Packaging device with liquid cooling heat dissipation structure

Abstract

The utility model relates to a kind of encapsulation devices with liquid cooling heat dissipation structure.The encapsulation devices with liquid cooling heat dissipation structure include: substrate, including the front and back of opposite distribution along first direction;Chip, is attached on the front of the substrate, the chip includes the first surface towards the substrate and the second surface opposite with the first surface along the first direction;Liquid cooling heat dissipation structure, including upper cover, lower support and heat dissipation channel, the lower support is attached on the side of the chip and is connected with the end of the upper cover, the upper cover and the chip form the heat dissipation channel, and the heat dissipation channel is used to accommodate coolant.The utility model enhances the heat dissipation performance of chip.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a packaged device with a liquid cooling heat dissipation structure. Background Technology

[0002] Chips are crucial components in electronic devices, significantly impacting their performance. As electronic devices become increasingly functional, the demands on chip performance rise, leading to increased power consumption. This increased power consumption exacerbates the problem of chip overheating, which can cause chip burnout. Therefore, heat dissipation has become one of the bottlenecks restricting chip development.

[0003] When a chip doesn't reach 100% efficiency, power consumption is transferred as heat. The purpose of heat dissipation design in packaged devices is to ensure the chip has a low thermal resistance, increasing heat flow and maintaining the chip's operating temperature within an appropriate range to prevent burnout. Currently, heat in packaged devices is mainly generated at the interface, transferred upwards via the molding compound to the chip surface, and finally dissipated into the air through the heat sink. However, as chip functionality increases, the heat generated during operation also increases. Relying solely on heat sinks to dissipate heat is insufficient to effectively remove the heat generated by the chip, thus still affecting chip performance and, in severe cases, even causing burnout.

[0004] Therefore, improving the heat dissipation performance of chips in packaged devices, maintaining stable operation of chips within packaged devices, and preventing chips from burning out due to excessive temperature are urgent technical problems that need to be solved. Summary of the Invention

[0005] This invention provides a packaged device with a liquid cooling structure to improve the heat dissipation performance of the chip in the packaged device, maintain the stable operation of the chip in the packaged device, and prevent the chip from burning out due to excessive temperature.

[0006] According to some embodiments, this utility model provides a packaged device with a liquid cooling heat dissipation structure, comprising:

[0007] The substrate includes a front side and a back side that are distributed opposite to each other along a first direction;

[0008] A chip is mounted on the front side of the substrate, the chip including a first surface facing the substrate and a second surface opposite to the first surface along the first direction;

[0009] The liquid cooling structure includes an upper cover, a lower support, and a heat dissipation channel. The upper cover is located above the chip along the first direction. The lower support is attached to the side of the chip and connected to the end of the upper cover. The upper cover and the chip enclose each other to form the heat dissipation channel, and the heat dissipation channel is used to contain coolant.

[0010] In some embodiments, the liquid cooling structure further includes an inlet and an outlet formed by the upper cover and the lower support, and the heat dissipation channel is connected to both the inlet and the outlet.

[0011] In some embodiments, the surface of the top cover facing the chip has a central cavity and two end cavities distributed at opposite ends of the central cavity along a second direction, the central cavity communicating with the end cavities, and the second direction being parallel to the front side of the substrate;

[0012] The central cavity and the chip enclose each other to form the heat dissipation channel, and the two end cavities enclose each other with the lower support to form the liquid inlet and the liquid outlet, respectively.

[0013] In some embodiments, the width of the liquid inlet and the width of the liquid outlet are both smaller than the width of the heat dissipation channel.

[0014] In some embodiments, the projection of the heat dissipation channel onto the front side of the substrate at least completely covers the projection of the second surface of the chip onto the front side of the substrate.

[0015] In some embodiments, the coolant is deionized water.

[0016] In some embodiments, it also includes:

[0017] A barrier layer is applied to the second surface of the chip to prevent the coolant from penetrating the chip.

[0018] In some embodiments, the barrier layer is a metal material layer.

[0019] In some embodiments, the lower support is an injection molded part, which is distributed around the outer periphery of the chip and directly attached to the side of the chip.

[0020] In some embodiments, the central cavity has a first groove on its inner wall facing the chip, and the first groove communicates with the central cavity.

[0021] In some embodiments, the second surface of the chip has a second groove, and the second groove is in communication with the heat dissipation channel.

