Wafer box clamping structure

Abstract

The utility model relates to the technical field of semiconductor processing equipment, especially a wafer box clamping structure, including clamping box, alignment component is connected in the sliding to clamping box, at least two along the same direction sliding connection in the two sides of clamping box's clamping claw, the drive assembly for driving the synchronous reverse movement of the clamping claw of clamping box two sides and the detection assembly for detecting whether the clamping claw is synchronous clamping wafer box, the alignment component is provided with the alignment part of the recess cavity adaptation with wafer box top end, the clamping claw is provided with the clamping part of the clamping cavity adaptation on wafer box, when the alignment part and recess cavity cooperate, drive assembly drives the clamping claw and moves to the required position, when the clamping claw synchronous clamping wafer box, realize the stable clamping of wafer box, the utility model realizes the stable clamping of wafer box to accurate clamping wafer box, prevents wafer box inclination or positioning deviation, guarantees wafer processing accuracy.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, and in particular to a wafer box clamping structure. Background Technology

[0002] In semiconductor manufacturing, wafer cassettes are key carriers for holding and transporting wafers. Their clamping accuracy is crucial to process stability, yield, and equipment safety. Currently, wafer cassette clamping is usually achieved by grippers, which are symmetrically distributed on both sides of the wafer cassette. When the grippers extend into the clamping cavity of the wafer cassette, they clamp the wafer cassette, thus enabling smooth handling of the wafer cassette.

[0003] However, due to the asynchronous operation of the grippers holding the two ends of the wafer cassette, such as when one side of the gripper is in contact with the wafer cassette while the other side is suspended, the wafer cassette is subjected to uneven force, which causes the wafer cassette to tilt or shift in position, affecting the wafer processing accuracy. Utility Model Content

[0004] This invention addresses the shortcomings of existing technologies by providing a wafer cassette clamping structure that enables stable clamping of the wafer cassette, thereby accurately clamping the wafer cassette, preventing wafer cassette tilting or positioning deviation, and ensuring wafer processing accuracy.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] This utility model provides a wafer cassette clamping structure, including a clamping box, an alignment member slidably connected to the clamping box, at least two clamping claws slidably connected to both sides of the clamping box in the same direction, a driving component for driving the clamping claws on both sides of the clamping box to move synchronously in opposite directions, and a detection component for detecting whether the clamping claws are synchronously clamping the wafer cassette. The alignment member is provided with an alignment part adapted to the cavity at the top of the wafer cassette, and the clamping claws are provided with clamping parts adapted to the clamping cavity on the wafer cassette.

[0007] When the alignment part engages with the cavity, the drive assembly moves the clamping claws to the desired position. When the clamping claws simultaneously clamp the wafer cassette, the wafer cassette is stably clamped.

[0008] The detection component includes several detection components that are installed one-to-one with the clamping claws. When the detection components simultaneously detect that the clamping claws are clamping the wafer cassette, the clamping claws can synchronously clamp the wafer cassette.

[0009] The detection component includes a detection element hinged to the clamping jaw at one end, a detection switch mounted on the clamping jaw, a detection part disposed on the detection element, and a reset component connected to the clamping jaw and the detection element, wherein the detection part corresponds to the detection switch;

[0010] When the clamping jaw moves to the desired position in the clamping cavity, the detection piece is squeezed by the clamping cavity and the reset component is in a compressed state, so that the detection part is separated from the detection switch. Then the clamping jaw continues to move to the clamping cavity so that the clamping part engages with the clamping cavity.

[0011] When the detection unit and the detection switch are separated at the same time, the clamping claws can simultaneously clamp the wafer cassette.

[0012] The detection element is provided with a guide surface. When the clamping claw moves to the desired position in the clamping cavity, the inner wall of the clamping cavity squeezes the detection element along the guide surface.

[0013] The clamping part is provided with a clamping surface, and when the clamping part is engaged with the clamping cavity, the clamping surface is flush with the guide surface.

[0014] The clamping box is equipped with at least two through-beam sensors, and the alignment member is provided with a blocking part;

[0015] When the alignment part contacts the cavity and is pushed upward a certain distance, the blocking part blocks one of the through-beam sensors.

[0016] When the alignment part is inserted into the cavity, the blocking part blocks at least two through-beam sensors.

