Circuit board structure with thermistor

Abstract

The utility model discloses a circuit board structure with thermistor, which comprises a circuit layer and a thermistor functional layer, the circuit layer is provided with a through hole, the thermistor functional layer is bonded together with the circuit layer through a heat-conducting silica gel layer, and the test port of the thermistor functional layer is electrically connected with the circuit layer at the through hole.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board structure with a thermistor. Background Technology

[0002] With the rapid development of electronic technology, NTC (negative temperature coefficient) thermistors have been widely used in temperature monitoring, control and other fields. Traditional NTC thermistors are mostly rigid structures, and their integration with flexible printed circuit boards (FPCs) is mostly achieved through methods such as through-hole insertion, surface mounting and soldering.

[0003] However, the above connection methods have problems such as complicated operation, easy connection failure, and poor resistance to bending.

[0004] The above content is only used to help understand the technical solution of this utility model and does not represent an admission that the above content is prior art. Utility Model Content

[0005] The main objective of this invention is to provide a circuit board structure with a thermistor, which aims to solve the problems of complex operation, easy connection failure, and poor bending resistance in the existing combination of NTC thermistors and flexible circuit boards.

[0006] To achieve the above objectives, this utility model provides a circuit board structure with a thermistor, the circuit board structure with a thermistor comprising:

[0007] The circuit layer has through-holes; and,

[0008] The thermistor functional layer is bonded to the circuit layer via a thermally conductive silicone layer;

[0009] The test port of the thermistor functional layer is electrically connected to the circuit layer at the via.

[0010] Preferably, in the circuit board structure with thermistor, the thermistor functional layer includes a first conductive layer, an NTC circuit layer, and a first thin film layer stacked together in sequence.

[0011] Preferably, in the circuit board structure with thermistors, the thermistor functional layer has a serpentine or T-shaped first conductive layer and a serpentine or rectangular NTC circuit layer respectively formed by a combination of acidic and alkaline etching.

[0012] Preferably, in the circuit board structure with thermistor, the first conductive layer is formed into a serpentine or T-shape by acid etching;

[0013] The NTC circuit layer is formed into a serpentine or rectangular shape through alkaline etching.

[0014] Preferably, in the circuit board structure with thermistors, there are multiple circuit layers and at least one thermistor functional layer;

[0015] At least one thermistor functional layer is located between multiple circuit layers.

[0016] Preferably, in the circuit board structure with thermistors, a protective film layer is provided on the outermost circuit layer, and the protective film layer is bonded together with the adjacent circuit layer.

[0017] Preferably, in the circuit board structure with thermistor, the protective film layer is made of the same material as the thin film layer of the thermistor functional layer and the circuit layer.

[0018] Preferably, in the circuit board structure with thermistor, the number of the circuit layer is one, and the number of thermistor functional layers is at least one;

[0019] At least one thermistor functional layer is disposed on the surface of the circuit layer.

[0020] Preferably, in the circuit board structure with thermistor, both the outermost circuit board structure and the outermost thermistor functional layer are provided with a protective film layer, which is bonded to the adjacent circuit layer or thermistor functional layer.

[0021] Preferably, in the circuit board structure with thermistor, the protective film layer is made of the same material as the thin film layer of the thermistor functional layer and the circuit layer.

[0022] This utility model has at least the following beneficial effects:

[0023] The circuit board structure with a thermistor provided by this utility model has the thermistor functional layer and the circuit layer bonded together by a thermally conductive silicone layer, which facilitates the combination of the thermistor functional layer with any circuit layer, and is simple to operate, more stable in connection and less prone to failure, and resistant to bending.

[0024] Furthermore, by forming the first conductive layer and the NTC circuit layer into serpentine, T-shaped, or rectangular shapes, the bending resistance of the circuit board structure can be enhanced. Attached Figure Description

[0025] Figure 1 A schematic diagram of the circuit board structure with a thermistor provided by this utility model in the first embodiment;

[0026] Figure 2 A schematic diagram of the circuit board structure with a thermistor provided by this utility model in a second embodiment;

[0027] Figure 3 A structural diagram of an embodiment of the thermistor functional layer provided by this utility model;

[0028] Figure 4 A schematic diagram of an embodiment of the thermistor functional layer provided by this utility model when forming a serpentine electrode;

[0029] Figure 5 A schematic diagram of another embodiment of the thermistor functional layer provided by this utility model when forming a serpentine electrode;

[0030] Figure 6 A schematic diagram of an embodiment of the thermistor functional layer provided by this utility model when forming an I-shaped electrode;

[0031] Figure 7 This is a schematic diagram of another embodiment of the thermistor functional layer provided by this utility model when forming an I-shaped electrode;

[0032] Figure 8 This is a schematic diagram of an embodiment of the circuit layer provided by this utility model.

