Deposition device
By designing a nozzle with a gradually decreasing inner diameter and a detachable deposition chamber in the deposition device, combined with vacuum equipment and adjustable support legs, the problem of easy particle detachment was solved, the bonding force and equipment stability were improved, and the operation process was simplified.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN KUOWEI ATOMIC NEW MATERIALS CO LTD
- Filing Date
- 2025-08-14
- Publication Date
- 2026-06-30
AI Technical Summary
In existing deposition devices, the binding force between single-atom or cluster particles and the deposition carrier is insufficient, which makes the particles easy to detach, affecting the stability of the deposition structure and the reliability of device performance.
A deposition device was designed, which uses a nozzle with a gradually decreasing inner diameter to form a high-speed jet of particles. Combined with a vacuum pump and a detachable deposition chamber structure, it ensures efficient bonding of particles and carriers, and is adaptable to different environments through adjustable height support legs.
It significantly improves the bonding force between particles and the carrier, reduces particle detachment, ensures the stability of the deposited structure and device performance, simplifies the operation process, and enhances the adaptability and stability of the equipment.
Smart Images
Figure CN224430711U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of atomic layer deposition technology, and in particular to a deposition apparatus. Background Technology
[0002] In fields such as materials preparation and electronic device manufacturing, deposition apparatuses are key devices for achieving precise deposition of single-atom or cluster particles on the surface of target carriers (such as substrates, circuit boards, and chips). Their performance directly affects the deposition quality and subsequent application effects. Existing deposition apparatuses typically include a deposition chamber, a particle feeding structure, and a vacuum pumping assembly, which can basically achieve the function of introducing single-atom or cluster particles into the deposition chamber and depositing them on the carrier surface.
[0003] However, existing deposition devices suffer from significant drawbacks in practical applications: single-atom or cluster particles are prone to detachment after deposition onto the target carrier. This problem stems primarily from insufficient bonding between the particles and the carrier surface, leading to poor stability of the deposited structure. This not only severely impacts the accuracy of subsequent experimental data (e.g., missing structural information during electron microscopy due to particle detachment) but also reduces the performance reliability and lifespan of devices fabricated using this deposition technology (such as chips and functional coatings), thus hindering its further application in fields requiring high precision and stability. Therefore, improving the bonding force between single-atom or cluster particles and the deposition carrier, and reducing particle detachment, has become a critical technical challenge that existing deposition devices urgently need to address. Utility Model Content
[0004] In view of the shortcomings of the prior art, the technical problem to be solved by this utility model is to provide a deposition device to enhance the bonding force between single atom or cluster particles and the deposition carrier, and reduce particle shedding.
[0005] To solve the above-mentioned technical problems, the present invention provides a deposition device, including a deposition chamber, the deposition chamber having a deposition cavity inside, the deposition chamber being provided with an inlet for single-atom or cluster particles to enter the deposition cavity, the inlet being provided with a nozzle, the deposition cavity being provided with an installation position for mounting a deposition carrier for single-atom or cluster particles to be deposited thereon, and the deposition chamber being provided with an exhaust port for connecting a vacuum pump to evacuate the deposition cavity.
[0006] Furthermore, the mounting position is located within the deposition chamber at a position corresponding to the nozzle spray, so that the deposition carrier assembled in the mounting position can receive the single-atom or cluster particles sprayed from the nozzle.
[0007] Furthermore, the deposition chamber includes a bottom wall, a side wall, and an end cap, which together enclose the deposition cavity. The bottom wall, the side wall, and the end cap are detachably connected.
[0008] Furthermore, the end cap is provided with a feed pipe, the feed pipe having an inlet connecting the deposition chamber and the outside of the deposition chamber, one end of the feed pipe extending into the deposition chamber and the other end extending toward the side of the end cap away from the deposition chamber, and the nozzle being provided at the end of the feed pipe extending into the deposition chamber.
[0009] Furthermore, the nozzle has an inner cavity into which the feed tube extends, the inner cavity extending through the nozzle to one end away from the feed tube to form an orifice.
[0010] Furthermore, the inner cavity has a first cavity that matches the feed pipe and a second cavity that communicates with the first cavity. The second cavity is located at the end of the first cavity away from the end cap, and the inner diameter of the second cavity gradually decreases from near the first cavity to away from the first cavity, forming the nozzle.
