A type of crystal display screen

Abstract

This utility model relates to the technical field of crystal chip display screens, specifically a crystal chip display screen, comprising: a fully transparent substrate, including a fully transparent base layer, a fully transparent base layer including a light-emitting display area, the transparent substrate further including a circuit layer disposed within the light-emitting display area, a plurality of LED wafer chip light-emitting units, a first transparent optical soft adhesive layer, a second transparent optical soft adhesive layer, a first light-transmitting explosion-proof protective film, and a second light-transmitting explosion-proof protective film. This utility model, firstly, can prevent excessive light mixing between adjacent light-emitting units, and secondly, can allow for a larger distance between light-emitting units to ensure the light transmission effect of the crystal chip transparent display screen. When the driving circuit layer is correspondingly disposed on the first surface and / or the second surface, it will be sandwiched, covered, and wrapped by the first transparent optical soft adhesive layer and / or the second transparent optical soft adhesive layer corresponding to the first surface and / or the second surface.

Description

Technical Field

[0001] This utility model relates to the technical field of crystal chip display screens, specifically a crystal chip display screen. Background Technology

[0002] A transparent display screen is an LED display screen with a transparent substrate. Its typical structure includes a flexible film, on which a circuit layer is formed. LED wafer chip light-emitting units are fixedly disposed on the flexible film and electrically connected to the circuit layer. The LED wafer chip light-emitting units are arranged on the transparent display screen with a certain interval, so that there are gaps between the LED wafer chip light-emitting units. These gaps allow light to pass through based on the light-transmitting property of the transparent substrate. Thus, the transparent display screen can display content on the one hand, and allow light to pass through on the other hand, achieving a transparent display effect.

[0003] Due to the material properties of flexible films, existing transparent displays are usually attached to transparent carriers with transparent adhesive. The transparent display itself has low strength, making it difficult to display independently, and it is also inconvenient to change its position after installation, which greatly limits its application scenarios.

[0004] Therefore, a crystal chip display screen is proposed to solve the problems mentioned above. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a crystal chip display screen, which can solve the problems of insufficient strength and inconvenient installation of existing devices.

[0006] To achieve the above objectives, this utility model provides the following technical solution: including:

[0007] A fully transparent substrate, including a fully transparent substrate layer;

[0008] A fully transparent substrate layer, including the light-emitting display area;

[0009] The transparent substrate also includes a circuit layer disposed within the light-emitting display area;

[0010] Several LED wafer chip light-emitting units;

[0011] First transparent optical soft adhesive layer;

[0012] Second transparent optical soft adhesive layer;

[0013] First light-transmitting explosion-proof protective film;

[0014] Second light-transmitting explosion-proof protective film.

[0015] Preferably, a plurality of the LED wafer chip light-emitting units are fixedly disposed on the first surface of the fully transparent substrate layer and located within the light-emitting display area, and the LED wafer chip light-emitting units are electrically connected to the circuit layer.

[0016] Preferably, the first transparent optical soft adhesive layer is fixedly disposed on the first surface and covers the LED wafer chip light-emitting unit and the circuit layer located on the first surface.

[0017] Preferably, the second transparent optical soft adhesive layer is disposed on a second surface that is disposed on the back side opposite to the first surface.

[0018] Preferably, the first light-transmitting explosion-proof protective film is adhered to the first transparent optical soft adhesive layer.

[0019] Preferably, the second light-transmitting explosion-proof protective film is adhered to the second transparent optical soft adhesive layer.

[0020] Preferably, the circuit layer includes a first sub-circuit layer and a second sub-circuit layer respectively disposed on the first surface and the second surface, and the first sub-circuit layer and the second sub-circuit layer are electrically connected through vias.

[0021] Preferably, the fully transparent substrate further includes a driving circuit layer and a circuit layer disposed in the display area, wherein the circuit layer and the driving circuit layer are electrically connected.

[0022] Preferably, the fully transparent substrate further includes several drive control elements that are electrically connected to the drive circuit layer.

[0023] Compared with the prior art, the present invention provides a crystal chip display screen, which has the following beneficial effects:

[0024] 1. In this application, the distance between adjacent light-emitting units is greater than the distance between light-emitting devices within the light-emitting unit group. Firstly, this can prevent excessive light mixing between adjacent light-emitting units, allowing relatively independent light-emitting units to present a more accurate light-emitting effect. Secondly, it allows for a greater distance between light-emitting units to ensure the light transmission effect of the crystal core transparent display screen.

