Support device for lead-free reflow soldering furnace

Abstract

The utility model discloses a kind of support devices for lead-free reflow soldering furnace, it is related to vacuum reflow soldering technical field, including sprocket, chain is installed on the sprocket outside, support plate is installed on the opposite side of chain, support frame is arranged on the lower side of support plate, spring is arranged in the support frame, limit pin is arranged on the upper side of spring. The utility model is provided with support plate, support frame, spring and limit pin, so that when supporting small circuit board, the mounting hole on small circuit board can be inserted into limit pin, ensure the support stability of circuit board, avoid circuit board shaking to affect welding quality.

Description

Technical Field

[0001] This utility model relates to the field of vacuum reflow soldering technology, specifically a support device for a lead-free reflow soldering furnace. Background Technology

[0002] Vacuum reflow soldering, also known as a vacuum / controlled atmosphere eutectic furnace, boasts a large heat capacity and minimal temperature difference on the PCB surface, making it widely used in European and American aerospace, military electronics, and other fields. Utilizing infrared radiation heating, it features uniform temperature, safe ultra-low temperature soldering, no temperature difference, no overheating, reliable and stable process parameters, no need for complex process testing, and environmentally friendly, low-cost operation, meeting the diverse, small-batch, and highly reliable soldering needs of military products. During processing, a conveyor chain transports the circuit board into the reflow oven via a support device, where it undergoes preheating, heating, soldering, and cooling to complete the soldering process.

[0003] The existing support device only uses the support bar on the side of the chain to support the circuit board. When supporting small circuit boards, which are light, the support is not firm and can easily cause the circuit board to wobble, affecting the soldering quality. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the existing defects and provide a support device for a lead-free reflow oven. By setting a support plate, support frame, spring and limiting pin, the mounting holes on the small circuit board can be inserted into the limiting pin when supporting the small circuit board, so as to ensure the support stability of the circuit board and avoid the circuit board shaking from affecting the soldering quality. This can effectively solve the problems in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a support device for a lead-free reflow oven, including a sprocket, a chain installed on the outer side of the sprocket, a support plate installed on the opposite side of the chain, a support frame provided on the lower side of the support plate, a spring provided inside the support frame, and a limit pin provided on the upper side of the spring.

[0006] Furthermore, a support shaft is provided inside the sprocket, and a limiting groove is formed on the support shaft.

[0007] Furthermore, a limiting protrusion is provided at the contact position between the sprocket and the limiting groove, and the limiting protrusion is slidably connected to the limiting groove.

[0008] Furthermore, the sprocket is pressed together with the support shaft by screws, and the support plate is fixedly connected to the chain.

[0009] Furthermore, the limiting pin is connected to the support plate via the spring, and the lower end of the spring is fixedly connected to the support frame.

[0010] Furthermore, the limiting pin is inserted into the support plate, and the upper end of the spring is fixedly connected to the lower end of the limiting pin.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. This utility model, through the setting of a support plate, support frame, spring and limiting pin, allows the mounting holes on the small circuit board to be inserted into the limiting pin when supporting the small circuit board, ensuring the stability of the circuit board support and preventing the circuit board from shaking and affecting the soldering quality. Attached Figure Description

[0013] Figure 1 This is a front view schematic diagram of the installation part support plate and limiting pin of this utility model;

[0014] Figure 2 This utility model Figure 1 Enlarged structural diagram at point A;

[0015] Figure 3 This utility model Figure 1 A side view of the middle support plate and the limiting pin;

[0016] Figure 4 This utility model Figure 1 A magnified structural diagram at point B in the middle.

[0017] In the diagram: 1. Support shaft; 2. Sprocket; 3. Chain; 4. Limiting groove; 5. Support plate; 6. Limiting pin; 7. Support frame; 8. Spring; 9. Limiting protrusion. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figure 1-4 This embodiment provides a technical solution: a support device for a lead-free reflow oven, including a sprocket 2, a chain 3 installed on the outside of the sprocket 2, a support plate 5 installed on the opposite side of the chain 3, a support frame 7 provided on the lower side of the support plate 5, a spring 8 provided inside the support frame 7, and a limit pin 6 provided on the upper side of the spring 8.

