Liquid cooling plate, electronic device

Abstract

This application discloses a liquid cooling plate and an electronic device. The liquid cooling plate includes a frame and a cover plate. The inner wall of the frame is used to enclose a space for containing coolant. The frame is provided with a recessed platform at the connection between the inner wall and the end face of the frame. The edge of the cover plate overlaps the recessed platform, and a first airtight structure is injection molded between the edge of the cover plate and the frame for fixing the cover plate and the frame together.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a liquid cooling plate and electronic equipment. Background Technology

[0002] As electronic devices become increasingly sophisticated, high-power hardware applications are becoming more prevalent. For example, the total power consumption of central processing units used in server upgrades is growing. This high power consumption leads to increased heat generation during operation, necessitating the use of liquid cooling plates to improve the heat dissipation performance of electronic devices.

[0003] To create the space for holding the coolant, current liquid cooling plates are mainly fixed together by welding or bolting. However, welding is a complex process with low production efficiency, and the welding process often causes significant localized thermal deformation of the product, affecting the final quality. Bolted connections require sealing rings, but these rings often fail to maintain airtightness due to aging after long-term use, affecting the service life of the liquid cooling plate. Utility Model Content

[0004] This application provides the following technical solution:

[0005] A liquid cooling plate, comprising:

[0006] The frame has an inner wall surface for enclosing a space for containing coolant, and the frame has a recessed platform surface located at the connection between the inner wall surface and the end face of the frame opening.

[0007] A cover plate, the edge of which overlaps the recessed platform surface, and a first airtight structure is injection molded between the edge of the cover plate and the frame body for fixing the cover plate and the frame body together.

[0008] Optionally, in the above-mentioned liquid cooling plate, the frame has a connecting surface connecting the recessed surface and the frame opening end face, and at least one of the recessed surface and the connecting surface is provided with a connecting portion to increase the connection strength between the frame and the first airtight structure.

[0009] Optionally, in the above-mentioned liquid cooling plate, the connecting portions of the recessed surface and the connecting surface are correspondingly provided, the connecting portion is used to provide the first airtight structure, the connecting portion is a nanopore, or the connecting portion is a groove.

[0010] Optionally, the above-mentioned liquid cooling plate includes:

[0011] The substrate is located on the side of the frame away from the cover plate and is airtightly connected to the frame opening end face of the frame. The substrate has an extension that extends out of the outer wall of the frame, and the extension has mounting holes for installing fasteners.

[0012] Optionally, in the above-mentioned liquid cooling plate, the protrusion is configured to extend continuously around the outer periphery of the frame, and the substrate is rectangular with mounting holes at the four corners.

[0013] Optionally, in the above-mentioned liquid cooling plate, the substrate and the frame are integrally formed; or,

[0014] The substrate has a base groove with the same shape as the frame on the side facing the frame. The side of the frame away from the cover plate is located in the base groove, and a second airtight structure is injection molded between the inner surface of the base groove and the frame for fixing the frame and the substrate together.

[0015] Optionally, in the above-mentioned liquid cooling plate, the cover plate is provided with a liquid inlet connector and / or a liquid outlet connector. The liquid inlet connector is used to connect to a liquid inlet pipe communicating with the receiving space, and the liquid outlet connector is used to connect to a liquid outlet pipe communicating with the receiving space.

[0016] Optionally, in the above-mentioned liquid cooling plate, the cover plate is made of any one of aluminum alloy, magnesium alloy, copper alloy, titanium alloy and stainless steel, and the frame is made of any one of aluminum alloy, magnesium alloy, copper alloy, titanium alloy and stainless steel.

[0017] Optionally, in the above-mentioned liquid cooling plate, the material of the first airtight structure is any one of rubber, glue, PPS plastic, LCP plastic, PEEK plastic, PBT plastic, PI plastic and PA plastic.

[0018] An electronic device includes a heat-generating component and a liquid-cooled plate thermally connected to the heat-generating component, the liquid-cooled plate comprising:

[0019] The frame has an inner wall surface for enclosing a space for containing coolant, and the frame has a recessed platform surface located at the connection between the inner wall surface and the end face of the frame opening.

