation device 9 disposed within the inner circle of the annular sealing and protective layer 33, and a circular isolation device 9 disposed outside the annular sealing and protective layer 33.

[0039] Figure 3 This is a side view of an LED packaging structure according to a specific embodiment of the present invention, as shown below. Figure 3As shown, the system includes a substrate 1, and a focusing chip 21 and a floodlight chip 31 on the front side of the substrate 1. The focusing chip 21 is located at the center of the substrate 1, and the floodlight chip 31 is located at the edge of the substrate 1 surrounding the focusing chip 21. A wavelength conversion layer 23 is provided on the focusing chip 21. Optionally, the wavelength conversion layer 23 covers the light-emitting area of ​​the focusing chip 21 and connects the focusing chip 21 and the substrate 1 through a focusing area connection line 10. A sealing protective layer 33 is provided on the floodlight chip 31 and is located between two isolation devices 9. Optionally, the cross-section of the isolation device 9 is a rounded protrusion. The isolation device 9 isolates the focusing area light source 2 and the floodlight area light source 3 into separate zones, thereby improving the lighting effect of the zones.

[0040] Figure 4 This is a bottom view of an LED packaging structure according to a specific embodiment of the present invention, as shown below. Figure 4 As shown, the back side of substrate 1 includes a positive electrode region, a negative electrode region, and a heat dissipation region 4. The positive electrode region is located on one side of substrate 1, the negative electrode region is located on the other side of substrate 1, and the heat dissipation region 4 is located between the positive electrode region and the negative electrode region. The positive electrode region includes a focusing positive electrode 5 and a floodlight positive electrode 7, and the negative electrode region includes a focusing negative electrode 6 and a floodlight negative electrode 8. The central area of ​​the back side of substrate 1 is used for heat dissipation and is not charged, while the edge area of ​​the back side of substrate 1 is used for conductivity, achieving thermoelectric separation and separating the conductive path from the heat conduction path. Combined with the split heat dissipation path design of this application, compared with the traditional LED packaging structure where heat is mainly dissipated through electrodes, the design of this application can significantly improve heat dissipation performance and reduce thermal resistance. Furthermore, the luminous efficiency of LEDs decreases as the junction temperature increases; the design of this application effectively reduces the junction temperature, allowing the LED to operate closer to its optimal efficiency temperature. Due to the enhanced heat dissipation capacity, the driving current can be safely increased without significantly increasing the junction temperature, thereby obtaining higher light output, while also improving lifespan and the uniformity and stability of the entire LED device operation.

[0041] Figure 5 This is a top view of the internal structure of an LED packaging structure according to a specific embodiment of the present invention, as shown below. Figure 5 As shown, it includes a substrate 1, a focusing area light source 2 and a floodlight area light source 3. The focusing area light source 2 includes a focusing chip 21, and the floodlight area light source 3 includes an even number of floodlight chips 31. The floodlight chips 31 are arranged around the focusing chip 21.

[0042] In a specific embodiment, the focusing area light source 2 is electrically connected to the positive electrode 5 and the negative electrode 6 of the focusing area via metallized wiring on the substrate 1, and the floodlight area light source 3 is electrically connected to the positive electrode 7 and the negative electrode 8 of the floodlight area via metallized wiring on the substrate 1. By controlling the focusing area light source 2 and the floodlight area light source 3 separately via separate circuits, the problem of traditional solutions being unable to simultaneously consider projection distance and illumination range is solved. Figure 5 As shown, the metallized wiring on the substrate 1 has one branch connected to the focusing chip 21 and another branch connected to the floodlight chip 31 at the edge of the substrate 1, so as to realize independent control of internal focusing and external floodlight.

[0043] Optionally, the above circuit connection can be a common cathode or common anode connection, or a connection in which each anode and cathode are completely separated.

[0044] In a specific embodiment, ten floodlight chips 31 are provided; the ten floodlight chips 31 are arranged in a circle around the focusing chip 21, and the center of each floodlight chip 31 is located on a circle with the center of the focusing chip 21 as the center; on the circle formed by connecting the centers of each floodlight chip 31 with the center of the focusing light source 2 as the center, the central angle subtended by the centers of two adjacent floodlight chips 31 is 45 degrees, and the central angle subtended by the centers of the remaining adjacent floodlight chips 31 is 35 degrees. Wherein, as... Figure 5 As shown, the driving circuit of the focusing chip 21 is routed between two adjacent floodlight chips 31 with a central angle of 45 degrees. The chip arrangement and routing of this LED packaging structure are conducive to device miniaturization and alleviate local overheating.

