Wafer transfer device and semiconductor apparatus
By setting up detection and adjustment mechanisms on the robotic arm, wafer alignment and angle adjustment can be completed directly on the robotic arm, solving the problems of low wafer transfer efficiency and positional deviation in the existing technology, and realizing more efficient wafer transfer and gripping.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SIEN (QINGDAO) INTEGRATED CIRCUITS CO LTD
- Filing Date
- 2025-07-03
- Publication Date
- 2026-06-26
AI Technical Summary
In the prior art, the wafers are aligned and transferred through the alignment device, which reduces the wafer output per hour of the process equipment, and the multiple gripping by the robotic arm increases the wafer position deviation.
By setting up a detection mechanism and an adjustment mechanism on the robotic arm, the wafer alignment and angle adjustment can be completed directly on the robotic arm by detecting the notch position and using the adjustment mechanism for rotation adjustment, eliminating the need for an alignment device and improving transfer efficiency.
It increased hourly wafer throughput, reduced wafer position deviation, enhanced gripping reliability, and resolved gripping failure issues caused by high wafer warpage.
Smart Images
Figure CN224419238U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a wafer transfer device and semiconductor equipment. Background Technology
[0002] In chip manufacturing, the wafer transport path is a crucial parameter affecting process precision. After the Manufacturing Execution System (MES) dispatches the work, the Front Opening Unified Pod (FOUP), containing multiple wafers, is transported by an automated transport vehicle to the wafer carrier of the corresponding machine. After the machine identifies the wafers, it opens the FOUP door. The robotic arm of the air transfer module (ATM) first inspects the wafers inside the FOUP to confirm that the quantity matches the system and to check for any wafer stacking or fragments, ensuring the safety of the robotic arm's wafer handling. After the robotic arm picks up the wafers, it first transports them to the alignment unit for rotational alignment, and then gradually conveys the wafers into the process chamber for processing.
[0003] Traditional vacuum-adhesive ATMs use a V-shaped gripping unit with two fingers at the front for wafer identification. The gripping arm incorporates a vacuum system, creating a sealed space between the back of the wafer and the front of the arm upon successful gripping. The successfully gripped wafer is then sent to an alignment unit for alignment and angle adjustment. Each wafer has a notch (a notch on the wafer used for alignment and positioning). The wafer rotates on a platform with a vacuum in the alignment unit, ensuring there are no excess notches and rotating it to a specific angle. However, this process of first aligning and then transferring the wafer to the airlock module reduces the wafer per hour (WPH) of the machine, and the double gripping by the arm increases wafer positional deviation.
[0004] In view of this, it is necessary to propose a wafer transfer device and semiconductor equipment to solve the above problems. Utility Model Content
[0005] The purpose of this invention is to provide a wafer transfer device and semiconductor equipment to improve the problem that the existing process of aligning wafers using an alignment device reduces the wafer permeability (WPH).
[0006] This utility model provides a wafer transfer device, comprising:
[0007] A robotic arm is used to pick up and hold wafers.
[0008] A detection mechanism, mounted on the robotic arm, is used to detect the notch position of the wafer;
[0009] An adjustment mechanism, located on the robotic arm and capable of adsorbing the wafer, can be adjusted in height and rotation relative to the robotic arm. By rotating the wafer together with the adjustment mechanism, the notch of the wafer can be adjusted to a set notch position for wafer alignment.
[0010] In one possible embodiment, the detection mechanism includes a transmitter mounted on the robotic arm and a receiver mounted on the robotic arm and positioned corresponding to a reference notch. The transmitter emits an angled light beam toward the receiver, and the receiver receives the light beam. Alternatively,
[0011] The testing facility includes an image acquisition module for acquiring images of the wafer.