[0020] A cover plate, the edge of which overlaps the recessed platform surface, and a first airtight structure is injection molded between the edge of the cover plate and the frame body for fixing the cover plate and the frame body together. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0022] Figure 1This is a perspective view of a liquid cooling plate according to an embodiment of this application;

[0023] Figure 2 yes Figure 1 A schematic diagram of the cover plate in the structure shown;

[0024] Figure 3 yes Figure 1 A schematic diagram of the structure shown after removing the cover plate;

[0025] Figure 4 yes Figure 1 Enlarged view of point A in the middle;

[0026] Figure 5 yes Figure 4 A partial cross-sectional view along line BB in the middle;

[0027] Figure 6 yes Figure 5 A schematic diagram of the frame in the structure shown;

[0028] Figure 7 This is a schematic diagram of the internal structure of the liquid cooling plate according to an embodiment of this application;

[0029] Figure 8 This is a perspective view of a substrate according to an embodiment of this application;

[0030] Figure 9 This is a partial schematic diagram of an electronic device according to an embodiment of this application;

[0031] Figure 10 This is a partial schematic diagram of an electronic device according to an embodiment of this application.

[0032] The diagram is marked as follows:

[0033] 100. Liquid cooling plate; 200. Heating element;

[0034] 110. Cover plate; 111. Liquid inlet connector; 112. Liquid outlet connector; 113. Edge;

[0035] 120. Frame; 121. Inner wall surface; 122. Recessed platform surface; 123. Frame opening end face; 124. Outer wall surface; 125. Connecting surface; 126. Connecting part;

[0036] 130. Substrate; 131. Mounting hole; 132. Extension; 133. Base groove;

[0037] 140. First airtight structure; 150. Flow guiding structure. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0039] In the description of this application, the references to terms such as "one embodiment," "some embodiments," "example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0040] In the description of this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0041] See Figures 1-6 This application provides a liquid cooling plate 100, including a frame 120 and a cover plate 110. The inner wall surface 121 of the frame 120 is used to enclose a space for containing coolant. The frame 120 is provided with a recessed surface 122 located at the connection between the inner wall surface 121 and the frame end face 123. The edge portion 113 of the cover plate 110 overlaps the recessed surface 122, and a first airtight structure 140 is injection molded between the edge portion 113 of the cover plate 110 and the frame 120 for fixing the cover plate 110 and the frame 120 together.

[0042] The edge 113 of the cover plate 110 refers to the portion near the outer edge of the cover plate 110. The frame opening end face 123 of the frame body 120 refers to the surface connecting the inner wall surface 121 and the outer wall surface 124 of the frame body 120. The edge 113 of the cover plate 110 overlaps with the recessed surface 122 at the connection between the inner wall surface 121 and the frame opening end face 123 of the frame body 120, thus the cover plate 110 covers the frame opening of the frame body 120. It is easy to understand that the side of the cover plate 110 facing the frame opening and the inner wall surface 121 of the frame body 120 are used to enclose a space for containing coolant. The cover plate 110 and the frame 120 are fixedly connected by a first airtight structure 140 between the edge portion 113 of the cover plate 110 and the frame 120. That is, the first airtight structure 140 airtightly connects the edge portion 113 of the cover plate 110 and the frame 120, so the coolant in the containment space cannot flow out from between the edge portion 113 of the cover plate 110 and the frame 120. The material of the first airtight structure 140 can be of various types, as long as it can be fixed between the edge portion 113 of the cover plate 110 and the frame 120 by injection molding.

[0043] In the liquid cooling plate 100 provided in this application, the cover plate 110 and the frame 120 are fixedly connected by a first airtight structure 140 formed by injection molding. Compared with welding, this method has higher production efficiency and can avoid large local thermal deformation of the product, thus helping to ensure the final quality of the product. Compared with bolt connection, the use of sealing rings is avoided, thus eliminating the airtightness failure problem caused by sealing ring aging, which helps to improve the service life of the liquid cooling plate 100.

