A modular die control system

Abstract

A modular die head control system belongs to the field of thin film processing technology. It includes a host computer connected to a main controller, which is connected to the control signal input terminal of a switching device. The contacts of the switching device are connected to thermal expansion bolts. The system is characterized by: a main frame (3) being provided, within which at least one set of control modules are arranged by plug-in connection; the main controller and switching devices are located in the control circuit within the control modules; and several bolt control terminals (9) for connecting thermal expansion bolts are provided on the surface of the control modules. In the modular die head control system of this application, the control modules are installed in the main frame by plug-in connection, and bolt control terminals for connecting thermal expansion bolts are provided on the control modules, enabling centralized control of the thermal expansion bolts at the lip, so as to accurately control and provide feedback on the state of the thermal expansion bolts.

Description

Technical Field

[0001] A modular die head control system, belonging to the field of thin film processing technology. Background Technology

[0002] In many fields, such as lithium batteries, thin-film structures are required as raw materials. If there is uneven thickness during film forming, defects such as tensile deformation may occur in areas with large lateral thickness deviations. Therefore, a key quality issue in thin-film production is how to improve and stabilize the control precision of film thickness. In existing casting film and casting biaxially stretched film equipment, film thickness is achieved through the die head: the lip opening of the die head determines the film thickness. Thermal expansion bolts are installed at the lip position of the die head. By controlling the displacement of the thermal expansion bolts at different positions of the lip, the lateral uniformity of the film thickness can be controlled.

[0003] The specific control process is as follows: the controller converts the thickness deviation measured by the thickness gauge into a temperature compensation value, and then the controller controls the heating power of the thermal expansion bolt to adjust the temperature of the thermal expansion bolt, thereby achieving the adjustment of the film thickness of the section corresponding to the bolt. This is similar to the technical solutions described in Chinese invention patents, application number 201910845719.8 (application date May 28, 2017) entitled "A Film Thickness Control System" and application number 201710429919.6 (application date May 28, 2017) entitled "A Film Thickness Monitoring System Based on Bolt Self-Positioning".

[0004] However, in existing technologies, the general research direction for film thickness control is on how to implement control strategies for thermal expansion bolts. However, in practical applications, the following problems have been found: Currently, the conventional spacing of thermal expansion bolts at the die lip is 25.4mm. When the film width is wide, the number of thermal expansion bolts at the die lip is enormous. Therefore, in existing technologies, the wiring between each thermal expansion bolt and the control cabinet is quite complicated, and it is difficult to detect when a thermal expansion bolt experiences a fault such as a broken wire. Therefore, designing a technical solution that can centrally control the thermal expansion bolts at the lip to accurately control and provide feedback on the status of the thermal expansion bolts has become an urgent problem to be solved in this field. Utility Model Content

[0005] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a modular die head control system in which the control module is installed in the main frame in a plug-in form, and the control module is provided with bolt control terminals for connecting thermal expansion bolts, so as to centrally control the thermal expansion bolts at the lip, and accurately control and provide feedback on the state of the thermal expansion bolts.

[0006] The technical solution adopted by this utility model to solve its technical problem is as follows: the modular mold head control system includes a host computer, which is connected to a main controller. The main controller is connected to the control signal input terminal of the switching device, and the contacts of the switching device are connected to the thermal expansion bolts. The feature is that a main frame is provided, and at least one set of control modules is arranged in the main frame by plugging in. The main controller and the switching device are set in the control circuit in the control module. Several bolt control terminals for connecting the thermal expansion bolts are provided on the surface of the control module.

[0007] Preferably, each control module includes a main control board plugged into the main frame and at least one slave control board, with the main control board and slave control board connected to the main frame.

[0008] Preferably, the main controller is arranged on the main control board, and switching devices are arranged on both the main control board and the slave control board. The main controller is connected to the control signal input terminals of the switching devices on both the main control board and the slave control board.

[0009] Preferably, the main control board is also equipped with a bus communication module in its control circuit. The main control board in the control module is connected to the host computer in the form of a bus through the bus communication module.

[0010] Preferably, indicator lights are provided on the front face of the main control board and the slave control board to correspond one-to-one with the thermal expansion bolts and to display the working status of the thermal expansion bolts.

[0011] Preferably, fixing plates are provided on both sides of the main frame, and fixing holes are provided on the surface of the fixing plates.

[0012] Preferably, the switching device is a relay, the main controller is connected to the control signal input terminal of the relay through the relay drive circuit, and the output terminal of the relay is connected to the power supply circuit of the thermal expansion bolt.

[0013] Preferably, the relay is an electronic solid-state relay.

[0014] Preferably, several heat dissipation holes are also provided on the upper and lower end faces of the main frame.

[0015] Compared with the prior art, the beneficial effects of this utility model are: In the modular die head control system of this application, the control module is installed in the main frame in a plug-in manner, and a bolt control terminal for connecting the thermal expansion bolt is provided on the control module, which can centrally control the thermal expansion bolt at the lip so as to accurately control and provide feedback on the status of the thermal expansion bolt.

