A chip packaging device

Abstract

This invention relates to the field of chip processing, and more particularly to a chip packaging device, comprising a frame with a conveyor belt driven by a conveyor motor. A sliding plate is obliquely fixed to the frame at the end of the conveyor belt, and dividing blocks are evenly fixed to the sliding plate, dividing the upper part of the sliding plate into multiple sliding channels. A baffle is also fixed to the frame above the sliding plate. Positioning cylinders are fixed to the frame at positions corresponding to the sliding channels, and positioning blocks are fixed to the piston rods of the positioning cylinders. Multiple limiting cylinders are also fixed to the frame at the ends of the sliding channels. A limiting plate is also provided above the baffle, and the piston rods of the limiting cylinders are fixed to the limiting plate. Limiting blocks are fixed to the lower part of the limiting plate at positions corresponding to the sliding channels. This device can perform chip loading operations on multiple chip tubes at once, greatly improving the tube loading efficiency of chip packaging.

Description

Technical Field

[0001] This invention relates to the field of chip processing, and more particularly to a chip packaging device. Background Technology

[0002] In electronics, an electronic chip is a way to miniaturize circuits and is often manufactured on the surface of a semiconductor wafer. After the chip is manufactured, it is packaged and protected using a packaging tube.

[0003] Patent application CN202220496001.X discloses a chip packaging and collecting fixture, comprising: a guide block with a cover plate on top and a clamping channel between the guide block and the cover plate; and a slide rail fixedly disposed at any end of the guide block, corresponding to the channel. With this setup, an anti-static integrated circuit chip packaging tube is inserted into the clamping channel. After each integrated circuit chip is inspected, tweezers or a suction cup are used to place the integrated circuit chip on the slide rail according to a fixed pin order, allowing the integrated circuit chip to slide into the anti-static integrated circuit packaging tube. However, this type of device can only load one chip packaging tube at a time, resulting in low loading efficiency. A single wafer cutting process typically yields thousands of individual chips; using a single-tube collection method requires repeating this process many times to complete the chip loading, leading to low efficiency and making it unsuitable for mass production.

[0004] This invention was proposed in response to the shortcomings of existing technologies. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a chip packaging device.

[0006] This invention can be achieved through the following technical solutions:

[0007] This invention discloses a chip packaging device, comprising a frame, a conveyor belt mounted on the frame, the conveyor belt being driven to rotate by a conveyor motor, a sliding plate being inclinedly fixed to the frame at the end of the conveyor belt, and partition blocks being evenly fixed to the sliding plate, the partition blocks dividing the upper part of the sliding plate into multiple sliding channels, a baffle plate being fixed to the frame above the sliding plate, positioning cylinders being fixed to positions corresponding to the sliding channels on the frame, and positioning blocks being fixed to the ends of the piston rods of the positioning cylinders, and multiple limiting cylinders being fixed to the frame at the ends of the sliding channels, a limiting plate being mounted above the baffle plate, the piston rod ends of the limiting cylinders being fixed to the limiting plate, and limiting blocks being fixed to positions corresponding to the sliding channels below the limiting plate, with chip tubes being disposed below each sliding channel.

[0008] Preferably, the baffle is provided with a positioning hole through the baffle at a position corresponding to the positioning block, and the baffle is provided with a limiting hole through the baffle at a position corresponding to the limiting block.

[0009] Preferably, guide tubes are fixed on the frame between the sliding channel and the chip tube. After the chip slides down from the sliding channel, it falls onto the guide tube and is then slid into the chip tube through the guide tube.

[0010] Preferably, a lead screw and a sliding rod are provided on the frame below the sliding plate. The lead screw is driven to rotate by a take-up motor. A slide table is also provided below the sliding plate, and a threaded tube and a sliding tube are fixed on the slide table. The lead screw passes through the threaded tube and is threadedly connected to it. The sliding rod passes through the sliding tube and is slidably connected to it. A fixing plate is also fixed above the slide table, and multiple fixing holes are evenly arranged on the fixing plate. Chip tubes are placed in the fixing holes of the fixing plate. After a row of chip tubes reaches the bottom of the sliding channel, chip loading is performed on that row of chip tubes. After a row of chip tubes is loaded with chips, the lead screw is driven to rotate a certain number of revolutions by the take-up motor, and the slide table moves a certain distance, allowing the next row of empty chip tubes to reach the bottom of the sliding channel, greatly improving the chip loading efficiency.