[0012] In one possible embodiment, for cases where the detection mechanism includes a transmitter and a receiver, the wafer transfer device further includes:
[0013] The signal analysis module is communicatively connected to the receiver and is used to determine the target time when the notch of the wafer rotates to the reference notch position based on the detection signal transmitted by the transmitter during the rotation of the adjustment mechanism when detecting the notch position of the wafer.
[0014] The judgment control module is connected to the signal analysis module and is used to determine whether the rotation angle of the adjustment mechanism at the target time and the rotation angle at the current position are consistent. If they are, the wafer notch is determined to be located at the reference notch position. If not, the adjustment mechanism is controlled to rotate the wafer according to the rotation angle of the adjustment mechanism at the target time and the rotation angle at the current position, so as to adjust the wafer notch to the reference notch position.
[0015] In one possible embodiment, the wafer transfer device further includes:
[0016] The alignment adjustment module is connected to the judgment and control module and is used to control the adjustment mechanism to rotate the wafer according to the angle between the reference notch position and the set notch position when the notch of the wafer is located at the reference notch position, so as to adjust the notch of the wafer to the set notch position, thereby aligning the wafer.
[0017] In one possible embodiment, for cases where the detection mechanism includes an image acquisition module, the wafer transfer device further includes:
[0018] The controller is communicatively connected to the image acquisition module and is used to determine whether the notch position in the acquired wafer image is consistent with the set notch position in the standard wafer image. If so, it determines that the notch of the wafer is located at the set notch position; if not, it controls the adjustment mechanism to rotate the wafer by a set angle and performs the notch position determination again until the wafer alignment is completed.
[0019] In one possible embodiment, the wafer transfer device further includes a lifting mechanism connected to the adjustment mechanism and used to drive the adjustment mechanism to adjust its height; and / or,
[0020] The wafer transfer device also includes a rotating mechanism connected to the adjustment mechanism and used to drive the adjustment mechanism to rotate for adjustment.
[0021] In one possible embodiment, the robotic arm includes an arm portion and a pair of fingers connected to the arm portion and in an open position.
[0022] In one possible embodiment, a first air hole is provided at the connection point of a pair of fingers, and a second air hole is provided at the end of a pair of fingers away from the arm.
[0023] The robotic arm is provided with a first air passage structure that is connected to the first air hole and the second air hole respectively, and the first air passage structure is connected to the air extraction system.
[0024] In one possible embodiment, the line connecting the first vent and the second vent forms a triangular shape.
[0025] In one possible embodiment, the robotic arm further includes a support portion disposed on the finger portion and located between a pair of fingers, and the adjustment mechanism is disposed on the support portion.
[0026] In one possible embodiment, the adjustment mechanism has a plurality of third air holes on the side of the wafer it adsorbs, and the adjustment mechanism has a second air passage structure communicating with the third air holes, the second air passage structure being connected to the air extraction system.
[0027] In one possible embodiment, the lines connecting the plurality of the third vents form a triangular shape.
[0028] This utility model also provides a semiconductor device, characterized in that it includes the wafer transfer device in any of the above embodiments.
[0029] The advantages of the wafer transfer device provided by this utility model are as follows: By setting a detection mechanism and an adjustment mechanism on the robotic arm, the notch position of the wafer is detected during the wafer gripping process, and the wafer alignment and angle adjustment are completed. This eliminates the need to send the wafer to an alignment device for alignment and angle adjustment, thus increasing the hourly wafer output. In a further embodiment, the wafer's central region is adsorbed through vents on the adjustment mechanism, and the wafer's edge region is adsorbed through vents on the robotic arm, improving the reliability of wafer gripping and effectively solving the problem of gripping failure caused by high wafer warpage. Attached Figure Description
[0030] Figure 1 This is a top view of one embodiment of the wafer transfer device of this utility model.
[0031] Figure 2 This is a side view of one embodiment of the wafer transfer device of this utility model.
[0032] Figure 3 This is a state diagram showing the detection of the notch position in one embodiment of the wafer transfer device of this utility model.