[0033] Reference numerals in the drawings of this utility model:

[0034] 100 - Circuit board structure with thermistor, 1 - Circuit layer, 11 - Through hole, 1a - First flexible circuit layer, 1a1 - First protective film layer, 1a2 - Second conductive layer, 1a3 - Second thin film layer, 1a4 - First adhesive layer, 1b - Second flexible circuit layer, 1b1 - Third conductive layer, 1b2 - Third thin film layer, 1b3 - Fourth conductive layer, 1b4 - Second protective film layer, 2 - Thermistor functional layer, 21 - Third protective film layer, 22 - First conductive layer, 23 - NTC circuit layer, 24 - First thin film layer, 3 - Thermally conductive silicone layer.

[0035] The purpose, features, and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0036] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The present utility model will be described in detail below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0037] In this embodiment of the invention, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0038] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0039] In this embodiment of the invention, the term "multiple" refers to two or more, and other quantifiers are similar.

[0040] In this utility model, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0041] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the various embodiments of this utility model will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details are provided in the various embodiments of this utility model to facilitate a better understanding of the invention. However, the technical solutions claimed by this utility model can be implemented even without these technical details and various variations and modifications based on the following embodiments. The division of the various embodiments below is for ease of description and should not constitute any limitation on the specific implementation of this utility model. The various embodiments can be combined with and referenced by each other without contradiction.

[0042] Figure 1 and Figure 2 A schematic diagram of the circuit board structure with a thermistor provided by this utility model is shown below. Figure 1 and Figure 2 This utility model provides a circuit board structure 100 with a thermistor. The circuit board structure 100 includes a circuit layer 1 and a thermistor functional layer 2. The circuit layer 1 has a through-hole 11. The thermistor functional layer 2 is bonded to the circuit layer 1 by a thermally conductive silicone layer 3. The test port of the thermistor functional layer 2 is electrically connected to the circuit layer 1 at the through-hole 11.

[0043] The circuit board structure 100 with a thermistor provided by this utility model has the thermistor functional layer 2 and the circuit layer 1 bonded together by a thermally conductive silicone layer 3, which makes it easy for the thermistor functional layer 2 to be combined with any circuit layer 1, and the operation is simple, the connection is more stable and not easy to fail, and it is resistant to bending.

[0044] It should be noted that both the outermost circuit board structure 100 and the outermost thermistor functional layer 2 are provided with a protective film layer, which is bonded to the adjacent circuit layer 1 or thermistor functional layer 2.

[0045] In some embodiments, the thermistor functional layer 2 may be embedded between multiple circuit layers 1. Specifically, there are multiple circuit layers 1, and at least one thermistor functional layer 2; at least one thermistor functional layer 2 is disposed between multiple circuit layers 1. Connections between different layers are achieved through a thermally conductive silicone layer 3. The test port of the thermistor functional layer 2 can be connected to the conductive layer of the circuit layer 1 by plating a conductive layer (e.g., copper plating) at blind or through holes. Taking a circuit board structure 100 including a first flexible circuit layer 1a, at least one thermistor functional layer 2, and a second flexible circuit layer 1b as an example, the test port of the thermistor functional layer 2 can be connected to the conductive layer of the first flexible circuit layer 1a or the second flexible circuit layer 1b by plating a conductive layer at blind or through holes.

[0046] like Figure 1 As shown, taking a circuit board structure 100 including a first flexible circuit layer 1a, a thermistor functional layer 2, and a second flexible circuit layer 1b as an example, the first flexible circuit layer 1a includes a first protective film layer 1a1, a second conductive layer 1a2, and a second thin film layer 1a3 stacked vertically. The second flexible circuit layer 1b includes a third conductive layer 1b1, a third thin film layer 1b2, a fourth conductive layer 1b3, and a second protective film layer 1b4 stacked vertically. The thermistor functional layer 2 includes a first conductive layer 22, an NTC circuit layer 23, and a first thin film layer 24 stacked vertically. The first protective film layer 1a1 is bonded to the second conductive layer 1a2, and the fourth conductive layer 1b3 is bonded to the second protective film layer 1b4, respectively, by an adhesive layer (which can be a thermally conductive silicone layer 3). The second thin film layer 1a3 is bonded to the first conductive layer 22 by a thermally conductive silicone layer 3. The first thin film layer 24 is bonded to the third conductive layer 1b1 by a thermally conductive silicone layer 3.