[0044] In some embodiments, the material of the first airtight structure 140 can be any one of rubber, adhesive, PPS plastic, LCP plastic, PEEK plastic, PBT plastic, PI plastic, and PA plastic. The materials of the cover plate 110 and the frame 120 can be the same or different. In some embodiments, the material of the cover plate 110 can be any one of aluminum alloy, magnesium alloy, copper alloy, titanium alloy, and stainless steel, and the material of the frame 120 can be any one of aluminum alloy, magnesium alloy, copper alloy, titanium alloy, and stainless steel.

[0045] In some embodiments, the cover plate 110 and the frame 120 can be selected from materials that meet the requirements of nano-injection molding process and have good thermal conductivity. That is, the cover plate 110 and the frame 120 can be selected from metal materials suitable for connection by nano-injection molding process. For example, in the aluminum and aluminum alloy 1000~7000 series, any one of 5052, 6061, 6063, 7072 and 7075 can be selected; in the stainless steel series, any one of SUS-304, SUS-316 and SUS-316L can be selected (in other iron series alloys, MIM304L can be selected); in magnesium and magnesium alloys, AZ-31B or AZ-91D can be selected; in copper and copper alloys, any one of C110, C1020, C5191, KFC5, CAC16 and KLF194 can be selected; and in titanium and titanium alloys, KSTI or KS40 can be selected.

[0046] In the embodiment where the cover plate 110 and the frame 120 are connected by a nano-injection molding process, the material of the first airtight structure 140 should be selected as a plastic that meets the requirements of the nano-injection molding process, such as glass fiber reinforced PPS system engineering plastic, glass fiber reinforced PBT system engineering plastic, glass fiber reinforced PA system engineering plastic (PA6, PA66, PPA).

[0047] It is easy to understand that, in the direction of the frame opening of the frame 120, there is a height difference between the recessed surface 122 and the frame opening end face 123. The frame 120 has a connecting surface 125 that connects the recessed surface 122 and the frame opening end face 123. The dimension of the connecting surface 125 in the direction of the frame opening of the frame 120 is the aforementioned height difference. It should be noted that the relationship between this height difference and the thickness of the cover plate 110 can be varied. For example, the height difference can be equal to, greater than, or less than the thickness of the cover plate 110. When the height difference (i.e., the height of the connecting surface 125) is equal to the thickness of the cover plate 110, after the edge 113 of the cover plate 110 overlaps the recessed surface 122, the surface of the cover plate 110 (i.e., the side facing away from the frame opening of the frame 120) is flush with the frame opening end face 123. When the height difference is greater than the thickness of the cover plate 110, after the edge 113 of the cover plate 110 overlaps the recessed platform 122, the end face 123 of the frame opening protrudes from the surface of the cover plate 110 (i.e., the side facing away from the frame opening of the frame body 120). Conversely, when the height difference is less than the thickness of the cover plate 110, after the edge 113 of the cover plate 110 overlaps the recessed platform 122, the surface of the cover plate 110 (i.e., the side facing away from the frame opening of the frame body 120) protrudes from the end face 123 of the frame opening.

[0048] The edge 113 of the cover plate 110 overlaps the recessed surface 122 of the frame 120, so the recessed surface 122 faces the plate surface of the cover plate 110, and the connecting surface 125 faces the side of the cover plate 110. In some embodiments, the first airtight structure 140 may exist only between the recessed surface 122 and the plate surface of the cover plate 110, or only between the connecting surface 125 and the side of the cover plate 110, or it may be as follows: Figure 5 As shown, the first airtight structure 140 exists both between the surfaces of the recessed platform 122 and the cover plate 110, and also between the connecting surface 125 and the side of the cover plate 110.

