Chip test probe positioning calibration structure
By designing a chip test probe positioning and calibration structure, and using an elastic buffer sheet and support block structure to guide and buffer the probe pressure, the problem of uneven pressure caused by uneven probe bending is solved, thereby improving the probe's strength and the accuracy of chip testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN AILETONE TECHNOLOGY CO LTD
- Filing Date
- 2025-07-30
- Publication Date
- 2026-07-07
AI Technical Summary
Existing chip test probes suffer from uneven pressure due to uneven bending during chip contact testing, which affects probe lifespan and chip yield.
A chip test probe positioning and calibration structure was designed, including a probe base, an elastic buffer, a support block and a CCD detection camera. The elastic buffer guides and buffers the probe pressure to reduce pressure differences, and the support block and stop block structure facilitates the replacement of the buffer.
It effectively reduces probe wear caused by uneven pressure, improves probe strength and chip testing accuracy, and extends probe lifespan.
Smart Images

Figure CN224471731U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip test probe positioning and calibration technology, and specifically to a chip test probe positioning and calibration structure. Background Technology
[0002] During chip fabrication and use, it is necessary to detect the chip's condition, which requires the use of test probes. During chip testing, the contact state between the probes and the chip test points directly determines the accuracy of the test data and the lifespan of the probes. During long-term use or frequent insertion and removal, some probes are prone to slight bending due to uneven force. When the probe array descends to contact the chip, the effective contact length of the bent probes is shortened, causing the unbent probes to bear greater pressure to compensate for the contact gap. This results in the unbent probes wearing down faster due to excessive force, and plastic deformation at the tips, leading to increased contact resistance with the test points. At the same time, the chip test points may develop indentations or cracks due to excessive local pressure, affecting the chip yield.
[0003] Therefore, we propose a chip test probe positioning and calibration structure to solve the above problems. Summary of the Invention
[0004] In view of the problems existing in the above-mentioned chip test probe positioning and calibration structure, this utility model is proposed.
[0005] Therefore, the purpose of this utility model is to provide a chip test probe positioning and calibration structure, which solves the problem that when existing test probes are in contact with the chip, the tips of different probes may be bent, resulting in greater pressure on the tips of longer probes when all probes are in contact with the chip, thus affecting their strength.
[0006] To achieve the above objectives, this utility model provides the following technical solution:
[0007] A chip test probe positioning and calibration structure includes a probe base and a plurality of test probes slidably disposed inside the probe base at intervals. The bottom of the probe base has a groove, and a plurality of elastic buffer sheets are disposed in the groove at intervals. The bottom of the test probe is fixedly provided with two symmetrically arranged pressure rods, and the bottom of the pressure rods contacts and engages with the side of the elastic buffer sheet.
[0008] The lower end of the elastic buffer sheet has a through hole, and a support block slides through the through hole. The support block is fixed to the inner side wall of the groove.
[0009] A support frame is fixedly provided on the outer wall of the probe base, and a CCD detection camera is fixedly provided on the upper end of the support frame.
[0010] Preferably, the elastic buffer sheet is V-shaped.
[0011] Preferably, the support block has a movable groove at its end, and a stop block is slidably inserted on both sides of the movable groove. The stop block covers the outside of the elastic buffer sheet. A fixing plate is fixedly installed on the inner wall of the movable groove. A sleeve is fixedly installed on both sides of the fixing plate. A sleeve rod is slidably inserted in the sleeve. The sleeve rod is fixedly connected to the stop block. A spring is sleeved on the rod wall of the sleeve rod. The two ends of the spring are fixedly connected to the stop block and the sleeve, respectively.
[0012] Preferably, all of the blocks are wedge-shaped blocks, and the side away from the elastic buffer sheet has an inclined surface.
[0013] Furthermore, a movable limiting plate is fixedly sleeved on the lower end of the test probe.
[0014] Preferably, the outer wall of the stop is fixedly provided with a pull plate, and the end of the pull plate passes through the moving groove and extends to the outside.
[0015] The technical effects and advantages provided by this utility model in the above technical solution are as follows:
[0016] 1. This utility model, through the provision of a probe base, groove, test probe, pressure rod, support block and elastic buffer sheet, can effectively guide and buffer the test pressure on the probe when it contacts the chip, so as to avoid the pressure difference between probes of different lengths and specifications, reduce pressure damage to the probe and improve the strength of the probe.
[0017] 2. This utility model, through the provision of an elastic buffer sheet, through hole, support block, stop block, sleeve, sleeve rod, fixing plate and spring, can restrict the position of the elastic buffer sheet, making it convenient to replace the buffer sheet. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.
[0019] Figure 1 This is a schematic diagram of the structure of this utility model;
[0020] Figure 2 For the present utility model Figure 1 Enlarged schematic diagram of part A;
[0021] Figure 3 This is a three-dimensional structural diagram of the stop block of this utility model.
[0022] Explanation of reference numerals in the attached figures:
[0023] 1. Probe base; 2. Test probe; 3. Groove; 4. Elastic buffer sheet; 5. Pressure rod; 6. Through hole; 7. Support block; 8. Support frame; 9. CCD inspection camera; 10. Stop block; 11. Fixing plate; 12. Sleeve; 13. Sleeve rod; 14. Spring; 15. Moving limit plate; 16. Pull plate. Detailed Implementation
[0024] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.
[0025] This utility model discloses a chip test probe positioning and calibration structure.
