A bottom-lifting automatic adhesive paper tearing mechanism

Abstract

This utility model discloses a bottom-lifting automatic adhesive tape peeling mechanism, which includes an adhesive tape peeling component, a waste adhesive tape recycling component, a vertical mounting plate, a lifting movable plate, and a lifting drive component for driving the lifting movable plate. The waste adhesive tape recycling component includes a recycling drive motor, a recycling driven wheel, a recycling drive wheel, and several tape guide wheels respectively mounted on the lifting movable plate. The adhesive tape peeling component includes a lifting drive cylinder, an adhesive tape clamping drive cylinder, and an adhesive tape pressing drive cylinder. The driving end of the adhesive tape clamping drive cylinder is equipped with an adhesive tape clamping block, the driving end of the lifting drive cylinder is equipped with an adhesive tape push rod, and the driving end of the adhesive tape pressing drive cylinder is equipped with an adhesive tape pressing head. The tape guide wheels guide the tape to pass under the adhesive tape pressing head with the adhesive surface facing down. The tooling fixture has a vertical through hole at the PI adhesive tape pasting position. Through the above structural design, this utility model has a novel structural design, high adhesive tape peeling efficiency, and is effectively applicable to the adhesive tape peeling operation of circuit boards.

Description

Technical Field

[0001] This utility model relates to the technical field of adhesive paper tearing devices, and in particular to a bottom-lifting automatic adhesive paper tearing mechanism. Background Technology

[0002] One method for mounting and securing PCB or FPC circuit boards to a fixture is through high-temperature adhesive tape bonding. This involves using PI adhesive tape (high-temperature resistant polyimide tape) to bond the PCB or FPC circuit board to the fixture. During this process, a portion of the PI tape adheres to the PCB or FPC circuit board, while another portion adheres to the surface of the fixture.

[0003] After the PCB or FPC circuit board is processed, it needs to be removed from the tooling fixture. During this process, the PI adhesive tape needs to be peeled off in multiple locations. The traditional manual method of peeling off the adhesive tape is obviously time-consuming, labor-intensive, and inefficient.

[0004] It should be noted that Chinese invention patent application number 202510285680.4, entitled "A Paper-Tearing Device and Carding Production Line," discloses a paper-tearing device. Specifically, the paper-tearing device discloses the following technical solution: the device includes a conveying mechanism, a paper-tearing mechanism, a translation component, and a waste paper recycling device; the paper-tearing mechanism is located above the conveying mechanism and includes a fixed base, a lifting drive component, a mounting block, a pressure roller, a scraper, a clamping component, and a pushing drive component. The lifting drive component is vertically mounted on the fixed base. The mounting block is fixedly mounted on the bottom end of the telescopic rod of the lifting drive component. The pressure roller and scraper are both located on the bottom end of the mounting block and are kept flush. The pushing drive component is fixedly mounted on the mounting block. The clamping component consists of a rotating part, a clamping part, and a push rod part. The rotating part is rotatably connected to the bottom end of the mounting block, and the push rod part is hinged to the telescopic rod of the pushing drive component. The clamping component, under the action of the driving component, makes the clamping part abut against the scraper block; the waste adhesive paper recycling device includes a plate frame, a driving mechanism, a collecting cylinder, a tape roll, a bonding platform, and a pressure adjustment mechanism. The plate frame is rotatably equipped with a collecting roller, a discharging roller, and several guide rollers. Mounting cakes are fixedly installed on both the collecting roller and the discharging roller. The collecting cylinder is sleeved around the mounting cakes fixed on the collecting roller, and the tape roll is sleeved around the mounting cakes fixed on the discharging roller. The tape in the tape roll is wound around the periphery of each guide roller, passes through the pressure adjustment mechanism, and is wound around the collecting cylinder. The bonding platform is fixedly installed between the two guide rollers. The bonding platform is located below the tape and supports the tape. Waste adhesive paper is pasted onto the tape above the bonding platform.

