Microcrystalline dc common mode inductor

Abstract

The utility model discloses a kind of microcrystalline direct current common mode inductance, including insulating shell, microcrystalline magnetic core, positive pole copper bar and negative pole copper bar, microcrystalline magnetic core is fixed in the inside of insulating shell, positive pole copper bar and negative pole copper bar are through the insulating shell, and its both ends extend to the outside of insulating shell, as inductance winding;Positive pole copper bar and negative pole copper bar pass through the center hole of microcrystalline magnetic core in parallel, and keep preset interval in the magnetic core inside.The utility model replaces winding with integrated copper bar, optimizes copper bar interval and magnetic circuit symmetry, enhances common mode spurious wave current suppression capability.Integrated copper bar structure replaces traditional winding, simplifies winding design, reduces connecting point and welding link, to reduce contact resistance and potential fault point, enhances current carrying stability and long-term durability.Positive and negative pole copper bar passes through magnetic core center hole and keeps preset interval: on structure, it is ensured that double copper bar forms symmetrical and parallel magnetic circuit in the magnetic core inside, and the suppression effect of spurious wave current is optimized.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, specifically to a microcrystalline DC common-mode inductor. Background Technology

[0002] Common-mode inductors are the core components for suppressing electromagnetic interference. Traditional structures mainly have the following problems:

[0003] 1. Complex winding process: Conventional common-mode inductors use enameled wire to manually wind the magnetic ring, which results in problems such as winding asymmetry and numerous contact points, leading to increased DC resistance, causing heat generation and uneven current carrying capacity. It also prevents the inductance of larger currents.

[0004] 2. Poor core reliability: Ferrite or nanocrystalline cores have low hardness and are prone to deformation and cracking under the stress of windings, affecting the stability of magnetic permeability.

[0005] 3. Heat dissipation and installation defects: The heat dissipation efficiency of the round wire winding is low, and the magnetic core lacks effective physical protection, making it prone to corrosion and failure in high temperature and high humidity environments.

[0006] A search revealed that patent publication number CN221304430U discloses a DC common-mode inductor structure, including a base, a magnetic ring, and enameled wire windings. While it uses a support to fix the horizontal magnetic ring, reducing product height, it still employs a traditional winding method, resulting in issues such as high resistance and numerous solder joints. Utility Model Content

[0007] To address the shortcomings of existing technologies, this invention provides a microcrystalline DC common-mode inductor that replaces winding with an integrated copper busbar, allowing for a larger actual current flow, simplifying the structure and reducing resistance; it also optimizes the spacing between the copper busbars and the symmetry of the magnetic circuit, enhancing the ability to suppress common-mode clutter currents.

[0008] To achieve the above objectives, this utility model provides the following technical solution:

[0009] A microcrystalline DC common-mode inductor includes an insulating shell, a microcrystalline magnetic core, a positive copper busbar, and a negative copper busbar. The microcrystalline magnetic core is fixed inside the insulating shell. The positive and negative copper busbars penetrate the insulating shell and the microcrystalline magnetic core, with their two ends extending to the outside of the insulating shell, serving as inductor windings. The insulating shell has several through holes in its middle, two of which are used to accommodate the positive and negative copper busbars, and the two maintain a preset distance inside the magnetic core.

[0010] Furthermore, the insulating outer shell includes an upper cover and a lower shell; the lower shell is provided with a magnetic core positioning groove, the microcrystalline magnetic core is embedded in the magnetic core positioning groove, and the upper cover is disposed above the magnetic core positioning groove and is snap-fitted to the lower shell.

[0011] Furthermore, the lower shell is provided with two spaced copper busbar slots, through which the positive and negative copper busbars pass respectively.

[0012] Furthermore, the microcrystalline magnetic core is a toroidal core or a rectangular core, and its material is an iron-based nanocrystalline alloy.

[0013] Furthermore, the cross-sections of the positive and negative copper busbars are rectangular or annular.

[0014] Furthermore, the positive and negative copper busbars are respectively provided with mounting holes at both ends extending out of the insulating shell.