[0045] Figure 6 This is an exploded view of an LED packaging structure according to a specific embodiment of the present invention, as shown below. Figure 6 As shown, an LED packaging structure includes a substrate 1. The front side of the substrate 1 includes a focusing chip 21 and an even number of floodlight chips 31. The floodlight chips 31 are arranged around the focusing chip 21, which is located in the center of the substrate 1. A focusing die-attach layer 22 is provided between the focusing chip 21 and the substrate 1, and a floodlight die-attach layer 32 is provided between the floodlight chips 31 and the substrate 1. Both the focusing die-attach layer 22 and the floodlight die-attach layer 32 are made of die-attach adhesive. The focusing chip 21 is connected to the substrate 1 via a focusing area connection line 10. A wavelength conversion layer 23 is covered on the light-emitting surface of the focusing chip 21. Optionally, the wavelength conversion layer 23 is circular. A sealing protective layer 33 covers the floodlight chips 31 arranged around the focusing chip 21. Optionally, the sealing protective layer 33 is annular. An isolation device 9 is provided in the inner circle of the annular sealing protective layer 33, the radius of which is larger than the radius of the wavelength conversion layer 23. An isolation device 9 is also provided in the outer circle of the annular sealing protective layer 33.

[0046] In a specific embodiment, ten floodlight chips 31 are provided; the ten floodlight chips 31 are arranged in a circle around the focusing chip 21, and the center of each floodlight chip 31 is located on a circle with the center of the focusing chip 21 as the center; on the circle formed by connecting the centers of each floodlight chip 31 with the center of the focusing light source 2 as the center, the central angle subtended by the centers of two adjacent floodlight chips 31 is 45 degrees, and the central angle subtended by the centers of the remaining adjacent floodlight chips 31 is 35 degrees. Wherein, as... Figure 6 As shown, the driving circuit of the focusing chip 21 is routed between two adjacent floodlight chips 31 with a central angle of 45 degrees. The driving circuit of the focusing chip 21 passes between the two adjacent chips and surrounds the square focusing chip 21. The driving circuit of the floodlight chip 31 is arranged in a ring along the floodlight chip 31. The driving circuit of the focusing chip 21 is connected to the driving circuit of the floodlight chip 31. The chip arrangement and wiring of this LED packaging structure are conducive to device miniaturization and have good reliability. The maximum current density it can withstand is greater than or equal to 1 ampere per square millimeter.

[0047] In a specific embodiment, the center of the circle formed by connecting the center of the circular light-emitting surface of the spotlight chip and the center of the floodlight chip is within 50μm.

[0048] In other embodiments, the floodlight chip can be arranged in a single-layer circle or in a multi-layer circle, i.e., concentric circle arrangement.

[0049] In a specific embodiment, the side length of the focusing chip 21 is greater than that of the floodlight chip 31. It should be noted that the focusing chip 21 refers to an LED chip that can provide focused light, i.e., high illuminance and narrow angle, while the floodlight chip 31 refers to an LED chip that can provide floodlight, i.e., high luminous flux and wide angle.

[0050] Optionally, both the focusing chip 21 and the floodlight chip 31 are blue light chips.

[0051] Optionally, the floodlight 3 provides light of a single color, or a combination of any colors.

[0052] According to a second aspect of this application, an LED module is proposed, including a lens or reflector, and an LED packaging structure as described above, wherein the lens or reflector is connected to the LED packaging structure. In specific embodiments, single or separate lenses, such as lenses, Fresnel lenses, and microprisms, can be added to the LED packaging structure. When combined with a lens or reflector, focusing and switching of the light spot effect can be achieved simply by controlling the current of the internal focusing area and the external floodlight area, eliminating the need for complex structural components of focusing equipment and significantly reducing system costs.

[0053] Figure 7 and Figure 8 This paper shows an optical experiment diagram of an LED module in floodlight mode, where floodlight mode refers to the mode in which the spotlight source 2 and the floodlight source 3 are lit simultaneously. Figure 7 The light distribution curve of the LED module of this application in floodlight mode is shown. The FWHM (Full width at halfmaxima) value is 21.4° and the K value is 4.331 cd / lm. Figure 8 The diagram shows the light spot pattern of the LED module at a distance of 1 meter in floodlight mode. In summary, the range that FWHM can achieve in floodlight mode is 20 degrees to 55 degrees, which can realize high luminous flux and wide angle floodlight illumination, basically covering the lighting needs of floodlight mode for applications such as flashlights and headlamps.