[0022] In some embodiments, the cross-sectional shape of the second groove is an arc, a quadrilateral, or a triangle.

[0023] In some embodiments, the central cavity has a first groove on its inner wall facing the chip, and the first groove communicates with the central cavity;

[0024] The second surface of the chip has a second groove, and the second groove is in communication with the heat dissipation channel.

[0025] In some embodiments, a plurality of first grooves are spaced apart along a second direction on the inner wall of the central cavity facing the chip, and a plurality of second grooves are spaced apart along a second direction on the second surface of the chip, the second direction being parallel to the front side of the substrate;

[0026] The plurality of first grooves and the plurality of second grooves are aligned one by one along the first direction.

[0027] In some embodiments, a plurality of first grooves are spaced apart along a second direction on the inner wall of the central cavity facing the chip, and a plurality of second grooves are spaced apart along a second direction on the second surface of the chip, the second direction being parallel to the front side of the substrate;

[0028] The second groove is aligned with the gap area between the two adjacent first grooves.

[0029] In some embodiments, the liquid cooling heat dissipation structure further includes:

[0030] An adhesive is located between the upper cover and the lower support member to connect the upper cover and the lower support member.

[0031] In some embodiments, the lower support member has a recess on its top surface facing the upper cover;

[0032] The top cover includes a lower surface facing the substrate and an upper surface opposite the lower surface along the first direction, and the lower surface of the top cover has a protrusion that engages with the recess.

[0033] This utility model provides a packaged device with a liquid cooling structure. By mounting a chip and the liquid cooling structure on the front side of a substrate, the liquid cooling structure includes an upper cover, a lower support, and a heat dissipation channel. The lower support is mounted on the side of the chip and connected to the end of the upper cover. The heat dissipation channel is located between the upper cover and the second surface of the chip and is used to contain coolant. The coolant provides liquid cooling to the chip, thereby enhancing the chip's heat dissipation performance, maintaining stable operation of the chip within the packaged device, and preventing chip burnout due to overheating. Furthermore, the heat dissipation channel is formed by the upper cover and the chip, which not only shortens the distance between the coolant and the chip, further improving the chip's heat dissipation efficiency, but also eliminates the need for an embedded channel within the upper cover, simplifying the manufacturing process of the upper cover and reducing the manufacturing cost of the packaged device with the liquid cooling structure. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0035] Figure 1 This is a schematic diagram of the first structure of the packaged device with a liquid cooling heat dissipation structure in a specific embodiment of this utility model;

[0036] Figure 2 yes Figure 1 A schematic diagram of the cross-section at position AA;

[0037] Figure 3 This is a schematic diagram of the structure of the upper cover facing the substrate in a specific embodiment of this utility model;

[0038] Figure 4 This is a schematic diagram of the second structure of the packaged device with a liquid cooling heat dissipation structure in a specific embodiment of this utility model;

[0039] Figure 5 This is a schematic diagram of the third structure of the packaged device with liquid cooling heat dissipation structure in a specific embodiment of this utility model;

[0040] Figure 6 This is a schematic diagram of the fourth structure of the packaged device with a liquid cooling heat dissipation structure in a specific embodiment of this utility model;

[0041] Figure 7 This is a schematic diagram of the fifth structure of the packaged device with a liquid cooling heat dissipation structure in a specific embodiment of this utility model;

[0042] Figure 8 This is a schematic diagram of the sixth structure of the packaged device with a liquid cooling heat dissipation structure in a specific embodiment of this utility model;

[0043] Figure 9 This is a seventh structural schematic diagram of a packaged device with a liquid cooling heat dissipation structure in a specific embodiment of this utility model;

[0044] Figure 10 yes Figure 9 An exploded view of a packaged device with a liquid cooling structure. Detailed Implementation

[0045] The following detailed description, in conjunction with the accompanying drawings, illustrates the specific embodiments of the packaging device with a liquid cooling heat dissipation structure provided by this utility model.