[0011] Furthermore, the bottom wall of the chamber has a first groove for inserting the side wall of the chamber, and the bottom wall of the first groove has a second groove to form the mounting position for assembling the deposition carrier.
[0012] Furthermore, the deposition carrier is mounted on the bottom wall of the chamber via a mounting platform, the outer diameter of which matches the inner diameter of the second groove so that it can be inserted into the second groove, and the mounting platform has a third groove for inserting the deposition carrier therein.
[0013] Furthermore, the mounting platform has a fourth groove at the periphery of the third groove. The fourth groove is configured as a plurality of grooves spaced apart around the third groove. Each fourth groove is connected to the third groove and the bottom wall of the fourth groove is lower than the bottom wall of the third groove so that the user can separate the deposition carrier from the mounting platform through the fourth groove.
[0014] Furthermore, the deposition chamber is equipped with height-adjustable support legs.
[0015] The deposition apparatus of this invention has at least the following beneficial effects: Through structural optimization, the deposition apparatus achieves multiple beneficial effects: its nozzle employs a special design with a gradually decreasing inner diameter of the second chamber, enabling single-atom or cluster particles to be accelerated into a high-speed jet, which rapidly combines with the deposition carrier in the vacuum deposition chamber. This significantly improves the bonding force between particles and the carrier, effectively reduces particle detachment, and ensures the stability of the deposition structure and the reliability of subsequent experimental data and device performance. The deposition chamber features a design with detachable connections for the bottom wall, side walls, and end caps, coupled with a sealing structure consisting of an assembly ring, fixing bolts, and sealing rings. This facilitates sample removal, chamber cleaning, and maintenance by the user, reducing costs. Operational ease: The deposition carrier is mounted on the bottom wall of the chamber via a mounting platform. The third groove on the mounting platform precisely positions the carrier, while the fourth groove on the periphery creates a gap due to the lower bottom wall, facilitating easy separation of the carrier from the mounting platform and improving the convenience of sample handling. The evacuation port connects to a vacuum pump, maintaining a vacuum environment in the deposition chamber to ensure high-speed particle movement and promptly removing particles not bound to the carrier, preventing interference with the deposition process and ensuring deposition quality and efficiency. The deposition chamber is equipped with adjustable height support legs, which can be adjusted by rotating the nuts to flexibly adapt to different height requirements and correct equipment tilt, enhancing the stability and adaptability of the equipment in various environments. Attached Figure Description
[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:
[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the deposition apparatus of this utility model. Figure 1 ;
[0018] Figure 2 This is an exploded view of the structure of an embodiment of the deposition apparatus of this utility model;
[0019] Figure 3 This is a schematic diagram of the structure of an embodiment of the deposition apparatus of this utility model. Figure 2 ;
[0020] Figure 4 For along Figure 3 A schematic diagram of the cross-sectional structure of AA.
[0021] The meanings of the labels in the attached diagram are as follows:
[0022] Deposition chamber 1, bottom wall 11, first groove 111, second groove 112, side wall 12, end cap 13, assembly ring 131, first fixing hole 132, sealing ring 133, deposition chamber 2, feed pipe 3, feed inlet 31, nozzle 4, first cavity 41, second cavity 42, nozzle 43, raised edge 44, second fixing hole 45, deposition carrier 5, mounting platform 51, third groove 52, fourth groove 53, air extraction port 6, support leg 7, support rod 71, base foot 72, limit block 73, nut 74, thread 75. Detailed Implementation
[0023] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0024] The following disclosure provides various embodiments or examples of different features for implementing this utility model. Specific examples of components and arrangements will be described below to simplify the utility model. Of course, these are merely examples and are not intended to limit the utility model. For example, in the following description, forming a first component above or on a second component may include embodiments where the first and second components are in direct contact, or embodiments where other components may be formed between the first and second components such that the first and second components are not in direct contact. Additionally, reference numerals and / or characters may be repeated in various instances of the utility model. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations.
