Semiconductor etching machine with quick clamping structure

Abstract

The utility model discloses a semiconductor etching machine with quick clamping structure, including the organism, the inner bottom portion fixed mounting of organism has etching rack, the top of etching rack is equipped with two removal grooves, the below of etching rack is provided with the adjusting box, be provided with auxiliary mechanism on the adjusting box, the auxiliary mechanism includes the pivot that rotates and connects between the inside top and the inside bottom of adjusting box, the outer wall of pivot is fixed with the carousel, the outer wall of pivot is fixed with the worm wheel, the both sides inner wall of adjusting box is rotatably connected with the worm, the worm is engaged with the worm wheel, the outer wall on one side of adjusting box is fixed with the adjusting motor. The utility model discloses through starting hydraulic cylinder can make the compression block down -shift complete clamping, simple operation is different for the size semiconductor, can through adjusting motor and make carousel rotate and change the interval of two compression blocks, and the versatility is strong, uses more convenient.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor etching technology, and in particular to a semiconductor etching machine with a quick clamping structure. Background Technology

[0002] Semiconductor etching machines, as one of the core pieces of equipment in the semiconductor manufacturing process, play a crucial role in the production of integrated circuits, microelectromechanical systems (MEMS), and other fields. By controlling parameters such as the flow rate and energy of etching gases or liquids, they selectively etch the surface of semiconductor wafers to remove excess material, thereby forming the desired circuit patterns and microstructures.

[0003] However, the current semiconductor clamping process is complex and cumbersome, reducing production efficiency. Moreover, most clamping structures have poor versatility and are difficult to adapt to semiconductor wafers of different sizes, making them very inconvenient to use. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor etching machine with a quick clamping structure.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A semiconductor etching machine with a quick clamping structure includes a machine body, an etching placement rack fixedly installed at the bottom of the machine body, two moving slots opened at the top of the etching placement rack, an adjustment box arranged below the etching placement rack, and an auxiliary mechanism arranged on the adjustment box.

[0007] Preferably, the auxiliary mechanism includes a rotating shaft rotatably connected between the top and bottom of the adjusting box, a turntable fixedly mounted on the outer wall of the rotating shaft, a worm gear fixedly mounted on the outer wall of the rotating shaft, a worm rotatably connected between the two inner walls of the adjusting box, the worm meshing with the worm gear, an adjusting motor fixedly mounted on one outer wall of the adjusting box, and one end of the worm penetrating one inner wall of the adjusting box and fixedly connected to the output shaft of the adjusting motor.

[0008] Preferably, the turntable has two symmetrically arranged adjustment slots, and a rotating rod is slidably connected to the inner wall of each of the two adjustment slots. A movable rod is slidably connected to each of the two side walls of the adjustment box. The two rotating rods are rotatably connected to the bottom of the two movable rods respectively. A pressure block is fixedly installed on the top of each of the two movable rods. A hydraulic cylinder is fixedly installed on the inner bottom of the machine body, and the telescopic end of the hydraulic cylinder is fixedly connected to the bottom of the adjustment box.

[0009] Preferably, both adjustment grooves are arc-shaped.

[0010] Preferably, both pressure blocks are inverted "L" shapes, and the two pressure blocks pass through the two moving slots respectively and are adapted to the two moving slots respectively.

[0011] Preferably, two telescopic rods are fixedly installed on the inner bottom of the machine body, and the telescopic ends of the two telescopic rods are fixedly connected to the bottom of the adjustment box.

[0012] The beneficial effects of this utility model are:

[0013] This invention enables the clamping blocks to move downwards by activating the hydraulic cylinder, making it simple to operate. For semiconductors of different sizes, the distance between the two clamping blocks can be changed by adjusting the motor to rotate the turntable. It is highly versatile and more convenient to use. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of a semiconductor etching machine with a quick clamping structure proposed in this utility model;

[0015] Figure 2 This is a schematic diagram of the planar structure of the auxiliary mechanism of this utility model;

[0016] Figure 3 This is a schematic diagram of the planar structure of the turntable, adjusting groove, and rotating rod of this utility model.

[0017] In the diagram: 1. Machine body, 2. Etching rack, 3. Press block, 4. Moving slot, 5. Adjustment box, 6. Adjustment motor, 7. Hydraulic cylinder, 8. Telescopic rod, 9. Moving rod, 10. Worm gear, 11. Worm wheel, 12. Rotating shaft, 13. Turntable, 14. Rotating rod, 15. Adjustment slot. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] Reference Figures 1-3 A semiconductor etching machine with a quick clamping structure includes a body 1, an etching placement rack 2 is fixedly installed on the bottom of the body 1, two moving slots 4 are opened on the top of the etching placement rack 2, an adjustment box 5 is provided below the etching placement rack 2, and an auxiliary mechanism is provided on the adjustment box 5.