[0046] This specific embodiment provides a packaged device with a liquid cooling heat dissipation structure. Figure 1 This is a schematic diagram of the first structure of the packaged device with a liquid cooling heat dissipation structure in a specific embodiment of this utility model. Figure 2 yes Figure 1 A cross-sectional diagram at position AA. Figure 3 This is a schematic diagram of the structure of the upper cover facing the substrate in a specific embodiment of this utility model. For example... Figure 1 , Figure 2 and Figure 3 As shown, the packaged device with a liquid-cooled heat dissipation structure includes:

[0047] The substrate 10 includes a front side 101 and a back side 102 that are relatively distributed along a first direction D1;

[0048] Chip 11 is mounted on the front side 101 of the substrate 10. Chip 11 includes a first surface facing the substrate 10 and a second surface opposite to the first surface along the first direction D1.

[0049] The liquid cooling structure includes an upper cover 12, a lower support 13, and a heat dissipation channel 17. The upper cover 12 is located above the chip 11 along the first direction D1. The lower support 13 is attached to the side of the chip 11 and connected to the end of the upper cover 12. The upper cover 12 and the chip 11 enclose each other to form the heat dissipation channel 17, and the heat dissipation channel 17 is used to contain coolant.

[0050] For example, the substrate 10 may be, but is not limited to, a PCB circuit board. The substrate 10 includes a front side 101 and a back side 102 that are distributed opposite to each other along the first direction D1, and the substrate 10 has a high-density wiring layer inside. The chip 11 is mounted on the front side 101 of the substrate 10, and the chip 11 includes a first surface facing the substrate 10 and a second surface opposite to the first surface along the first direction D1. In one example, the first surface of the chip 11 is the functional surface of the chip 11, that is, the chip 11 is flip-chip mounted on the front side 101 of the substrate 10. The first surface of the chip 11 has a plurality of conductive bumps 15, and one end of the conductive bumps 15 is electrically connected to the chip 11, and the other end is electrically connected to the high-density wiring layer in the substrate 10. A plurality of solder balls 16 are spaced apart on the back surface 102 of the substrate. The solder balls 16 are electrically connected to the high-density wiring layer inside the substrate 10, thereby enabling the transmission of control signals to the chip 11 or the extraction of signals from the chip 11 through the solder balls 16 and the conductive bumps 15. An underfill adhesive 14 is also filled between the chip 11 and the substrate 10 to enhance the connection strength between the chip 11 and the substrate 10.

[0051] The liquid cooling structure is disposed on the front side 101 of the substrate 10. The top end of the lower support member 13 in the liquid cooling structure is connected to the end of the upper cover 12, and the bottom end is connected to the front side 101 of the substrate 10, thereby allowing the upper cover 12 and the lower support member 13 to together form a receiving cavity. The chip 11 is located within the receiving cavity, and the lower support member 13 is attached to the side of the chip 11, meaning the side of the chip 11 is in close contact with the inner wall of the receiving cavity, thus preventing the coolant from flowing to the side of the chip 11. The upper cover 12 and the chip 11 together form the heat dissipation channel 17, thereby enabling the transfer of coolant to the heat dissipation channel 17, achieving liquid cooling of the chip 11, thereby enhancing the heat dissipation performance of the chip 11, maintaining stable operation of the chip within the packaged device, and preventing the chip from burning out due to excessive temperature. Moreover, the heat dissipation channel 17 is formed by the upper cover 12 and the chip 11, which not only shortens the distance between the coolant and the chip 11, thereby further improving the heat dissipation efficiency of the chip 11, but also eliminates the need for complex structures such as channels or capillary layers embedded in the upper cover, thereby simplifying the manufacturing process of the upper cover and reducing the manufacturing cost of the packaged device with liquid cooling structure.

[0052] In some embodiments, the liquid cooling structure further includes an inlet 18 and an outlet 19 formed by the upper cover 12 and the lower support 13, and the heat dissipation channel 17 is connected to both the inlet 18 and the outlet 19.

[0053] In some embodiments, the surface of the top cover 12 facing the chip 11 has a central cavity 30 and two end cavities 31 distributed at opposite ends of the central cavity 30 along a second direction D2. The central cavity 30 communicates with the end cavities 31, and the second direction D2 is parallel to the front surface 101 of the substrate 10.

[0054] The central cavity 30 and the chip 11 enclose each other to form the heat dissipation channel 17, and the two end cavities 31 enclose each other with the lower support member 13 to form the liquid inlet 18 and the liquid outlet 19, respectively.