[0049] In some embodiments, at least one of the recessed surface 122 and the connecting surface 125 may be provided with a connecting portion 126 to increase the connection strength between the frame 120 and the first airtight structure 140. The connecting portion 126 may be configured as a protruding structure or a recessed structure, as long as it increases the connection strength between the injection-molded first airtight structure 140 and the frame 120. See also Figure 5 and Figure 6 In some embodiments, the connecting portion 126 may be disposed on the recessed surface 122 of the frame 120. Of course, in other embodiments, the connecting portion 126 may also be disposed on the connecting surface 125 of the frame 120, or the recessed surface 122 and the connecting surface 125 may each be provided with a connecting portion 126.

[0050] It should be understood that both the recessed surface 122 and the connecting surface 125 form a complete ring around the frame opening of the frame body 120. Based on the provision of connecting portions 126 on the recessed surface 122 and / or the connecting surface 125, the position of the connecting portions 126 within the complete ring around the frame opening of the frame body 120 can be selected in various ways. It should be noted that the connecting portions 126 can be located at various positions within the complete ring around the frame opening of the frame body 120, or they can be located at several positions within the complete ring around the frame opening of the frame body 120. That is, the recessed surface 122 and the connecting surface 125 can select several areas at intervals within the complete ring to provide the connecting portions 126, while the intervals between these areas are not provided with connecting portions 126; alternatively, all areas corresponding to the complete ring can be used to provide the connecting portions 126.

[0051] Based on the premise that both the recessed surface 122 and the connecting surface 125 are provided with connecting portions 126, in some embodiments, the connecting portions 126 of the recessed surface 122 and the connecting surface 125 can be correspondingly provided, that is, the connecting portions 126 on the recessed surface 122 and the connecting surface 125 are positioned correspondingly. Of course, in other embodiments, the connecting portions 126 of the recessed surface 122 and the connecting surface 125 can also be offset in the circumferential direction of the frame opening.

[0052] The connecting portion 126 is used to provide the first airtight structure 140. The type of connecting portion 126 can be varied; for example, it can be a nanopore or a groove. It should be understood that when the connecting portion 126 is a nanopore, the injection molding of the first airtight structure 140 is a nano-injection molding process. It should be noted that when the connecting portion 126 is a groove, the size of the groove is larger than the nanometer scale; therefore, the groove and the nanopore are different structural types. In some embodiments, the connecting portions 126 of the recessed surface 122 and the connecting surface 125 can be of the same type or different types. For example, the recessed surface 122 may have nanopores, while the connecting surface 125 may have a groove. Alternatively, both the recessed surface 122 and the connecting surface 125 may have nanopores.

[0053] See Figure 5 and Figure 6 Since the connecting portion 126 is used to provide the first airtight structure 140, and the first airtight structure 140 is used to fix the cover plate 110 and the frame 120, the connecting portion 126 can be provided on either the frame 120 or the cover plate 110. It is easy to understand that the cover plate 110 and the frame 120 can be configured such that only one of them has the connecting portion 126, or both can have the connecting portion 126. Based on the fact that both the cover plate 110 and the frame 120 have the connecting portion 126, the connecting portions 126 on the cover plate 110 and the frame 120 can be of the same type or different types. It should be noted that in the embodiment where the cover plate 110 has the connecting portion 126, the connecting portion 126 on the cover plate 110 is located at the edge portion 113 of the cover plate 110. It should be understood that the edge portion 113 includes the side of the cover plate 110 and the portion of the cover plate 110 adjacent to the side. Therefore, in the embodiment where the cover plate 110 is provided with the connecting portion 126, the connecting portion 126 may be provided on the side of the cover plate 110 and / or the portion of the cover plate 110 adjacent to the side.