[0005] It should be noted that, in the above-mentioned adhesive paper tearing device, during its operation, the adhesive paper is first torn off by the adhesive paper tearing structure. When the adhesive paper tearing mechanism is working, when it is necessary to tear the adhesive paper on the conveyor mechanism, the telescopic rod of the lifting drive extends, so that the bottom end of the pressure roller and the bottom end of the scraper block simultaneously abut against the paper. As the paper continues to be conveyed on the conveyor belt, the scraper block scrapes off the adhesive paper on the paper. Then, the telescopic rod of the swing cylinder extends, so that the clamping member rotates along the mounting block, causing the clamping part of the clamping member to move towards the scraper block until the clamping part and the scraper block clamp the scraped adhesive paper. As the conveyor mechanism continues to convey the paper, the adhesive paper on the paper is torn off. After the adhesive paper tearing mechanism tears off the adhesive paper on the paper, the translation module drives the adhesive paper tearing mechanism to move, placing the torn waste adhesive paper at the waste adhesive paper recycling device, which then recycles the torn waste adhesive paper.

[0006] It should be noted that the above-mentioned adhesive paper tearing device has the following defects, specifically: Defect 1: The adhesive paper tearing mechanism and the waste adhesive paper recycling device are two separate parts, resulting in poor structural compactness. After the adhesive paper tearing mechanism tears off the adhesive paper, it needs to be moved and the torn adhesive paper needs to be transferred to the waste adhesive paper recycling device for recycling. This action method will affect the efficiency of the adhesive paper tearing operation, that is, there is a problem of low adhesive paper tearing efficiency. Defect 2: The adhesive paper tearing mechanism of this adhesive paper tearing device separates the adhesive paper from the cardboard by scraping. This scraping method is obviously not suitable for PCB circuit boards or FPC circuit boards. Utility Model Content

[0007] The purpose of this utility model is to provide a bottom-lifting automatic adhesive tape tearing mechanism to address the shortcomings of the existing technology. This bottom-lifting automatic adhesive tape tearing mechanism has a novel structural design, high adhesive tape tearing efficiency, and can be effectively applied to adhesive tape tearing operations on PCB circuit boards or FPC circuit boards.

[0008] To achieve the above objectives, this utility model is implemented through the following technical solution.

[0009] A bottom-lifting automatic adhesive tape tearing mechanism is used to tear PI adhesive tape from a tooling fixture or a circuit board, wherein the circuit board is a PCB circuit board or an FPC circuit board. The bottom-lifting automatic tape-tearing mechanism includes a tape-peeling component and a waste tape recycling component. The waste tape recycling component includes a recycling drive motor, a recycling driven wheel for placing the tape roll, a recycling drive wheel driven by the recycling drive motor, and several tape guide wheels for guiding the movement of the tape. The bottom-lifting automatic adhesive paper tearing mechanism also includes a vertically arranged vertical mounting plate and a lifting movable plate. The vertical mounting plate is equipped with a lifting drive component corresponding to the lifting movable plate, and the driving end of the lifting drive component is connected to the lifting movable plate. The recovery drive motor is screwed onto the lifting movable plate, and the recovery drive wheel and recovery driven wheel are rotatably mounted on the lifting movable plate. The adhesive tape peeling assembly includes a lifting drive cylinder mounted on the lower end of a vertical mounting plate and moving vertically, and an adhesive tape clamping drive cylinder mounted on a lifting movable plate and moving horizontally back and forth. The drive end of the adhesive tape clamping drive cylinder is equipped with an adhesive tape clamping block, and the drive end of the lifting drive cylinder is equipped with a vertically arranged adhesive tape push rod. The lifting movable plate is equipped with a vertically moving adhesive tape pressing drive cylinder on the front side of the adhesive tape clamping drive cylinder, and the drive end of the adhesive tape pressing drive cylinder is equipped with an adhesive tape pressing head located on the front side of the adhesive tape clamping block. The recovery drive wheel and recovery driven wheel are located on the upper side of the adhesive tape pressure head, and the tape guide wheel guides the tape to pass under the adhesive tape pressure head with the adhesive side facing down; The tooling fixture has a vertical through hole at the PI adhesive tape pasting position.