[0025] 2. The portion of the circuit layer located on the first surface is also covered by the first transparent optical soft adhesive layer, thereby forming a huge encapsulation unit on the first surface side of the fully transparent substrate layer. This not only protects, isolates, and electrically connects the LED wafer chip light-emitting unit and other devices as well as the circuit layer, but also enhances the transparent light emission effect based on the first transparent optical soft adhesive layer.

[0026] 3. Some of the lines in the second sub-line layer will run from the bottom of the LED wafer chip light-emitting unit. This can take advantage of the inherent visual effect of the LED wafer chip light-emitting unit to block the lines to a certain extent, effectively ensuring the light transmittance and visual effect of the crystal core transparent display screen.

[0027] 4. The driving circuit layer can be specifically disposed on the first surface and / or the second surface; when the driving circuit layer is disposed on the first surface and / or the second surface, it will be sandwiched, covered and wrapped by the first transparent optical soft adhesive layer and / or the second transparent optical soft adhesive layer corresponding to the first surface and / or the second surface. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0029] Figure 2 This is an exploded view of the fully transparent substrate of this utility model;

[0030] Figure 3 This is a schematic diagram of the wiring between the first sub-line layer and the second sub-line layer of this utility model;

[0031] Figure 4 This is a schematic diagram of the wafer chip dimensions and structure of this utility model;

[0032] Figure 5 This is a schematic diagram of the topology of the transparent display screen series system of this utility model;

[0033] Figure 6 This is a schematic diagram of a partial light-emitting wafer chip array of this utility model.

[0034] In the figure: 14, fully transparent substrate layer; 11, circuit layer; 111, first sub-circuit layer; 112, second sub-circuit layer; 12, driving circuit layer; 13, driving control element; 30, LED wafer chip light-emitting unit; 21, first transparent optical soft adhesive layer; 22, second transparent optical soft adhesive layer; 42, first light-transmitting explosion-proof protective film; 41, second light-transmitting explosion-proof protective film. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0036] Example:

[0037] Please see Figure 1 - Figure 6 A crystal display screen in this embodiment includes:

[0038] A fully transparent substrate, including a fully transparent substrate layer 14;

[0039] A fully transparent substrate layer 14 includes a light-emitting display area;

[0040] The transparent substrate also includes a circuit layer 11 disposed within the light-emitting display area;

[0041] Several LED wafer chip light-emitting units 30;

[0042] First transparent optical soft adhesive layer 21;

[0043] Second transparent optical soft adhesive layer 22;

[0044] First light-transmitting explosion-proof protective film 42;

[0045] Second light-transmitting explosion-proof protective film 41;

[0046] Several LED wafer chip light-emitting units 30 are fixedly disposed on the first surface of the fully transparent substrate layer 14 and located within the light-emitting display area, and the LED wafer chip light-emitting units 30 are electrically connected to the circuit layer 11.

[0047] The first transparent optical soft adhesive layer 21 is fixedly disposed on the first surface and covers the LED wafer chip light-emitting unit 30 and the circuit layer 11 located on the first surface;

[0048] The second transparent optical soft adhesive layer 22 is disposed on the second surface, which is the opposite side of the first surface;

[0049] The first light-transmitting explosion-proof protective film 42 is adhered to the first transparent optical soft adhesive layer 21;

[0050] The second light-transmitting explosion-proof protective film 41 is adhered to the second transparent optical soft adhesive layer 22;

[0051] The circuit layer 11 includes a first sub-circuit layer 111 and a second sub-circuit layer 112 respectively disposed on the first surface and the second surface, and the first sub-circuit layer 111 and the second sub-circuit layer 112 are electrically connected through vias.

[0052] The fully transparent substrate also includes a driving circuit layer 12 and a circuit layer 11 disposed in the display area, wherein the circuit layer 11 and the driving circuit layer 12 are electrically connected.

[0053] The fully transparent substrate also includes several drive control elements 13 that are electrically connected to the drive circuit layer 12;

[0054] First, the transparent LED display screen involved in this application refers to a display screen that allows light to pass through it while displaying content. This light includes ambient light from the outside world, as well as light emitted by the LED wafer chip light-emitting unit 30 of the transparent display screen itself as a light source. Therefore, the transparent LED display screen can present the following effects:

[0055] If the LED wafer chip light-emitting unit 30 in the crystal core transparent display screen is not powered on and does not display content, since the crystal core transparent display screen allows external light to pass through directly, the crystal core transparent display screen can be regarded as not existing in the visual effect under this situation, and its impact on the blocking of ambient light is very slight.

