A silicon wafer cassette for high temperature baking

Abstract

The utility model discloses a kind of silicon wafer cassettes for high-temperature drying, it is related to silicon wafer cassette technical field.The utility model includes cassette, the fracture is opened in the inside of cassette, the flow groove is opened in the front and back of cassette, the support boss is fixedly connected in the bottom four corners of cassette, further include: placing mechanism, the placing mechanism is set in the inside of cassette, the placing mechanism includes several locating plates and several silicon wafers.The utility model is placed mechanism by setting, specifically is to place multiple silicon wafers on the arc-shaped protrusion on locating plate in turn, by driving clamping plate to push left side, to push multiple locating plates in turn, and utilize plastic push block to slightly clamp silicon wafer, can avoid the situation of shaking, simultaneously plastic push block can increase the gap between two locating plates, make heat flow circulation better, simultaneously heat can flow from flow groove, improve flowability again, make silicon wafer drying more efficient.

Description

Technical Field

[0001] This utility model belongs to the field of silicon wafer cassette technology, and in particular relates to a silicon wafer cassette for high-temperature drying. Background Technology

[0002] Silicon wafer cassettes used for high-temperature drying are key carriers in semiconductor manufacturing, photovoltaic industry and other fields. They must meet requirements such as high temperature resistance, cleanliness, stability and process compatibility. Silicon wafer cassettes are used to hold multiple silicon wafers at the same time to facilitate subsequent drying processes.

[0003] Traditional silicon wafer cassettes typically consist of multiple partitions, with a silicon wafer placed between every two partitions. However, the partitions are usually integrated with the cassette, resulting in fixed gaps between them. This causes the silicon wafer to wobble after placement. Furthermore, the small gaps between the partitions restrict airflow, reducing drying efficiency during the drying process. Parts of the silicon wafer that need to be covered require longer drying times. Utility Model Content

[0004] The purpose of this invention is to provide a silicon wafer holder for high-temperature drying. By setting up a placement mechanism, multiple silicon wafers are sequentially placed on the arc-shaped protrusions on the positioning plates to ensure proper positioning. Then, rotating the handle clockwise drives the threaded rod, pushing the clamping plate to the left, thereby pushing the multiple positioning plates sequentially. A plastic pusher lightly clamps the silicon wafers, preventing wobbling. Simultaneously, the plastic pusher increases the gap between the two positioning plates, improving heat flow. Heat can also flow through the flow channel, further enhancing fluidity and making the silicon wafer drying process more efficient. This invention solves the problems of traditional silicon wafer holders, which typically have multiple partitions inside, causing silicon wafers to wobble after placement, and the small gaps between the partitions resulting in poor airflow and reduced drying efficiency.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution: This utility model relates to a silicon wafer cassette for high-temperature drying, comprising a wafer cassette with an internal cut, flow grooves on both the front and back sides, and support protrusions fixedly connected to the four corners of the bottom of the wafer cassette. It also includes: A placement mechanism is disposed inside a wafer cassette. The placement mechanism includes several positioning plates and several silicon wafers. A clamping plate is located on the right side of the wafer cassette, and a handle is located on the right side of the wafer cassette. A threaded rod is fixedly connected to the left side of the handle, penetrating the wafer cassette and used for threaded connection. A limit ring is fixedly connected to the right side of the clamping plate, and the left end of the threaded rod is rotatably connected inside the limit ring. Several plastic push blocks are fixedly connected to the left sides of both the clamping plate and the positioning plate. An adjustment mechanism is provided at the bottom of the film cassette, and the adjustment mechanism is used to adjust the width of the film cassette; The break extends through the positioning plate and the clamping plate, and the plastic pusher block contacts the silicon wafer on the side facing the silicon wafer. The plastic pusher block is used to lightly clamp the silicon wafer.

[0006] Furthermore, an arc-shaped protrusion is fixedly connected to the right side of the positioning plate. The arc-shaped protrusion is used to position and support the silicon wafer. Several limiting slide rods are fixedly connected to the inner wall of the wafer box. When the clamping plate moves, it will slide on the limiting slide rods to make the movement of the clamping plate more stable and avoid deviation. The arc-shaped protrusion is designed to fit the surface of the silicon wafer. The positioning plate is slidably disposed inside the wafer cassette. The limiting slide rod slides through the positioning plate and extends to the outside. The limiting slide rod is used to limit and support the positioning plate.