[0017] The wafer cassette has several limiting grooves circumferentially, and the clamping claw has a limiting part. When the clamping part is engaged with the clamping cavity, the limiting part is engaged with the limiting groove.

[0018] A return spring is connected between the alignment member and the clamping box, and the return spring is compressed when the alignment part is pressed by the wafer box.

[0019] The clamping claw is equipped with a clamping seat, the detection component is provided with a receiving groove, and the two ends of the reset component are respectively connected to the inner walls of the clamping seat and the receiving groove; when the clamping part cooperates with the clamping cavity, the top surface of the clamping seat abuts against the inner wall of the receiving groove.

[0020] The clamping base is provided with an installation hole, the receiving groove is provided with a storage hole, the two ends of the reset component are respectively located in the installation hole and the storage hole, and the installation hole corresponds to the storage hole when the clamping part is engaged with the clamping cavity.

[0021] The clamping claw is provided with an abutting part. When the clamping part is engaged with the clamping cavity, one side of the abutting part abuts against the outside of the wafer cassette.

[0022] The contact portion is provided with a hidden hole, and the detection portion passes through the hidden hole.

[0023] The beneficial effects of this utility model are:

[0024] In practical applications, the clamping box is moved by an external device. When the alignment part mates with the cavity, the clamping box and the wafer cassette are centered. The driving component moves the clamping claws towards each other to the desired position. During the movement of the clamping claws, the detection component detects whether the clamping claws are simultaneously clamping both sides of the wafer cassette. If the detection shows that the clamping claws cannot simultaneously clamp both sides of the wafer cassette, that is, one side of the wafer cassette is in contact with the wafer cassette while the other side is suspended, the wafer cassette is subjected to uneven clamping force, so the wafer cassette is removed and awaits subsequent manual processing or correction. When the clamping claws can simultaneously clamp both sides of the wafer cassette, the wafer cassette is stably clamped, thereby accurately clamping the wafer cassette, preventing the wafer cassette from tilting or positioning deviation, and ensuring the accuracy of wafer processing. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural diagram of the wafer box clamping structure.

[0026] Figure 2 This is a three-dimensional view of a partial structure of a wafer cassette.

[0027] Figure 3 This is a cross-sectional view of the connection structure between the clamping box and the wafer box.

[0028] Figure 4 Exploded view of the installation structure for inspecting components.

[0029] Figure 5 This is a cross-sectional view of the installation structure for inspecting components.

[0030] 01. Wafer box; 011. Cavity; 012. Clamping cavity; 013. Limiting groove;

[0031] 1. Clamping box;

[0032] 2. Alignment component; 21. Alignment part; 22. Blocking part;

[0033] 3. Clamping claw; 31. Clamping part; 311. Clamping surface; 32. Limiting part; 33. Abutting part; 331. Concealed hole;

[0034] 4. Driver components;

[0035] 5. Inspect components;

[0036] 51. Inspection component; 511. Guide surface; 512. Receiving groove; 513. Storage hole;

[0037] 52. Detection switch; 53. Detection unit; 54. Reset component;

[0038] 6. Through-beam sensor; 7. Return spring; 8. Clamping seat; 81. Mounting hole. Detailed Implementation

[0039] To facilitate understanding by those skilled in the art, the present invention will be further described below in conjunction with embodiments and accompanying drawings. Specific embodiments of the present invention will be described below. It should be noted that, in order to provide a concise description of these embodiments, this specification cannot provide a detailed description of all features of the actual embodiments.

