Sintered diamond grinding disc structure
By separating the sintered diamond grinding disc structure, the base and the substrate ring are separated and connected by pins, which solves the problems of high production difficulty and high cost caused by the integrated structure of the grinding disc, and realizes the manufacturing of grinding discs with high bonding strength and low cost.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIZHOU JIM COMPOSITE MATERIALS CO LTD
- Filing Date
- 2025-08-14
- Publication Date
- 2026-07-17
AI Technical Summary
The existing integrated structure of the grinding disc leads to high production difficulty and cost, unstable bonding strength, and high-temperature welding affects the performance of the sintered matrix.
The sintered diamond grinding disc structure adopts a separate design, with the base and substrate ring separated and connected by pins and coated with room temperature adhesive. After the blank is sintered and formed, it is assembled with the substrate to avoid high-temperature welding.
It improves the bonding strength between the grinding wheel substrate and the blank, reduces production difficulty and cost, enhances the chip removal and heat dissipation capabilities of the finished product, and improves the performance of the grinding disc.
Smart Images

Figure CN224509382U_ABST
Abstract
Claims
1. A sintered diamond grinding disc structure, comprising a base (1), characterized in that: A limiting groove (2) is provided on one side end face of the base (1), and a substrate ring (6) is fixedly placed inside the limiting groove (2). Multiple sets of blanks (9) are integrally sintered at one outer end of the substrate ring (6).
2. The sintered diamond grinding disc structure according to claim 1, characterized in that: The outer wall of the base (1) is provided with a first pin hole (3) that extends through the limiting groove (2), and the outer wall of the base ring (6) is provided with a second pin hole (8). A pin (11) is locked between the first pin hole (3) and the second pin hole (8).
3. The sintered diamond grinding disc structure according to claim 2, wherein: The surface of the pin (11) is coated with a room temperature adhesive, which is used to fill the gap between the pin (11) and the first pin hole (3) and the second pin hole (8).
4. The sintered diamond grinding disc structure according to claim 1, wherein: The outer end of the substrate ring (6) is integrally formed with a protrusion (7), and the blank (9) is sintered around the protrusion (7).
5. The sintered diamond grinding disc structure according to claim 4, wherein: The lower end of the blank (9) is sintered to form a coupling groove (10), which is in contact with the protrusion (7).
6. The sintered diamond grinding disc structure according to claim 1, wherein: One end of the base (1) is provided with a connection hole (4), which is used to connect an existing drive device.
7. The sintered diamond grinding disc structure according to claim 1, wherein: The outer wall of the base (1) has multiple sets of hollow sections (5) through which waste chips are discharged.