[0026] This utility model provides, for example Figure 1-3 The chip test probe positioning and calibration structure shown includes a probe base 1 and a plurality of test probes 2 slidably disposed inside the probe base 1 at intervals. The lower end of the test probe 2 is fixedly fitted with a movable limiting plate 15. The bottom of the probe base 1 has a groove 3, and a plurality of elastic buffer sheets 4 are disposed at intervals in the groove 3. The elastic buffer sheets 4 are arranged in a V shape. The bottom of the test probe 2 is fixedly fitted with two symmetrically arranged pressure rods 5, and the bottom of the pressure rods 5 contacts and cooperates with the side of the elastic buffer sheet 4.
[0027] The lower end of the elastic buffer sheet 4 is provided with a through hole 6, and a support block 7 is slidably inserted in the through hole 6. The support block 7 is fixedly installed on the inner side wall of the groove 3.
[0028] A support frame 8 is fixedly mounted on the outer wall of the probe base 1, and a CCD inspection camera 9 is fixedly mounted on the upper end of the support frame 8.
[0029] In order to restrict the position of the elastic buffer sheet and facilitate its easy replacement, such as Figure 2-3 As shown, the end of the support block 7 is provided with a moving groove, and the two sides of the moving groove are slidably provided with a stop block 10. The stop block 10 covers the outside of the elastic buffer sheet 4. The multiple stop blocks 10 are all wedge-shaped blocks, and the side away from the elastic buffer sheet 4 is provided with an inclined surface. The inner wall of the moving groove is fixedly provided with a fixing plate 11. The two sides of the fixing plate 11 are fixedly provided with a sleeve 12. The sleeve rod 13 is slidably provided in the sleeve 12. The sleeve rod 13 is fixedly connected to the stop block 10. The rod wall of the sleeve rod 13 is fitted with a spring 14. The two ends of the spring 14 are fixedly connected to the stop block 10 and the sleeve 12 respectively. The outer wall of the stop block 10 is fixedly provided with a pull plate 16. The end of the pull plate 16 passes through the moving groove and extends to the outside.
[0030] Working principle: During use, the CCD inspection camera 9 detects and calibrates the position of the test probe 2 and the chip test point to ensure that the test probe 2 is aligned with the chip test point. When the test probe 2 contacts the chip, the chip generates an upward reaction force on the test probe 2. The test probe 2 slides upward and drives the pressure rod 5 to move synchronously. The pressure rod 5 squeezes the side of the V-shaped elastic buffer sheet 4, causing the elastic buffer sheet 4 to undergo elastic deformation with the support block 7 as the fulcrum, thus buffering the pressure. Due to the buffering effect of the elastic buffer sheet 4, the pressure difference of test probes 2 of different lengths or with bends is reduced, reducing the damage to the test probe 2 caused by excessive pressure.
[0031] The movable limiting plate 15 restricts the sliding distance of the test probe 2, preventing it from falling out of the probe base 1. When the elastic buffer sheet 4 needs to be replaced, pull the pull plate 16 to move the stop block 10 into the moving groove. The stop block 10 compresses the spring 14 and causes the sleeve rod 13 to retract into the sleeve 12. At this time, the stop block 10 no longer covers the elastic buffer sheet 4, and the elastic buffer sheet 4 can be removed from the support block 7 for replacement. After replacement, release the pull plate 16, the spring 14 resets, and pushes the stop block 10 reset, covering the outside of the elastic buffer sheet 4 again to limit and fix it.
[0032] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.
Claims
1. A chip test probe positioning and calibration structure, comprising a probe base (1) and a plurality of test probes (2) slidably disposed inside the probe base (1) at intervals, characterized in that, The probe base (1) has a groove (3) at the bottom, and a plurality of elastic buffer sheets (4) are provided in the groove (3) at intervals. The test probe (2) has two symmetrically arranged pressure rods (5) fixed at the bottom, and the bottom of the pressure rods (5) is in contact with the side of the elastic buffer sheet (4). The lower end of the elastic buffer sheet (4) is provided with a through hole (6), and a support block (7) is slidably inserted in the through hole (6). The support block (7) is fixedly installed on the inner side wall of the groove (3). The outer wall of the probe base (1) is fixedly provided with a support frame (8), and the upper end of the support frame (8) is fixedly provided with a CCD detection camera (9).
2. The chip test probe positioning and calibration structure according to claim 1, characterized in that, The elastic buffer sheet (4) is arranged in a V-shape.
3. The chip test probe positioning and calibration structure according to claim 1, characterized in that, The support block (7) has a movable groove at its end. Both sides of the movable groove are slidably provided with a stop block (10). The stop block (10) covers the outside of the elastic buffer sheet (4). The inner wall of the movable groove is fixedly provided with a fixing plate (11). Both sides of the fixing plate (11) are fixedly provided with a sleeve (12). The sleeve rod (13) is slidably provided inside the sleeve (12). The sleeve rod (13) is fixedly connected to the stop block (10). The sleeve wall of the sleeve rod (13) is fitted with a spring (14). The two ends of the spring (14) are fixedly connected to the stop block (10) and the sleeve (12) respectively.
4. The chip test probe positioning and calibration structure according to claim 3, characterized in that, All of the aforementioned blocks (10) are wedge-shaped blocks, and have an inclined surface on the side away from the elastic buffer sheet (4).
5. The chip test probe positioning and calibration structure according to claim 1, characterized in that, The lower end of the test probe (2) is fixedly fitted with a movable limiting plate (15).
6. The chip test probe positioning and calibration structure according to claim 3, characterized in that, The outer wall of the stop (10) is fixedly provided with a pull plate (16), the end of the pull plate (16) passes through the moving groove and extends to the outside.