Liquid cooling device and liquid cooling system

Abstract

This application relates to the field of heat dissipation equipment technology, and discloses a liquid cooling device and liquid cooling system. The liquid cooling device includes a cabinet, a flow equalization plate, and a flow limiting mechanism. The flow equalization plate is disposed inside the cabinet and has a liquid inlet hole. The flow limiting mechanism includes an abutment, a baffle, and a transmission assembly. A first elastic member is connected between the abutment and the cabinet, and a second elastic member is connected between the baffle and the flow equalization plate. When the server is removed from the heat dissipation cavity, the abutment rises under the action of the first elastic member and drives the baffle to slide through the transmission assembly to cover the liquid inlet hole. The second elastic member is stretched as the baffle slides. When the server enters the heat dissipation cavity, the abutment descends and drives the transmission assembly to move, releasing space for the baffle to slide. The baffle slides under the action of the second elastic member and exposes the liquid inlet hole. Through the above method, the flow equalization effect of the flow equalization plate and the flow field of the cooling medium inside the cabinet are optimized.

Description

Technical Field

[0001] This application relates to the field of heat dissipation equipment technology, specifically to a liquid cooling device and liquid cooling system. Background Technology

[0002] Liquid cooling is a highly efficient heat dissipation technology that uses liquid as a cooling medium. It leverages the high specific heat capacity and thermal conductivity of liquid to rapidly absorb and transfer heat generated by equipment. Taking immersion liquid cooling as an example, the liquid cooling cabinet is equipped with a flow equalization plate, through which multiple through-holes guide the flow. The server is placed above these through-holes. The cooling medium enters the liquid cooling cabinet through the inlet at the bottom and flows upwards through the through-holes on the flow equalization plate. As it flows past the server, it carries away the heat generated by the server. The cooled medium, having absorbed the heat, is then discharged from the outlet at the top of the liquid cooling cabinet.

[0003] However, the number and location of the through holes on the existing flow equalization plate are fixed. When the number of servers in the liquid-cooled cabinet decreases or the size of the servers decreases, some through holes on the flow equalization plate will not have servers above them. The cooling medium at the corresponding locations of these through holes will flow directly upwards and be discharged from the outlet without passing through the servers. This will not only waste the flow of cooling medium, but also accelerate the flow of cooling medium flowing upwards through these through holes, while the cooling medium at other locations will still be obstructed by the servers and flow more slowly. This will change the uniformity of the flow inside the entire liquid-cooled cabinet, resulting in poor heat dissipation for servers at other locations. Utility Model Content

[0004] In view of the above problems, embodiments of this application provide a liquid cooling device and a liquid cooling system for optimizing the flow equalization effect of the flow equalization plate and the flow field of the cooling medium in the cabinet.

[0005] According to one aspect of the embodiments of this application, a liquid cooling device is provided, comprising: a cabinet, a flow equalization plate, and a current limiting mechanism; a liquid cooling pool is disposed on the cabinet, and the flow equalization plate is disposed within the liquid cooling pool and divides the liquid cooling pool into a receiving cavity and a heat dissipation cavity, the receiving cavity being used to receive a cooling medium, and the heat dissipation cavity being used to receive a server; an inlet hole is provided on the flow equalization plate for allowing the cooling medium to enter the heat dissipation cavity from the receiving cavity to dissipate heat from the server; the current limiting mechanism includes an abutment member, a baffle plate, and a transmission assembly; the abutment member is vertically and vertically mounted on the cabinet, and a first elastic member is connected between the abutment member and the cabinet, the abutment member being used to interact with the incoming heat dissipation cavity. The server in the heat dissipation cavity abuts against the heat dissipation cavity and descends under the weight of the server, compressing the first elastic element; the baffle is slidably mounted on the flow equalization plate, and a second elastic element is connected between the baffle and the flow equalization plate; the transmission assembly is connected between the abutting member and the baffle; when the server moves out of the heat dissipation cavity, the abutting member rises under the action of the first elastic element and drives the baffle to slide through the transmission assembly to cover the liquid inlet, and the second elastic element is stretched as the baffle slides; when the server enters the heat dissipation cavity, the abutting member descends and drives the transmission assembly to move, so as to release space for the baffle to slide, and the baffle slides under the action of the second elastic element and exposes the liquid inlet.

[0006] In one alternative approach, the abutment is located on the side wall of the rack and protrudes upward to the top of the rack. The abutment is used to abut against the mounting ears on the server when the server enters the cooling cavity.