[0047] In some other embodiments, the thermistor functional layer 2 may be disposed on the surface of the circuit layer 1. Specifically, there is one circuit layer 1 and at least one thermistor functional layer 2; at least one thermistor functional layer 2 is disposed on the surface of the circuit layer 1. The thermistor functional layer 2 is attached to the flexible circuit layer via a thermally conductive silicone layer 3. The test port of the thermistor functional layer 2 can be connected to the conductive layer of the circuit layer 1 by plating a conductive layer (e.g., copper) at the via.

[0048] like Figure 2 As shown, taking a circuit board structure 100 including a thermistor functional layer 2 and a flexible circuit board layer as an example, the flexible circuit board layer includes a third conductive layer 1b1, a third thin film layer 1b2, a fourth conductive layer 1b3, and a second protective film layer 1b4 stacked vertically. The thermistor functional layer 2 includes a third protective film layer 21, a first conductive layer 22, an NTC circuit layer 23, and a first thin film layer 24 stacked vertically. The third protective film layer 21 and the first conductive layer 22, and the fourth conductive layer 1b3 and the second protective film layer 1b4 are respectively bonded together by an adhesive layer (which can be a thermally conductive silicone layer 3). The first thin film layer 24 and the third conductive layer 1b1 are bonded together by a thermally conductive silicone layer 3.

[0049] Figure 3 This diagram illustrates the structure of one embodiment of the thermistor functional layer 2 provided by this invention. Please refer to [link / reference]. Figure 3 The thermistor functional layer 2 includes a first conductive layer 22, an NTC circuit layer 23, and a first thin film layer 24 stacked sequentially. To further improve the bending resistance and other properties of the circuit board structure 100, the thermistor functional layer 2 provided by this invention obtains the first conductive layer 22 and the NTC circuit layer 23 through differentiated etching methods. Specifically, the thermistor functional layer 2 is formed by a combination of acidic and alkaline etching, resulting in a serpentine or T-shaped first conductive layer 22 and a serpentine or rectangular NTC circuit layer 23. More specifically, the differentiated etching methods for the thermistor functional layer 2 include acidic etching of the first conductive layer 22, etching of the NTC circuit layer 23, and alkaline etching that removes only the conductive layer while retaining the NTC circuit layer 23.

[0050] In some embodiments, the first conductive layer 22 is formed into a serpentine or T-shape by acid etching; the NTC circuit layer 23 is formed into a serpentine or rectangular shape by alkaline etching. Of course, in other embodiments, the first conductive layer 22 and the NTC circuit layer 23 can also be formed into other shapes. By forming the first conductive layer 22 and the NTC circuit layer 23 into serpentine, T-shaped, rectangular, or other shapes, the bending resistance of the circuit board structure 100 can be enhanced.

[0051] Figure 4 and Figure 5This diagram illustrates the formation of the serpentine electrode in the thermistor functional layer 2. Figure 4 As shown, in some embodiments, the first conductive layer 22 forms a serpentine electrode, and the NTC circuit layer 23 forms a serpentine NTC circuit layer 23. For example... Figure 5 As shown, in some other embodiments, the first conductive layer 22 may form a serpentine electrode, and the NTC circuit layer 23 may form a rectangular NTC circuit layer 23.

[0052] Figure 6 and Figure 7 This diagram illustrates the formation of the I-shaped electrode in the thermistor functional layer 2. (See attached diagram.) Figure 6 As shown, in some embodiments, the first conductive layer 22 forms a T-shaped electrode, and the NTC circuit layer 23 forms a rectangular NTC circuit layer 23. For example... Figure 7 As shown, in some other embodiments, the first conductive layer 22 may form a T-shaped electrode, and the NTC circuit layer 23 may form a serpentine NTC circuit layer 23.

[0053] The thermistor functional layer 2 is formed by combining acid and alkaline etching to form a serpentine or T-shaped first conductive layer 22 and a serpentine or rectangular NTC circuit layer 23, respectively.

[0054] In some embodiments, the NTC circuit layer 23 can be prepared by magnetron sputtering a ceramic thin film containing Mn, Co, Ni, and O on the first conductive layer 22. The first conductive layer 22 is serpentine or T-shaped, and the NTC circuit layer 23 is serpentine or rectangular, respectively, by combining acid and alkaline etching, which can effectively reduce the problem of the ceramic thin film being not resistant to bending.