[0007] A protrusion 1 is fixedly connected to the rear clamping plate, and a protrusion 2 is fixedly connected to the front clamping plate. Two connecting slide rods are fixedly connected to the front of the protrusion 1. The connecting slide rods slide within the protrusion 2, which not only allows the clamping plate to adjust its width, but also allows the two clamping plates to move simultaneously. The clamping plate is integrally formed with protrusion one and protrusion two. The plate box, positioning plate and clamping plate are divided into two pieces by a break. The connecting slide rod slides through protrusion two and extends to the outside. Protrusion two is used to limit and connect the two clamping plates.

[0008] Furthermore, the adjustment mechanism includes a fixing block one and a fixing block two fixedly connected to the bottom of the tablet cassette. An adjustment rod is fixedly connected to the back of the fixing block two, and a threaded knob is threadedly connected to the bottom of the fixing block one. The adjustment rod is used to limit the movement of the tablet cassette during adjustment, so that the tablet cassette can be moved and adjusted stably. The adjusting rod slides through the fixed block and extends to the outside, and the adjusting rod is used to connect the two sheet boxes.

[0009] Furthermore, the top of the threaded knob contacts the bottom of the adjusting rod, the adjusting rod is square, and the threaded knob is used to lock and fix the adjusting rod; turning the threaded knob counterclockwise loosens the adjusting rod, allowing the film box to be extended or retracted.

[0010] This utility model has the following beneficial effects: This invention features a placement mechanism that sequentially places multiple silicon wafers onto the arc-shaped protrusions on the positioning plate to ensure proper positioning. Turning the handle clockwise rotates the threaded rod, pushing the clamping plate to the left and sequentially moving the positioning plates. A plastic pusher lightly clamps the silicon wafers, preventing wobbling. The plastic pusher also increases the gap between the two positioning plates, improving heat flow. Furthermore, the heat can flow through the flow channel, further enhancing fluidity and making the silicon wafer drying process more efficient.

[0011] This invention features an adjustment mechanism. Specifically, turning the threaded knob counterclockwise loosens the adjustment rod, allowing the wafer cassette to extend and retract. The adjustment rod slides within the first fixed block, while the connecting slide slides within the second protrusion. This not only allows for width adjustment of the clamping plates but also enables the two clamping plates to move simultaneously. Once the width of the wafer cassette is adjusted, it can be locked in place. This method is applicable to various silicon wafer sizes, meeting diverse drying requirements.

[0012] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the bottom structure of the film box of this utility model; Figure 3 This is a schematic diagram of the internal right side structure of the film box of this utility model; Figure 4 This is a schematic diagram of the left side structure of the positioning plate of this utility model; Figure 5 This is a schematic diagram of the right side structure of the positioning plate of this utility model.

[0015] The attached diagram lists the components represented by each number as follows: 1. Wafer tray; 11. Cut-off point; 12. Flow channel; 13. Supporting protrusion; 2. Placement mechanism; 21. Positioning plate; 211. Silicon wafer; 212. Limiting slide bar; 213. Plastic push block; 214. Arc-shaped protrusion; 22. Clamping plate; 221. Limiting ring; 222. Protrusion one; 223. Protrusion two; 224. Connecting slide bar; 23. Turn handle; 231. Threaded rod; 3. Adjustment mechanism; 31. Fixing block one; 32. Fixing block two; 33. Adjusting rod; 34. Threaded knob. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0017] Please see Figures 1-5 As shown, this utility model is a silicon wafer cassette for high-temperature drying, including a wafer cassette 1, with an opening 11 inside the wafer cassette 1, flow grooves 12 on both the front and back of the wafer cassette 1, and support protrusions 13 fixedly connected to the four corners of the bottom of the wafer cassette 1, and also including: Placement mechanism 2 is located inside wafer cassette 1. Placement mechanism 2 includes several positioning plates 21 and several silicon wafers 211. A clamping plate 22 is located on the right side of wafer cassette 1, and a handle 23 is located on the right side of wafer cassette 1. A threaded rod 231 is fixedly connected to the left side of the handle 23, passing through wafer cassette 1 and used for threaded connection. A limit ring 221 is fixedly connected to the right side of clamping plate 22, and the left end of the threaded rod 231 is rotatably connected inside the limit ring 221. Several plastic push blocks 213 are fixedly connected to the left sides of clamping plate 22 and positioning plates 21. Multiple wafers are placed inside the wafer cassette 1. Silicon wafers 211 are placed sequentially on the arc-shaped protrusions 214 on the positioning plates 21 to position them. Then, rotating the handle 23 clockwise rotates the threaded rod 231, pushing the clamping plate 22 to the left. This pushes the multiple positioning plates 21 sequentially, and the plastic pusher 213 lightly clamps the silicon wafers 211 to prevent wobbling. The plastic pusher 213 also increases the gap between the two positioning plates 21, improving heat flow. Heat can also flow through the flow channel 12, further enhancing flowability and making the drying of the silicon wafers 211 more efficient. Adjustment mechanism 3 is located at the bottom of wafer cassette 1 and is used to adjust the width of wafer cassette 1. The cut 11 passes through the positioning plate 21 and the clamping plate 22. The plastic push block 213 contacts the silicon wafer 211 on the side facing the silicon wafer 211 and is used to slightly clamp the silicon wafer 211. Turning the threaded knob 34 counterclockwise loosens the adjustment rod 33, at which point the wafer cassette 1 can be extended and retracted. The adjustment rod 33 will slide in the first fixing block 31. At the same time, the connecting slide rod 224 will slide in the second protrusion 223. This not only allows the clamping plate 22 to adjust its width, but also allows the two clamping plates 22 to move simultaneously. After the width of wafer cassette 1 is adjusted, it can be locked and fixed. This method can be applied to silicon wafers 211 of various sizes to meet different drying requirements.