[0056] If the LED wafer chip light-emitting unit 30 in the crystal core transparent display screen is powered on and displaying content, then the crystal core transparent display screen allows users to see the displayed content from both sides of the crystal core display screen, and the surrounding environment can be used as the background of the displayed content through the crystal core transparent display screen;

[0057] Among them, there is a fully transparent substrate, which is made of a material with a light transmittance of more than 90%, allowing external light or light emitted by the LED wafer chip light-emitting unit 30 to pass through. Generally speaking, the smaller the thickness of the fully transparent substrate, the better its light transmission effect. However, the thinner the fully transparent substrate, the lower its hardness and strength. Therefore, the material of the transparent substrate is generally flexible and presents itself as a completely transparent thin film.

[0058] In addition, the specific structure of the fully transparent substrate includes a fully transparent substrate layer 14 as the main support, and a circuit layer 11 disposed on the fully transparent substrate layer 14. The fully transparent substrate layer 14 is divided into a light-emitting display area according to its function. The light-emitting display area is divided into an area where LED wafer chip light-emitting units 30 are disposed. The LED wafer chip light-emitting units 30 are fixedly disposed in the fully transparent substrate layer 14 at a position corresponding to the display area.

[0059] The circuit layer 11 is formed by processing conductive materials to form a conductive network circuit. The conductive materials can be set on the fully transparent substrate layer 14 through processing processes such as electroplating and etching. It is worth mentioning that in order to ensure the light transmittance of the fully transparent substrate, the width of the lines in the conductive network circuit layer 11 formed by the conductive materials is very small. In particular, the gap between adjacent lines is usually set to 3 to several times the line width. This can minimize the shading of light by the conductive network circuit.

[0060] The LED wafer chip light-emitting unit 30 is fixedly disposed on the first surface of the fully transparent substrate layer 14. The thin film fully transparent substrate layer 14 has two surfaces, namely a first surface and a second surface arranged opposite to each other. The LED wafer chip light-emitting unit 30 is disposed on the first surface. In order to achieve the fixed placement of the LED wafer chip light-emitting unit 30, the first surface of the fully transparent substrate layer 14 is provided with precision pads that match the position and number of each LED wafer chip light-emitting unit 30. The precision pads are part of the circuit layer 11 and are electrically connected to the circuits in the circuit layer 11. It is worth mentioning that the first surface and the second surface of the fully transparent substrate layer 14 involved in this application embodiment are only used to distinguish the surfaces of the fully transparent substrate layer 14 used to place the LED wafer chip light-emitting unit 30. It does not mean that the two surfaces of the fully transparent substrate layer 14 have any difference. In fact, as long as precision pads are provided on the corresponding surfaces, they can be used to fix the corresponding LED wafer chip light-emitting unit 30.

[0061] In some optional embodiments, the type of LED wafer chip light-emitting unit 30 may specifically include at least one or more combinations of bare die chips and CSP chips. A bare die chip refers to an LED chip without components such as encapsulant, bracket, and bonding wire, while a CSP chip refers to an LED chip with encapsulant but without a bracket. In the structure of the bare die chip, different color light emission effects can be achieved by setting a corresponding quantum dot layer on the epitaxial layer.

[0062] In some optional embodiments, the specific application form of the LED wafer chip light-emitting unit 30 may include adjacent red light-emitting unit devices, blue light-emitting unit devices, and green light-emitting unit devices, and the distance between the light-emitting units is greater than the distance between adjacent light-emitting devices within the light-emitting unit. That is to say, the LED wafer chip light-emitting unit 30 in this embodiment can be a group of RGB three-color light-emitting devices, wherein each group of LED wafer chip light-emitting units 30 includes adjacent red light-emitting unit devices, blue light-emitting unit devices, and green light-emitting unit devices. The distance between adjacent light-emitting units is greater than the distance between light-emitting devices within the light-emitting unit group. Firstly, this can prevent excessive light mixing between adjacent light-emitting units, allowing relatively independent light-emitting units to present a more accurate light-emitting effect. Secondly, it allows for a larger distance between light-emitting units to ensure the light transmission effect of the crystal core transparent display screen.