[0054] It should be noted that the K value is an optical performance parameter describing the performance of a spotlight or device. It directly reveals how the light source converts light energy into central luminous intensity and long-range projection capability. The unit is cd / lm. Here, cd refers to candela, a unit of luminous intensity, which measures the luminous intensity of a light source in a specific direction. The higher the value, the stronger the light in that direction. lm refers to lumen, a unit of luminous flux, which measures the total amount of visible light emitted by a light source. The higher the value, the more total light emitted by the light source. The unit of K value, cd / lm, refers to candela per lumen, which represents the maximum luminous intensity (candela) that can be produced per unit of luminous flux (1 lumen), that is, how many candela of peak luminous intensity can be produced per lumen.

[0055] Figure 9 and Figure 10 The diagram shows an optical experiment of an LED module in a focusing mode, where the focusing mode refers to the mode in which the light source 2 in the focusing area is lit alone. Figure 9 The light distribution curve of the LED module of this application in the focusing mode is shown, with an FWHM value of 7.91° and a K value of 14.69 cd / lm; Figure 10 The diagram shows the light spot pattern of the LED module in the spotting mode at a distance of 1 meter. In summary, the range that FWHM can achieve in the spotting mode is 5 degrees to 15 degrees, which can realize high illuminance and narrow angle spotting lighting, basically covering the lighting needs of spotting mode applications such as flashlights, headlamps, and commercial lighting.

[0056] It is obvious that those skilled in the art can make various modifications and alterations to the embodiments of this application without departing from the spirit and scope of this application. In this way, this application also aims to cover such modifications and alterations if they fall within the scope of the claims and their equivalents. The word "comprising" does not exclude the presence of other elements or steps not listed in the claims. The simple fact that certain measures are described in mutually different dependent claims does not indicate that a combination of these measures cannot be used for profit. Any reference numerals in the claims should not be considered limiting in scope.

Claims

1. An LED packaging structure, characterized in that, The system includes a substrate, and a focused light source and a floodlight source located on the front side of the substrate. The focused light source is located at the center of the substrate, and the floodlight source surrounds the focused light source. The floodlight source includes an even number of floodlight chips. The center of the focused light source coincides with the geometric center of the pattern formed by the lines connecting the centers of the floodlight chips. A heat dissipation structure is provided below the focused light source. The heat dissipation structure is columnar and extends to the substrate. An isolation device is provided between the focused light source and the floodlight source.

2. The LED packaging structure according to claim 1, characterized in that, The center of the light source in the focusing area coincides with the center of the circle formed by the lines connecting the centers of each floodlight chip; the central angle opposite the centers of two adjacent floodlight chips is greater than the central angle opposite the centers of other adjacent floodlight chips.

3. The LED packaging structure according to claim 2, characterized in that, The floodlight chip is provided with ten chips; on the circle formed by connecting the centers of the floodlight chips with the center of the light source in the focusing area as the center, the central angle between the centers of two adjacent floodlight chips is 45 degrees, and the central angle between the centers of the remaining adjacent floodlight chips is 35 degrees.

4. The LED packaging structure according to claim 1, characterized in that, The heat dissipation structure is a copper pillar. The back side of the substrate includes a positive electrode region, a negative electrode region, and a heat dissipation region. The positive electrode region is located on one side of the substrate, the negative electrode region is located on the other side of the substrate, and the heat dissipation region is located between the positive electrode region and the negative electrode region. The positive electrode region includes a focusing area positive electrode and a floodlight area positive electrode, and the negative electrode region includes a focusing area negative electrode and a floodlight area negative electrode.

5. The LED packaging structure according to claim 4, characterized in that, The light source in the focusing area is electrically connected to the positive and negative electrodes of the focusing area via metallized wiring on the substrate, and the light source in the floodlight area is electrically connected to the positive and negative electrodes of the floodlight area via metallized wiring on the substrate.

6. The LED packaging structure according to claim 1, characterized in that, The focusing area light source also includes a focusing chip for providing focusing light and a wavelength conversion layer located above the focusing chip. The floodlight area light source also includes a sealing and protective layer located above the floodlight chip. The sealing and protective layer is provided with isolation devices on the inner side near the focusing area light source and on the outer side away from the focusing area light source.

7. The LED packaging structure according to claim 6, characterized in that, The light source in the focusing area also includes a light-focusing die-bonding layer located below the light-focusing chip, and the light source in the floodlight area also includes a floodlight die-bonding layer located below the floodlight chip.

8. The LED packaging structure according to claim 6, characterized in that, The wavelength conversion layer is circular, and the sealing and protective layer is annular, covering all the floodlight chips.

9. The LED packaging structure according to claim 1, characterized in that, The substrate is one of DPC ceramic substrate, copper substrate, aluminum substrate and IMS substrate.

10. An LED module, characterized in that, It includes a lens or reflector, and an LED package structure as described in any one of claims 1-9, wherein the lens or reflector is connected to the LED package structure.

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