Semiconductor rod material clamping jaw rotating mechanism

Abstract

The utility model relates to the technical field of semiconductor wafer picking, in particular to semiconductor bar clamp jaw rotating mechanism. It includes the first connecting plate for with the fixed connection of clamp jaw and the second connecting plate for with the fixed connection of lifting arm, the first connecting plate is located below the second connecting plate, the lower end surface of second connecting plate is provided with fixed disc, the middle part of fixed disc is hollow and the bottom of fixed disc is open, the mouth of fixed disc is provided with rotary disc, the upper end surface of rotary disc and the inner wall surface of fixed disc form hollow cavity, the hollow cavity is provided with unloading mechanism, the lower end surface of rotary disc and the first connecting plate fixed connection, the fixed disc is provided with servo mechanism for driving rotary disc rotation, through the above technical scheme, the utility model solves the problem that semiconductor wafer picking equipment needs manual reversing of operator.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer handling technology, specifically a semiconductor rod clamping and rotating mechanism. Background Technology

[0002] In the semiconductor wafer handling process, the loading gripper of the semiconductor wafer handling equipment is a key component for automating the loading and unloading of ingots. In existing technologies, a PLC control system can be used to move the loading gripper horizontally and vertically, thereby completing the automatic loading and unloading of ingots and improving the level of automation in production to a certain extent.

[0003] However, actual wafer dicing processes require biplane dicing, meaning that both sides of the ingot must be diced separately. Current semiconductor wafer dicing equipment lacks automatic reversing capabilities in its grippers, making it impossible to change the orientation of the ingot within the grippers. Operators must manually turn the ingot around to adjust the orientation of the side to be processed. As the semiconductor industry's demands for ingot specifications continue to increase, the size and weight of the ingots are gradually growing, significantly increasing the difficulty of manual reversing operations. This not only consumes substantial labor and time costs, reducing overall production efficiency, but also poses the risk of ingot damage due to human error. Utility Model Content

[0004] To address the problems in related technologies, this invention provides a semiconductor rod clamping jaw rotation mechanism, which solves the problem of requiring operators to manually change the direction of semiconductor wafer picking equipment.

[0005] To solve the above problems, the following technical solutions are provided:

[0006] The semiconductor rod clamping and rotating mechanism of this utility model includes a first connecting plate for fixed connection with the clamping jaws and a second connecting plate for fixed connection with a lifting arm. The first connecting plate is located below the second connecting plate. A fixed disk is provided on the lower end surface of the second connecting plate. The fixed disk is hollow in the middle and open at the bottom. A rotary disk is provided at the opening of the fixed disk. A hollow cavity is formed between the upper end surface of the rotary disk and the inner wall surface of the fixed disk. An unloading mechanism is provided in the hollow cavity. The lower end surface of the rotary disk is fixedly connected to the first connecting plate. A servo mechanism for driving the rotary disk to rotate is provided on the fixed disk.

[0007] In the above solution, a servo mechanism drives the rotary table to rotate, which in turn drives the gripper to rotate, thus meeting the reversing requirements for picking up wafers from both sides of the bar stock. This eliminates the need for operators to manually turn the bar stock around, effectively reducing the difficulty and intensity of manual operation and preventing damage to the bar stock caused by manual reversing. This solves the problem of requiring manual reversing in semiconductor wafer picking equipment. The first connecting plate is fixed to the gripper, and the second connecting plate is fixed to the lifting arm, ensuring stable assembly of the gripper and the lifting arm. The unloading mechanism can bear the weight of the gripper and the bar stock, preventing the servo mechanism from being damaged by excessive load and improving the stability of the mechanism's operation.

[0008] By setting up a servo mechanism, it is easy to connect to the equipment's PLC control system and link it with the overall automated process of the semiconductor wafer picking equipment. The gripper reversal operation can be completed without additional manual intervention, further improving the level of production automation, reducing labor and time costs, and improving overall production efficiency.

[0009] Furthermore, the unloading mechanism includes a rotating shaft, and the first connecting plate and the second connecting plate are respectively provided with a first central hole and a second central hole. The rotating shaft passes through the first central hole and the second central hole, and a limiting block is fixedly provided on the section of the rotating shaft located above the second central hole.