[0054] In an embodiment where the connecting portion 126 is configured as a nanopore, the connecting portion 126 can be formed by the following steps: First, the metal substrate (i.e., the part where the connecting portion 126 is located) is degreased and cleaned by alkaline treatment to remove surface grease and dirt, and then dried. After drying, acid treatment is performed to etch nanopores on the surface of the metal substrate, thereby forming the connecting portion 126. After the connecting portion 126 in the form of nanopores is formed on the surface of the metal substrate, the first airtight structure 140 can be further formed by the following steps: First, the cover plate 110 and the frame 120 are aligned according to their positions (i.e., the relative positions of the cover plate 110 and the frame 120 in the finished liquid cooling plate 100), then the cover plate 110 and the frame 120 are placed as a whole into the mold (the mold can ensure that the injection material flows between the edge portion 113 of the cover plate 110 and the frame 120 during subsequent injection molding), then the fluid plastic is injected into the mold, and finally pressure drying is performed. It should be noted that after being removed from the mold, an airtightness test must be performed to check whether the first airtight structure 140 is qualified. If the gas does not pass between the edge 113 of the cover plate 110 and the frame 120 under the specified test pressure, the first airtight structure 140 can be determined to be qualified.

[0055] In some embodiments, the liquid cooling plate 100 may include a substrate 130, which is located on the side of the frame 120 away from the cover plate 110 and is hermetically connected to the frame opening end face of the frame 120. It should be understood that the frame 120 has frame opening end faces on opposite sides, and the frame opening end face to which the substrate 130 is connected is the frame opening end face of the frame 120 away from the cover plate 110. Similar to the cover plate 110, the substrate 130 covers the frame opening of the frame 120, and the side of the substrate 130 facing the frame opening and the inner wall surface 121 of the frame 120 are used to enclose a receiving space for containing coolant. It should be noted that when the liquid cooling plate 100 is not equipped with a substrate 130, the frame opening on the side of the liquid cooling plate 100 away from the cover plate 110 can be covered by other components besides the liquid cooling plate 100. Taking the case where the liquid cooling plate 100 is used to dissipate heat from components on the PCB board as an example, the frame 120 of the liquid cooling plate 100 can be airtightly connected to the PCB board, thereby using the PCB board to cover the frame opening on the side of the liquid cooling plate 100 away from the cover plate 110.

[0056] In some embodiments, based on the liquid cooling plate 100 having a substrate 130, the substrate 130 may have an extension 132 extending beyond the outer wall surface 124 of the frame 120, and the extension 132 has mounting holes 131 for mounting fasteners. The liquid cooling plate 100 can be fixed to other components using fasteners at the mounting holes 131. For example, in cases where the liquid cooling plate 100 is used to dissipate heat from components on a PCB board, the liquid cooling plate 100 can be fixed to the PCB board using fasteners such as screws or bolts. See [link to documentation]. Figure 1 and Figure 3In some embodiments, the extension 132 of the substrate 130 may be configured to extend continuously around the outer periphery of the frame 120 for a full circle. Of course, in other embodiments, the extension 132 of the substrate 130 may also be configured in other forms, for example in… Figure 7 In the exemplary embodiment shown, the substrate 130 has extensions 132 only on opposite sides, that is, only opposite sides of the substrate 130 extend out of the outer wall surface 124 of the frame 120.

[0057] In some embodiments, the substrate 130 may be rectangular with mounting holes 131 at its four corners. Of course, in other embodiments, the substrate 130 may be of other shapes, such as circular or elliptical. Furthermore, based on the presence of the protrusion 132 on the substrate 130, the shape of the substrate 130 may be the same as or different from the shape of the frame 120. For example, both the substrate 130 and the frame 120 may be rectangular, or the frame 120 may be rectangular while the substrate 130 is elliptical.