[0040] refer to Figure 1 As shown, this utility model provides a wafer cassette clamping structure, including a clamping box 1, an alignment member 2 slidably connected to the clamping box 1, at least two clamping claws 3 slidably connected to both sides of the clamping box 1 in the same direction, a driving component 4 for driving the clamping claws 3 on both sides of the clamping box 1 to move synchronously in opposite directions, and a detection component for detecting whether the clamping claws 3 synchronously clamp the wafer cassette 01; Reference Figure 2 , 3 As shown in Figures 4 and 5, the alignment member 2 is provided with an alignment portion 21 adapted to the cavity 011 at the top of the wafer cassette 01, and the clamping claw 3 is provided with a clamping portion 31 adapted to the clamping cavity 012 on the wafer cassette 01; Reference Figure 1 , 3 As shown, in practical applications, the clamping box 1 is moved by an external device. When the alignment part 21 engages with the cavity 011, the clamping box 1 and the wafer cassette 01 are centered. The clamping claws 3 are moved to the desired position by the drive component 4. The drive component 4 uses a clamping claw cylinder to achieve synchronous clamping of both sides of the wafer cassette 01. During the movement of the clamping claws 3, the detection component detects whether the clamping claws 3 synchronously clamp both sides of the wafer cassette 01. When it is detected that the clamping claws 3 cannot synchronously clamp both sides of the wafer cassette 01, that is, when one side of the clamping claw of the wafer cassette 01 is in contact with the wafer cassette 01, the other side is suspended. The clamping force of the wafer cassette 01 is uneven, so the wafer cassette 01 is removed and awaits subsequent manual processing or correction. When the clamping claws 3 can synchronously clamp both sides of the wafer cassette 01, the wafer cassette 01 is stably clamped, thereby accurately clamping the wafer cassette 01, preventing the wafer cassette 01 from tilting or positioning deviation, and ensuring the wafer processing accuracy.

[0041] refer to Figure 1 , 5 As shown in this embodiment, the detection component includes several detection components 5 that are installed one-to-one with the clamping claws 3. When the detection components 5 simultaneously detect that the clamping claws 3 are clamping the wafer cassette 01, the clamping claws 3 synchronously clamp the wafer cassette 01, thereby achieving stable clamping of the wafer cassette 01, accurately clamping the wafer cassette 01, preventing the wafer cassette 01 from tilting or deviating in positioning, and ensuring the accuracy of wafer processing.

[0042] refer to Figure 1 , 4As shown in Figure 5, in this embodiment, the detection component 5 includes a detection element 51 with one end hinged to the clamping claw 3, a detection switch 52 installed on the clamping claw 3, a detection part 53 disposed on the detection element 51, and a reset component 54 connected to the clamping claw 3 and the detection element 51. The detection part 53 corresponds to the detection switch 52. In actual application, the clamping claw 3 is moved by the driving component 4. When the clamping claw 3 moves to the desired position in the clamping cavity 012, the detection element 51 is squeezed by the clamping cavity 012 and the reset component 54 is in a compressed state, so that the detection part 53 is separated from the detection switch 52. Then the clamping claw 3 continues to move to the clamping cavity 012 so that the clamping part 31 cooperates with the clamping cavity 012. When the detection part 53 and the detection switch 52 are separated at the same time, the clamping claw 3 synchronously clamps the wafer cassette 01, preventing the wafer cassette 01 from tilting or deviating in positioning, and ensuring the wafer processing accuracy.

[0043] refer to Figure 4 , 5 As shown, in this embodiment, the detection element 51 is provided with a guide surface 511. When the clamping claw 3 moves to the desired position in the clamping cavity 012, the inner wall of the clamping cavity 012 presses the detection element 51 along the guide surface 511. The clamping part 31 is provided with a clamping surface 311. When the clamping part 31 cooperates with the clamping cavity 012, the clamping surface 311 is flush with the guide surface 511. By making the clamping surface 311 flush with the guide surface 511, the contact triggering conditions between the clamping claw 3 and the wafer cassette 01 are kept strictly consistent. This geometric consistency can ensure that the detection switches 52 of multiple clamping claws 3 are triggered synchronously, avoiding misjudgment caused by differences in contact time. Furthermore, through two flush planes, the clamping claw 3 can still automatically correct its trajectory through the guide surface 511 when there is a slight positional deviation, successfully correcting the positioning error of the clamping claw 3, reducing the positioning accuracy requirements of the wafer cassette 01. This can reduce the probability of clamping failure due to vibration or inertia in high-speed automated scenarios.