[0055] For example, such as Figure 1 , Figure 2 and Figure 3 As shown, the upper cover 12 includes a lower surface facing the chip 11 and an upper surface opposite to the lower surface along the first direction D1. The upper cover 12 also includes a cavity extending from the lower surface along the first direction D1 into the interior of the upper cover 12. The cavity penetrates the upper cover 12 along the second direction D2, and the cavity includes a central cavity 30 and two end cavities 31 communicating with the central cavity 30. The central cavity 30 is located at the middle of the lower surface of the upper cover 12, and the two end cavities 31 are distributed at opposite ends of the central cavity 30 along the second direction D2. The central cavity 30 and the second surface of the chip 11 enclose the heat dissipation channel 17. One of the two end cavities 31, together with the lower support member 13, forms the liquid inlet 18, and the other end cavity 31, together with the lower support member 13, forms the liquid outlet 19. That is, the liquid inlet 18 and the liquid outlet 19 are distributed along the second direction D2 at opposite ends of the heat dissipation channel 17. By providing the liquid inlet 18 and the liquid outlet 19, which communicate with the heat dissipation channel 17, on the one hand, the liquid inlet 18 and the liquid outlet 19 can maintain a continuous flow of coolant within the heat dissipation channel 17, thereby more quickly removing the heat generated by the chip 11 during operation and further improving the heat dissipation performance of the chip 11; on the other hand, the type and volume of coolant within the heat dissipation channel 17 can be flexibly adjusted through the liquid inlet 18 and the liquid outlet 19, thereby improving the flexibility of heat dissipation for the chip 11.

[0056] In some embodiments, the widths of the inlet 18 and the outlet 19 are both smaller than the width of the heat dissipation channel 17. This facilitates the circulation of the coolant within the heat dissipation channel 17 and increases the contact area between the coolant and the chip 11, thereby further improving the heat dissipation effect of the chip. Specifically, the width of the inlet 18 can be the width of the inlet 18 along the third direction D3, the width of the outlet 19 can be the width of the outlet 19 along the third direction D3, and the width of the heat dissipation channel 17 can be the width of the heat dissipation channel 17 along the third direction D3. The third direction D3 is parallel to the front surface of the substrate 10 and intersects perpendicularly with the second direction D2.

[0057] In some embodiments, the projection of the heat dissipation channel 17 on the front surface 101 of the substrate 10 at least completely covers the projection of the second surface of the chip 11 on the front surface 101 of the substrate 10, so as to achieve uniform liquid cooling of the chip 11 and avoid uneven heat dissipation of the chip 11.

[0058] In some embodiments, the coolant is deionized water.

[0059] Specifically, since the heat dissipation channel 17 is formed by the upper cover 12 and the second surface of the chip 11, the coolant within the heat dissipation channel 17 directly contacts the second surface of the chip 11. The resistivity of the deionized water is less than 10 ohms. -10 This ensures that even if the deionized water comes into contact with the second surface of the chip 11, it will not cause an electrical short circuit in the chip 11, thus ensuring the normal operation of the chip 11.

[0060] In some embodiments, the packaged device having a liquid-cooled heat dissipation structure further includes:

[0061] A barrier layer is applied to the second surface of the chip 11 to prevent the coolant from penetrating the chip 11.

[0062] In some embodiments, the barrier layer is a metal material layer.

[0063] Specifically, by covering the entire second surface of the chip 11 with the barrier layer, the barrier layer can prevent the coolant from penetrating to the chip 11, thereby further avoiding the impact of the coolant on the performance of the chip 11. The barrier layer being a metallic material layer means that the material of the barrier layer is a metallic material. Using this metallic material to make the barrier layer allows it to not only prevent the coolant (e.g., deionized water) from penetrating but also prevent oxygen penetration. Furthermore, the metallic material also has good thermal conductivity, thereby further contributing to improving the heat dissipation effect of the chip 11. In one example, the material of the barrier layer is titanium.

[0064] In some embodiments, the lower support 13 is an injection molded part, which is distributed around the outer periphery of the chip 11 and directly attached to the side of the chip 11.

[0065] For example, after mounting the chip 11 onto the front side 101 of the substrate 10, an injection molding process can be used to form an injection molded part that surrounds the outer periphery of the chip 11 and is directly attached to the side surface of the chip 11. This injection molded part serves as the lower support 13 of the liquid cooling structure. By using the injection molded part as the lower support 13 and directly attaching it to the side surface of the chip 11, gaps can be avoided between the lower support 13 and the side surface of the chip 11, thereby preventing coolant leakage between the lower support 13 and the side surface of the chip 11, thus protecting the chip 11. The material of the injection molded part can be epoxy resin molding compound.