[0010] The adhesive tape press head is equipped with an auxiliary mounting plate. The auxiliary mounting plate is slidably mounted with an auxiliary lifting plate via a guide rail slider pair. The lower end of the auxiliary lifting plate is equipped with a circuit board pressure plate. The circuit board pressure plate is provided with two pressure plate heads arranged at left and right intervals. One pressure plate head is located on the left side of the adhesive tape press head, and the other pressure plate head is located on the right side of the adhesive tape press head. A spring assembly is installed between the auxiliary lifting plate and the auxiliary mounting plate.

[0011] The spring assembly includes a vertically arranged limiting bolt and a limiting block screwed onto the upper end of the auxiliary mounting plate and located on the upper side of the auxiliary lifting plate. The limiting block has a vertically penetrating bolt mounting hole corresponding to the limiting bolt. The threaded part of the limiting bolt passes through the bolt mounting hole from top to bottom and is connected to the upper end of the auxiliary lifting plate. The large end of the limiting bolt is located on the upper side of the limiting block. A compression spring is fitted around the limiting bolt. The upper end of the compression spring elastically abuts against the limiting plate, and the lower end of the compression spring elastically abuts against the auxiliary lifting plate.

[0012] The lifting drive component includes a lifting drive cylinder screwed onto the upper end of the vertical mounting plate and capable of lifting. The drive end of the lifting drive cylinder is connected to the lifting movable plate, and a guide rail slider pair is installed between the cylinder body of the lifting drive cylinder and the lifting movable plate.

[0013] The adhesive tape clamping block has a vertical through-hole top rod clearance groove in the middle that opens forward.

[0014] The drive end of the adhesive tape clamping drive cylinder is equipped with a horizontal movable bracket, and the adhesive tape clamping block is installed on the horizontal movable bracket.

[0015] The drive end of the adhesive tape pressing drive cylinder is equipped with a vertical movable bracket, and the adhesive tape pressing head is mounted on the vertical movable bracket.

[0016] Compared with the prior art, the present invention has the following advantages: the bottom lifting automatic adhesive paper tearing mechanism of the present invention can automatically and efficiently perform adhesive paper tearing operations; compared with the prior art, the bottom lifting automatic adhesive paper tearing mechanism of the present invention has the advantages of novel structural design and high adhesive paper tearing efficiency, and can be effectively applied to adhesive paper tearing operations on PCB circuit boards or FPC circuit boards. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention.

[0018] Figure 1 This is a schematic diagram of the structure of this utility model.

[0019] Figure 2 This is a structural schematic diagram from another perspective of the present invention.

[0020] Figure 3 This is a structural schematic diagram from another perspective of the present invention.

[0021] Figure 4 for Figure 3 A magnified view of a portion of the image.

[0022] Figure 5 This is a structural schematic diagram from another perspective of the present invention.

[0023] Figure 6 This is a partial structural diagram of the adhesive paper of this utility model.

[0024] exist Figures 1 to 6 This includes: 11-Recycling drive motor; 12-Tape roll; 121-Tape; 13-Recycling driven wheel; 14-Recycling drive wheel; 15-Tape guide wheel; 2-Vertical mounting plate; 3-Lifting movable plate; 4-Lifting drive component; 41-Lifting drive cylinder; 51-Top lifting drive cylinder; 52-Adhesive paper clamping drive cylinder; 53-Adhesive paper clamping block; 531-Top rod clearance groove; 54-Adhesive paper top rod; 55-Adhesive paper pressing drive cylinder; 56-Adhesive paper pressing head; 57-Horizontal movable bracket; 58-Vertical movable bracket; 61-Auxiliary mounting plate; 62-Auxiliary lifting plate; 63-Circuit board pressure plate; 631-Pressure plate pressure head; 641-Limit bolt; 642-Limit block; 643-Compression spring; 7-PI adhesive paper; 8-Circuit board; 9-Tooling fixture; 91-Through hole. Detailed Implementation

[0025] The present invention will now be described in conjunction with specific embodiments.