[0010] In the above solution, the weight borne by the gripper and bar stock is transferred to the lifting arm by the rotating shaft. The weight is then directly transmitted to the second connecting plate fixed to the lifting arm through the rotating shaft. This effectively avoids the weight acting on the servo mechanism or turntable, reduces the load pressure on the servo mechanism and turntable, reduces component wear, extends service life, and solves the problem of the turntable's low axial load capacity and easy damage.

[0011] The rotating shaft passes through the first center hole and the second center hole, and is used to guide and position the first connecting plate and the second connecting plate to ensure the coaxiality and stability of the gripper during rotation.

[0012] Furthermore, thrust bearings are provided on the rotating shafts located on both sides of the first connecting plate.

[0013] In the above solution, the use of thrust bearings reduces friction and decreases the relative rotational frictional resistance between the first connecting plate and the rotating shaft. When the servo mechanism drives the rotary table to rotate the first connecting plate and the gripper, the thrust bearings can effectively prevent the first connecting plate from directly contacting and wearing the rotating shaft, ensuring that the gripper can still rotate smoothly back and forth while bearing the weight of the bar stock, ensuring the smoothness of the bar stock reversal action, and avoiding rotation jamming or component damage due to excessive friction.

[0014] Furthermore, a fixing block is fitted onto the outer wall surface of the lower part of the rotating shaft, and the upper end face of the fixing block abuts against the lower end face of the thrust bearing located below the first connecting plate.

[0015] In the above scheme, the fixed block is used to axially limit the thrust bearing and prevent it from moving up and down along the rotation axis during operation.

[0016] Furthermore, the servo mechanism includes a servo motor, which drives the rotary table to reciprocate 180°.

[0017] The above solution uses a servo motor to drive the rotary table to achieve 180° reciprocating rotation, which can accurately adapt to the reversing requirements of picking up semiconductor rods from both sides.

[0018] Furthermore, the first connecting plate is fixedly connected to the gripper by a first screw, and the second connecting plate is fixedly connected to the lifting arm by a second screw.

[0019] The above solution ensures the stability of the entire rotating mechanism by using the first and second screws.

[0020] The above solution has the following advantages:

[0021] 1. The semiconductor rod gripper rotation mechanism of this utility model, by setting a servo mechanism to drive the rotary table to rotate, and the rotary table to drive the gripper to rotate, thereby meeting the reversing requirements for picking up the rod from both sides, eliminates the need for operators to manually turn the rod around, effectively reducing the difficulty and intensity of manual operation, and avoiding damage to the rod caused by manual reversing, thus solving the problem of requiring operators to manually reverse the direction of semiconductor wafer picking equipment; fixing the first connecting plate to the gripper and the second connecting plate to the lifting arm ensures stable assembly of the gripper and the lifting arm; through the setting of the unloading mechanism, the unloading mechanism can bear the weight of the gripper and the rod, avoiding damage to the servo mechanism due to excessive load, and improving the stability of the mechanism operation.

[0022] 2. The rotating shaft is used to transfer the weight borne by the grippers and bar stock to the lifting arm. The weight is directly transmitted to the second connecting plate fixed to the lifting arm through the rotating shaft, which effectively avoids the weight acting on the servo mechanism or turntable, reduces the load pressure on the servo mechanism and turntable, reduces component wear, extends service life, and solves the problem of the turntable's low axial load capacity and easy damage. The rotating shaft passes through the first center hole and the second center hole to guide and position the first connecting plate and the second connecting plate, ensuring the coaxiality and stability of the grippers during rotation. Attached Figure Description

[0023] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings, wherein:

[0024] Figure 1This is a schematic diagram of the semiconductor rod clamping and rotating mechanism.