[0033] Figure 4 This is a logic block diagram of the wafer transfer device of this utility model in one embodiment.
[0034] Figure 5 This is a logic block diagram of another embodiment of the wafer transfer device of this utility model.
[0035] Figure 6 This is a diagram showing the state of the wafer transfer device of this utility model when the adjustment mechanism is raised.
[0036] Figure 7 This is a diagram showing the state of the wafer transfer device of this utility model when the adjustment mechanism is descending.
[0037] Figure 8 This is a schematic diagram of the adjustment mechanism, lifting mechanism, and rotating mechanism of the wafer transfer device of this utility model.
[0038] Explanation of reference numerals in the attached drawings: 110, robotic arm; 111, arm section; 112, finger section; 1121, first air vent; 1122, second air vent; 113, support section; 120, detection mechanism; 121, transmitter; 122, receiver; 123, image acquisition module; 130, adjustment mechanism; 131, third air vent; 141, signal analysis module; 142, judgment and control module; 143, alignment and adjustment module; 150, controller; 160, lifting mechanism; 170, rotation mechanism; 200, wafer. Detailed Implementation
[0039] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0040] To address the problems existing in the prior art, embodiments of this utility model provide a wafer transfer device, see [link to relevant documentation]. Figure 1 and Figure 3 The wafer transfer device includes a robotic arm 110, a detection mechanism 120, and an adjustment mechanism 130. The robotic arm 110 is used to pick up the wafer 200. The detection mechanism 120 is mounted on the robotic arm 110 and is used to detect the notch position of the wafer 200. The adjustment mechanism 130 is mounted on the robotic arm 110 and can pick up the wafer 200. The adjustment mechanism 130 can be raised and lowered and rotated relative to the robotic arm 110. By rotating the wafer 200 together with the adjustment mechanism 130, the notch of the wafer 200 can be adjusted to the set notch position to align the wafer 200.
[0041] In this embodiment, by setting a detection mechanism 120 and an adjustment mechanism 130 on the robotic arm 110, during wafer 200 alignment, the adjustment mechanism 130 adsorbs the wafer 200 and lifts the adjustment mechanism 130 to prevent the wafer 200 from colliding with the robotic arm 110 during subsequent rotation. The detection mechanism 120 detects the notch position of the wafer 200, and based on the detection result, controls the rotation angle of the adjustment mechanism 130, causing the adjustment mechanism 130 to rotate along with the adsorbed wafer 200, thereby adjusting the notch of the wafer 200 to the set notch position for wafer 200 alignment. This solution eliminates the step in the traditional transfer process where the wafer 200 needs to be aligned by an alignment device before being transferred to the air-locking module. Detection, alignment, and transfer are completed directly on the robotic arm 110, simplifying the wafer 200 transfer path, improving the efficiency of the entire wafer 200 transfer system, and thus increasing the hourly wafer 200 output. Furthermore, it avoids the wafer 200 position deviation problem caused by the robotic arm 110 gripping the wafer twice.
[0042] In one embodiment, see Figure 1 , Figure 2 as well as Figure 3 The detection mechanism 120 includes a transmitter 121 mounted on a robotic arm 110 and a receiver 122 mounted on the robotic arm 110 and positioned corresponding to a reference notch. The transmitter 121 is used to emit an inclined light beam to the receiver 122, and the receiver 122 is used to receive the light beam.
[0043] In this embodiment, a tilted light beam is emitted from the transmitter 121 to the receiver 122. If the receiver 122 receives the light beam, it means that the light beam is not blocked by the wafer 200. At this time, the notch of the wafer 200 is located at the reference notch position, and the light beam passes through the notch of the wafer 200 and enters the receiver 122. If the receiver 122 does not receive the light beam, it means that the light beam is blocked by the wafer 200. At this time, the notch of the wafer 200 is not located at the reference notch position.