[0026] Example 1, as Figure 1 , Figure 2 , Figure 3 as well as Figure 5 As shown, a bottom-lifting automatic adhesive tape tearing mechanism is used to tear PI adhesive tape 7 from a tooling fixture 9 and a circuit board 8, where the circuit board 8 is a PCB circuit board or an FPC circuit board. The bottom-lifting automatic adhesive tape tearing mechanism includes an adhesive tape peeling component and a waste adhesive tape recycling component. The waste adhesive tape recycling component includes a recycling drive motor 11, a recycling driven wheel 13 for placing the tape roll 12, a recycling drive wheel 14 driven by the recycling drive motor 11, and several tape guide wheels 15 for guiding the movement of the tape 121.

[0027] Furthermore, such as Figure 1 , Figure 2 , Figure 3 as well as Figure 5 As shown, the bottom-lifting automatic adhesive paper tearing mechanism also includes a vertical mounting plate 2 and a lifting movable plate 3 arranged vertically. The vertical mounting plate 2 is equipped with a lifting drive component 4 corresponding to the lifting movable plate 3. The driving end of the lifting drive component 4 is connected to the lifting movable plate 3. The recovery drive motor 11 is screwed onto the lifting movable plate 3, and the recovery drive wheel 14 and the recovery driven wheel 13 are rotatably mounted on the lifting movable plate 3.

[0028] Furthermore, such as Figures 1 to 6As shown, the adhesive tape peeling assembly includes a lifting drive cylinder 51 mounted on the lower end of the vertical mounting plate 2 and moving vertically, and an adhesive tape clamping drive cylinder 52 mounted on the lifting movable plate 3 and moving horizontally back and forth. The drive end of the adhesive tape clamping drive cylinder 52 is equipped with an adhesive tape clamping block 53, and the drive end of the lifting drive cylinder 51 is equipped with a vertically arranged adhesive tape push rod 54. The lifting movable plate 3 is equipped with a vertically moving adhesive tape pressing drive cylinder 55 on the front end side of the adhesive tape clamping drive cylinder 52, and the drive end of the adhesive tape pressing drive cylinder 55 is equipped with an adhesive tape pressing head 56 located on the front end side of the adhesive tape clamping block 53.

[0029] The active recycling wheel 14 and the driven recycling wheel 13 are located on the upper side of the adhesive tape pressure head 56, and the tape guide wheel 15 guides the tape 121 to pass under the adhesive tape pressure head 56 with the adhesive side facing down.

[0030] It should be noted that, as Figure 6 As shown, the tooling fixture 9 has a vertical through hole 91 at the position where the PI adhesive paper 7 is pasted.