[0007] In one alternative embodiment, a flow equalization plate is horizontally positioned within a liquid cooling pool, vertically dividing the pool into a receiving chamber and a heat dissipation chamber. A baffle plate is horizontally slidably positioned on the flow equalization plate. The transmission assembly includes a first guide wheel and a pull rope. The first guide wheel is rotatably positioned on the flow equalization plate and located on one side of the baffle plate along the horizontal direction. The two ends of the pull rope are connected to the baffle plate and the abutment member, respectively. The middle section of the pull rope is wound around the first guide wheel. The portion of the pull rope between the baffle plate and the first guide wheel extends horizontally, while the portion between the first guide wheel and the abutment member extends vertically or obliquely upward. When the abutment member rises, the pull rope is taut and pulls the baffle plate to slide. When the abutment member descends, the pull rope is relaxed, releasing space for the baffle plate to slide.

[0008] In one alternative embodiment, a first guide hole is provided on the inner side wall of the cabinet, and a second guide hole is provided on the top of the cabinet. The second guide hole extends vertically downward and connects to the first guide hole. An abutment can be lifted and inserted into the second guide hole and extends into the first guide hole to a position where it connects with the second guide hole. A second guide wheel is provided in the first guide hole. One end of the abutment located in the first guide hole is connected to a pull rope. The portion of the pull rope located between the abutment and the first guide wheel is wound around the second guide wheel. The portion of the pull rope located between the opening of the first guide hole on the inner side wall of the cabinet and the first guide wheel extends vertically or obliquely upward.

[0009] In one alternative embodiment, the second guide wheel is positioned at the opening of the first guide hole, and at least a portion of the second guide wheel is located outside the first guide hole.

[0010] In one alternative approach, the first guide hole extends obliquely upward from the opening on the inner wall of the cabinet to the position where it connects with the second guide hole.

[0011] In one alternative embodiment, at least two abutments are provided on opposite sides of the cabinet, and the two ends of the baffle are connected to at least one abutment via a transmission assembly. The at least two abutments are used to abut against the same server and together drive the baffle to slide when the server is removed from the heat dissipation cavity.

[0012] In one alternative approach, the second elastic element comprises multiple elements arranged at intervals, which together drive the baffle to slide and expose the liquid inlet hole when the server enters the heat dissipation cavity.

[0013] In one alternative embodiment, a slide rail is fixedly mounted on the flow equalization plate, and a baffle plate is slidably mounted on the slide rail; a baffle portion is provided on the side of the baffle plate facing the flow equalization plate, the baffle portion is in contact with the flow equalization plate, and is used to cover the liquid inlet hole when the server is removed from the heat dissipation cavity.

[0014] According to another aspect of the embodiments of this application, a liquid cooling system is provided, comprising: a cooling supply device and the liquid cooling device described in any of the above claims, wherein the cooling supply device and the receiving cavity of the liquid cooling device are connected through a first pipe, and the cooling supply device and the heat dissipation cavity of the liquid cooling device are connected through a second pipe; the first pipe is used to supply a cooling medium from the cooling supply device into the receiving cavity, so that the cooling medium enters the heat dissipation cavity from the receiving cavity and dissipates heat from the server in the heat dissipation cavity; the second pipe is used to supply a cooling medium that has absorbed heat from the heat dissipation cavity into the cooling supply device, so that the cooling supply device reduces the temperature of the cooling medium.

[0015] This embodiment of the application incorporates a baffle plate on the flow equalization plate. When no server is present at the location corresponding to the liquid inlet on the flow equalization plate, the baffle plate covers the liquid inlet. This not only prevents waste of cooling medium flow but also ensures that servers are present at the locations corresponding to the liquid inlet through which the cooling medium can pass. This results in a more uniform flow velocity of the cooling medium after entering the heat dissipation cavity from the cabinet's receiving cavity, guaranteeing effective heat dissipation for the servers within the heat dissipation cavity. Furthermore, by providing a contact member on the cabinet for contacting the server, and connecting the contact member and the baffle plate via a transmission assembly, the contact member automatically drives the baffle plate to cover the liquid inlet when the server is removed from the heat dissipation cavity. When the server enters the heat dissipation cavity, the contact member automatically releases space for the baffle plate to slide under the server's gravity, allowing the baffle plate to slide and expose the liquid inlet.

[0016] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0018] Figure 1 A perspective view of the liquid cooling device provided in an embodiment of the present invention is shown;

[0019] Figure 2 A cross-sectional view of the liquid cooling device provided in an embodiment of the present invention is shown;

[0020] Figure 3 A top view of one state of the liquid cooling device provided in an embodiment of the present invention is shown;

[0021] Figure 4 A partial structural schematic diagram of the liquid cooling device provided in this embodiment of the present invention, showing the liquid inlet hole in an exposed state;

[0022] Figure 5 A partial structural schematic diagram of the liquid cooling device provided in this embodiment of the present invention, in which the liquid inlet hole is covered, is shown.

[0023] Figure 6 A partial cross-sectional view of the liquid cooling device provided in an embodiment of the present invention is shown.