[0044] In one specific embodiment, see Figure 2 and Figure 4 For the case where the testing unit 120 includes a transmitter 121 and a receiver 122, the wafer transfer device further includes:
[0045] The signal analysis module 141 is communicatively connected to the receiver 122 and is used to determine the target time when the notch of the wafer 200 rotates to the reference notch position based on the detection signal transmitted by the transmitter 121 during the rotation of the adjustment mechanism 130 when detecting the notch position of the wafer 200.
[0046] The judgment control module 142 is connected to the signal analysis module 141 and is used to judge whether the rotation angle of the adjustment mechanism 130 at the target time and the rotation angle at the current position are consistent. If they are consistent, the notch of the wafer 200 is determined to be located at the reference notch position. If not, the adjustment mechanism 130 is controlled to rotate the wafer 200 according to the rotation angle of the adjustment mechanism 130 at the target time and the rotation angle at the current position, so as to adjust the notch of the wafer 200 to the reference notch position.
[0047] In this embodiment, when detecting the notch position of wafer 200, the adjustment mechanism 130 rotates wafer 200, and the transmitter 121 sends a detection signal to the signal analysis module 141 in real time. The signal analysis module 141 determines the target time when the notch of wafer 200 rotates to the reference notch position by analyzing the changes in the detection signal. The judgment control module 142 determines whether the notch of wafer 200 is located at the reference notch position based on the correspondence between the detection signal and the detection time, and the correspondence between the rotation angle of the adjustment mechanism 130 and the detection time. If it is not located, the adjustment mechanism 130 is controlled to rotate to adjust the notch of wafer 200 to the reference notch position.
[0048] In one specific embodiment, see Figure 4 The wafer transfer device also includes:
[0049] The alignment adjustment module 143 is connected to the judgment control module 142 and is used to control the adjustment mechanism 130 to rotate the wafer 200 according to the angle between the reference notch position and the set notch position when the notch of the wafer 200 is located at the reference notch position, so as to adjust the notch of the wafer 200 to the set notch position, so as to align the wafer 200.
[0050] In this embodiment, the alignment adjustment module 143 can precisely control the rotation of the adjustment mechanism 130 according to the angle difference between the set notch position and the reference notch position, so as to adjust the notch of the wafer 200 to the set notch position and automatically complete the alignment and angle adjustment of the wafer 200.
[0051] In another embodiment, see Figure 2 and Figure 4 For the case where the testing facility 120 includes an image acquisition module 123, the wafer transfer device further includes:
[0052] The controller 150 is communicatively connected to the image acquisition module 123 and is used to determine whether the notch position in the acquired wafer 200 image is consistent with the set notch position in the standard wafer 200 image. If so, it is determined that the notch of the wafer 200 is located at the set notch position; if not, it controls the adjustment mechanism 130 to rotate the wafer 200 by a set angle and performs the notch position determination again until the wafer 200 is aligned.
[0053] In this embodiment, the controller 150 first determines the position of the notch in the currently acquired image of the wafer 200. If the current notch is located at the set notch position, no alignment operation is required for the wafer 200. If the current notch is not located at the set notch position, the controller adjusts the adjustment mechanism 130 to rotate the wafer 200 by a set angle. The set angle is small to control the adjustment accuracy. The image of the adjusted wafer 200 is acquired by the image acquisition module 123. The controller 150 determines the notch position again, and so on, gradually adjusting the angle and determining the notch position until the notch of the wafer 200 is located at the set notch position, thus completing the alignment adjustment of the wafer 200.
[0054] In one embodiment, see Figure 1 The robotic arm 110 includes an arm portion 111 and a pair of fingers 112 connected to the arm portion 111 and in an open position. Specifically, the pair of fingers 112 are U-shaped or V-shaped.