[0031] The following is a detailed description of the bottom-lifting automatic adhesive paper tearing mechanism in Embodiment 1, with reference to its specific working process. The working process includes the following steps: Step a: Install the tape roll 12 onto the recycling driven wheel 13, and peel off the tape 121 from the tape roll 12 and pass the tape 121 through several tape guide wheels 15 before sticking it onto the recycling drive wheel 14, so as to ensure that the tape 121 passes under the tape pressure head 56 and that the adhesive side of the tape 121 located under the tape pressure head 56 faces down; Step b: After the tape 121 is wound, the tool 9 carrying the circuit board 8 moves to the tape tearing position. Step c: The lifting drive component 4 drives the lifting movable plate 3 to move down, and the lifting drive plate drives the adhesive peeling component and the waste adhesive recycling component to move down simultaneously. Step d: After the lifting drive component 4 drives the lifting movable plate 3 to move down to the position, the adhesive tape pressing drive cylinder 55 is activated and drives the adhesive tape pressing head 56 to move down to the pressing position. During this process, the adhesive tape pressing head 56 presses and pulls the tape 121, causing the recovery driven wheel 13 to release the tape 121, and the tape 121 pressing head down against the part of the PI adhesive tape 7 pasted on the circuit board 8. Step e: After the adhesive tape press head 56 presses the portion of the PI adhesive tape 7 that is pasted on the circuit board 8, the lifting drive cylinder 51 is activated and the lifting drive cylinder 51 drives the adhesive tape push rod 54 to move upward. The upward-moving adhesive tape push rod 54 passes through the through hole 91 of the tooling fixture from bottom to top, so that the portion of the PI adhesive tape 7 that is pasted on the tooling fixture 9 is pushed upward and peeled off from the surface of the tooling fixture 9. Step f: After the portion of the PI adhesive tape 7 that is stuck to the surface of the tooling fixture 9 is pushed up, the adhesive tape clamping drive cylinder 52 is activated, and the adhesive tape clamping drive cylinder 52 pushes the adhesive tape clamping block 53 forward. The adhesive tape clamping block 53 presses the lifted portion of the PI adhesive tape 7 forward, and makes the lifted portion of the PI adhesive tape 7 stick to the adhesive tape recycling tape 121. Step g: After the adhesive tape clamping block 53 attaches the portion of the PI adhesive tape 7 originally stuck to the surface of the tooling fixture 9 to the tape 121, the lifting drive component 4 drives the lifting movable plate 3 to move upward. The upward-moving lifting movable plate 3 drives the adhesive tape peeling component and the waste adhesive tape recycling component to move upward synchronously. During this process, the adhesive tape clamping block 53 keeps pressing the PI adhesive tape 7. As the lifting movable plate 3 moves upward, the portion of the PI adhesive tape 7 stuck to the circuit board 8 is gradually peeled off from the circuit board 8 until the PI adhesive tape 7 is completely peeled off from the surface of the circuit board 8. Step h: After the PI adhesive paper 7 is completely peeled off, the adhesive paper clamping drive cylinder 52 drives the adhesive paper clamping block 53 to move backward and reset. At this time, the adhesive paper clamping block 53 retracts from the PI adhesive paper 7 and causes the PI adhesive paper 7 to remain on the tape 121. Step i: The adhesive tape pressing drive cylinder 55 is activated and drives the adhesive tape pressing head 56 to move upward and reset. As the adhesive tape pressing head 56 moves upward, the tape 121 that was originally pulled by the adhesive tape pressing head 56 is released. The recycling drive motor 11 drives the recycling drive wheel 14 to rotate. The rotating recycling drive wheel 14 winds up the tape 121. The tape 121 carries the peeled PI adhesive tape 7 and is wound up to realize the waste adhesive tape recycling operation.

[0032] In summary, through the above structural design, the bottom-lifting automatic tape-tearing mechanism of this embodiment can automatically and efficiently perform tape-tearing operations. Compared with the prior art, the bottom-lifting automatic tape-tearing mechanism of this embodiment has the advantages of novel structural design and high tape-tearing efficiency, and can be effectively applied to the tape-tearing operations of PCB circuit boards or FPC circuit boards.

[0033] Example 2, as Figure 1 , Figure 3 as well as Figure 5 As shown, the difference between this embodiment 2 and embodiment 1 is that: the adhesive tape press head 56 is equipped with an auxiliary mounting plate 61, the auxiliary mounting plate 61 is slidably mounted with an auxiliary lifting plate 62 via a guide rail slider pair, the lower end of the auxiliary lifting plate 62 is equipped with a circuit board pressure plate 63, the circuit board pressure plate 63 is provided with two pressure plate heads 631 arranged at left and right intervals, one pressure plate head 631 is located on the left end side of the adhesive tape press head 56, and the other pressure plate head 631 is located on the right end side of the adhesive tape press head 56.