[0025] Furthermore, spatial relation terms such as "below," "under," "below," "above," and "above" may be used herein to readily describe the relationship between one element or component and another element (or component) or component (or component) as shown in the figure. In addition to the orientations shown in the figure, spatial relation terms will encompass various different orientations of the device in use or operation. The device may be positioned in other ways (rotated 90 degrees or in other orientations) and will be interpreted accordingly through the spatial relation descriptors used herein.
[0026] Furthermore, the technical parts described in this utility model and the appended claims are mainly the improved technical parts of this utility model, and do not limit the object protected by this utility model to only having these technical parts. Other known necessary components (structures and / or methods) and / or non-essential components of the protected object, other than the technical parts described in this utility model and the appended claims, are not included in this utility model and the appended claims because they do not involve the improvement scope of this utility model. However, this does not mean that the object protected by this utility model does not possess these known components.
[0027] The present invention will be further described below with reference to the accompanying drawings.
[0028] Please refer to Figure 1 The deposition apparatus of this utility model includes a deposition chamber 1, which has a deposition cavity 2 inside. The deposition chamber 1 is provided with an inlet 31 for single-atom or cluster particles to enter the deposition cavity 2. A nozzle 4 is provided on the inlet 31. The deposition cavity 2 is provided with a mounting position for mounting a deposition carrier 5 for depositing single-atom or cluster particles thereon. The deposition chamber 1 is also provided with an air extraction port 6 for connecting a vacuum pump to evacuate the deposition cavity 2 into a vacuum.
[0029] Please refer to Figure 2The deposition chamber 1 has a bottom wall 11, a side wall 12, and an end cap 13, which together enclose the deposition cavity 2. For ease of assembly, the bottom wall 11, side wall 12, and end cap 13 are detachably connected. For example, the bottom wall 11 is configured as a boss, and its upper end is recessed to form a first groove 111 for inserting the side wall 12. The outer diameter of the side wall 12 matches the inner diameter of the first groove 111 for an interference fit. The side wall 12 has an opening at its upper end, and the end cap 13 covers the opening to form a sealed deposition cavity 2. The end cap 13 is assembled to the upper opening of the chamber sidewall 12 via an assembly ring 131. The inner diameter of the assembly ring 131 matches the outer diameter of the chamber sidewall 12 for a sealing fit. The end cap 13 covers the upper end of the assembly ring 131. A first fixing hole 132 is provided between the end cap 13 and the assembly ring 131. Several first fixing holes 132 are arranged at intervals around the assembly ring 131. A first fixing bolt (not shown in the figure) can be installed in each first fixing hole 132 to connect the end cap 13 and the assembly ring 131. A sealing ring 133 is provided between the end cap 13 and the assembly ring 131 to increase the sealing performance between them. This detachable design of the deposition chamber 1 facilitates the removal of the deposited sample by the user and also facilitates cleaning or maintenance of the deposition chamber 1.
[0030] The feed inlet 31 is disposed on the end cap 13. For example, the end cap 13 is provided with a feed pipe 3, which passes through the end cap 13 with one end extending into the deposition chamber 2 and the other end extending out of the deposition chamber 1. The feed pipe 3 has the feed inlet 31 connecting the deposition chamber 2 and the outside of the deposition chamber 1. Please refer to... Figure 3 and Figure 4The nozzle 4 is located at one end of the feed pipe 3 that extends into the deposition chamber 2. The nozzle 4 has an inner cavity into which the feed pipe 3 extends. The inner cavity includes a first cavity 41 that matches the feed pipe 3 and a second cavity 42 that communicates with the first cavity 41. The second cavity 42 is located at the end of the first cavity 41 away from the end cap 13, and the inner diameter of the second cavity 42 gradually decreases from near the first cavity 41 to away from the first cavity 41 to form a nozzle 43. The end of the nozzle 4 near the end cap 13 extends radially outward to form a flange 44 for connection with the end cap 13. A second fixing hole 45 is provided between the flange 44 and the end cap 13. The second fixing holes 45 are arranged in a plurality of spaced intervals around the flange 44, and a second fixing bolt (not shown in the figure) can be fitted into each second fixing hole 45 to connect the nozzle 4 and the end cap 13.
[0031] The air extraction port 6 is located on the side wall 12 of the chamber, and one end of the air extraction port 6 is connected to the deposition chamber 2, while the other end is connected to the outside of the deposition chamber 1 to connect to a vacuum pumping device.
