A die cutting device suitable for high precision positioning
By using a feed inlet that is wider at the top and narrower at the bottom and a collection box with an inverted V-shaped baffle structure in the die-cutting device, combined with the cooperation of cylinders and air pumps, the problem of untimely collection and debris drifting out during the die-cutting process of flexible circuit boards is solved, achieving high-precision positioning and effective collection of debris, and reducing the intensity of cleaning work.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 东莞市奥佳光电材料有限公司
- Filing Date
- 2025-05-08
- Publication Date
- 2026-07-07
AI Technical Summary
Existing flexible circuit board die-cutting equipment cannot collect debris in a timely manner during the die-cutting process, resulting in a high workload for subsequent cleaning. Furthermore, the airflow when the air pump is started can easily cause debris to drift out of the collection box.
A die-cutting device suitable for high-precision positioning was designed. It adopts a feed inlet that is wider at the top and narrower at the bottom and a collection box with an inverted V-shaped baffle structure. Combined with the cooperation of cylinders and air pumps, it can achieve precise positioning of flexible circuit boards of different widths and effective collection of debris.
It achieves high-precision positioning of flexible circuit boards and effective collection of debris, preventing debris from drifting out of the collection box under the action of airflow and reducing the intensity of subsequent cleaning work.
Smart Images

Figure CN224464862U_ABST