[0055] In some embodiments, the thin film layer of the thermistor functional layer 2 and the thin film layer of the circuit layer 1 are bonded to it by lamination. For example, the first thin film layer 24 of the thermistor functional layer 2 is bonded to the first conductive layer 22 / NTC circuit layer 23 by lamination (e.g., hot pressing), which can effectively reduce the problem of poor bonding force between the NTC circuit layer 23 and the first thin film layer 24.

[0056] It is worth noting that the thin film layers mentioned in this invention (including the first thin film layer 24, the second thin film layer 1a3, and the third thin film layer 1b2) may be, but are not limited to, PI layers. Furthermore, the thermal expansion coefficients of the thermally conductive silicone layer 3, the thin film layers, and the NTC circuit layer 23 are matched, thus preventing lamination stress cracking.

[0057] In some embodiments, the protective film layer mentioned in this invention (including the first protective film layer 1a1, the second protective film layer 1b4, and the third protective film layer 21) can be made of the same material as the thin film layer of the thermistor functional layer 2 and the circuit layer 1. This can ensure the flexibility of the circuit board structure 100 and also have the same coefficient of thermal expansion as the thin film layer of the thermistor functional layer 2 and the circuit layer, thus avoiding lamination stress cracking.

[0058] In addition, in some embodiments, the circuit layer can be any single or multi-layer flexible circuit board, and may include, but is not limited to, a conductive layer, a thin film layer, a thermally conductive silicone layer, and a protective film layer. Figure 8 A schematic diagram illustrating an embodiment of the circuit layer provided by this utility model is shown. For example... Figure 8 As shown, the circuit layer includes a first protective film layer 1a1, a first adhesive layer 1a4, a second conductive layer 1a2, a second thin film layer 1a3, and a thermally conductive silicone layer 3, which are stacked sequentially. The first adhesive layer 1a4 may, but is not limited to, be made of the same material as the thermally conductive silicone layer 3. In some embodiments, test ports can be set according to different functional testing requirements, by creating windows in the first protective film layer 1a1 and the first adhesive layer 1a4, and then applying chemical nickel-gold plating to the second conductive layer 1a2. When the circuit layer is a multi-layered flexible circuit board, conventional laser-drilled vias or blind vias followed by conductive metal plating can be used, which will not be detailed here.

[0059] In the description of this specification, references to terms such as "this embodiment," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0060] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0061] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, those skilled in the art can make other variations or modifications without creative effort, and all such variations or modifications should fall within the protection scope of this utility model.

Claims

1. A circuit board structure with a thermistor, characterized in that, include: The circuit layer has through-holes; and, The thermistor functional layer is bonded to the circuit layer via a thermally conductive silicone layer; The test port of the thermistor functional layer is electrically connected to the circuit layer at the via.

2. The circuit board structure with a thermistor as described in claim 1, characterized in that, The thermistor functional layer includes a first conductive layer, an NTC circuit layer, and a first thin film layer stacked together in sequence.

3. The circuit board structure with a thermistor as described in claim 2, characterized in that, The thermistor functional layer has a serpentine or T-shaped first conductive layer and a serpentine or rectangular NTC circuit layer, respectively, formed by a combination of acidic and alkaline etching.

4. The circuit board structure with a thermistor as described in claim 3, characterized in that, The first conductive layer is formed into a serpentine or T-shape by acid etching; The NTC circuit layer is formed into a serpentine or rectangular shape through alkaline etching.

5. The circuit board structure with a thermistor as described in claim 1, characterized in that, The number of the circuit layers is multiple, and the number of the thermistor functional layers is at least one; At least one thermistor functional layer is located between multiple circuit layers.

6. The circuit board structure with a thermistor as described in claim 5, characterized in that, The outermost circuit layer is provided with a protective film layer, which is bonded to the adjacent circuit layer.

7. The circuit board structure with a thermistor as described in claim 6, characterized in that, The protective film layer is made of the same material as the thin film layer of the thermistor functional layer and the circuit layer.

8. The circuit board structure with a thermistor as described in claim 1, characterized in that, The number of the circuit layer is one, and the number of the thermistor functional layer is at least one; At least one thermistor functional layer is disposed on the surface of the circuit layer.

9. The circuit board structure with a thermistor as described in claim 8, characterized in that, Both the outermost circuit board structure and the outermost thermistor functional layer are provided with a protective film layer, which is bonded to the adjacent circuit layer or thermistor functional layer.

10. The circuit board structure with a thermistor as described in claim 9, characterized in that, The protective film layer is made of the same material as the thin film layer of the thermistor functional layer and the circuit layer.

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