[0066] Figure 4 This is a second structural schematic diagram of a packaged device with a liquid cooling heat dissipation structure according to a specific embodiment of the present invention. In some embodiments, the inner wall of the central cavity 30 facing the chip 11 has a first groove 40, and the first groove 40 communicates with the central cavity 30.

[0067] For example, such as Figure 3 and Figure 4As shown, the central cavity 30 has a first groove 40 on its bottom wall facing the chip 11 along the first direction D1, and the first groove 40 is connected to the central cavity 30. This allows the coolant to enter the first groove 40 from the heat dissipation channel 17, thereby increasing the amount of coolant that the packaged device with the liquid cooling structure can hold, and further improving the heat dissipation effect. Moreover, after the coolant absorbs the heat generated during the operation of the chip 11, some of the heat can be transferred upward to the outside through the top cover 12. The setting of the first groove 40 is equivalent to increasing the heat dissipation area of ​​the chip 11, thereby further improving the heat dissipation effect of the chip 11. In one example, the central cavity 30 has a plurality of first grooves 40 arranged at intervals along the second direction D2 on its inner wall facing the chip 11, and all the first grooves 40 are connected to the central cavity 30. The cross-sectional shape of the first groove 40 is arc-shaped, quadrilateral, or triangular.

[0068] Figure 5 This is a schematic diagram of the third structure of the packaged device with a liquid cooling heat dissipation structure in a specific embodiment of this utility model. Figure 6 This is a schematic diagram of the fourth structure of the packaged device with a liquid cooling heat dissipation structure in a specific embodiment of this utility model. In other embodiments, such as... Figure 5 and Figure 6 As shown, the second surface of the chip 11 has a second groove 50, and the second groove 50 is connected to the heat dissipation channel 17.

[0069] In some embodiments, the cross-sectional shape of the second groove 50 is an arc, a quadrilateral, or a triangle.

[0070] For example, by etching the second surface of the chip 11, a second groove 50 is formed on the second surface of the chip 11, and the second groove 50 communicates with the heat dissipation channel 17. The provision of the second groove 50 can further increase the contact area between the chip 11 and the coolant, that is, increase the heat dissipation area of ​​the chip 11, thereby further improving the heat dissipation effect of the chip 11. In one example, the second surface of the chip 11 has a plurality of second grooves 50 arranged at intervals along the second direction D2, and all the second grooves 50 communicate with the heat dissipation channel 17.

[0071] Figure 7 This is a fifth structural schematic diagram of a packaged device with a liquid cooling heat dissipation structure in a specific embodiment of this utility model. In some other embodiments, the inner wall of the central cavity 30 facing the chip 11 has a first groove 40, and the first groove 40 communicates with the central cavity 30;

[0072] The second surface of the chip 11 has a second groove 50, and the second groove 50 is connected to the heat dissipation channel 17.

[0073] In some embodiments, a plurality of first grooves 40 are spaced apart along a second direction D2 on the inner wall of the central cavity 30 facing the chip 11, and a plurality of second grooves 50 are spaced apart along the second direction D2 on the second surface of the chip 11, the second direction D2 being parallel to the front surface 101 of the substrate 10.

[0074] The plurality of first grooves 40 and the plurality of second grooves 50 are aligned one by one along the first direction D1 so as to align the upper cover 12 with the chip 11.

[0075] In some embodiments, a plurality of first grooves 40 are spaced apart along a second direction D2 on the inner wall of the central cavity 30 facing the chip 11, and a plurality of second grooves 50 are spaced apart along the second direction D2 on the second surface of the chip 11, the second direction D2 being parallel to the front surface 101 of the substrate 10.

[0076] The second groove 50 is aligned with the gap area between the two adjacent first grooves 40 to facilitate flexible adjustment of the positions of the first groove 40 and the second groove 50.