[0025] Figure 2 A top view of the semiconductor bar clamping mechanism;

[0026] Figure 3 A cross-sectional view of the semiconductor bar clamping mechanism;

[0027] Figure 4 for Figure 3 Enlarged diagram of section A in the middle;

[0028] Figure 5 A schematic diagram of the semiconductor rod clamping rotating mechanism, the clamps, and the lifting arm;

[0029] Explanation of reference numerals in the attached drawings: 1. Gripper; 2. First connecting plate; 3. Lifting arm; 4. Second connecting plate; 5. Fixed plate; 6. Rotary plate; 7. Rotating shaft; 8. First center hole; 9. Second center hole; 10. Limiting block; 11. Thrust bearing; 12. Fixed block; 13. Servo motor. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] In specific embodiment 1, such as Figures 1-5As shown, the semiconductor rod clamping rotation mechanism of this utility model includes a first connecting plate 2 for fixed connection with the clamping jaw 1 and a second connecting plate 4 for fixed connection with the lifting arm 3. The first connecting plate 2 is located below the second connecting plate 4. A fixed disk 5 is provided on the lower end surface of the second connecting plate 4. The fixed disk 5 is hollow in the middle and open at the bottom. A rotary disk 6 is provided at the opening of the fixed disk 5. A hollow cavity is formed between the upper end surface of the rotary disk 6 and the inner wall surface of the fixed disk 5. An unloading mechanism is provided in the hollow cavity. The lower end surface of the rotary disk 6 is fixedly connected to the first connecting plate 2. A servo mechanism for driving the rotary disk 6 to rotate is provided on the fixed disk 5. By setting a servo mechanism to drive the rotary table 6 to rotate, and the rotary table 6 to drive the gripper 1 to rotate, the reversing requirements for picking up the wafers from both sides of the bar are met. There is no need for operators to manually turn the bar around, which effectively reduces the difficulty and intensity of manual operation and avoids damage to the bar caused by manual reversing. This solves the problem of requiring operators to manually reverse the direction of semiconductor wafer picking equipment. The first connecting plate 2 is fixed to the gripper 1 and the second connecting plate 4 is fixed to the lifting arm 3 to ensure the stable assembly of the gripper 1 and the lifting arm 3. Through the setting of the unloading mechanism, the weight of the gripper 1 and the bar can be borne by the unloading mechanism, which prevents the servo mechanism from being damaged by excessive load and improves the stability of the mechanism operation.

[0032] By setting up the servo mechanism, it is easy to connect to the equipment's PLC control system and link with the overall automated process of the semiconductor wafer picking equipment. The gripper 1 reversing operation can be completed without additional manual intervention, further improving the level of production automation, reducing labor and time costs, and improving overall production efficiency.

[0033] like Figure 3 As shown, the unloading mechanism includes a rotating shaft 7. A first central hole 8 and a second central hole 9 are respectively provided on the first connecting plate 2 and the second connecting plate 4. The rotating shaft 7 passes through the first central hole 8 and the second central hole 9. A limiting block 10 is fixedly installed on the section of the rotating shaft 7 above the second central hole 9. The rotating shaft 7 is used to transfer the weight borne by the gripper 1 and the bar stock to the lifting arm 3, directly transmitting the weight to the second connecting plate 4 fixed to the lifting arm 3. This effectively prevents the weight from acting on the servo mechanism or the rotary table 6, reducing the load-bearing pressure on the servo mechanism and the rotary table 6, reducing component wear, extending service life, and solving the problem of the rotary table 6's low axial load capacity and susceptibility to damage. The rotating shaft 7, passing through the first central hole 8 and the second central hole 9, guides and positions the first connecting plate 2 and the second connecting plate 4, ensuring the coaxiality and stability of the gripper 1 during rotation.

[0034] like Figure 4As shown, thrust bearings 11 are provided on the rotating shafts 7 on both sides of the first connecting plate 2 to reduce friction and decrease the relative rotational frictional resistance between the first connecting plate 2 and the rotating shaft 7. When the servo mechanism drives the rotary table 6 to rotate the first connecting plate 2 and the gripper 1, the thrust bearings 11 can effectively prevent the first connecting plate 2 from directly contacting and wearing the rotating shaft 7, ensuring that the gripper 1 can still rotate smoothly back and forth under the weight of the bar stock, ensuring the smoothness of the bar stock reversal action, and avoiding rotation jamming or component damage due to excessive friction.