[0016] In the modular mold head control system of this application, heat dissipation holes on the upper and lower surfaces of the main frame are used to cooperate with heat dissipation equipment (such as cooling fans) in the control cabinet to dissipate heat from the main control board and the slave control board.

[0017] Fixing plates are installed on both sides of the main frame to facilitate fixing the main frame in the control cabinet.

[0018] The main control board in all control modules is connected to the host computer via its internal bus communication module in the form of a bus, so as to facilitate the serial connection of all control modules.

[0019] Indicator lights are provided to easily display the working status of the thermal expansion bolts. Attached Figure Description

[0020] Figure 1 This is a front view of a modular die head control system.

[0021] Figure 2 for Figure 1 Rear view.

[0022] Figure 3 for Figure 1 Top view.

[0023] Figure 4 This is a schematic diagram of the control network connection for a modular mold head control system.

[0024] Figure 5 This is a block diagram of the control principle of the main control board for a modular mold head control system.

[0025] Figure 6 The modular mold head control system is shown in the block diagram of the control board control principle.

[0026] The components include: 1. Fixing plate; 2. Main control board; 3. Main frame; 4. Slave control board; 5. Indicator light; 6. Network interface; 7. Buckle; 8. Control power terminal; 9. Bolt control terminal; 10. Working power terminal; 11. Heat dissipation hole. Detailed Implementation

[0027] Figures 1-6 This is the preferred embodiment of the present invention, which is described below in conjunction with the appendix. Figures 1-6 The present invention will be further described below.

[0028] like Figures 1-3 As shown, a modular mold head control system (hereinafter referred to as the mold head control system) includes a main frame 3, which is a rectangular frame with open front and rear ends. A fixing plate 1 is vertically arranged on the side of the front and rear ends of the main frame 3. Fixing holes are provided on the surface of the four fixing plates 1 in total, so as to fix the main frame 3 in the fixing cabinet (not shown in the figure).

[0029] The main frame 3 contains several slots and guide rails. Control boards are inserted into the slots. In this mold head control system, the control boards installed in the slots include a main control board 2 and a slave control board 4. The front and rear panels of the main control board 2 and the slave control board 4 have the same structure. A circuit board for the main control board 2 is located between the front and rear panels of the main control board 2, and a circuit board for the slave control board 4 is located between the front and rear panels of the slave control board 4. Each circuit board of the main control board 2 is connected to at least one circuit board of the slave control board 4 within the main frame 3 and communicates with it.

[0030] Buckles 7 are provided at the top and bottom ends of the front panels of the main control board 2 and the slave control board 4, respectively. After the main control board 2 and the slave control board 4 are inserted into the corresponding slots in the main frame 3, they are fixed by the buckles 7. Several heat dissipation holes 11 are provided on the top and bottom surfaces of the main frame 3. The heat dissipation holes 11 on the top and bottom surfaces of the main frame 3, together with the heat dissipation equipment (such as cooling fans) in the control cabinet, are used to dissipate heat from the main control board 2 and the slave control board 4.

[0031] In this control system, the main control board 2 is connected to two slave control boards 4 within the main frame 3. The main control board 2 and the two slave control boards 4 connected to it form a control module. The only difference between the main control board 2 and the slave control boards 4 is that the main control board 2 has a network interface 6 on its front end, which is used to connect the control module to the bus. Specifically, the network interface 6 includes a bus input port and a bus output port. The bus input port of the main control board 2 in the first control module is connected to the bus in the control cabinet. The bus output port of the main control board 2 in the first control module is connected to the bus input port of the main control board 2 in the next control module, and so on. The bus output port of the main control board 2 in the last control module in the main frame 3 is connected to the bus input port of the main control board 2 in the first control module in the next main frame 3 in the control cabinet, thus realizing the connection between all control modules in the control cabinet and the bus.

[0032] In the mold head control system, the EtherCAT bus protocol, which is well-known in the field, is adopted, combined with... Figure 4 The host computer is connected to the bus and connected to all control modules in the control cabinet through the bus. The main control board 2 and the slave control board 4 in the control cabinet are respectively connected to the thermal expansion bolts at the lip of the mold head.

[0033] A control power terminal 8 is provided on the upper part of the rear end face of the main control board 2 and the slave control board 4. This terminal is used to connect to a 220V AC power supply. A bolt control terminal 9 is provided below the control power terminal 8, which is connected to the corresponding thermal expansion bolt at the die lip. Multiple thermal expansion bolts can be connected to the main control board 2 and the slave control board 4 respectively. Multiple indicator lights 5 are also provided on the front end face of the main control board 2 and the slave control board 4, corresponding to each connected thermal expansion bolt. These indicator lights indicate the working status of the corresponding thermal expansion bolt connected to the main control board 2 and the slave control board 4. A working power terminal 10 is also provided below the bolt control terminal 9, through which a 24V DC power supply is connected to provide working power to the main control board 2 and the slave control board 4.