[0018] An arc-shaped protrusion 214 is fixedly connected to the right side of the positioning plate 21. The arc-shaped protrusion 214 is used to position and support the silicon wafer 211. Several limiting slide rods 212 are fixedly connected to the inner wall of the wafer box 1. The arc-shaped protrusion 214 is arc-shaped and is used to fit the surface of the silicon wafer 211. The positioning plate 21 is slidably set inside the wafer box 1. The limiting slide rods 212 slide through the positioning plate 21 and extend to the outside. The limiting slide rods 212 are used to limit and support the positioning plate 21.

[0019] A protrusion 1 222 is fixedly connected to the rear clamping plate 22, and a protrusion 223 is fixedly connected to the front clamping plate 22. Two connecting slide rods 224 are fixedly connected to the front of the protrusion 1 222. The clamping plate 22 is integrally set with the protrusion 1 222 and the protrusion 223. The film box 1, the positioning plate 21 and the clamping plate 22 are divided into two pieces by the break 11. The connecting slide rod 224 slides through the protrusion 223 and extends to the outside. The protrusion 223 is used to limit and connect the two clamping plates 22.

[0020] The adjustment mechanism 3 includes a first fixing block 31 and a second fixing block 32 fixedly connected to the bottom of the film cassette 1. An adjustment rod 33 is fixedly connected to the back of the second fixing block 32. A threaded knob 34 is threadedly connected to the bottom of the first fixing block 31. The adjustment rod 33 slides through the first fixing block 31 and extends to the outside. The adjustment rod 33 is used to connect the two film cassettes 1.

[0021] The top of the threaded knob 34 contacts the bottom of the adjusting rod 33, which is square in shape. The threaded knob 34 is used to lock and fix the adjusting rod 33.

[0022] One specific application of this embodiment is: In use, first adjust the wafer cassette 1 to a suitable width according to the size of the silicon wafer 211. Turn the threaded knob 34 counterclockwise to loosen the adjusting rod 33. At this time, the wafer cassette 1 can be extended and retracted. The adjusting rod 33 will slide in the fixed block 31. At the same time, the connecting slide rod 224 will slide in the protrusion 223. This not only allows the clamping plate 22 to adjust its width, but also allows the two clamping plates 22 to move simultaneously. After the width of the wafer cassette 1 is adjusted, turn the threaded knob 34 clockwise to make it contact the adjusting rod 33, and then lock and fix the adjusting rod 33. At this time, the width of the wafer cassette 1 is locked and fixed. Multiple silicon wafers 211 are sequentially placed on the arc-shaped protrusions 214 on the positioning plate 21 to position them. After placement, the handle 23 is turned clockwise, causing the threaded rod 231 to rotate along with it. Simultaneously, the threaded rod 231, through the constraint of the limiting ring 221, pushes the clamping plate 22 to the left. The plastic push block 213 on the clamping plate 22 then contacts the silicon wafer 211, and the clamping plate 22 slides on the limiting slide rod 212. By continuously rotating the handle 23, the clamping plate 22 is continuously pushed, causing several positioning plates 21 to be pushed closer to each other in sequence, and the plastic push block 213 on the positioning plate 21 contacts the silicon wafer 211. This process only requires placing the silicon wafers... The wafer 211 can be lightly clamped, and the positioning plate 21 slides on the limiting slide bar 212 during movement, so that the positioning plate 21 moves stably. This method can stably place multiple silicon wafers 211 to avoid shaking. At the same time, the plastic push block 213 can increase the gap between the two positioning plates 21, so as to improve heat flow. Heat can also flow from the flow channel 12, further improving the fluidity and making the drying of silicon wafers 211 more efficient. When it is necessary to remove the silicon wafer 211, turn the handle 23 counterclockwise, and the threaded rod 231 will pull the limiting ring 221 to the right. The clamping plate 22 will move together, so that multiple positioning plates 21 can be loosened. Finally, the silicon wafer 211 can be removed.