[0058] In some embodiments, the substrate 130 and the frame 120 can be integrally formed, that is, the substrate 130 and the frame 120 are configured as a single structure. Of course, in other embodiments, the substrate 130 and the frame 120 can be manufactured independently and then connected together. Based on the independent manufacturing of the substrate 130 and the frame 120, such as... Figure 8 As shown, in some embodiments, the side of the substrate 130 facing the frame 120 may be provided with a base groove 133 having the same shape as the frame ring of the frame 120. The side of the frame 120 away from the cover plate 110 is located within the base groove 133, and a second airtight structure (not shown in the figure) is injection molded between the inner surface of the base groove 133 and the frame 120 for fixing the frame 120 and the substrate 130 together. It should be understood that the inner surface of the base groove 133 includes the bottom surface of the base groove 133 and the wall surface of the base groove 133. In some embodiments, the second airtight structure may be configured to exist only between the wall surface of the base groove 133 and the frame 120, or it may be configured to exist simultaneously between the bottom surface of the base groove 133 and the frame 120, and between the wall surface of the base groove 133 and the frame 120. It should be noted that the second airtight structure can be formed in the same manner as the first airtight structure 140 described above, and will not be repeated here. The base groove 133 is used to fix and install the frame 120, therefore the shape of the base groove 133 is the same as the shape of the frame ring of the frame 120. Figure 3 and Figure 8In the exemplary embodiment shown, the frame of the frame 120 is rectangular, so the base groove 133 is rectangular in shape. In other embodiments, the base groove 133 may be set to other shapes according to the shape of the frame of the frame 120. For example, in an embodiment where the frame of the frame 120 is elliptical, the base groove 133 is correspondingly set to elliptical.

[0059] In some embodiments, the cover plate 110 may be provided with an inlet connector 111 and / or an outlet connector 112. The inlet connector 111 is used to connect to an inlet pipe (not shown in the figure) communicating with the receiving space, and the outlet connector 112 is used to connect to an outlet pipe (not shown in the figure) communicating with the receiving space. It is easy to understand that the liquid cooling plate 100 is connected with other components such as the inlet pipe and the outlet pipe to form a cooling system. The coolant flows into the interior of the liquid cooling plate 100 from the inlet pipe through the inlet connector 111, and after flowing through the interior of the liquid cooling plate 100, the coolant flows into the outlet pipe through the outlet connector 112, thereby carrying away the heat from the liquid cooling plate 100. The cover plate 110 is provided with an inlet connector 111 and / or an outlet connector 112 in three cases: First, the cover plate 110 is only provided with an inlet connector 111, in which case the outlet connector 112 can be provided on the frame 120; Second, the cover plate 110 is only provided with an outlet connector 112, in which case the inlet connector 111 can be provided on the frame 120; Third, the cover plate 110 is provided with both an inlet connector 111 and an outlet connector 112.

[0060] See Figure 7 In some embodiments, a flow guiding structure 150 may be provided within the accommodating space of the liquid cooling plate 100, the flow guiding structure 150 being used to guide the flow of coolant. Figure 7 In the exemplary embodiment, hollow arrows illustrate the flow of coolant. After flowing into the interior of the liquid cooling plate 100 from the inlet connector 111, the coolant flows through the guide structure 150 to the outlet connector 112. The guide structure 150 can have various forms. In some embodiments, the guide structure 150 can be configured to include multiple parallel fins forming flow channels between adjacent fins; that is, at least two parallel flow channels extend from the inlet end of the guide structure 150 (the end of the guide structure 150 near the inlet connector 111) to the outlet end of the guide structure 150 (the end of the guide structure 150 near the outlet connector 112). In other embodiments, the guide structure 150 can be configured with only one flow channel extending from the inlet end of the guide structure 150 in a reciprocating bending shape to the outlet end of the guide structure 150.

[0061] Based on the liquid cooling plate 100 provided in this application, this application also provides an electronic device, including a heat-generating component 200 and a liquid cooling plate 100 heat-transferringly connected to the heat-generating component 200. The liquid cooling plate 100 includes a frame 120 and a cover plate 110. The inner wall surface 121 of the frame 120 is used to enclose a receiving space for containing coolant. The frame 120 is provided with a recessed platform surface 122 located at the connection between the inner wall surface 121 and the frame end face 123. The edge portion 113 of the cover plate 110 overlaps the recessed platform surface 122, and a first airtight structure 140 is injection molded between the edge portion 113 of the cover plate 110 and the frame 120 for fixing the cover plate 110 and the frame 120 together.