[0024] The reference numerals in the detailed embodiments are as follows:

[0025] 1. Liquid cooling system; 2. Server;

[0026] 110. Server rack; 120. Current distribution plate; 130. Current limiting mechanism;

[0027] 111. Liquid cooling pool; 1111. Receiving cavity; 1112. Heat dissipation cavity; 112. Opening; 113. First guide hole; 114. Second guide hole;

[0028] 121. Liquid inlet; 122. Slide rail;

[0029] 131. Abutting component; 132. Baffle plate; 133. Transmission assembly; 134. First elastic component; 135. Second elastic component;

[0030] 1331. First guide wheel; 1332. Pull rope; 1333. Second guide wheel;

[0031] 210. Ear loops. Detailed Implementation

[0032] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0034] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0035] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0036] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0037] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0038] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0039] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0040] A liquid-cooled server rack is a enclosure used to house servers and cooling media. To ensure consistent heat dissipation for all servers within the rack, a flow equalizer is typically installed inside. Through-holes on the flow equalizer guide the cooling media, ensuring uniform flow throughout the rack. Taking immersion liquid cooling as an example, the flow equalizer divides the rack's interior into upper and lower chambers. The lower chamber connects to the liquid inlet on the rack, while the upper chamber connects to the liquid outlet. Servers are placed in the upper chamber, positioned above the through-holes on the flow equalizer. When cooling media from outside the rack enters the lower chamber through the inlet, it flows evenly through the through-holes on the flow equalizer into the upper chamber, rising upwards. After passing over the servers, it exits through the outlet, thus carrying away the heat generated by the servers.

[0041] When the servers within a liquid-cooled cabinet change—for example, reducing the number of servers or decreasing the horizontal cross-sectional area of ​​the servers—the number and position of the through-holes on the flow equalization plate remain fixed. Therefore, some through-holes may no longer have servers directly above them. This causes the cooling medium to flow upwards through these through-holes without passing over the heat-generating components and exit through the outlet, resulting in wasted cooling medium flow. Furthermore, when only some through-holes on the flow equalization plate are not above servers, the upward flow of the cooling medium through these through-holes is no longer obstructed by servers, increasing its flow speed. However, the upward flow of the cooling medium through other through-holes is still obstructed by servers. This alters the uniformity of cooling medium flow within the liquid-cooled cabinet, causing more liquid to exit directly through the through-holes and less cooling medium to flow over the servers, resulting in poor heat dissipation for the servers within the liquid-cooled cabinet.

[0042] Based on this, to ensure the cooling medium flows evenly across the servers within the liquid-cooled cabinet, this application provides a liquid cooling device. By sliding a baffle plate on the flow equalization plate, the baffle plate covers the through-holes when no servers are above them. This not only prevents the cooling medium from being discharged directly from the outlet without passing through the heat-generating components, reducing waste, but also ensures that servers are present above the through-holes through which the cooling medium can pass, thus obstructing its upward flow and resulting in a more balanced flow field for the cooling medium within the liquid-cooled cabinet, thereby effectively dissipating heat from the servers. Furthermore, an abutment structure can be installed on the cabinet. Through this abutment structure's contact with the servers and its transmission mechanism with the baffle plate, the weight of the servers controls whether the baffle plate covers the through-holes on the flow equalization plate. This allows the liquid cooling device to automatically adjust the exposed through-holes on the flow equalization plate according to the number of servers within the liquid-cooled cabinet.

[0043] According to one aspect of this application, a liquid cooling device is provided, such as... Figure 1 , Figure 2 and Figure 3 As shown, Figure 1 A perspective view of the liquid cooling device is shown. Figure 2 A cross-sectional view of the liquid cooling device is shown. Figure 3 A top view of the liquid cooling unit is shown. The liquid cooling unit 1 includes a cabinet 110, a flow equalization plate 120, and a flow limiting mechanism 130.

[0044] As shown in the figure, a liquid cooling pool 111 is provided on the cabinet 110. A flow equalization plate 120 is disposed within the liquid cooling pool 111, dividing the liquid cooling pool 111 into a receiving cavity 1111 and a heat dissipation cavity 1112. The flow equalization plate 120 can be horizontally disposed within the liquid cooling pool 111 as shown in the figure, to vertically divide the liquid cooling pool 111 into the receiving cavity 1111 and the heat dissipation cavity 1112. Alternatively, the flow equalization plate 120 can be vertically disposed within the liquid cooling pool 111, to horizontally divide the liquid cooling pool 111 into two cavities.