[0035] A fixing block 12 is fitted onto the outer wall of the lower part of the rotating shaft 7. The upper end face of the fixing block 12 abuts against the lower end face of the thrust bearing 11 located below the first connecting plate 2, which is used to axially limit the thrust bearing 11 and prevent the thrust bearing 11 from moving up and down along the rotating shaft 7 during operation.

[0036] like Figure 1 As shown, the servo mechanism includes a servo motor 13, which drives the rotary table 6 to rotate. It can rotate 180° back and forth, and can accurately adapt to the reversing requirements of picking up semiconductor rods from both sides.

[0037] In specific embodiment 2, the difference between this embodiment and embodiment 1 is that the first connecting plate 2 and the gripper 1 are fixedly connected by the first screw, and the second connecting plate 4 and the lifting arm 3 are fixedly connected by the second screw; the setting of the first screw and the second screw ensures the stability of the entire rotating mechanism installation.

[0038] During operation, the lifting wall moves the gripper 1 to the bar placement position, the gripper 1 closes and clamps the bar, and the lifting arm 3 moves vertically to transport the bar to the cutting station. At this time, the first side of the bar faces the cutting device. After the first side of the bar is removed, the servo motor 13 is turned on, and the servo motor 13 drives the rotary table 6 to rotate, so that the first connecting plate 2, the gripper 1 and the clamped bar rotate synchronously. The thrust bearing 11 can reduce the frictional resistance between the first connecting plate 2 and the rotating shaft 7, ensuring that the gripper 1 can still rotate smoothly while bearing the weight of the bar. The servo motor 13 precisely controls the rotation angle. When it rotates to 180°, the second side of the bar faces the cutting device, completing the automatic reversal. After the reversal, the lifting arm 3 moves the bar down and precisely positions the second side of the bar to the cutting station, thus completing the second removal. After the second removal, the gripper 1 releases the bar, and the lifting arm 3 moves the mechanism vertically upward to reset to the initial position.

[0039] In the description of this utility model, it should be understood that the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise specified and limited, it should be noted that the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components, and can be direct connections or indirect connections through an intermediate medium. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0040] Obviously, the above embodiments are merely examples for clear illustration and are not intended to limit the implementation. For those skilled in the art, other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all implementation methods here, and any obvious variations or modifications derived therefrom are still within the protection scope of this utility model.

Claims

1. A semiconductor rod clamping jaw rotation mechanism, characterized in that, The device includes a first connecting plate for fixed connection with grippers and a second connecting plate for fixed connection with a lifting arm. The first connecting plate is located below the second connecting plate. A fixing plate is provided on the lower end surface of the second connecting plate. The fixing plate is hollow in the middle and open at the bottom. A rotary table is provided at the opening of the fixing plate. A hollow cavity is formed between the upper end surface of the rotary table and the inner wall surface of the fixing plate. An unloading mechanism is provided in the hollow cavity. The lower end surface of the rotary table is fixedly connected to the first connecting plate. A servo mechanism for driving the rotary table to rotate is provided on the fixing plate.

2. The semiconductor rod clamping and rotating mechanism as described in claim 1, characterized in that, The unloading mechanism includes a rotating shaft. The first connecting plate and the second connecting plate are respectively provided with a first central hole and a second central hole. The rotating shaft passes through the first central hole and the second central hole. A limiting block is fixedly provided on the section of the rotating shaft located above the second central hole.

3. The semiconductor rod clamping and rotating mechanism as described in claim 2, characterized in that, Thrust bearings are provided on the rotating shafts located on both sides of the first connecting plate.

4. The semiconductor rod clamping and rotating mechanism as described in claim 3, characterized in that, A fixing block is fitted onto the outer wall of the lower part of the rotating shaft, and the upper end face of the fixing block abuts against the lower end face of the thrust bearing located below the first connecting plate.

5. The semiconductor rod clamping and rotating mechanism as described in claim 1, characterized in that, The servo mechanism includes a servo motor, which drives the rotary table to rotate 180° back and forth.

6. The semiconductor rod clamping and rotating mechanism as described in claim 1, characterized in that, The first connecting plate is fixedly connected to the gripper by a first screw, and the second connecting plate is fixedly connected to the lifting arm by a second screw.

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