Wafer film sticking machine wafer stage

Abstract

The utility model discloses a wafer film pasting machine carrier stage, include: porous region, a plurality of screw holes, recess part, first gas pipe interface and second gas pipe interface, the inner side area of porous region upper surface is provided with a plurality of first air holes, recess part sets up between the outer periphery of porous region upper surface and a plurality of first air holes, and the shape of recess part is circular, the bottom of recess part is equipped with a plurality of second air holes, and screw hole sets up between the outer periphery of porous region upper surface and recess part, first gas pipe interface sets up in the side of porous region, and the first air hole in porous region is communicated, and second gas pipe interface is communicated with second air hole, the utility model adds air hole as adsorption hole in recess part, and the particle produced when blade cuts adhesive film will be sucked, not only avoid the accumulation of particle in recess part, and simultaneously due to the effect of adsorption force, the particle on blade and wafer edge also will be sucked, and the product anomaly caused by particle uncontrolled is thoroughly avoided.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor equipment technology, specifically relating to a wafer bonding machine stage. Background Technology

[0002] Wafer coating is an important process before wafer thinning. Before thinning the back side of the wafer, a protective film is usually applied to the front side to protect it from damage during the thinning process. The coating process requires that there be no air bubbles or particles between the film and the wafer after coating, as these could cause the wafer to crack during the thinning process.

[0003] In existing equipment, particles are often generated when the blades cut the film. Some of these particles adhere to the blades or the wafer stage. During repeated processing, these particles enter the space between the film and the wafer or remain on the film surface, leading to wafer abnormalities. Utility Model Content

[0004] To address the aforementioned problems in the prior art, this utility model provides a wafer bonding machine stage. The technical problem to be solved by this utility model is achieved through the following technical solution: This utility model embodiment provides a wafer bonding machine stage, including: The area includes a porous region, several screw holes, a recessed section, a first air pipe interface, and a second air pipe interface; among which, The inner region of the upper surface of the porous region is provided with a number of first air holes; The groove portion is disposed between the outer periphery of the upper surface of the porous region and several first air holes, and the groove portion is circular in shape; the bottom of the groove portion is provided with several second air holes; The screw hole is located between the outer periphery of the upper surface of the porous area and the groove portion; The first tracheal inlet is located on the side of the porous region and communicates with the first tracheal pore in the porous region; The second air tube interface is located on the side of the porous area and communicates with the second air hole in the groove portion.

[0005] In one embodiment of this utility model, the porous region is circular in shape.

[0006] In one embodiment of this utility model, the central region of the porous region is hollow or solid.

[0007] In one embodiment of this invention, the diameter of the porous region is smaller than the diameter of the wafer.

[0008] In one embodiment of this utility model, screw holes are uniformly and symmetrically arranged on the upper surface of the multi-hole area.

[0009] In one embodiment of this utility model, the second air holes are evenly distributed at the bottom of the groove portion.

[0010] In one embodiment of this utility model, the diameter of the first tracheal inlet is 6mm.

[0011] In one embodiment of this utility model, the diameter of the second tracheal inlet is 6mm.

[0012] The beneficial effects of this utility model are: The solution provided in this embodiment addresses the problem that during repeated cutting, particles gradually accumulate in the laminating machine's substrate stage, and some particles migrate to other areas with the blade movement, causing product abnormalities. This invention incorporates pores in the groove as adsorption holes, which suck away particles generated during blade cutting of the adhesive film. This not only prevents particle accumulation in the groove but also, due to the adsorption force, removes particles from the blade and wafer edges, completely avoiding product abnormalities caused by uncontrolled particle movement. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall appearance of a wafer bonding machine stage provided in an embodiment of the present utility model; Figure 2 A top view of a wafer lamination stage provided in an embodiment of this utility model; Figure 3 A bottom view of a wafer lamination stage provided in an embodiment of this utility model; Figure 4 This is a front view of a wafer lamination stage provided in an embodiment of the present invention.

[0014] Figure Labels 1-Porous area, 2-Screw hole, 3-Recessed part, 4-First air tube interface, 5-Second air tube interface. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] To address the issue of grain formation on wafers after film lamination in existing technologies, this invention provides a wafer lamination onboard stage, such as... Figure 1 As shown, it may include: 1. A porous area; 2. Several screw holes; 3. A recessed portion; 4. A first air pipe interface; 5. A second air pipe interface; wherein, Several first pores are provided on the inner side of the upper surface of porous region 1; The groove portion 3 is disposed between the outer periphery of the upper surface of the porous region 1 and several first air holes, and the groove portion 3 is circular in shape; the bottom of the groove portion 3 is provided with several second air holes; Screw hole 2 is located between the outer periphery of the upper surface of the porous area 1 and the groove portion 3; The first tracheal inlet 4 is located on the side of the porous region 1 and communicates with the first tracheal pore in the porous region 1. The second tracheal inlet 5 is located on the side of the porous region 1 and communicates with the second tracheal hole in the groove portion 3.