[0032] The bottom wall of the first groove 111 has a second groove 112, which forms the mounting position described above. The position of the second groove 112 corresponds to the spraying position of the nozzle 4 so that the deposition carrier 5 assembled in the second groove 112 can receive the single-atom or cluster particles sprayed by the nozzle 4. A mounting platform 51 for placing the deposition carrier 5 is inserted into the second groove 112. The thickness of the mounting platform 51 is greater than the depth of the second groove 112, so that when the mounting platform 51 is inserted into the second groove 112, it will protrude upwards from the second groove 112, making it easy for the user to remove the mounting platform 51. The upper end face of the mounting platform 51 is recessed downwards to form a third groove 52 for inserting the deposition carrier 5. The upper end face of the mounting platform 51 is recessed downwards at the periphery of the third groove 52 to form a fourth groove 53. The fourth grooves 53 are configured in a plurality of spaced intervals around the third grooves 52, each fourth groove 53 communicating with the third groove 52 and the bottom wall of the fourth groove 53 being lower than the bottom wall of the third groove 52. When the deposition carrier 5 is inserted into the third groove 52, a gap is formed between the lower end face of the deposition carrier 5 and the bottom surface of the fourth groove 53 to facilitate the user in removing the deposition carrier 5 from the third groove 52.
[0033] The sedimentation chamber 1 is also equipped with height-adjustable support legs 7, which are configured to be several located on the bottom wall 11 of the chamber at positions around the outer periphery of the side wall 12. Each support leg 7 includes a support rod 71, a base 72, a limiting block 73, and a nut 74. The bottom wall 11 of the chamber has a vertical through hole corresponding to the installation position of the support leg 7, and the inner diameter of the through hole matches the outer diameter of the support rod 71 so that the support rod 71 can pass through it. The base 72 is fixedly installed at the lower end of the support rod 71 to provide support, and the outer diameter of the base 72 is larger than the outer diameter of the support rod 71 to make the support more stable. The outer periphery of the support rod 71 is machined with threads 75, and the nut 74 is screwed onto the threads 75. The bottom wall 11 of the chamber is supported by several nuts 74. The limiting block 73 is fixedly disposed on the support rod 71 at a position corresponding to the lower part of the thread 75 to limit the nut 74 and prevent the nut 74 from coming down out of the thread 75.
[0034] One embodiment of the deposition apparatus of this utility model operates as follows: In the initial state, all components of the apparatus are assembled together. The extraction port 6 is connected to a vacuum pump, and the vacuum pump is activated to evacuate the deposition chamber 2 to a vacuum. Single-atom or cluster particles are introduced through the feed port 31 using a protective gas. The single-atom or cluster particles are accelerated as they pass through the nozzle 4 and then enter the vacuum environment. When the airflow enters the vacuum environment through the nozzle 4, it is accelerated and expands due to the vacuum. The single-atom or cluster particles diffuse at high speed into the vacuum, forming a jet and combining with the deposition carrier 5 at a high speed to achieve deposition. This high-speed movement can enhance the bonding force between the single-atom or cluster particles and the deposition carrier 5. During this process, the vacuum pump continues to operate to maintain the vacuum state of the deposition chamber 2, ensuring the movement of the single-atom or cluster particles. The vacuum pump also extracts single-atom or cluster particles that have not combined with the deposition carrier 5, which does not affect the normal bonding of the single-atom or cluster particles sprayed onto the deposition carrier 5.
[0035] Simultaneously, we can adjust the support leg 7 to position the deposition chamber 1 at an appropriate height. The adjustment method is as follows: rotate the corresponding nut 74 so that it moves vertically along the support rod 71 under the engagement of the thread 75. Changing the height of the nut 74 supporting the deposition chamber 1 naturally changes the height of the deposition chamber 1. With increased use, different nuts 74 may exhibit varying degrees of wear on their surfaces supporting the deposition chamber 1, which could cause the deposition chamber 1 to tilt. We can also restore the deposition chamber 1 to a balanced state by adjusting the height of the different nuts 74.