[0045] The receiving cavity 1111 is used to contain the cooling medium, such as fluorinated liquid or silicone oil. The heat dissipation cavity 1112 is used to contain the server 2, such as electronic equipment in a data center, an AI server, or an edge computing device. The flow equalization plate 120 has a liquid inlet 121 for allowing the cooling medium to enter the heat dissipation cavity 1112 from the receiving cavity 1111, thereby dissipating heat from the server 2. Figure 2 As shown, the top of the cabinet 110 has an opening 112. After the server 2 enters the heat dissipation cavity 1112 through the opening 112, the bottom of the server 2 will be opposite to the liquid inlet 121. The cooling medium in the receiving cavity 1111 flows upward through the liquid inlet 121 and passes through the surface of the server 2, and exchanges heat with the server 2. The cooling medium that has absorbed the heat continues to flow upward and is discharged from the heat dissipation cavity 1112 through the opening 112, thereby taking away the heat generated by the server 2.

[0046] The number and size of the liquid inlet holes 121 on the flow equalization plate 120 can be set according to the cross-sectional shape of the server 2 along the horizontal direction and the heat dissipation requirements of the server 2. For example, due to Figure 1 The server 2 shown has a long, narrow cross-section along the horizontal direction. The inlet holes 121 on the flow equalization plate 120, which are opposite to the same server 2, can be... Figure 3 As shown, they are arranged in a row along the horizontal direction. If the heat dissipation cavity 1112 is used to accommodate multiple servers 2, then multiple rows of liquid inlet holes 121 are provided on the flow equalization plate 120 so that the multiple rows of liquid inlet holes 121 correspond one-to-one with the multiple servers 2.

[0047] like Figure 2 As shown, the current limiting mechanism 130 includes an abutment 131, a baffle 132, and a transmission assembly 133. The abutment 131 is vertically and vertically mounted on the rack 110, and a first elastic member 134 is connected between the abutment 131 and the rack 110. The abutment 131 is used to abut against the server 2 entering the heat dissipation cavity 1112, and it descends and compresses the first elastic member 134 under the gravity of the server 2.

[0048] Attachment 131 can be as follows Figure 2The abutment 131, shown as being mounted on the side wall of the rack 110 and protruding upwards from the top of the rack 110, is used to abut against the mounting ears 210 of the server 2 when the server 2 enters the cooling cavity 1112. This allows for easy observation of whether the server 2 has successfully abutted against the abutment 131 during server placement, making the placement of the server 2 more convenient. Specifically, a through hole can be vertically opened at the top of the rack 110, and the abutment 131 can be slidably inserted into the through hole. Alternatively, a lifting rail can be provided on the inner side wall of the rack 110, and the abutment 131 can be mounted on the lifting rail. Of course, the abutment 131 can also be mounted on the air distribution plate 120, and abut against the bottom of the server 2 when the server 2 enters the cooling cavity 1112. The first elastic element 134 can be a spring, a sheet spring, etc.

[0049] The baffle plate 132 is slidably mounted on the flow equalization plate 120, and a second elastic element 135 connects the baffle plate 132 and the flow equalization plate 120. The sliding of the baffle plate 132 can be achieved by means of a slide rail, a ball bearing guide rail, etc. The second elastic element 135 can be a spring, an elastic rope, etc.

[0050] As an example, a slide rail 122 is fixedly provided on the flow equalization plate 120, and a baffle plate 132 is slidably provided on the slide rail 122, so that the baffle plate 132 can slide smoothly. Moreover, the slide rail 122 can constrain the movement trajectory of the baffle plate 132 and fix the baffle plate 132 to prevent the baffle plate 132 from being affected by the buoyancy and flow of the cooling medium.

[0051] Furthermore, considering that the slide rail 122 has a certain height, it may raise the baffle plate 132, creating a gap between the baffle plate 132 and the flow equalization plate 120. This could cause the cooling medium, after passing through the inlet hole 121, to enter the heat dissipation cavity 1112 through the gap between the baffle plate 132 and the flow equalization plate 120, and exit the heat dissipation cavity 1112 without passing through the heat-generating components, thus wasting the cooling medium flow. Therefore, to avoid wasting the cooling medium flow, the baffle plate 132 is also provided with a blocking part on the side facing the flow equalization plate 120. The blocking part fits against the flow equalization plate 120 and is used to cover the inlet hole 121 when the server 2 is removed from the heat dissipation cavity 1112, so that the blocking part fits against the surface around the opening of the inlet hole 121, thereby stably preventing the cooling medium from entering the heat dissipation cavity 1112 from the inlet hole 121.

[0052] The transmission assembly 133 is connected between the abutment member 131 and the baffle plate 132, so that during the lifting and lowering of the abutment member 131, the sliding of the baffle plate 132 can be controlled by the transmission assembly 133, thereby utilizing the gravity of the server 2 to control whether the baffle plate 132 covers the liquid inlet hole 121. The transmission between the abutment member 131 and the baffle plate 132 can be achieved by means of guide wheels, pull ropes, inclined planes, etc.