[0015] Compared with existing technologies, the technical solution of this patent has the following advantages:

[0016] The microcrystalline magnetic core is fixed inside the insulating shell, structurally providing physical protection and electrical isolation. This prevents external environmental factors such as humidity and dust from corroding the core, while also mitigating the risk of electrical short circuits, thus improving overall reliability and safety. The positive and negative copper busbars run parallel through the insulating shell, extending outwards at both ends as inductor windings. This integrated copper busbar structure replaces traditional windings, simplifying the winding design, reducing connection points and welding steps, thereby lowering contact resistance and potential failure points, and enhancing current carrying stability and long-term durability. The positive and negative copper busbars pass through the central hole of the core and maintain a predetermined spacing. Structurally, this ensures that the two copper busbars form a symmetrical and parallel magnetic circuit inside the core, optimizing the suppression of common-mode clutter currents. Attached Figure Description

[0017] Figure 1 The diagram shown is a schematic of the overall structure of a microcrystalline DC common-mode inductor.

[0018] Figure 2 The diagram shown is an exploded view of the microcrystalline DC common-mode inductor.

[0019] Figure 3 The diagram shown is a top view of the structure of a microcrystalline DC common-mode inductor.

[0020] Figure 4 The diagram shown is a side view of the microcrystalline DC common-mode inductor.

[0021] In the diagram: 1. Insulating outer shell; 2. Microcrystalline magnetic core; 3. Positive copper busbar; 4. Negative copper busbar; 11. Top cover; 12. Bottom shell; 121. Magnetic core positioning groove; 122. Copper busbar through groove. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] See Figure 1-4 As shown, this embodiment provides a microcrystalline DC common-mode inductor, including an insulating shell 1, a microcrystalline magnetic core 2, a positive copper busbar 3, and a negative copper busbar 4. The microcrystalline magnetic core 2 is fixed inside the insulating shell 1. The positive copper busbar 3 and the negative copper busbar 4 penetrate the insulating shell 1 and the microcrystalline magnetic core 2, with their two ends extending to the outside of the insulating shell 1, serving as inductor windings. The insulating shell 1 has several through holes in its middle, two of which are used to accommodate the positive copper busbar 3 and the negative copper busbar 4, and the two maintain a preset distance inside the magnetic core. The microcrystalline magnetic core 2 is fixed inside the insulating shell 1, which structurally achieves physical protection and electrical isolation of the magnetic core, avoiding corrosion of the magnetic core by external environments such as humidity and dust, while also preventing the risk of electrical short circuits, thus improving overall reliability and safety. Positive copper busbar 3 and negative copper busbar 4 run parallel through the insulating shell, extending outwards at both ends as inductor windings. This integrated copper busbar structure replaces traditional windings, simplifying the winding design, reducing connection points and welding steps, thereby lowering contact resistance and potential failure points, and enhancing current carrying stability and long-term durability. The positive and negative copper busbars pass through the central hole of the magnetic core and maintain a predetermined spacing. Structurally, this ensures that the two copper busbars form a symmetrical and parallel magnetic circuit inside the magnetic core, optimizing the suppression of common-mode clutter currents.

[0024] In addition, the middle part of the insulating shell 1 is provided with several through holes, including through holes directly provided on the positive copper busbar and the negative copper busbar. These through holes can provide ventilation and cooling for the microcrystalline magnetic core, and can also act as a gap between the two copper busbars through the through holes in the middle to avoid short circuits.

[0025] See Figure 2 , Figure 4 As shown, the insulating housing 1 includes an upper cover 11 and a lower housing 12. The lower housing 12 has a core positioning groove 121 for embedding the microcrystalline magnetic core 2. The upper cover 11 is positioned above the core positioning groove 121 and snaps into the lower housing 12. The core positioning groove 121 enables precise embedding and fixation of the magnetic core, preventing displacement of the magnetic core under vibration or impact and improving the stability of the inductor. The snap-fit ​​structure simplifies the assembly and disassembly process, eliminating the need for additional fasteners, reducing production complexity and maintenance difficulty, and improving manufacturing efficiency and maintainability.