[0055] In one embodiment, see Figure 1 , Figure 6 as well as Figure 7A first air hole 1121 is provided at the connection point of a pair of finger portions 112, and a second air hole 1122 is provided at the end of each pair of finger portions 112 away from the arm portion 111. The robotic arm 110 has a first air passage structure that communicates with the first air hole 1121 and the second air hole 1122 respectively, and the first air passage structure is connected to a vacuum system. The first air hole 1121 and the second air hole 1122 are provided corresponding to the edge region of the wafer 200. When the robotic arm 110 grasps the wafer 200, it can form a negative pressure between the finger portion 112 and the edge region of the wafer 200 through the vacuum system to adsorb the wafer 200.
[0056] In one specific embodiment, see Figure 1 The line connecting the first pore 1121 and the second pore 1122 forms a triangular shape. The triangular distribution design of the pores can provide greater adsorption force and reduce the abnormal adsorption problem of wafer 200 caused by excessive warpage of wafer 200.
[0057] In one embodiment, see Figure 1 , Figure 6 as well as Figure 7 The adjustment mechanism 130 has several third air holes 131 on the side of the wafer 200 it adsorbs. The adjustment mechanism 130 has a second air passage structure that communicates with the third air holes 131 and is connected to the air extraction system. The several third air holes 131 are arranged corresponding to the middle area of the wafer 200. When the robotic arm 110 grasps the wafer 200, it can create a negative pressure between the finger part 112 and the middle area of the wafer 200 through the air extraction system to adsorb the wafer 200.
[0058] In one specific embodiment, see Figure 1 The lines connecting several third pores 131 form a triangular shape. The triangular distribution design of the pores can provide greater adsorption force and reduce the abnormal adsorption problem of wafer 200 caused by excessive warpage of wafer 200.
[0059] In one embodiment, see Figure 1 The robotic arm 110 also includes a support portion 113 disposed on the finger portion 112 and located between a pair of finger portions 112, and an adjustment mechanism 130 disposed on the support portion 113.
[0060] In one embodiment, see Figure 8 The wafer transfer device also includes a lifting mechanism 160 connected to the adjustment mechanism 130 and used to drive the adjustment mechanism 130 to adjust its height. The lifting mechanism 160 is an electric telescopic rod, a cylinder, or a gear and toothed rail structure driven by a motor.
[0061] In one embodiment, see Figure 8The wafer transfer device also includes a rotating mechanism 170 connected to the adjusting mechanism 130 and used to drive the adjusting mechanism 130 to rotate and adjust. The rotating mechanism 170 is a motor, a rotary cylinder, etc.
[0062] In some specific embodiments, see Figure 8 The lifting mechanism 160 is mounted on the robotic arm 110, the rotating mechanism 170 is mounted on the lifting mechanism 160, and the adjusting mechanism 130 is mounted on the rotating mechanism 170; or, the rotating mechanism 170 is mounted on the robotic arm 110, the lifting mechanism 160 is mounted on the rotating mechanism 170, and the adjusting mechanism 130 is mounted on the lifting mechanism 160.
[0063] Before the adjustment mechanism 130 rotates, the lifting mechanism 160 raises the adjustment mechanism 130, providing negative pressure through the third vent 131 of the adjustment mechanism 130 to adsorb the wafer 200. At this time, the finger part 112 does not adsorb the wafer 200. The rotation mechanism 170 drives the adjustment mechanism 130 to rotate, aligning and adjusting the angle of the wafer 200. After the wafer 200 is aligned, the lifting mechanism 160 lowers the adjustment mechanism 130, bringing the wafer 200 closer to the finger part 112. Negative pressure is provided through the third vent 131 of the adjustment mechanism 130 to adsorb the central area of the wafer 200, and negative pressure is provided through the first vent 1121 and the second vent 1122 on the finger part 112 to adsorb the edge area of the wafer 200, making the grip on the wafer 200 more secure and improving the success rate of gripping different types of wafers 200.
[0064] This utility model also provides a semiconductor device, characterized in that it includes the wafer transfer device in any of the above embodiments.
