Power assembly, vehicle power electronic control system

Abstract

The utility model discloses power component, vehicle electric power electronic control system. Among them power component includes power device, the circuit board of installation power device, the heat dissipation device that the side of power device contains electrified area is heat dissipation, and the heat conduction layer is equipped between heat dissipation device and power device, and the side of power device contains electrified area is first side, and first side is equipped with with contact the heat conduction layer, is used for controlling electrified area and the insulating projection of heat dissipation device between electrical clearance. The utility model discloses through increasing insulating projection in electrified area one side, to increase the electrical clearance between power device and heat dissipation device, so that the heat conduction layer of heat dissipation device can be very thin, has realized better insulating effect, and has realized better heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the technical field of vehicle electronic power control systems, and in particular to power devices and vehicle power electronic control systems that can meet good insulation and heat dissipation performance requirements. Background Technology

[0002] With the transformation of the global energy structure and the increasing environmental protection requirements, new energy vehicles are gradually becoming the main direction of automotive industry development. The core systems of new energy vehicles, such as motor controllers, inverters, and on-board charging systems, all require high-performance power devices to achieve efficient power conversion and control. However, in the practical application of new energy vehicles, power devices face severe challenges. First, the operating environment of new energy vehicles typically involves high voltage, high current, and high power density, which requires power devices to have higher insulation performance and heat dissipation capabilities in their packaging design. Second, a certain electrical clearance is required between devices; a lack of electrical clearance can easily lead to dielectric breakdown and systemic cascading risks.

[0003] In the prior art, the electrical clearance between devices is increased by increasing the thickness of the insulating layer. However, the increase in the thickness of the insulating layer leads to an increase in its thermal resistance, which is not conducive to the heat dissipation of the device.

[0004] Taking externally insulated MOSFETs as an example, they are widely used in the power electronic systems of new energy vehicles due to their high switching speed, low on-resistance, and good thermal stability. Figure 1 As shown, the structure of a conventional externally insulated MOSFET includes a chip 7, a chip solder 8, a casing for packaging the chip, and a copper base plate (charged area 6) located at the bottom of the chip. Externally insulated MOSFETs often use DBC (Direct Bonded Copper) or insulating spraying for insulation and thermal conductivity. The additional DBC and insulating layer attached to the copper base plate of its charged area 6 will increase the thermal resistance. Moreover, when considering the electrical clearance, externally insulated power devices usually need to maintain sufficient electrical clearance by controlling the thickness of the thermal conductive layer, which will further increase the thermal resistance and bring difficulties to product applications.

[0005] Therefore, how to provide a power component with better insulation performance and lower thermal resistance is a technical problem to be solved. Utility Model Content

[0006] To address the technical problem that existing externally insulated power devices, which increase electrical clearance and achieve better insulation by thickening the insulation layer, result in high thermal resistance, this invention proposes a power component and a vehicle power electronic control system.

[0007] The power component proposed in this utility model includes a power device, a circuit board for mounting the power device, and a heat dissipation device for dissipating heat from the side of the power device containing the charged area. A heat-conducting layer is provided between the heat dissipation device and the power device. The side of the power device containing the charged area is a first side. The first side is provided with an insulating protrusion that contacts the heat-conducting layer and is used to control the electrical clearance between the charged area and the heat dissipation device.

[0008] Furthermore, the insulating protrusion includes at least one insulating protrusion disposed in the insulating region of the first side surface.

[0009] Furthermore, there are four insulating protrusions, located at the four corners of the insulating area on the first side; or, there are four or more insulating protrusions, evenly distributed along the annular insulating area on the first side.

[0010] Furthermore, the contact surface between the insulating protrusion and the heat dissipation device is irregular, circular, or polygonal.

[0011] Furthermore, the insulating protrusion is an annular protrusion disposed within the insulating area of ​​the first side surface;

[0012] Furthermore, the annular protrusion may have the same or different area as the insulating region.

[0013] Furthermore, the annular protrusion has a grid-like annular protrusion.

[0014] Furthermore, the area of ​​the thermally conductive layer is greater than or equal to the area of ​​the first side surface, and the projection of the thermally conductive layer toward the circuit board covers the power device; or the thermally conductive layer fills the space between the circuit board and the heat dissipation device and encloses the power device.

[0015] Furthermore, the power devices are diodes, thyristors, MOSFETs, or IGBTs.

[0016] The vehicle power electronic control system proposed in this utility model uses the power components of the above-mentioned technical solution. The components include at least one of a motor controller, an inverter, and an on-board charging system.