[0023] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0024] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the present utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the present utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A silicon wafer cassette for high-temperature drying, comprising a cassette (1), wherein the cassette (1) has an opening (11) inside, flow grooves (12) are provided on both the front and back sides of the cassette (1), and support protrusions (13) are fixedly connected to the four corners of the bottom of the cassette (1), characterized in that, Also includes: Placement mechanism (2), the placement mechanism (2) is set inside the wafer cassette (1), the placement mechanism (2) includes several positioning plates (21) and several silicon wafers (211), a clamping plate (22) is set on the right side inside the wafer cassette (1), a throttle (23) is set on the right side of the wafer cassette (1), a threaded rod (231) is fixedly connected to the left side of the throttle (23), the threaded rod (231) passes through the wafer cassette (1) and is used for threaded connection of the wafer cassette (1), a limit ring (221) is fixedly connected to the right side of the clamping plate (22), the left end of the threaded rod (231) is rotatably connected to the inside of the limit ring (221), several plastic push blocks (213) are fixedly connected to the left side of the clamping plate (22) and the left side of the positioning plate (21); and Adjustment mechanism (3), which is located at the bottom of the film box (1), is used to adjust the width of the film box (1); The break (11) penetrates the positioning plate (21) and the clamping plate (22), and the plastic push block (213) contacts the silicon wafer (211) on the side facing the silicon wafer (211). The plastic push block (213) is used to lightly clamp the silicon wafer (211).

2. A silicon wafer cassette for high-temperature drying according to claim 1, characterized in that, The positioning plate (21) is fixedly connected to an arc-shaped protrusion (214) on the right side. The arc-shaped protrusion (214) is used to position and support the silicon wafer (211). Several limiting slide rods (212) are fixedly connected to the inner wall of the wafer box (1). The arc-shaped protrusion (214) is set in an arc and is used to fit the surface of the silicon wafer (211). The positioning plate (21) is slidably set inside the wafer cassette (1).

3. A silicon wafer cassette for high-temperature drying according to claim 2, characterized in that, The limiting slide bar (212) slides through the positioning plate (21) and extends to the outside. The limiting slide bar (212) is used to limit and support the positioning plate (21).

4. A silicon wafer cassette for high-temperature drying according to claim 3, characterized in that, A protrusion 1 (222) is fixedly connected to the rear clamping plate (22), and a protrusion 2 (223) is fixedly connected to the front clamping plate (22). Two connecting slide rods (224) are fixedly connected to the front of the protrusion 1 (222). The clamping plate (22) is integrally formed with protrusion one (222) and protrusion two (223), and the plate box (1), positioning plate (21) and clamping plate (22) are divided into two pieces by a break (11).

5. A silicon wafer cassette for high-temperature drying according to claim 4, characterized in that, The connecting slide bar (224) slides through the second protrusion (223) and extends to the outside. The second protrusion (223) is used to limit and connect the two clamping plates (22).

6. A silicon wafer cassette for high-temperature drying according to claim 3, characterized in that, The adjustment mechanism (3) includes a fixing block one (31) and a fixing block two (32) fixedly connected to the bottom of the tablet box (1). An adjustment rod (33) is fixedly connected to the back of the fixing block two (32), and a threaded knob (34) is threadedly connected to the bottom of the fixing block one (31). The adjusting rod (33) slides through the fixed block (31) and extends to the outside. The adjusting rod (33) is used to connect the two sheet boxes (1).

7. A silicon wafer cassette for high-temperature drying according to claim 6, characterized in that, The top of the threaded knob (34) contacts the bottom of the adjusting rod (33), which is square in shape. The threaded knob (34) is used to lock and fix the adjusting rod (33).

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