[0034] The control circuit of the main control board 2 is set on the circuit board inside the main control board 2, such as Figure 5 As shown, the control circuit of the main control board 2 includes a main controller. A bus communication module is connected to the input / output ports of the main controller, and the main controller is connected to the bus through the bus communication module. Several relays are also connected to the signal output terminals of the main controller through corresponding relay drive circuits. The output terminals of the relay drive circuits are connected to the control signal input terminals of the relays to drive the relays to operate. The output terminals of the relays are connected to the power supply circuit of the thermal expansion bolts.

[0035] The relay is implemented using an electronic solid-state relay known in the art, and the relay driving circuit is a corresponding solid-state relay driving circuit. The solid-state relay corresponds one-to-one with the thermal expansion bolt, and the output terminal of the solid-state relay is connected to the power supply circuit of the thermal expansion bolt.

[0036] Specifically: The live wire L (or neutral wire N) of the AC power supply is directly connected to one end of the power supply port of the thermal expansion bolt. The neutral wire N (or live wire L) of the 220V AC power supply connected through the control power terminal 8 is connected to one end of the output terminal (equivalent to the normally open or normally closed contact in a mechanical relay) of all solid-state relays. The other end of the output terminal is output through the bolt control terminal 9 and connected to the other end of the corresponding thermal expansion bolt power supply port. Thus, the output terminal is connected to the power supply circuit of the thermal expansion bolt. When the main controller drives the corresponding solid-state relay to operate, it connects or disconnects the power supply circuit of the corresponding thermal expansion bolt, thereby controlling the power of the thermal expansion bolt. The indicator light 5 mentioned above is also connected to the power supply circuit of the thermal expansion bolt to display the on / off status of the thermal expansion bolt.

[0037] like Figure 6 As shown, the control circuit of control board 4 includes several solid-state relays and a solid-state relay control circuit corresponding to each solid-state relay. Figure 5The connection method shown is the same. The signal output terminal of the main controller is directly driven by the solid-state relay circuit. The solid-state relays in the control board 4 are also connected one-to-one with the thermal expansion bolts, and their contacts are connected to the power supply circuit of the thermal expansion bolts.

[0038] The specific working process and working principle are as follows: The film is output through the lip of the die head, and the thickness of the film measured by the thickness gauge is sent to the host computer. The host computer obtains the thickness deviation of the film based on the data measured by the thickness gauge, and then the host computer confirms the position of the thermal expansion bolt at the lip where the thickness deviation occurs through its internal software.

[0039] Then, the host computer sends the control signal to the corresponding main control board 2 via the bus. After receiving the control signal from the host computer, the main controller in the main control board 2 sends a control signal to the solid-state relay of the corresponding thermal expansion bolt. After receiving the level signal output by the main controller, the solid-state relay drive circuit of the corresponding solid-state relay controls the output terminal of the solid-state relay to operate, thereby connecting or disconnecting the power supply circuit of the corresponding thermal expansion bolt, realizing the control of the power of the thermal expansion bolt, and achieving the effect of changing the film thickness.

[0040] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.

Claims

1. A modular mold head control system, comprising a host computer connected to a main controller, the main controller connected to the control signal input terminal of a switching device, and the output terminal of the switching device connected to a thermal expansion bolt, characterized in that: A main frame (3) is provided, and at least one set of control modules is arranged in the main frame (3) by plugging in. The main controller and switching devices are set in the control circuit in the control module. Several bolt control terminals (9) for connecting thermal expansion bolts are provided on the surface of the control module.

2. The modular mold head control system according to claim 1, characterized in that: Each control module includes a main control board (2) plugged into the main frame (3) and at least one slave control board (4), with the main control board (2) and the slave control board (4) connected in the main frame (3).

3. The modular mold head control system according to claim 2, characterized in that: The main controller is located on the main control board (2). Switching devices are arranged on both the main control board (2) and the slave control board (4). The main controller is connected to the control signal input terminals of the switching devices on both the main control board (2) and the slave control board (4).

4. The modular mold head control system according to claim 2, characterized in that: The main control board (2) is also equipped with a bus communication module in its control circuit. The main control board (2) in the control module is connected to the host computer in the form of a bus through the bus communication module.

5. The modular mold head control system according to claim 2, characterized in that: Indicator lights (5) are provided on the front surfaces of the main control board (2) and the slave control board (4) to correspond one-to-one with the thermal expansion bolts and to display the working status of the thermal expansion bolts.

6. The modular mold head control system according to claim 1, characterized in that: Fixing plates (1) are provided on both sides of the main frame (3), and fixing holes are provided on the surface of the fixing plates (1).

7. The modular mold head control system according to claim 1, characterized in that: The switching device is a relay. The main controller is connected to the control signal input terminal of the relay through the relay drive circuit, and the output terminal of the relay is connected to the power supply circuit of the thermal expansion bolt.

8. The modular mold head control system according to claim 7, characterized in that: The relay is an electronic solid-state relay.

9. The modular mold head control system according to claim 1, characterized in that: Several heat dissipation holes (11) are also provided on the upper and lower end faces of the main frame (3).

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