[0044] refer to Figure 1 , 3As shown, in this embodiment, the clamping box 1 is equipped with at least two through-beam sensors 6, and the alignment member 2 is provided with a blocking part 22. In actual application, each through-beam sensor 6 includes a transmitting end and a receiving end. When the blocking part 22 blocks the light beam transmission between the transmitting end and the receiving end, it is detected that the blocking part 22 has moved to a set position. When the alignment part 21 contacts the cavity 011 and the alignment part 21 is pushed upward a certain distance, the blocking part 22 blocks one of the through-beam sensors 6, which can reduce the moving speed of the clamping box 1 towards the wafer cassette 01, realize the pre-positioning of the alignment part 21 and the wafer cassette 01, facilitate the slow positioning of the wafer cassette 01, reduce the impact between the wafer cassette 01 and the clamping box 1, and facilitate the stable positioning of the wafer cassette 01. When the alignment part 21 is inserted into the cavity 011, the blocking part 22 blocks at least two through-beam sensors 6, the clamping box 1 stops moving, and the relative position of the wafer cassette 01 and the clamping box 1 is determined, which facilitates the drive component 4 to drive the clamping claw 3 to clamp the wafer cassette 01.

[0045] refer to Figure 2 , 4 As shown, in this embodiment, the wafer cassette 01 is provided with a plurality of limiting grooves 013 in the circumferential direction, and the clamping claw 3 is provided with a limiting part 32. When the clamping part 31 cooperates with the clamping cavity 012, the limiting part 32 cooperates with the limiting groove 013. In actual application, the limiting groove 013 is triangular. When the limiting part 32 cooperates with the limiting groove 013, the width of the space is gradually compressed and narrowed, so that the tip of the limiting groove 013 and the limiting part 32 gradually approach each other until they merge, which facilitates the quick adaptation of the limiting part 32 and the limiting groove 013 and restricts the horizontal relative rotation of the wafer cassette 01 and the clamping box 1.

[0046] refer to Figure 3 As shown, in this embodiment, a reset spring 7 is connected between the alignment member 2 and the clamping box 1. When the alignment part 21 is squeezed by the wafer box 01, the reset spring 7 is compressed. When the alignment part 21 loses the squeezing of the wafer box 01, it can smoothly return to the initial position, accurately position each wafer box 01, and improve the reuse rate.

[0047] refer to Figure 4 , 5 As shown, in this embodiment, the clamping claw 3 is equipped with a clamping seat 8, the detection element 51 is provided with a receiving groove 512, and the two ends of the reset component 54 are respectively connected to the inner walls of the clamping seat 8 and the receiving groove 512; when the clamping part 31 cooperates with the clamping cavity 012, the top surface of the clamping seat 8 abuts against the inner wall of the receiving groove 512, which facilitates determining the position of the clamping seat 8 when the wafer cassette 01 is accurately gripped, and is conducive to reuse; the reset component 54 is a telescopic spring, which facilitates the reset of the detection element 51.

[0048] refer to Figure 4 , 5As shown, in this embodiment, the clamping seat 8 is provided with a mounting hole 81, the receiving groove 512 is provided with a storage hole 513, and the two ends of the reset component 54 are respectively located in the mounting hole 81 and the storage hole 513. When the clamping part 31 cooperates with the clamping cavity 012, the mounting hole 81 corresponds to the storage hole 513. The reset component 54 is hidden inside the clamping seat 8 and the detection component 51 through the mounting hole 81 and the storage hole 513, providing an independent space for the reset component 54 to be installed, avoiding resistance caused by the extension and retraction of the reset component 54 and the movement of the clamping seat 8, and the structure is compact.

[0049] refer to Figure 5 As shown, in this embodiment, the clamping claw 3 is provided with an abutment portion 33. When the clamping portion 31 cooperates with the clamping cavity 012, one side of the abutment portion 33 abuts against the outer side of the wafer cassette 01, thereby achieving accurate positioning of the wafer cassette 01. The abutment portion 33 is provided with a hidden hole 331, and the detection portion 53 passes through the hidden hole 331. The structure is compact and facilitates the concealment of the detection component 51.

[0050] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.

Claims

1. A wafer cassette clamping structure, characterized in that, The device includes a clamping box (1), an alignment member (2) slidably connected to the clamping box (1), at least two clamping claws (3) slidably connected to both sides of the clamping box (1) in the same direction, a drive assembly (4) for driving the clamping claws (3) on both sides of the clamping box (1) to move synchronously in opposite directions, and a detection assembly for detecting whether the clamping claws (3) synchronously clamp the wafer cassette (01). The alignment member (2) is provided with an alignment part (21) adapted to the cavity (011) at the top of the wafer cassette (01), and the clamping claws (3) are provided with a clamping part (31) adapted to the clamping cavity (012) on the wafer cassette (01). When the alignment part (21) engages with the cavity (011), the drive assembly (4) drives the clamping claws (3) to move towards the desired position. When the clamping claws (3) simultaneously clamp the wafer cassette (01), the wafer cassette (01) is stably clamped.