[0077] For example, such as Figure 3 and Figure 7 As shown, the central cavity 30 has a first groove 40 on its bottom wall facing the chip 11 along the first direction D1, and the first groove 40 communicates with the central cavity 30. Simultaneously, the second surface of the chip 11 has a second groove 50, and the second groove 50 communicates with the heat dissipation channel 17. By simultaneously providing the first groove 40 and the second groove 50 in the packaged device with the liquid cooling structure, the heat dissipation area can be further increased, and the heat dissipation effect can be improved.

[0078] Figure 8 This is a sixth structural schematic diagram of a packaged device with a liquid cooling heat dissipation structure according to a specific embodiment of this utility model. In some embodiments, such as Figure 8 As shown, the liquid cooling heat dissipation structure further includes:

[0079] Adhesive 80 is located between the upper cover 12 and the lower support member 13, and is used to connect the upper cover 12 and the lower support member 13.

[0080] For example, the lower surface of the upper cover 12 is provided with a cavity including the central cavity 30 and the end cavity 31, and the cavity penetrates the upper cover 12 along the second direction D2. The adhesive 80 is distributed at least on opposite sides of the cavity along a third direction D3, which is parallel to the front surface 101 of the substrate 10 and intersects the second direction D2 perpendicularly. After the injection molded part serving as the lower support 13 is formed by injection molding, the upper cover 12 can be directly attached to the top surface of the lower support 13 (i.e., the surface of the lower support 13 facing away from the substrate 10) using the adhesive 80, thereby simplifying the manufacturing process of the packaged device with a liquid cooling heat dissipation structure.

[0081] Figure 9 This is a schematic diagram of the seventh structure of the packaged device with a liquid cooling heat dissipation structure in a specific embodiment of this utility model. Figure 10 yes Figure 9 An exploded view of a packaged device with a liquid cooling structure. In some embodiments, such as... Figure 9 and Figure 10 As shown, the lower support member 13 has a recess 100 on its top surface facing the upper cover 12;

[0082] The upper cover 12 includes a lower surface facing the substrate 10 and an upper surface opposite to the lower surface along the first direction D1, and the lower surface of the upper cover 12 has a protrusion 90 that engages in the recess 100.

[0083] For example, after the lower support member 13, which is directly attached to the side of the chip 11, is formed using injection molding, the recess 100 can be formed on the top surface of the lower support member 13 using laser grooving or dry etching. After forming the protrusion 90 at the end of the upper cover 12 that matches the shape and size of the recess 100, the protrusion 90 is slid into the recess 100 from the side of the lower support member 13 to achieve the connection between the upper cover 12 and the lower support member 13, such as... Figure 9 As shown. The upper cover 12 and the lower support member 13 are connected by the interlocking of the recess 100 and the protrusion 90, thereby eliminating the need for adhesive, avoiding the risk of adhesive overflow, and helping to increase the connection strength between the upper cover 12 and the lower support member 13.

[0084] The packaged device with a liquid cooling structure provided in this specific embodiment mounts a chip and a liquid cooling structure on the front side of a substrate. The liquid cooling structure includes an upper cover, a lower support, and a heat dissipation channel. The lower support is mounted on the side of the chip and connected to the end of the upper cover. The heat dissipation channel is located between the upper cover and the second surface of the chip and is used to contain coolant. The coolant provides liquid cooling to the chip, thereby enhancing the chip's heat dissipation performance, maintaining stable operation of the chip within the packaged device, and preventing the chip from burning out due to overheating. Moreover, the heat dissipation channel is formed by the upper cover and the chip, which not only shortens the distance between the coolant and the chip, thereby further improving the chip's heat dissipation efficiency, but also eliminates the need for an embedded channel within the upper cover, simplifying the manufacturing process of the upper cover and reducing the manufacturing cost of the packaged device with the liquid cooling structure.

[0085] It should be noted that the terms "comprising" and "having," and their variations, used in this utility model document are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless explicitly indicated by the context; it should be understood that such use of data can be interchanged where appropriate. The term "one or more" depends at least in part on the context and can be used to describe features, structures, or characteristics in a singular sense, or in a plural sense to describe combinations of features, structures, or characteristics. The term "based on" can be understood as not necessarily intended to express an exclusive set of factors, but can instead, also at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described. Furthermore, embodiments and features in embodiments of this utility model can be combined with each other without conflict. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this utility model. In the various embodiments described above, each embodiment focuses on the differences from other embodiments; similar / identical parts between embodiments can be referred to mutually.