[0036] Compared with existing technologies, the deposition apparatus of this invention achieves multiple beneficial effects through structural optimization: its nozzle adopts a special design with a gradually decreasing inner diameter of the second chamber, which accelerates single-atom or cluster particles into a high-speed jet, allowing them to rapidly combine with the deposition carrier in the vacuum deposition chamber. This significantly improves the bonding force between particles and the carrier, effectively reduces particle detachment, and ensures the stability of the deposition structure and the reliability of subsequent experimental data and device performance. The deposition chamber features a design with detachable connections for the bottom wall, side walls, and end caps, along with a sealing structure consisting of an assembly ring, fixing bolts, and sealing rings. This facilitates sample removal, chamber cleaning, and maintenance by the user, reducing operational complexity. Challenges: The deposition carrier is mounted on the bottom wall of the chamber via a mounting platform. The third groove on the mounting platform precisely positions the carrier, while the fourth groove on the periphery creates a gap due to the lower bottom wall, facilitating easy separation of the carrier from the mounting platform and improving the convenience of sample handling. The evacuation port connects to a vacuum pump, maintaining a vacuum environment in the deposition chamber to ensure high-speed particle movement and promptly removing particles not bound to the carrier, preventing interference with the deposition process and ensuring deposition quality and efficiency. The deposition chamber is equipped with adjustable height support legs, which can be adjusted by rotating nuts to flexibly adapt to different height requirements and correct equipment tilt, enhancing the stability and adaptability of the equipment in various environments.
[0037] The above embodiments only illustrate preferred implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A deposition apparatus, comprising a deposition chamber, characterized in that: The deposition chamber has a deposition cavity inside, and the deposition chamber is provided with a feed inlet for single-atom or cluster particles to enter the deposition cavity. The feed inlet is provided with a nozzle. The deposition cavity is provided with a mounting position for installing a deposition carrier for depositing single-atom or cluster particles. The deposition chamber is also provided with an air extraction port for connecting a vacuum pump to evacuate the deposition cavity.
2. The deposition apparatus as described in claim 1, characterized in that: The mounting position is located within the deposition chamber at a position corresponding to the nozzle spray, so that the deposition carrier assembled in the mounting position can receive the single-atom or cluster particles sprayed from the nozzle.
3. The deposition apparatus as described in claim 2, characterized in that: The deposition chamber includes a bottom wall, side walls, and an end cap. The bottom wall, side walls, and end cap together form the deposition cavity, and the bottom wall, side walls, and end cap are detachably connected.
4. The deposition apparatus as described in claim 3, characterized in that: The end cap is provided with a feed pipe, which has an inlet that connects the deposition chamber to the outside of the deposition chamber. One end of the feed pipe extends into the deposition chamber, and the other end extends toward the side of the end cap away from the deposition chamber. The nozzle is located at the end of the feed pipe that extends into the deposition chamber.
5. The deposition apparatus as described in claim 4, characterized in that: The nozzle has an inner cavity into which the feed tube extends, the inner cavity extending through the nozzle to one end away from the feed tube to form an orifice.
6. The deposition apparatus as described in claim 5, characterized in that: The inner cavity has a first cavity that matches the feed pipe and a second cavity that communicates with the first cavity. The second cavity is located at the end of the first cavity away from the end cap, and the inner diameter of the second cavity gradually decreases from near the first cavity to away from the first cavity, forming the nozzle.
7. The deposition apparatus as described in claim 3, characterized in that: The bottom wall of the chamber has a first groove for inserting the side wall of the chamber, and the bottom wall of the first groove has a second groove to form the mounting position for assembling the deposition carrier.
8. The deposition apparatus as claimed in claim 7, characterized in that: The deposition carrier is mounted on the bottom wall of the chamber via a mounting platform. The outer diameter of the mounting platform matches the inner diameter of the second groove so that it can be inserted into the second groove. The mounting platform has a third groove for inserting the deposition carrier.
9. The deposition apparatus as claimed in claim 8, characterized in that: The mounting platform has a fourth groove at the periphery of the third groove. Several fourth grooves are arranged at intervals around the third groove. Each fourth groove is connected to the third groove and the bottom wall of the fourth groove is lower than the bottom wall of the third groove so that the user can separate the deposition carrier from the mounting platform through the fourth groove.
10. The deposition apparatus according to any one of claims 1-9, characterized in that: The sedimentation chamber is equipped with height-adjustable support legs.