[0062] Electronic devices can be of various types, such as servers, mobile phones, desktop computer mainframes, and laptops. Heat-generating components 200 refer to components that generate heat during operation, such as central processing units, graphics processing units, power supply modules, and motors. See also Figure 9 In embodiments where the liquid cooling plate 100 includes a substrate 130, the heat-generating component 200 can be configured to be thermally connected to the substrate 130. For example, the heat-generating component 200 is located on the side of the substrate 130 facing away from the frame 120 and is stacked with the substrate 130. The heat from the heat-generating component 200 is transferred to the coolant within the liquid cooling plate 100 through the substrate 130, thereby achieving heat dissipation from the heat-generating component 200. Of course, in other embodiments, the heat-generating component 200 can be configured to be thermally connected to other locations on the liquid cooling plate 100, such as in… Figure 10 In the exemplary embodiment shown, the heat-generating component 200 is located on the side of the cover plate 110 away from the frame 120 and is stacked with the cover plate 110. The heat of the heat-generating component 200 is transferred to the coolant in the liquid cooling plate 100 through the cover plate 110, thereby realizing the heat dissipation of the heat-generating component 200.

[0063] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0064] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A liquid-cooled plate, characterized in that, include: The frame has an inner wall surface for enclosing a space for containing coolant, and the frame has a recessed platform surface located at the connection between the inner wall surface and the end face of the frame opening. A cover plate, the edge of which overlaps the recessed platform surface, and a first airtight structure is injection molded between the edge of the cover plate and the frame body for fixing the cover plate and the frame body together.

2. The liquid cold plate of claim 1, wherein, The frame has a connecting surface that connects the recessed surface and the end face of the frame opening. At least one of the recessed surface and the connecting surface is provided with a connecting part to increase the connection strength between the frame and the first airtight structure.

3. The liquid cold plate of claim 2, wherein, The connecting portions of the recessed platform and the connecting surface are correspondingly provided. The connecting portions are used to provide the first airtight structure. The connecting portions are nanopores or grooves.

4. The liquid cold plate of claim 1, wherein, include: The substrate is located on the side of the frame away from the cover plate and is airtightly connected to the frame opening end face of the frame. The substrate has an extension that extends out of the outer wall of the frame, and the extension has mounting holes for installing fasteners.

5. The liquid cold plate of claim 4, wherein, The extended portion is configured to extend continuously around the outer periphery of the frame, and the substrate is rectangular with mounting holes at the four corners.

6. The liquid cold plate of claim 4, wherein, The substrate and the frame are integrally formed; or... The substrate has a base groove with the same shape as the frame on the side facing the frame. The side of the frame away from the cover plate is located in the base groove, and a second airtight structure is injection molded between the inner surface of the base groove and the frame for fixing the frame and the substrate together.

7. The liquid cold plate of claim 1, wherein, The cover plate is provided with an inlet connector and / or an outlet connector. The inlet connector is used to connect to an inlet pipe that communicates with the containing space, and the outlet connector is used to connect to an outlet pipe that communicates with the containing space. 8.The liquid cold plate of any of claims 1-7, wherein, The cover plate is made of any one of aluminum alloy, magnesium alloy, copper alloy, titanium alloy, and stainless steel, and the frame is made of any one of aluminum alloy, magnesium alloy, copper alloy, titanium alloy, and stainless steel. 9.The liquid cold plate of any of claims 1-7, wherein, The material of the first airtight structure is any one of rubber, glue, PPS plastic, LCP plastic, PEEK plastic, PBT plastic, PI plastic and PA plastic.

10. An electronic device comprising a heat generating component and a liquid cooling plate in heat transfer connection with the heat generating component, characterized by The liquid cooling plate includes: The frame has an inner wall surface for enclosing a space for containing coolant, and the frame has a recessed platform surface located at the connection between the inner wall surface and the end face of the frame opening. A cover plate, the edge of which overlaps the recessed platform surface, and a first airtight structure is injection molded between the edge of the cover plate and the frame body for fixing the cover plate and the frame body together.

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