[0053] During the actual use of the liquid cooling device 1, the server 2, as... Figure 2 When the server 2 is located within the heat dissipation cavity 1112, the abutment 131 will compress the first elastic element 134 under the weight of the server 2. At this time, if the server 2 is moved out of the heat dissipation cavity 1112 from the opening 112, the server 2 separates from the abutment 131, and the weight exerted on the abutment 131 disappears. The abutment 131 will rise under the action of the first elastic element 134 and drive the baffle 132 to slide via the transmission assembly 133, thereby covering the liquid inlet 121. That is, the positional relationship between the baffle 132 and the liquid inlet 121 changes from... Figure 3 The structure located at the top is shown in a staggered state, transformed into Figure 3 The structure located below is in an overlapping state, preventing the cooling medium in the receiving cavity 1111 from passing through the liquid inlet 121 (where server 2 is not present) and entering the heat dissipation cavity 1112. Furthermore, when... Figure 3 When the baffle plate 132 in the upper structure slides downward to block the liquid inlet 121, the second elastic element 135 will be stretched as the baffle plate 132 slides.

[0054] When server 2 re-enters the heat dissipation cavity 1112, the abutment member 131 will re-abut against server 2 and descend under the gravity of server 2, thereby driving the transmission component 133 to move, releasing space for the baffle plate 132 to slide, allowing the baffle plate 132 to slide under the action of the second elastic member 135 and expose the liquid inlet hole 121, that is, the positional relationship between the baffle plate 132 and the liquid inlet hole 121 changes from Figure 3 The structure located below is shown in an overlapping state, which is transformed into Figure 3 The structure located at the top is staggered, so that the cooling medium in the housing cavity 1111 can pass through the liquid inlet 121 of the server 2 located above, and dissipate heat from the server above the liquid inlet 121.

[0055] In the above embodiments, by setting a shielding plate 132 on the flow equalization plate 120, when there is no server 2 at the position corresponding to the liquid inlet hole 121 on the flow equalization plate 120, the liquid inlet hole 121 can be covered by the shielding plate 132. This not only avoids the waste of cooling medium flow, but also ensures that there is a server 2 at the position corresponding to the liquid inlet hole 121 through which the cooling medium can pass. This makes the flow speed of the cooling medium after entering the heat dissipation cavity 1112 from the receiving cavity 1111 of the rack 110 through the liquid inlet hole 121 relatively close, ensuring that the server 2 in the heat dissipation cavity 1112 can be effectively cooled. Furthermore, by providing an abutment member 131 on the rack 110 for contacting the server 2, and connecting the abutment member 131 and the shield 132 together via a transmission assembly 133, when the server 2 moves out of the heat dissipation cavity 1112, the abutment member 131 can automatically drive the shield 132 via the transmission assembly 133 to cover the liquid inlet 121. When the server 2 enters the heat dissipation cavity 1112, the abutment member 131 automatically releases space for the shield 132 to slide under the gravity of the server 2, allowing the shield 132 to slide and expose the liquid inlet 121.

[0056] Regarding the implementation of the transmission component 133, this application provides one implementation method, which can be further referred to. Figure 2 and Figure 3 and further combine Figure 4 and Figure 5 , Figure 4 The diagram shows a partial structure of a liquid cooling system where the liquid inlet is exposed. Figure 5 This diagram shows a partial structure of the liquid cooling device with the liquid inlet hole covered. A flow equalization plate 120 is horizontally positioned within the liquid cooling pool 111, vertically dividing the pool into a receiving cavity 1111 and a heat dissipation cavity 1112. A shielding plate 132 is horizontally slidably mounted on the flow equalization plate 120. The transmission assembly 133 includes a first guide wheel 1331 and a pull rope 1332. The first guide wheel 1331 is rotatably mounted on the flow equalization plate 120 and located on one side of the shielding plate 132 along the horizontal direction. The two ends of the pull rope 1332 are connected to the shielding plate 132 and the abutment member 131, respectively. The middle section of the pull rope 1332 is wound around the first guide wheel 1331, such that the portion of the pull rope 1332 between the shielding plate 132 and the first guide wheel 1331 extends horizontally, while the portion between the first guide wheel 1331 and the abutment member 131 extends vertically or obliquely upwards. When the abutment 131 rises, the pull rope 1332 is tightened and pulls the baffle 132 to slide. When the abutment 131 falls, the pull rope is loosened and space is released for the baffle 132 to slide.