[0017] This invention provides an insulating protrusion between the power device and the heat dissipation device, ensuring sufficient electrical clearance between the charged area of ​​the power device and the heat dissipation device, thus achieving good insulation. Therefore, only a thin thermally conductive layer needs to be provided on the corresponding side of the heat dissipation device to effectively reduce thermal resistance and achieve good heat dissipation. Attached Figure Description

[0018] The present invention will now be described in detail with reference to the embodiments and accompanying drawings, wherein:

[0019] Figure 1 This is a cross-sectional schematic diagram of an existing externally insulated MOSFET.

[0020] Figure 2 This is a schematic diagram of the structure of a power component according to an embodiment of the present invention.

[0021] Figure 3 This is a structural schematic diagram of the first embodiment of the protrusion of this utility model.

[0022] Figure 4 This is a structural schematic diagram of the second embodiment of the protrusion of this utility model.

[0023] Figure 5 This is a structural schematic diagram of the third embodiment of the protrusion of this utility model.

[0024] Figure 6 This is a structural schematic diagram of the fourth embodiment of the protrusion of this utility model.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1. Circuit board; 2. Power device; 3. Thermal conductive layer; 4. Heat dissipation device; 5. Insulating protrusion; 6. Charged area; 7. Chip; 8. Chip soldering; 9. Plastic housing; 10. Pin; 5-1. Square protrusion; 5-2. Annular protrusion; 5-3. Grid-shaped annular protrusion; 5-4. Circular protrusion. Detailed Implementation

[0027] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0028] Therefore, a feature pointed out in this specification is used to describe one feature of one embodiment of the present invention, and does not imply that every embodiment of the present invention must have the described feature. Furthermore, it should be noted that this specification describes many features. Although certain features may be combined to illustrate possible system designs, these features may also be used in other combinations not explicitly stated. Therefore, unless otherwise stated, the described combinations are not intended to be limiting.

[0029] like Figure 2 As shown, in one embodiment, the power component of this utility model includes a power device 2, a circuit board 1 for mounting the power device 2, and a heat dissipation device 4 for dissipating heat from the power device 2.

[0030] The power device 2 can be an externally insulated power device, including but not limited to diodes, thyristors, MOSFETs, or IGBTs. Each of these power devices 2 has a charged area 6 on one side, which is referred to as the first side in this invention. To achieve more efficient heat dissipation, the heat sink 4 typically dissipates heat from the first side. Although the heat sink 4 can also dissipate heat from other sides, it usually contains thermally conductive metal for rapid heat dissipation, such as water channels made of thermally conductive metal. Therefore, a sufficient electrical clearance is required between the first side of the power device 2 and the heat sink 4.

[0031] The heat dissipation device 4 of this utility model has a heat-conducting layer 3 on the first side facing the power device 2. The first side of the power device 2 has an insulating protrusion 5 that contacts the heat-conducting layer 3. The insulating protrusion 5 ensures that there is a sufficient electrical gap between the first side of the power device 2 and the heat dissipation device 4, achieving a better insulation effect. It is not necessary to increase the thickness of the heat-conducting layer 3 for insulation, which effectively reduces the thermal resistance.

[0032] In different embodiments, the heat-conducting layer 3 can be configured with different areas or shapes. In one embodiment, the area of ​​the heat-conducting layer 3 is greater than or equal to the area of ​​the first side of the power device 2, and the projection of the heat-conducting layer 3 toward the circuit board 1 covers the power device 2, so that the heat-conducting layer 3 can play a more efficient heat conduction effect and conduct the heat dissipation of the power device 2 away in a timely manner.

[0033] In other embodiments, the thermally conductive layer 3 is filled between the circuit board 1 and the heat dissipation device 4, and encapsulates the power device 2. In this way, the thermally conductive layer 3 can not only conduct heat to the power device 2, but also conduct heat to other heat-generating devices on the circuit board 1.

[0034] The following description uses a MOSFET as an example to illustrate various modified embodiments of the present invention. Other power devices 2 can also apply the following modified embodiments.

[0035] In one embodiment, the insulating protrusion 5 includes at least one protrusion 5 disposed in the insulating region of the first side of the power device 2.

[0036] like Figure 3As shown, the insulating protrusion 5 can be four square protrusions 5-1, which are located at the four corners of the insulating area on the first side of the power device 2, and are set with the same width as the annular insulating area on the first side. In other embodiments, they can also be set with different widths. The insulating protrusion 5 can also be three, such as two insulating protrusions 5 on two adjacent corners and one insulating protrusion 5 between the other two adjacent corners. The insulating protrusion 5 can also be only one, which can also make a corresponding electrical clearance between the power range and the heat dissipation device. The insulating protrusion 5 can also be two, for example, two insulating protrusions 5 are respectively set on two opposite sides of the insulating area.