[0011] Preferably, each baffle is provided with an air passage groove penetrating the baffle at a position corresponding to the material sliding channel, and each frame is fixed with an air pipe at a position corresponding to the material sliding channel, the end of each air pipe being connected to an air pump. The air pump sprays compressed gas through the air pipe, using the airflow to agitate the chip and prevent the chip from clogging the material sliding channel.

[0012] Compared with existing technologies, the present invention has the following advantages:

[0013] This device forms multiple sliding channels on the sliding plate, and then discharges a specified amount of chips into the corresponding chip tubes, performing chip loading operations on multiple chip tubes at one time, which greatly improves the tube loading efficiency of chip packaging. Attached Figure Description

[0014] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, wherein:

[0015] Figure 1 This is a schematic diagram of the structure of the present invention;

[0016] Figure 2 This is a schematic diagram of the structure of the present invention from another angle;

[0017] Figure 3 for Figure 1 Enlarged view of point A in the middle;

[0018] In the diagram: 1. Frame; 2. Conveyor motor; 3. Conveyor belt; 4. Sliding plate; 5. Separator block; 6. Sliding channel; 7. Positioning cylinder; 8. Positioning block; 9. Air pipe; 10. Baffle; 11. Air passage groove; 12. Limiting cylinder; 13. Limiting plate; 14. Limiting block; 15. Guide pipe; 16. Slide table; 17. Fixing plate; 18. Fixing hole; 19. Chip tube; 20. Lead screw; 21. Sliding rod; 22. Receiving motor; Detailed Implementation

[0019] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings:

[0020] Example 1:

[0021] like Figures 1 to 3As shown, this embodiment discloses a chip packaging device, including a frame 1, a conveyor belt 3 on the frame 1, the conveyor belt 3 being driven to rotate by a conveyor motor 2, a sliding plate 4 being obliquely fixed on the frame 1 at the end of the conveyor belt 3, and partition blocks 5 being evenly fixed on the sliding plate 4, the partition blocks 5 dividing the upper end of the sliding plate 4 into multiple sliding channels 6, a baffle 10 being fixed on the frame 1 above the sliding plate 4, positioning cylinders 7 being fixed at positions corresponding to the sliding channels 6 on the frame 1, positioning blocks 8 being fixed at the ends of the piston rods of the positioning cylinders 7, multiple limiting cylinders 12 being fixed on the frame 1 at the end of the sliding channels 6, a limiting plate 13 being provided above the baffle 10, the piston rod ends of the limiting cylinders 12 being fixed to the limiting plate 13, limiting blocks 14 being fixed at positions corresponding to the sliding channels 6 below the limiting plate 13, and chip tubes 19 being provided below the sliding channels 6. The chips to be packaged are transported forward by conveyor belt 3. The chips fall onto the sliding plate 4. Due to the inclined design of the sliding plate 4 and the separation by the separator 5, the chips enter each sliding channel 6. When the chips reach the position of the limit block 14, they are stopped by the limit block 14. After the chips gradually fill the sliding channels, and each sliding channel 6 is filled with chips, the positioning cylinder 7 is activated, and the piston rod on the positioning cylinder 7 extends. The positioning block 8 enters the position of the sliding channel 6 and presses down on the corresponding chip. The limit cylinder 12 is activated, and the piston rod on the limit cylinder 12 shortens, moving the limit block 14 above the baffle 10. The chip on one side of the positioning block 8 slides down from the position of the sliding channel 6 and falls onto the corresponding chip. After a certain amount of chips are loaded into the chip tube 19, an empty chip tube 19 is replaced. Then, the solenoid valve connected to the limiting cylinder 12 is energized, opening the air passage. Compressed gas re-enters the limiting cylinder 12, and the piston rod of the limiting cylinder 12 moves again. The limiting block 14 re-enters the corresponding sliding channel 6. Then, the solenoid valve connected to the positioning cylinder 7 is de-energized, closing the corresponding air passage. After the gas in the positioning cylinder 7 is discharged, the positioning block 8 rises. The chip slides down again and is blocked by the limiting block 14. This cycle is repeated. This device forms multiple sliding channels 6 on the sliding plate 4, and then discharges a specified amount of chips into the corresponding chip tube 19. Multiple chip tubes 19 are loaded with chips at one time, which greatly improves the loading efficiency of chip packaging.