[0057] Specifically, with Figure 4 and Figure 5Taking the structure shown as an example, the first guide wheel 1331 is located on the left side of the baffle plate 132, and the second elastic element 135 is connected to the right side of the baffle plate 132. Figure 2 When server 2 is removed from heat dissipation cavity 1112, the abutment 131 will rise under the action of the first elastic element 134, and provide an upward pulling force to the pull rope 1332. At this time, the pull rope 1332 will be taut, and Figure 4 The vertically extending portion of the middle tension rope 1332 will move upward under the action of tension, driving the first guide wheel 1331 to rotate, thus... Figure 4 The horizontally extending portion of the pull rope 1332 moves to the left, providing a leftward pulling force to the baffle plate 132, thereby causing the baffle plate 132 to slide to the left to cover the liquid inlet 121. During this sliding process, the baffle plate 132 stretches the second elastic element 135 to the left, thus pulling the liquid cooling device 1 from... Figure 4 The structure shown is transformed into Figure 5 The structure shown.

[0058] Therefore, in Figure 5 In the structure shown, the pull cord 1332 provides a leftward pulling force to the baffle plate 132, while the second elastic element 135 provides a rightward elastic force to the baffle plate 132, so that the baffle plate 132 is balanced by forces and in a stationary state, thereby stably covering the liquid inlet 121. When the server 2 re-enters the heat dissipation cavity 1112, the abutment 131 will descend under the gravity of the server 2, and the vertical distance between the abutment 131 and the first guide wheel 1331 will decrease. The pull cord 1332 will loosen, that is, the pulling force provided by the pull cord 1332 to the baffle plate 132 will disappear or decrease, causing the baffle plate 132 to slide to the right under the action of the elastic force, exposing the liquid inlet 121, so that the cooling medium in the receiving cavity 1111 can enter the heat dissipation cavity 1112 through the liquid inlet 121. The first guide wheel 1331 can be a fixed pulley, tension wheel, etc.

[0059] The connection between the abutment 131 and the baffle 132 can also be achieved through inclined plane transmission. As an example, the transmission assembly 133 includes a first component connected to the abutment 131 and a second component connected to the baffle 132. The first component and the second component are provided with mutually cooperating inclined planes. When the abutment 131 rises, the inclined planes on the first component and the second component abut against each other, and the second component pushes the baffle 132 to slide to cover the liquid inlet 121. When the abutment 131 falls, the inclined planes on the first component and the second component separate to release space for the baffle 132 to slide.

[0060] Similarly, this application embodiment also provides an implementation method for the height-adjustable setting of the abutment member 131, such as... Figure 2 and Figure 6 As shown, Figure 6 A partial cross-sectional view of the liquid cooling device is shown. A first guide hole 113 is provided on the inner wall of the cabinet 110, and a second guide hole 114 is provided on the top of the cabinet 110. The second guide hole 114 extends vertically upwards and connects to the first guide hole 113. A stop member 131 can be vertically inserted into the second guide hole 114 and extends into the first guide hole 113, connecting with it. A second guide wheel 1333 is provided within the first guide hole 113. One end of the stop member 131 within the first guide hole 113 is connected to a pull rope 1332. The portion of the pull rope 1332 located between the stop member 131 and the first guide wheel is wound around the second guide wheel 1333. The portion of the pull rope 1332 located between the opening of the first guide hole 113 on the inner wall of the cabinet 110 and the first guide wheel 1331 extends vertically or obliquely upwards.

[0061] Specifically, as shown in the figure, when the server 2 moves out of the heat dissipation cavity 1112, the abutment 131 rises and its length extending into the first guide hole 113 decreases, while the length of the line connecting the abutment 131 and the second guide wheel 1333 increases. This requires an increase in the length of the pull rope 1332 needed within the first guide hole 113. Specifically, the portion of the pull rope 1332 between the opening of the first guide hole 113 and the first guide wheel 1331 moves upwards and smoothly enters the first guide hole 113 as the second guide wheel 1333 rotates, thereby pulling the baffle plate 132 to slide. When the server 2 enters the heat dissipation cavity 1112, the abutment 131 descends and its length extending into the first guide hole 113 increases, while the length of the line connecting the abutment 131 and the second guide wheel 1333 decreases, thus releasing part of the pull rope 1332. This portion of the pull rope 1332 provides sliding space for the baffle plate 132.

[0062] In this structure, most of the transmission component 133 is located on the flow equalization plate 120 and in the holes on the top or side wall of the cabinet 110, making the internal space of the heat dissipation cavity 1112 more concise, thereby enabling the server 2 to smoothly enter the heat dissipation cavity 1112.