[0037] like Figure 4 As shown, there can be four or more insulating protrusions 5, which are evenly distributed along the annular insulating region on the first side of the power device 2. Figure 4 Multiple insulating protrusions 5 are provided, specifically circular protrusions 5-4, which are evenly distributed along the annular plastic housing 9 on this side of the power device 2. In other embodiments, the insulating protrusions 5 may also be non-uniformly distributed, or grouped, with uniform distribution within each group; all of these fall within the protection scope of this utility model.

[0038] In the above embodiments of multiple independent insulating protrusions 5, the contact surface between the insulating protrusion 5 and the heat dissipation device 4 is irregular, circular, or polygonal, including triangles, quadrilaterals, pentagons, etc.

[0039] like Figure 5 As shown, in one embodiment, the insulating protrusion 5 can be an annular protrusion 5-2 disposed within the insulating region of the first side of the power device 2. The annular protrusion 5-2 can have the same area as or unequal to the annular insulating region of the first side. The position of the annular protrusion 5-2 can be disposed along the outermost edge of the first side of the power device 2, or it can be disposed at a certain distance from the edge.

[0040] like Figure 6 As shown, in one embodiment, the annular protrusion 5-2 can be a grid-shaped annular protrusion 5-3, which is composed of multiple ribs. The ribs that are not parallel to each other can be staggered or not staggered. Figure 6 The grid-like annular protrusions 5-3 include horizontal ribs and vertical ribs, which intersect each other to form a grid. The horizontal and vertical ribs forming the grid can be 2*2, 3*3, or other quantities.

[0041] In the above embodiments, the thermally conductive layer 3 of this utility model can be made of a thermally conductive interface material, namely TIM (Thermal Interface Material).

[0042] This utility model also protects the vehicle power electronic control system, in which the components adopt the power components in the above-mentioned technical solution. The components referred to herein include, but are not limited to, at least one of the motor controller, inverter and on-board charging system.

[0043] This invention designs insulating protrusions 5 of different shapes on the corresponding sides of the power device 2, creating a controllable electrical clearance between the charged area 6 on the corresponding side of the power device 2 and the heat dissipation device 4. The protrusion 5 structure of this invention allows for adjustment of the electrical clearance height, adapting to different voltage levels and enhancing the reliability of the equipment under harsh environments (high temperature, high humidity, vibration). Furthermore, the protrusion 5 structure of this invention is not particularly limited; it can be four-point, ring-shaped, mesh-like, distributed, etc. Those skilled in the art can flexibly choose the position, shape, and number of protrusions 5 according to requirements, improving design flexibility and versatility.

[0044] In the description of this utility model, it should be understood that directional terms such as "front, back, up, down, left, right," "horizontal, vertical, horizontal," and "top, bottom," indicating directions or positional relationships, are generally based on the directions or positional relationships shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner or outer contours relative to the outline of each component itself.

[0045] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0046] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A power component, comprising a power device (2), a circuit board (1) for mounting the power device (2), and a heat dissipation device (4) for dissipating heat from the side of the power device (2) containing a charged region (6), characterized in that, A heat-conducting layer (3) is provided between the heat dissipation device (4) and the power device (2). The side of the power device (2) containing the charged area is the first side. The first side is provided with an insulating protrusion (5) that contacts the heat-conducting layer (3) and is used to control the electrical gap between the charged area and the heat dissipation device (4).

2. The power component as described in claim 1, characterized in that, The insulating protrusion (5) includes at least one insulating protrusion (5) disposed in the insulating region of the first side.

3. The power component as described in claim 2, characterized in that, There are four insulating protrusions (5), which are located at the four corners of the insulating area on the first side; or, there are more than four insulating protrusions (5), which are distributed along the annular insulating area on the first side.

4. The power component as described in claim 2, characterized in that, The contact surface between the insulating protrusion (5) and the heat dissipation device (4) is circular or polygonal.

5. The power component as claimed in claim 1, characterized in that, The insulating protrusion (5) is an annular protrusion disposed in the insulating area of ​​the first side.

6. The power component as claimed in claim 5, characterized in that, The annular protrusion may have the same or different area as the insulating region.

7. The power component as claimed in claim 5, characterized in that, The annular protrusion has a grid-like annular protrusion.

8. The power component as claimed in claim 1, characterized in that, The area of ​​the heat-conducting layer (3) is greater than or equal to the area of ​​the first side surface, and the projection of the heat-conducting layer (3) toward the circuit board (1) covers the power device (2); or the heat-conducting layer (3) fills between the circuit board (1) and the heat dissipation device (4) and wraps the power device (2) inside.

9. The power component according to any one of claims 1 to 8, characterized in that, The power device (2) is a diode, thyristor, MOSFET or IGBT.

10. A vehicle power electronic control system, characterized in that, The components in the vehicle power electronic control system employ the power components described in any one of claims 1 to 9; The components include at least one of a motor controller, an inverter, and an on-board charging system.

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