[0034] A spring assembly is installed between the auxiliary lifting plate 62 and the auxiliary mounting plate 61. Specifically, the spring assembly includes a vertically arranged limiting bolt 641 and a limiting block 642 screwed onto the upper end of the auxiliary mounting plate 61 and located on the upper side of the auxiliary lifting plate 62. The limiting block 642 has a vertically penetrating bolt mounting hole corresponding to the limiting bolt 641. The threaded part of the limiting bolt 641 passes through the bolt mounting hole from top to bottom and connects to the upper end of the auxiliary lifting plate 62. The large end of the limiting bolt 641 is located on the upper side of the limiting block 642. A compression spring 643 is fitted around the limiting bolt 641. The upper end of the compression spring 643 elastically abuts against the limiting plate, and the lower end of the compression spring 643 elastically abuts against the auxiliary lifting plate 62.

[0035] It should be noted that when the adhesive tape pressing drive cylinder 55 drives the adhesive tape pressing head 56 to move down and press the part of the PI adhesive tape 7 that is pasted on the surface of the circuit board 8, the elastic force of the compression spring 643 causes each pressing head 631 to elastically press down on both sides of the PI adhesive tape 7 on the circuit board 8; when the lifting drive cylinder 41 drives the lifting movable plate 3 to move upward and peel the PI adhesive tape 7 off the circuit board 8, each pressing head 631 remains pressed against the circuit board 8 to prevent the circuit board 8 from being lifted when the PI adhesive tape 7 is torn off.

[0036] Example 3, as Figure 2 , Figure 3 as well as Figure 5 As shown, the difference between this embodiment 3 and embodiment 1 is that: the lifting drive component 4 includes a lifting drive cylinder 41 screwed to the upper end of the vertical mounting plate 2 and lifting action. The drive end of the lifting drive cylinder 41 is connected to the lifting movable plate 3. A guide rail slider pair is installed between the cylinder body of the lifting drive cylinder 41 and the lifting movable plate 3.

[0037] Example 4, as Figure 3 and Figure 4 As shown, the difference between this embodiment four and embodiment one is that the adhesive tape clamping block 53 has a vertical through-hole top rod clearance groove 531 with a forward opening in the middle.

[0038] For the adhesive tape clamping block 53 in this embodiment, the top rod clearance groove 531 of the adhesive tape clamping block 53 can clear the upward-rising adhesive tape top rod 54 to avoid interference between the adhesive tape clamping block 53 and the adhesive tape top rod 54, so as to ensure that the adhesive tape clamping block 53 can stably and reliably push the raised part of the PI adhesive tape 7 forward and make the adhesive tape stably adhered to the tape 121.

[0039] Example 5, such as Figure 3 and Figure 4As shown, the difference between this fifth embodiment and the first embodiment is that the driving end of the adhesive tape clamping driving cylinder 52 is equipped with a horizontal movable bracket 57, and the adhesive tape clamping block 53 is installed on the horizontal movable bracket 57.

[0040] Example 6, as Figure 2 and Figure 3 As shown, the difference between this sixth embodiment and the first embodiment is that the driving end of the adhesive tape pressing drive cylinder 55 is equipped with a vertical movable bracket 58, and the adhesive tape pressing head 56 is installed on the vertical movable bracket 58.