[0063] To prevent the pull rope 1332 from rubbing against the wall at the opening of the first guide hole 113 when it enters the first guide hole 113, thus causing wear on the pull rope 1332, such as... Figure 2 and Figure 3As shown, the second guide wheel 1333 can be set at the opening of the first guide hole 113, and at least part of the second guide wheel 1333 is located outside the first guide hole 113, so that after the pull rope 1332 is wound around the second guide wheel 1333, there is a certain distance between it and the inner wall of the cabinet 110. This not only avoids the pull rope 1332 from being worn due to friction with the wall of the cabinet 110, but also prevents the pull rope 1332 from being affected by the friction between it and the wall of the cabinet 110 during its movement, making the movement of the pull rope 1332 smoother.

[0064] Furthermore, in order to facilitate the pulling of the rope 1332 by the abutment 131, such as Figure 2 and Figure 6 As shown, the first guide hole 113 extends obliquely upward from the opening on the inner wall of the cabinet 110 to the position where it connects with the second guide hole 114. Compared with the first guide hole 113 extending in the horizontal direction, the portion of the pull rope 1332 inside the first guide hole 113 can always extend obliquely upward, and the vertical upward pulling force provided by the abutment 131 when rising can have a larger component force acting on the pull rope 1332, thereby making it easier for the abutment 131 to pull the pull rope 1332.

[0065] Furthermore, considering the issue of uniform force distribution on the baffle 132, in some embodiments, such as Figure 1 and Figure 3 As shown, at least two abutment members 131 are provided on opposite sides of the cabinet 110. The two ends of the shield 132 are connected to at least one abutment member 131 via a transmission assembly 133. The at least two abutment members 131 are used to abut against the same server 2, and together drive the shield 132 to slide when the server 2 is removed from the heat dissipation cavity 1112.

[0066] Specifically, as shown in the figure, the baffle 132 is elongated and extends from left to right. At least one abutment 131 is provided on both the left and right sides of the cabinet 110, and the abutments 131 on the left and right sides are respectively connected to the left and right ends of the baffle 132. When the server 2 enters the heat dissipation cavity 1112, the mounting ears 210 on the left and right sides of the server 2 abut against the abutments 131 on the left and right sides of the cabinet 110, respectively. When the server 2 moves out of the heat dissipation cavity 1112, the abutments 131 on the left and right sides of the cabinet 110 jointly drive the baffle 132 to slide from both ends, ensuring that the two ends of the baffle 132 are evenly stressed, thus improving the smoothness of the sliding of the baffle 132.

[0067] Furthermore, such as Figure 3As shown, the second elastic element 135 includes multiple elements arranged at intervals. These multiple elastic elements 135 work together to slide the baffle plate 132 when the server 2 enters the heat dissipation cavity 1112, thus exposing the liquid inlet hole 121. When the server 2 moves out of the heat dissipation cavity 1112, the multiple second elastic elements 135 connected to the baffle plate 132 are stretched as the baffle plate 132 slides. Therefore, when the server 2 moves out of the heat dissipation cavity 1112, the multiple second elastic elements 135 collectively provide a greater elastic force to the baffle plate 132, thereby causing the baffle plate 132 to slide quickly and expose the liquid inlet hole 121.

[0068] According to another aspect of the embodiments of this application, a liquid cooling system is also provided. This liquid cooling system includes a cooling supply device and a liquid cooling device 1 as described in any of the above embodiments. The cooling supply device and the receiving cavity 1111 of the liquid cooling device 1 are connected via a first pipe, and the cooling supply device and the heat dissipation cavity 1112 of the liquid cooling device 1 are connected via a second pipe. The first pipe is used to supply cooling medium from the cooling supply device into the receiving cavity 1111, so that the cooling medium enters the heat dissipation cavity 1112 from the receiving cavity 1111 and dissipates heat from the server 2 within the heat dissipation cavity 1112. The second pipe is used to supply cooling medium that has absorbed heat from the heat dissipation cavity 1112 into the cooling supply device, so that the cooling supply device lowers the temperature of the cooling medium.

[0069] Considering that the heat dissipation requirements of servers 2 of different sizes and quantities may be different, sensors can also be set on the abutment 131 and connected to the controller of the liquid cooling system. This allows the controller to determine the heat dissipation requirements of the server 2 based on the sensor's detection results, and then adjust the speed at which the first pipe delivers the cooling medium to the receiving cavity 1111 in real time according to the heat dissipation requirements of the server 2, that is, change the liquid flow rate entering the heat dissipation cavity 1112, thereby further optimizing the system's heat dissipation capacity and efficiency.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A liquid cooling device, characterized by, The liquid cooling device includes: a cabinet, a flow equalization plate, and a flow limiting mechanism; The cabinet is equipped with a liquid cooling pool, and the flow equalization plate is set in the liquid cooling pool and divides the liquid cooling pool into a receiving cavity and a heat dissipation cavity. The receiving cavity is used to contain the cooling medium, and the heat dissipation cavity is used to contain the server. The flow equalization plate is provided with a liquid inlet hole, which is used to allow the cooling medium to enter the heat dissipation cavity from the receiving cavity so as to dissipate heat from the server through the cooling medium. The current limiting mechanism includes an abutment, a baffle, and a transmission assembly. The abutment is vertically and vertically mounted on the cabinet, and a first elastic member is connected between the abutment and the cabinet. The abutment is used to abut against the server entering the heat dissipation cavity, and descends and compresses the first elastic member under the gravity of the server. The baffle plate is slidably disposed on the flow equalization plate, and a second elastic element is connected between the baffle plate and the flow equalization plate; The transmission assembly is connected between the abutment and the baffle. When the server is removed from the heat dissipation cavity, the abutment rises under the action of the first elastic member and drives the baffle to slide through the transmission assembly to cover the liquid inlet hole. The second elastic member is stretched as the baffle slides. When the server enters the heat dissipation cavity, the abutment member descends and drives the transmission assembly to move, thereby releasing space for the baffle plate to slide. The baffle plate slides under the action of the second elastic member and exposes the liquid inlet hole.