[0026] See Figure 2As shown, the lower casing 12 also has copper busbar through slots 122 through which the positive copper busbar 3 and the negative copper busbar 4 pass. The two copper busbar through slots 122 are spaced apart. The copper busbar through slots 122 provide a guiding or fixing function for the copper busbars, ensuring that the positive and negative copper busbars always maintain a preset distance and parallelism, avoiding magnetic circuit imbalance caused by installation deviations. At the same time, they create a space between the two copper busbars to facilitate heat dissipation, improving safety and reliability.

[0027] The microcrystalline magnetic core 2 is either a toroidal core or a rectangular core, made of an iron-based nanocrystalline alloy. The toroidal core provides a uniform closed magnetic circuit; the rectangular core is suitable for installation in confined spaces, thus enhancing the versatility and adaptability of the design.

[0028] The positive electrode copper busbar 3 and the negative electrode copper busbar 4 have rectangular or annular cross-sections. These two cross-sectional structures increase the surface area of ​​the copper busbars, improve heat dissipation, and reduce performance degradation at high temperatures. Overall, this design improves current distribution uniformity and thermal management capabilities through shape optimization, thus extending service life.

[0029] The positive copper busbar 3 and the negative copper busbar 4 extend from both ends of the insulating shell 1 and are respectively provided with mounting holes. The mounting hole structure facilitates direct fixing to the circuit board with bolts or screws, enhances mechanical stability, prevents loosening due to vibration, and improves installation efficiency and overall structural strength.

[0030] Working principle: When common-mode clutter current (flowing in the same direction through the positive and negative copper busbars) occurs, it generates superimposed magnetic flux in the same direction within the microcrystalline core, forming a high-impedance path and suppressing clutter current propagation. The magnetic flux generated by the differential-mode current (flowing in opposite directions through the copper busbars) cancels each other out, resulting in extremely low core impedance and no impact on normal signal transmission. The positive and negative copper busbars pass parallel through the central hole of the core and maintain a preset spacing, forming a symmetrical magnetic circuit structure. This ensures efficient coupling of the common-mode magnetic field to the core, improving the clutter current suppression effect.

Claims

1. A microcrystalline DC common-mode inductor, comprising an insulating shell (1), a microcrystalline magnetic core (2), a positive copper busbar (3), and a negative copper busbar (4), characterized in that, The microcrystalline magnetic core (2) is fixed inside the insulating shell (1). The positive copper busbar (3) and the negative copper busbar (4) pass through the insulating shell (1) and the microcrystalline magnetic core (2), and their two ends extend to the outside of the insulating shell (1) as inductor windings. The middle part of the insulating shell (1) is provided with several through holes, two of which are used to accommodate the positive copper busbar (3) and the negative copper busbar (4), and the two maintain a preset distance inside the magnetic core.

2. The microcrystalline DC common-mode inductor according to claim 1, characterized in that, The insulating outer shell (1) includes an upper cover (11) and a lower shell (12); the lower shell (12) is provided with a magnetic core positioning groove (121), the microcrystalline magnetic core (2) is embedded in the magnetic core positioning groove (121), and the upper cover (11) is located above the magnetic core positioning groove (121) and is snapped together with the lower shell (12).

3. The microcrystalline DC common-mode inductor according to claim 2, characterized in that, The lower shell (12) is provided with two spaced copper busbar channels (122), and the positive copper busbar (3) and the negative copper busbar (4) pass through the copper busbar channels (122) respectively.

4. The microcrystalline DC common-mode inductor according to any one of claims 1 to 3, characterized in that, The microcrystalline magnetic core (2) is a toroidal core or a rectangular core, and its material is an iron-based nanocrystalline alloy.

5. The microcrystalline DC common-mode inductor according to claim 4, characterized in that, The cross-sections of the positive electrode copper busbar (3) and the negative electrode copper busbar (4) are rectangular or annular.

6. The microcrystalline DC common-mode inductor according to claim 5, characterized in that, The positive copper busbar (3) and the negative copper busbar (4) extend out of the insulating shell (1) and are respectively provided with mounting holes at both ends.

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