[0041] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A bottom-lifting automatic adhesive paper tearing mechanism, which is used to tear PI adhesive paper (7) from a tooling fixture (9) and a circuit board (8), wherein the circuit board (8) is a PCB circuit board or an FPC circuit board; The bottom-lifting automatic tape-tearing mechanism includes a tape peeling component and a waste tape recycling component. The waste tape recycling component includes a recycling drive motor (11), a recycling driven wheel (13) for placing the tape roll (12), a recycling drive wheel (14) driven by the recycling drive motor (11), and several tape guide wheels (15) for guiding the movement of the tape (121). characterized in that The bottom-lifting automatic adhesive paper tearing mechanism also includes a vertical mounting plate (2) and a lifting movable plate (3) arranged vertically. The vertical mounting plate (2) is equipped with a lifting drive component (4) corresponding to the lifting movable plate (3). The driving end of the lifting drive component (4) is connected to the lifting movable plate (3). The recovery drive motor (11) is screwed onto the lifting movable plate (3), and the recovery drive wheel (14) and the recovery driven wheel (13) are rotatably mounted on the lifting movable plate (3). The adhesive tape peeling assembly includes a lifting drive cylinder (51) mounted on the lower end of the vertical mounting plate (2) and moving vertically, and an adhesive tape clamping drive cylinder (52) mounted on the lifting movable plate (3) and moving horizontally back and forth. The drive end of the adhesive tape clamping drive cylinder (52) is equipped with an adhesive tape clamping block (53), and the drive end of the lifting drive cylinder (51) is equipped with an adhesive tape push rod (54) arranged vertically. The lifting movable plate (3) is equipped with a vertically moving adhesive tape pressing drive cylinder (55) on the front end side of the adhesive tape clamping drive cylinder (52), and the drive end of the adhesive tape pressing drive cylinder (55) is equipped with an adhesive tape pressing head (56) located on the front end side of the adhesive tape clamping block (53). The active recovery wheel (14) and the driven recovery wheel (13) are located on the upper side of the adhesive tape pressure head (56), and the tape guide wheel (15) guides the tape (121) to pass under the adhesive tape pressure head (56) with the adhesive side facing down. The tooling (9) has a vertical through hole (91) at the position where the PI adhesive paper (7) is pasted.

2. The mechanism according to claim 1, wherein: The adhesive tape press head (56) is equipped with an auxiliary mounting plate (61). The auxiliary mounting plate (61) is slidably mounted with an auxiliary lifting plate (62) via a guide rail slider pair. The lower end of the auxiliary lifting plate (62) is equipped with a circuit board pressure plate (63). The circuit board pressure plate (63) is provided with two pressure plate heads (631) arranged at left and right intervals. One pressure plate head (631) is located on the left side of the adhesive tape press head (56), and the other pressure plate head (631) is located on the right side of the adhesive tape press head (56). A spring assembly is installed between the auxiliary lifting plate (62) and the auxiliary mounting plate (61).

3. A bottom lifting type automatic paper tearing mechanism according to claim 2, characterized in that: The spring assembly includes a vertically arranged limiting bolt (641) and a limiting block (642) screwed onto the upper end of the auxiliary mounting plate (61) and located on the upper side of the auxiliary lifting plate (62). The limiting block (642) has a vertically penetrating bolt mounting hole corresponding to the limiting bolt (641). The threaded part of the limiting bolt (641) passes through the bolt mounting hole from top to bottom and is connected to the upper end of the auxiliary lifting plate (62). The large end of the limiting bolt (641) is located on the upper side of the limiting block (642). A compression spring (643) is fitted around the limiting bolt (641). The upper end of the compression spring (643) elastically abuts against the limiting plate, and the lower end of the compression spring (643) elastically abuts against the auxiliary lifting plate (62).

4. The bottom-lifting automatic adhesive paper tearing mechanism according to claim 1, characterized in that: The lifting drive component (4) includes a lifting drive cylinder (41) screwed onto the upper end of the vertical mounting plate (2) and capable of lifting. The drive end of the lifting drive cylinder (41) is connected to the lifting movable plate (3), and a guide rail slider pair is installed between the cylinder body of the lifting drive cylinder (41) and the lifting movable plate (3).

5. The bottom-lifting automatic adhesive paper tearing mechanism according to claim 1, characterized in that: The adhesive tape clamping block (53) has a vertical through-hole top rod clearance groove (531) in the middle.

6. The bottom-lifting automatic adhesive paper tearing mechanism according to claim 1, characterized in that: The drive end of the adhesive tape clamping drive cylinder (52) is equipped with a horizontal movable bracket (57), and the adhesive tape clamping block (53) is installed on the horizontal movable bracket (57).

7. The bottom-lifting automatic adhesive paper tearing mechanism according to claim 1, characterized in that: The drive end of the adhesive tape pressing drive cylinder (55) is equipped with a vertical movable bracket (58), and the adhesive tape pressing head (56) is installed on the vertical movable bracket (58).

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