[0020] like Figure 1-4As shown, when a small circuit board needs to be supported, the position of the sprocket 2 on the support shaft 1 is adjusted so that the distance between two adjacent sprockets 2 meets the support requirements of the small circuit board. Then, the limiting pin 6 is passed through the mounting hole on the small circuit board, so that the limiting pin 6 can limit and support the circuit board, preventing the circuit board from shaking and affecting the welding quality. The support shaft 1 rotates under the drive of the power output device, which in turn causes the sprocket 2 to rotate, so that the chain 3 moves around the sprocket 2, thereby transporting the circuit board that is limited and fixed by the limiting pin 6, and then transporting the circuit board to the reflow oven to complete the welding process.

[0021] A support shaft 1 is inserted through the inner side of the sprocket 2, and a limit groove 4 is formed on the support shaft 1.

[0022] A limiting protrusion 9 is provided at the contact position between the sprocket 2 and the limiting groove 4, and the limiting protrusion 9 is slidably connected to the limiting groove 4.

[0023] The sprocket 2 is pressed together with the support shaft 1 by screws, and the support plate 5 is fixedly connected to the chain 3.

[0024] The limiting pin 6 is connected to the support plate 5 by a spring 8, and the lower end of the spring 8 is fixedly connected to the support frame 7.

[0025] The limiting pin 6 is inserted into the support plate 5, and the upper end of the spring 8 is fixedly connected to the lower end of the limiting pin 6.

[0026] The working principle of the support device for a lead-free reflow oven provided by this utility model is as follows: Figures 1-4 As shown, when a small circuit board needs to be supported, the position of the sprocket 2 on the support shaft 1 is adjusted so that the distance between two adjacent sprockets 2 meets the support requirements of the small circuit board. Then, the limiting pin 6 is passed through the mounting hole on the small circuit board, so that the limiting pin 6 can limit and support the circuit board, preventing the circuit board from shaking and affecting the welding quality. The support shaft 1 rotates under the drive of the power output device, which in turn causes the sprocket 2 to rotate, so that the chain 3 moves around the sprocket 2, thereby transporting the circuit board that is limited and fixed by the limiting pin 6, and then transporting the circuit board to the reflow oven to complete the welding process.

[0027] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A support device for a lead-free reflow oven, comprising a sprocket (2), characterized in that: A chain (3) is installed on the outside of the sprocket (2), a support plate (5) is installed on the opposite side of the chain (3), a support frame (7) is provided on the lower side of the support plate (5), a spring (8) is provided inside the support frame (7), and a limit pin (6) is provided on the upper side of the spring (8).

2. The support device for a lead-free reflow oven according to claim 1, characterized in that: The sprocket (2) has a support shaft (1) inside it, and a limit groove (4) is provided on the support shaft (1).

3. The support device for a lead-free reflow oven according to claim 2, characterized in that: A limiting protrusion (9) is provided at the contact position between the sprocket (2) and the limiting groove (4), and the limiting protrusion (9) is slidably connected to the limiting groove (4).

4. The support device for a lead-free reflow oven according to claim 1, characterized in that: The sprocket (2) is pressed together with the support shaft (1) by screws, and the support plate (5) is fixedly connected to the chain (3).

5. A support device for a lead-free reflow oven according to claim 1, characterized in that: The limiting pin (6) is connected to the support plate (5) through the spring (8), and the lower end of the spring (8) is fixedly connected to the support frame (7).

6. A support device for a lead-free reflow oven according to claim 1, characterized in that: The limiting pin (6) is inserted into the support plate (5), and the upper end of the spring (8) is fixedly connected to the lower end of the limiting pin (6).

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