[0065] In the description of this utility model, it should be understood that the terms "comprising" and "having" as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.
[0066] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0067] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0068] While the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model as set forth in the claims. Furthermore, the utility model described herein may have other embodiments and can be implemented or realized in various ways. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains.
Claims
1. A wafer transfer device, characterized by, include: A robotic arm is used to pick up and hold wafers. A detection mechanism, mounted on the robotic arm, is used to detect the notch position of the wafer; An adjustment mechanism, located on the robotic arm and capable of adsorbing the wafer, can be adjusted in height and rotation relative to the robotic arm. By rotating the wafer together with the adjustment mechanism, the notch of the wafer can be adjusted to a set notch position for wafer alignment.
2. The wafer transfer device according to claim 1, characterized in that, The detection mechanism includes a transmitter mounted on the robotic arm and a receiver mounted on the robotic arm and positioned corresponding to a reference notch. The transmitter emits an angled light beam toward the receiver, and the receiver receives the light beam; or... The testing facility includes an image acquisition module for acquiring images of the wafer.
3. The wafer transfer device according to claim 2, characterized in that, For cases where the detection mechanism includes a transmitter and a receiver, the wafer transfer device further includes: The signal analysis module is communicatively connected to the receiver and is used to determine the target time when the notch of the wafer rotates to the reference notch position based on the detection signal transmitted by the transmitter during the rotation of the adjustment mechanism when detecting the notch position of the wafer. The judgment control module is connected to the signal analysis module and is used to determine whether the rotation angle of the adjustment mechanism at the target time and the rotation angle at the current position are consistent. If they are, the wafer notch is determined to be located at the reference notch position. If not, the adjustment mechanism is controlled to rotate the wafer according to the rotation angle of the adjustment mechanism at the target time and the rotation angle at the current position, so as to adjust the wafer notch to the reference notch position.
4. The wafer transfer device according to claim 3, characterized in that, Also includes: The alignment adjustment module is connected to the judgment and control module and is used to control the adjustment mechanism to rotate the wafer according to the angle between the reference notch position and the set notch position when the notch of the wafer is located at the reference notch position, so as to adjust the notch of the wafer to the set notch position, thereby aligning the wafer.
5. The wafer transfer device according to claim 2, characterized in that, In the case where the inspection mechanism includes an image acquisition module, the wafer transfer device further includes: The controller is communicatively connected to the image acquisition module and is used to determine whether the notch position in the acquired wafer image is consistent with the set notch position in the standard wafer image. If so, it determines that the notch of the wafer is located at the set notch position; if not, it controls the adjustment mechanism to rotate the wafer by a set angle and performs the notch position determination again until the wafer alignment is completed.
6. The wafer transfer apparatus according to any one of claims 1-5, characterized in that, It also includes a lifting mechanism connected to the adjusting mechanism and used to drive the adjusting mechanism to adjust its height; and / or, It also includes a rotating mechanism connected to the adjusting mechanism and used to drive the adjusting mechanism to rotate for adjustment.
7. The wafer transfer apparatus according to any one of claims 1-5, characterized in that, The robotic arm includes an arm portion and a pair of fingers connected to the arm portion and in an open position.
8. The wafer transfer apparatus according to claim 7, characterized in that, A first air hole is provided at the connection point of a pair of fingers, and a second air hole is provided at the end of a pair of fingers away from the arm. The robotic arm is provided with a first air passage structure that is connected to the first air hole and the second air hole respectively, and the first air passage structure is connected to the air extraction system.
9. The wafer transfer apparatus according to any one of claims 1-5, characterized in that, The adjustment mechanism has several third air holes on the side of the wafer it adsorbs, and the adjustment mechanism has a second air passage structure that communicates with the third air holes. The second air passage structure is connected to the air extraction system.
10. A semiconductor device, characterized in that, Includes the wafer transfer device as described in any one of claims 1-9.