[0017] A top view of the wafer mounting machine's onboard stage, as shown below. Figure 2 As shown, the bottom view is as follows Figure 3 As shown, the front view is as follows Figure 4 As shown, combined with Figure 1 , Figure 2 , Figure 3 and Figure 4 The specific structure of the wafer lamination stage proposed in this embodiment of the present invention can be derived.

[0018] Optionally, the porous region 1 can be circular in shape. After negative or positive pressure gas is introduced into the several first pores provided on the porous region 1 through the first gas pipe interface 4, the wafer is adsorbed or released.

[0019] The diameter of porous region 1 is smaller than the diameter of the wafer. This design allows the wafer edge to extend relative to the edge of porous region 1 after the wafer is attached to it, facilitating the diaphragm blade to cut the adhesive film along the wafer edge to meet the film cutting requirements of the laminating machine.

[0020] Optionally, the central region of the porous region 1 can be hollow or solid. Since some film applicators are designed with a small, liftable suction cup in the central region, in order to meet this requirement, the central region of the porous region 1 can be set to be hollow; if a film applicator without a small suction cup is used, the center of the porous region 1 can be set to be solid.

[0021] Optionally, the screw holes 2 are evenly and symmetrically arranged on the upper surface of the porous area 1. The screw holes 2 can be fixing screw holes for the stage, and the diameter of the screw holes can be M6. There can be 8 screw holes 2, which are evenly and symmetrically arranged on the upper surface of the porous area 1.

[0022] Optionally, for the groove portion 3, on the one hand, it allows the blade to be inserted into the groove portion 3 when cutting the film, and on the other hand, the bottom of the groove portion 3 is designed with a second air hole. The second air hole is evenly distributed at the bottom of the groove portion 3 and is connected to the second air pipe interface 5. After negative pressure is introduced, an adsorption effect can be generated.

[0023] Optionally, the diameter of the first tracheal inlet 4 can be 6mm, and the diameter of the second tracheal inlet 5 can be 6mm.

[0024] The specific working process of the wafer bonding stage proposed in this embodiment is as follows: The robotic arm of the film applicator places the wafer onto the porous area 1. The wafer and the porous area 1 are placed concentrically. Then, the first air pipe interface 4 is turned on to create a vacuum, which adsorbs the wafer onto the porous area 1. The film laminator rollers apply adhesive film to the entire surface of the wafer and the wafer stage. The blade of the laminator descends and inserts into the groove 3 of the wafer stage (at this time, the second air pipe interface 5 turns on the vacuum and the groove 3 is adsorbed), and rotates once along the edge of the wafer to complete the cutting of the adhesive film, and then rises back (at this time, the second air pipe interface 5 turns off the vacuum). The first air pipe interface 4 is closed to shut off the vacuum, gas is introduced to release the wafer, and the robotic arm takes the wafer away from the porous area 1. The equipment rollers remove the remaining adhesive film from the tray. Repeat the above process to perform wafer lamination.

[0025] Existing wafer laminating machines suffer from particle accumulation in the grooves during repeated cutting processes, with some particles also migrating to other areas with the blade movement, causing product defects. The wafer laminating machine stage proposed in this embodiment incorporates pores in the grooves as suction holes, allowing particles generated during blade cutting to be drawn away. This not only prevents particle accumulation in the grooves but also, due to the suction force, removes particles from the blade and wafer edges, completely eliminating product defects caused by uncontrolled particle movement.

[0026] It should be noted that in the description of this utility model, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0028] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model are included within the scope of protection of this utility model.

Claims

1. A wafer lamination machine stage, characterized in that, include: The structure includes a porous area (1), several screw holes (2), a recessed portion (3), a first air pipe interface (4), and a second air pipe interface (5); among which, The inner side region of the upper surface of the porous region (1) is provided with a number of first air holes; The groove portion (3) is disposed between the outer periphery of the upper surface of the porous region (1) and several first air holes, and the groove portion (3) is circular in shape; the bottom of the groove portion (3) is provided with several second air holes; The screw hole (2) is located between the outer periphery of the upper surface of the porous area (1) and the groove portion (3); The first tracheal inlet (4) is disposed on the side of the porous region (1) and communicates with the first tracheal pore in the porous region (1); The second tracheal inlet (5) is located on the side of the porous region (1) and communicates with the second tracheal hole in the groove portion (3).

2. The wafer lamination stage according to claim 1, characterized in that, The porous region (1) is circular in shape.

3. The wafer lamination stage according to claim 1, characterized in that, The central region of the porous region (1) is hollow or solid.

4. The wafer lamination stage according to claim 2, characterized in that, The diameter of the porous region (1) is smaller than the diameter of the wafer.

5. The wafer lamination stage according to claim 1, characterized in that, The screw holes (2) are evenly and symmetrically arranged on the upper surface of the porous area (1).

6. The wafer lamination stage according to claim 1, characterized in that, The second pores are evenly distributed at the bottom of the groove portion (3).

7. The wafer lamination stage according to claim 1, characterized in that, The diameter of the first tracheal inlet (4) is 6 mm.

8. The wafer lamination stage according to claim 1, characterized in that, The diameter of the second tracheal inlet (5) is 6 mm.

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