[0063] In some optional embodiments, when the transparent display screen does not require RGB color display, each LED wafer chip light-emitting unit 30 can also be a single light-emitting device, with each light-emitting device emitting the same color and the distance between adjacent light-emitting devices being equal.

[0064] To protect the light-emitting unit and improve its display effect, a first transparent optical soft adhesive layer 21 is also included. The first transparent optical soft adhesive layer 21 is fixedly disposed on the first surface, and the LED wafer chip light-emitting unit 30 is also disposed on the first surface. Therefore, the first transparent optical soft adhesive layer 21 will cover the LED wafer chip light-emitting unit 30 within it. In addition, the portion of the circuit layer 11 located on the first surface will also be covered within it by the first transparent optical soft adhesive layer 21, thereby forming a huge encapsulation unit on the first surface side of the fully transparent substrate layer 14. This not only protects, isolates, and electrically connects the LED wafer chip light-emitting unit 30 and other devices and the circuit layer 11, but also improves its transparent light emission effect based on the first transparent optical soft adhesive layer 21.

[0065] Corresponding to the first transparent optical soft adhesive layer 21, a second transparent optical soft adhesive layer 22 is also included. The second transparent optical soft adhesive layer 22 is disposed on the second surface of the fully transparent substrate layer 14, wherein the second transparent optical soft adhesive layer 22 also provides electrical connection protection, isolation, and coverage for the circuit layer 11 present on the second surface. It is worth mentioning that, in this case, the circuit layer 11 can be disposed on both the first and second surfaces. For details, please refer to [reference needed]. Figure 2 To achieve electrical connection between the circuit layers 11 respectively disposed on the first and second surfaces, a plurality of electrical conductor connection vias are provided on the fully transparent substrate layer 14 to connect the first and second surfaces. The circuit layer 11 includes a first sub-circuit layer 111 and a second sub-circuit layer 112 respectively disposed on the first and second surfaces, and the first sub-circuit layer 111 and the second sub-circuit layer 112 are electrically connected through the vias. Compared with the scheme of only placing the circuit layer 11 on one of the surfaces, placing the circuit layer 11 on both surfaces can significantly reduce the difficulty of circuit design. For example, the insulation between the circuits corresponding to the positive and negative electrodes of the LED wafer chip light-emitting unit 30 can be easily achieved by placing the circuit layer 11 on both surfaces. When the circuit layer 11 includes two parts disposed on the first and second surfaces, the wiring that originally required jumpers or bypasses in the circuit design can be replaced by the electrical conductor connection vias respectively disposed on the two surfaces, thereby improving circuit safety, optimizing the wiring form and reducing wiring difficulty.

[0066] In some alternative embodiments, please refer to Figure 3To further reduce the impact of the circuit layer 11 on the light transmittance of the crystal core transparent display, in the second sub-circuit layer 112, at least some of the circuits run from the orthographic projection area of ​​the LED wafer chip light-emitting unit 30 on the second surface. In other words, some of the circuits in the second sub-circuit layer 112 run from the bottom of the LED wafer chip light-emitting unit 30. This utilizes the inherent visual effect characteristics of the LED wafer chip light-emitting unit 30 to partially obscure the circuits, effectively ensuring the light transmittance and visual effect of the crystal core transparent display.

[0067] In some optional embodiments, in order to further reduce the circuit design difficulty of the circuit layer 11 while ensuring the light transmittance of the crystal core transparent display, at least most of the lines in the first sub-circuit layer 111 and the second sub-circuit layer 112 are perpendicular to each other. When at least most of the lines in the first sub-circuit layer 111 and the second sub-circuit layer 112 are perpendicular to each other, a uniformly distributed rectangular transparent gap will be formed between the first sub-circuit layer 111 and the second sub-circuit layer 112. The greater the ratio of mutually perpendicular lines in the first sub-circuit layer 111 and the second sub-circuit layer 112, the more uniform the distribution of the rectangular gaps, thereby making the light transmittance of the crystal core transparent display more uniform.