2. The wafer cassette clamping structure according to claim 1, characterized in that, The detection component includes several detection components (5) that are installed one-to-one with the clamping claw (3). When the detection components (5) simultaneously detect that the clamping claw (3) is clamping the wafer cassette (01), the clamping claw (3) can simultaneously clamp the wafer cassette (01).

3. The wafer cassette clamping structure according to claim 2, characterized in that, The detection component (5) includes a detection element (51) hinged to the clamping claw (3) at one end, a detection switch (52) installed on the clamping claw (3), a detection part (53) provided on the detection element (51), and a reset component (54) connected to the clamping claw (3) and the detection element (51). The detection part (53) corresponds to the detection switch (52). When the clamping claw (3) moves to the desired position in the clamping cavity (012), the detection element (51) is squeezed by the clamping cavity (012) and the reset component (54) is in a compressed state, so that the detection part (53) is separated from the detection switch (52). Then the clamping claw (3) continues to move to the clamping cavity (012) so that the clamping part (31) cooperates with the clamping cavity (012). When the detection unit (53) and the detection switch (52) are separated at the same time, the clamping claw (3) can simultaneously clamp the wafer box (01).

4. The wafer cassette clamping structure according to claim 3, characterized in that, The detection element (51) is provided with a guide surface (511). When the clamping claw (3) moves to the desired position in the clamping cavity (012), the inner wall of the clamping cavity (012) squeezes the detection element (51) along the guide surface (511). The clamping part (31) is provided with a clamping surface (311), and when the clamping part (31) cooperates with the clamping cavity (012), the clamping surface (311) is flush with the guide surface (511).

5. The wafer cassette clamping structure according to claim 1, characterized in that, The clamping box (1) is equipped with at least two through-beam sensors (6), and the alignment member (2) is provided with a blocking part (22). When the alignment part (21) contacts the cavity (011) and the alignment part (21) is pushed upward a certain distance, the blocking part (22) blocks one of the through-beam sensors (6). When the alignment part (21) is inserted into the recess (011), the blocking part (22) blocks at least two through-beam sensors (6).

6. The wafer cassette clamping structure according to claim 1, characterized in that, The wafer cassette (01) is provided with several limiting grooves (013) in the circumferential direction. The clamping claw (3) is provided with a limiting part (32). When the clamping part (31) cooperates with the clamping cavity (012), the limiting part (32) cooperates with the limiting groove (013).

7. The wafer cassette clamping structure according to claim 1, characterized in that, A reset spring (7) is connected between the alignment member (2) and the clamping box (1). The reset spring (7) is compressed when the alignment part (21) is pressed by the wafer box (01).

8. The wafer cassette clamping structure according to claim 4, characterized in that, The clamping claw (3) is equipped with a clamping seat (8), the detection component (51) is provided with a receiving groove (512), and the two ends of the reset component (54) are respectively connected to the inner walls of the clamping seat (8) and the receiving groove (512); when the clamping part (31) cooperates with the clamping cavity (012), the top surface of the clamping seat (8) abuts against the inner wall of the receiving groove (512).

9. The wafer cassette clamping structure according to claim 8, characterized in that, The clamping seat (8) is provided with an installation hole (81), the receiving groove (512) is provided with a storage hole (513), the two ends of the reset component (54) are respectively located in the installation hole (81) and the storage hole (513), and the installation hole (81) corresponds to the storage hole (513) when the clamping part (31) cooperates with the clamping cavity (012).

10. The wafer cassette clamping structure according to claim 3, characterized in that, The clamping claw (3) is provided with an abutment part (33). When the clamping part (31) cooperates with the clamping cavity (012), one side of the abutment part (33) abuts against the outside of the wafer cassette (01). The contact part (33) is provided with a hidden hole (331), and the detection part (53) passes through the hidden hole (331).

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