[0086] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A packaged device with a liquid-cooled heat dissipation structure, characterized in that, include: The substrate includes a front side and a back side that are distributed opposite to each other along a first direction; A chip is mounted on the front side of the substrate, the chip including a first surface facing the substrate and a second surface opposite to the first surface along the first direction; The liquid cooling structure includes an upper cover, a lower support, and a heat dissipation channel. The upper cover is located above the chip along the first direction. The lower support is attached to the side of the chip and connected to the end of the upper cover. The upper cover and the chip enclose each other to form the heat dissipation channel, and the heat dissipation channel is used to contain coolant.

2. The package device with liquid cooling heat dissipation structure according to claim 1, characterized in that, The liquid cooling structure also includes an inlet and an outlet formed by the upper cover and the lower support, and the heat dissipation channel is connected to both the inlet and the outlet.

3. The package device with liquid cooling heat dissipation structure according to claim 2, characterized in that, The surface of the top cover facing the chip has a central cavity and two end cavities distributed at opposite ends of the central cavity along a second direction. The central cavity is in communication with the end cavities, and the second direction is parallel to the front side of the substrate. The central cavity and the chip enclose each other to form the heat dissipation channel, and the two end cavities enclose each other with the lower support to form the liquid inlet and the liquid outlet, respectively.

4. The package device with liquid cooling heat dissipation structure according to claim 2, characterized in that, The width of the liquid inlet and the width of the liquid outlet are both smaller than the width of the heat dissipation channel.

5. The package device with liquid cooling heat dissipation structure according to claim 1, characterized in that, The projection of the heat dissipation channel on the front side of the substrate at least completely covers the projection of the second surface of the chip on the front side of the substrate.

6. The package device with liquid cooling heat dissipation structure according to claim 1, characterized in that, The coolant is deionized water.

7. The package device with liquid cooling heat dissipation structure according to claim 1, characterized in that, Also includes: A barrier layer is applied to the second surface of the chip to prevent the coolant from penetrating the chip.

8. The package device with liquid cooling heat dissipation structure according to claim 7, characterized in that, The barrier layer is a metal material layer.

9. The package device with liquid cooling heat dissipation structure according to claim 1, characterized in that, The lower support is an injection molded part, which is distributed around the outer periphery of the chip and directly attached to the side of the chip.

10. The package device with liquid cooling heat dissipation structure according to claim 3, characterized in that, The central cavity has a first groove on its inner wall facing the chip, and the first groove communicates with the central cavity.

11. The package device with liquid cooling heat dissipation structure according to claim 3, characterized in that, The second surface of the chip has a second groove, and the second groove is in communication with the heat dissipation channel.

12. The package device with liquid cooling heat dissipation structure according to claim 11, characterized in that, The cross-sectional shape of the second groove is an arc, a quadrilateral, or a triangle.

13. The package device with liquid cooling heat dissipation structure according to claim 3, characterized in that, The central cavity has a first groove on its inner wall facing the chip, and the first groove communicates with the central cavity; The second surface of the chip has a second groove, and the second groove is in communication with the heat dissipation channel.

14. The package device with liquid cooling heat dissipation structure according to claim 13, characterized in that, A plurality of first grooves are spaced apart along a second direction on the inner wall of the central cavity facing the chip, and a plurality of second grooves are spaced apart along a second direction on the second surface of the chip, the second direction being parallel to the front side of the substrate; The plurality of first grooves and the plurality of second grooves are aligned one by one along the first direction.

15. The package device with liquid cooling heat dissipation structure according to claim 13, characterized in that, A plurality of first grooves are spaced apart along a second direction on the inner wall of the central cavity facing the chip, and a plurality of second grooves are spaced apart along a second direction on the second surface of the chip, the second direction being parallel to the front side of the substrate; The second groove is aligned with the gap area between the two adjacent first grooves.

16. The package device with liquid cooling heat dissipation structure according to claim 1, characterized in that, The liquid cooling heat dissipation structure also includes: An adhesive is disposed between the upper cover and the lower support to connect the upper cover and the lower support.

17. The package device with liquid cooling heat dissipation structure according to claim 1, characterized in that, The lower support has a recess on a top surface thereof facing the upper cover. The upper cover includes a lower surface facing the substrate and an upper surface opposite the lower surface in the first direction, and the lower surface of the upper cover has a protrusion engaged in the recess.

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