[0068] In some optional embodiments, in order to make the displayed content appear almost identical when viewed from both sides of the crystal core transparent display screen, the light transmittance of the corresponding first light-transmitting explosion-proof protective film 42 and the second light-transmitting explosion-proof protective film 41 can be set to be the same. The material affecting the light transmittance includes, but is not limited to, the material of the light-transmitting explosion-proof protective film, the thickness of the light-transmitting explosion-proof protective film, etc. That is, light-transmitting explosion-proof protective films of the same material and the same thickness can be used as the first light-transmitting explosion-proof protective film 42 and the second light-transmitting explosion-proof protective film 41, and respectively set on the upper and lower surfaces of the fully transparent substrate layer 14.

[0069] In some alternative embodiments, the transparent LED display screen, in addition to the display components, often includes a drive control communication circuit for communication drive control to achieve the required display content. Specifically, the fully transparent substrate layer 14 may also include a drive control circuit area located outside the light-emitting display area. The fully transparent substrate also includes a drive line layer 12 disposed within the drive control area, which is electrically connected to the line layer 11 disposed within the display area. The transparent display screen also includes several drive control elements 13 disposed within the drive area and electrically connected to the drive line layer 12. The drive control elements 13 can be used as control drive IC element chips. In addition to the display area where the LED wafer chip light-emitting device is disposed, the fully transparent substrate layer 14 is also equipped with a communication control drive circuit area, which is mainly used for communication. The drive circuit layer 12 is controlled, and the drive control element 13 is provided. The drive circuit layer 12 and the circuit layer 11 are electrically connected. Specifically, the drive circuit layer 12 and the circuit layer 11 can be designed and laid out together on the fully transparent substrate layer 14. Correspondingly, the drive circuit layer 12 can also be laid out regularly on the first and second surfaces of the fully transparent substrate layer 14, just like the circuit layer 11. This can reduce the difficulty of the wiring design and layout of the drive circuit layer 12, reduce the risk of circuit defects, improve safety and facilitate large-scale production. In other words, the drive circuit layer 12 can be set on the first surface and / or the second surface. When the drive circuit layer 12 is set on the first surface and / or the second surface, it will be sandwiched, covered and wrapped by the first transparent optical soft adhesive layer 21 and / or the second transparent optical soft adhesive layer 22 corresponding to the first surface and / or the second surface.

[0070] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods. As long as they can achieve their beneficial effects, they can be implemented. Therefore, this embodiment will not elaborate on their specific structural composition and working principle.

[0071] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A crystal chip display screen, characterized in that: include: A fully transparent substrate, including a fully transparent substrate layer (14). A fully transparent substrate layer (14) includes a light-emitting display area; The transparent substrate also includes a circuit layer (11) disposed within the light-emitting display area. Several LED wafer chip light-emitting units (30); First transparent optical soft adhesive layer (21); Second transparent optical soft adhesive layer (22); First light-transmitting explosion-proof protective film (42); Second light-transmitting explosion-proof protective film (41).

2. A crystal core display screen according to claim 1, characterized in that: Several LED wafer chip light-emitting units (30) are fixedly disposed on the first surface of the fully transparent substrate layer (14) and located within the light-emitting display area, and the LED wafer chip light-emitting units (30) are electrically connected to the circuit layer (11).

3. A crystal core display screen according to claim 2, wherein: The first transparent optical soft adhesive layer (21) is fixedly disposed on the first surface and covers the LED wafer chip light-emitting unit (30) and the circuit layer (11) located on the first surface.

4. A crystal core display screen according to claim 2, wherein: The second transparent optical soft adhesive layer (22) is disposed on a second surface that is disposed on the back side opposite to the first surface.

5. The crystal core display screen of claim 1, wherein: The first light-transmitting explosion-proof protective film (42) is bonded to the first transparent optical soft adhesive layer (21).

6. The crystal core display screen of claim 1, wherein: The second light-transmitting explosion-proof protective film (41) is bonded to the second transparent optical soft adhesive layer (22).

7. The crystal core display screen of claim 1, wherein: The circuit layer (11) includes a first sub-circuit layer (111) and a second sub-circuit layer (112) respectively disposed on the first surface and the second surface, and the first sub-circuit layer (111) and the second sub-circuit layer (112) are electrically connected through vias.

8. The crystal core display screen of claim 1, wherein: The fully transparent substrate also includes a driving circuit layer (12) and a circuit layer (11) disposed in the display area, wherein the circuit layer (11) is electrically connected to the driving circuit layer (12).

9. The crystal core display screen of claim 1, wherein: The fully transparent substrate also includes several drive control elements (13) that are electrically connected to the drive circuit layer (12).

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