2. The liquid cooling device of claim 1, wherein, The abutment is disposed on the side wall of the cabinet and protrudes upward to the top of the cabinet. The abutment is used to abut against the mounting ears on the server when the server enters the heat dissipation cavity.

3. The liquid cooling device of claim 2, wherein, The flow equalization plate is horizontally disposed in the liquid cooling pool and vertically divides the liquid cooling pool into the receiving cavity and the heat dissipation cavity. The shielding plate is horizontally slidably disposed on the flow equalization plate. The transmission assembly includes a first guide wheel and a pull rope. The first guide wheel is rotatably mounted on the flow equalization plate and located on one side of the baffle plate along the horizontal direction. The two ends of the pull rope are respectively connected to the baffle plate and the abutment. The middle section of the pull rope is wound around the first guide wheel. The portion of the pull rope between the baffle plate and the first guide wheel extends along the horizontal direction, and the portion between the first guide wheel and the abutment extends vertically or obliquely upward. As the abutment rises, the pull rope is tightened and pulls the baffle plate to slide. As the abutment descends, the pull rope is released, creating space for the baffle to slide.

4. The liquid cooling device of claim 3, wherein, A first guide hole is provided on the inner side wall of the cabinet, and a second guide hole is provided on the top of the cabinet. The second guide hole extends vertically downward and connects to the first guide hole. The abutment can be lifted and inserted into the second guide hole and extends into the first guide hole to a position where it connects with the second guide hole. A second guide wheel is provided in the first guide hole. One end of the abutment located in the first guide hole is connected to the pull rope. The part of the pull rope located between the abutment and the first guide wheel is wound around the second guide wheel. The part of the pull rope located between the opening of the first guide hole on the inner side wall of the cabinet and the first guide wheel extends vertically or inclined upwards.

5. The liquid cooling device of claim 4, wherein, The second guide wheel is disposed at the opening of the first guide hole, and at least part of the second guide wheel is located outside the first guide hole.

6. The liquid cooling device of claim 4, wherein, The first guide hole is located at the opening on the inner side wall of the cabinet and extends obliquely upward to the position where it connects with the second guide hole.

7. The liquid cooling device of claim 1, wherein, The abutment includes at least two, and is respectively disposed on opposite sides of the cabinet. The two ends of the shield are respectively connected to at least one of the abutment through the transmission assembly. At least two of the aforementioned abutments are used to abut against the same server, and together drive the shield to slide when the server moves out of the heat dissipation cavity.

8. The liquid cooling device of claim 7, wherein, The second elastic element includes multiple elements, which are arranged at intervals. The multiple second elastic elements are used together to drive the baffle to slide so that the liquid inlet hole is exposed when the server enters the heat dissipation cavity.

9. The liquid cooling device of claim 1, wherein, The flow equalization plate is fixedly provided with a slide rail, and the baffle plate is slidably provided on the slide rail; The shielding plate has a shielding part on the side facing the flow equalization plate. The shielding part is in contact with the flow equalization plate and is used to cover the liquid inlet when the server is removed from the heat dissipation cavity.

10. A liquid cooling system, characterized by, The liquid cooling system includes: a cooling device and a liquid cooling device according to any one of claims 1-9, wherein the cooling device and the receiving cavity of the liquid cooling device are connected through a first pipe, and the cooling device and the heat dissipation cavity of the liquid cooling device are connected through a second pipe; The first pipe is used to supply cooling medium from the cooling device into the receiving cavity, so that the cooling medium enters the heat dissipation cavity from the receiving cavity and dissipates heat from the server in the heat dissipation cavity; The second pipe is used to supply the cooling medium, which has absorbed heat, from the heat dissipation chamber into the cooling device, so as to reduce the temperature of the cooling medium through the cooling device.

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