[0020] The auxiliary mechanism includes a rotating shaft 12 rotatably connected between the top and bottom of the adjusting box 5. A turntable 13 is fixedly mounted on the outer wall of the rotating shaft 12, and a worm gear 11 is fixedly mounted on the outer wall of the rotating shaft 12. A worm 10 is rotatably connected between the two inner walls of the adjusting box 5, and the worm 10 meshes with the worm gear 11. An adjusting motor 6 is fixedly mounted on one outer wall of the adjusting box 5. One end of the worm 10 passes through one inner wall of the adjusting box 5 and is fixedly connected to the output shaft of the adjusting motor 6. Two symmetrically arranged adjusting slots 15 are opened on the turntable 13. A rotating rod 14 is slidably connected to the inner wall of each adjusting slot 15. A sliding rod 9 is slidably connected to each of the two inner walls of the adjusting box 5. The two rotating rods 14 are rotatably connected to the bottom of the two sliding rods 9, and the tops of the two sliding rods 9 are fixed. The machine body 1 is equipped with a pressure block 3 and a hydraulic cylinder 7 is fixedly installed at the bottom of the inner part of the machine body 1. The telescopic end of the hydraulic cylinder 7 is fixedly connected to the bottom of the adjustment box 5. Both adjustment slots 15 are arc-shaped, and both pressure blocks 3 are inverted "L"-shaped. The two pressure blocks 3 pass through the two moving slots 4 respectively and are adapted to the two moving slots 4 respectively, so that the pressure block 3 can move accurately along the moving slots 4 during the movement without deviation or shaking, ensuring the clamping accuracy. Two telescopic rods 8 are fixedly installed at the bottom of the inner part of the machine body 1. The telescopic ends of the two telescopic rods 8 are fixedly connected to the bottom of the adjustment box 5. The telescopic rods 8 play the role of auxiliary support and stabilization of the adjustment box 5. During the extension and retraction of the hydraulic cylinder 7, the telescopic rods 8 can extend and retract with the movement of the adjustment box 5, maintain the balance and stability of the adjustment box 5, and prevent the clamping accuracy from being affected by the shaking of the adjustment box 5.

[0021] In use, the semiconductor etching placement rack 2 is placed on the semiconductor etching rack and positioned below the two pressure blocks 3. The hydraulic cylinder 7 is activated, and its telescopic end retracts, causing the adjustment box 5 to descend. This causes the moving rod 9 and the pressure blocks 3 to move down synchronously, thus allowing them to contact the semiconductor and complete the clamping. If it is necessary to accommodate semiconductors of different sizes, the adjustment motor 6 is activated before clamping. Its output shaft drives the worm gear 10 to rotate, and the worm wheel 11 meshing with the worm gear 10 rotates accordingly. This, in turn, drives the rotating shaft 12 and the turntable 13 to rotate. The arc-shaped adjustment groove 15 on the turntable 13 allows the rotating rod 14 to move within the groove, pushing the moving rod 9 to slide on the side wall of the adjustment box 5, thereby changing the distance between the two pressure blocks 3 to meet the clamping requirements of semiconductors of different sizes.

[0022] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor etching machine with a quick-clamping structure, comprising a body (1), characterized in that, An etching placement rack (2) is fixedly installed at the bottom of the inner part of the body (1). Two moving slots (4) are opened at the top of the etching placement rack (2). An adjustment box (5) is provided below the etching placement rack (2). An auxiliary mechanism is provided on the adjustment box (5). The auxiliary mechanism includes a rotating shaft (12) rotatably connected between the top and bottom of the adjustment box (5). A turntable (13) is fixedly installed on the outer wall of the rotating shaft (12). A worm gear (11) is fixedly installed on the outer wall of the rotating shaft (12). A worm (10) is rotatably connected between the inner walls of the two sides of the adjustment box (5). The worm (10) meshes with the worm gear (11). An adjustment motor (6) is fixedly installed on one side of the outer wall of the adjustment box (5). One end of the worm gear (10) passes through the inner wall of one side of the adjustment box (5) and is fixedly connected to the output shaft of the adjustment motor (6). Two symmetrical adjustment slots (15) are provided on the turntable (13). A rotating rod (14) is slidably connected to the inner wall of each of the two adjustment slots (15). A moving rod (9) is slidably connected to both sides of the adjustment box (5). The two rotating rods (14) are rotatably connected to the bottom of the two moving rods (9). A pressure block (3) is fixedly installed on the top of each of the two moving rods (9). A hydraulic cylinder (7) is fixedly installed at the bottom of the inner side of the machine body (1). The telescopic end of the hydraulic cylinder (7) is fixedly connected to the bottom of the adjustment box (5).

2. A semiconductor etching machine with a quick-clamping structure according to claim 1, characterized in that, Both of the adjustment grooves (15) are arc-shaped.

3. A semiconductor etching machine with a quick-clamping structure according to claim 1, characterized in that, Both pressure blocks (3) are inverted "L" shapes, and the two pressure blocks (3) pass through the two moving slots (4) respectively and are adapted to the two moving slots (4) respectively.

4. A semiconductor etching machine with a quick-clamping structure according to claim 3, characterized in that, Two telescopic rods (8) are fixedly installed on the inner bottom of the body (1), and the telescopic ends of the two telescopic rods (8) are fixedly connected to the bottom of the adjustment box (5).

Images