[0022] The baffle 10 has a positioning hole that penetrates the baffle 10 at the position corresponding to the positioning block 8, and the baffle 10 has a limiting hole that penetrates the baffle 10 at the position corresponding to the limiting block 14.

[0023] The frame 1 below the sliding plate 4 is equipped with a lead screw 20 and a slide rod 21. The lead screw 20 is driven to rotate by the take-up motor 22. A slide table 16 is also provided below the sliding plate 4. A threaded tube and a slide tube are fixed on the slide table 16. The lead screw 20 passes through the threaded tube and is threadedly connected to it. The slide rod 21 passes through the slide tube and is slidably connected to it. A fixing plate 17 is fixed above the slide table 16. The fixing plate 17 has multiple fixing holes 18 evenly arranged through it. Chip tubes 19 are placed in the fixing holes 18 of the fixing plate 17. After a row of chip tubes 19 reaches below the sliding channel 6, chip loading is performed on the row of chip tubes 19. After a row of chip tubes 19 is loaded with chips, the lead screw 20 is driven to rotate a certain number of times by the take-up motor. The slide table 16 moves a certain distance, and the next row of empty chip tubes 19 reaches below the sliding channel 6, which greatly improves the chip loading efficiency.

[0024] Example 2:

[0025] This embodiment discloses a chip packaging device. Based on the structure and principle of Embodiment 1, a guide tube 15 is fixed on the frame 1 between the sliding channel 6 and the chip tube 19. After the chip slides down from the sliding channel 6, it falls onto the guide tube 15 and is then slid into the chip tube 19 through the guide tube 15.

[0026] Example 3:

[0027] This embodiment discloses a chip packaging device. Based on the structure and principle of Embodiment 1 or Embodiment 2, this embodiment provides air passage grooves 11 that penetrate the baffle 10 at positions corresponding to the material sliding channel 6. Air pipes 9 are fixed on the frame 1 at positions corresponding to the material sliding channel 6, and the ends of the air pipes 9 are connected to an air pump. The air pump sprays compressed gas through the air pipes 9, using the airflow to agitate the chips and prevent them from clogging the material sliding channel 6.

[0028] The above are merely preferred embodiments of the present invention. It should be noted that, for those skilled in the art, various changes, modifications, substitutions and variations can be made to these embodiments without departing from the technical principles of the present invention. These changes, modifications, substitutions and variations should also be considered within the scope of protection of the present invention.

Claims

1. A chip packaging apparatus, characterized by comprising: The device includes a frame on which a conveyor belt is mounted. The conveyor belt is driven to rotate by a conveyor motor. A sliding plate is obliquely fixed to the frame at the end of the conveyor belt. Dividing blocks are evenly fixed to the sliding plate, dividing the upper part of the sliding plate into multiple sliding channels. A baffle is also fixed to the frame above the sliding plate. Positioning cylinders are fixed to the frame at positions corresponding to the sliding channels. Positioning blocks are fixed to the piston rods of the positioning cylinders. Multiple limiting cylinders are also fixed to the frame at the ends of the sliding channels. A limiting plate is also provided above the baffle. The piston rods of the limiting cylinders are fixed to the limiting plate. Limiting blocks are fixed to the positions below the limiting plate corresponding to the sliding channels. Chip tubes are provided below each sliding channel.

2. The chip packaging apparatus according to claim 1, characterized by: The baffle plate is provided with positioning holes that penetrate the baffle plate at positions corresponding to the positioning blocks, and the baffle plate is provided with limiting holes that penetrate the baffle plate at positions corresponding to the limiting blocks.

3. The chip packaging apparatus of claim 1, wherein: Guide tubes are fixed on the frame between the material sliding channel and the chip tube.

4. The chip packaging apparatus of claim 1, wherein: A lead screw and a slide rod are installed on the frame below the sliding plate. The lead screw is driven to rotate by the receiving motor. A slide table is also installed below the sliding plate. A threaded tube and a slide tube are fixed on the slide table. The lead screw passes through the threaded tube and is threadedly connected to the threaded tube. The slide rod passes through the slide tube and is slidably connected to the slide tube. A fixing plate is also fixed above the slide table. Multiple fixing holes are evenly arranged on the fixing plate.

5. The chip packaging apparatus of claim 1, wherein: Each baffle is provided with an air passage groove that passes through the baffle at a position corresponding to the material sliding channel. Each frame is fixed with an air pipe at a position corresponding to the material sliding channel, and the end of each air pipe is connected to an air pump.

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