SMT patch processing and curing equipment

Abstract

This utility model relates to the field of SMT (Surface Mount Technology) chip mounting and curing technology, and more particularly to an SMT chip mounting and curing device. This utility model provides an SMT chip mounting and curing device, including a curing chamber, guide plates, a chamber door, a placement plate, and magnetic blocks. Guide plates are fixedly connected to both sides of the curing chamber, and the chamber door is slidably mounted on both guide plates. The placement plate is placed inside the curing chamber, and magnetic blocks are located at the bottom of the guide plates, attracting the chamber door. The device also includes a guide rod and a lead screw. The guide rod is fixedly connected inside the curing chamber, and the lead screw is rotatably mounted inside the curing chamber. By rotating a handle, the lead screw rotates, driving a moving frame to move linearly along the guide rod in opposite or opposite directions. This allows adjustment of the distance and irradiation range between the UV lamp and the workpiece according to different workpiece sizes or curing requirements, achieving uniform and efficient ultraviolet irradiation to promote rapid curing of the chip adhesive or solder paste.

Description

Technical Field

[0001] This utility model relates to the field of SMT (Surface Mount Technology) chip processing and curing technology, and in particular to an SMT chip processing and curing device. Background Technology

[0002] SMT (Surface Mount Technology) curing equipment is a key piece of equipment in surface mount technology (SMT) production lines, mainly used for curing materials such as adhesives and solder paste. Its core function is to control parameters such as temperature and light to enable materials to cross-link and cure in a short time, ensuring that electronic components are firmly bonded to the PCB board and achieving efficient and uniform curing results.

[0003] In fields such as electronics manufacturing, optical component bonding, and precision industrial assembly, UV curing technology is widely used for the rapid curing of materials such as adhesives and solder pastes due to its high efficiency and environmental friendliness. However, existing UV curing equipment typically employs a fixed UV lamp irradiation structure, with the lamp source position relatively fixed. During use, different workpieces may require different irradiation distances and ranges to ensure uniform and effective curing. The fixed light source layout cannot meet diverse production needs, leading to low efficiency and unstable curing quality.

[0004] Therefore, there is a need for SMT (Surface Mount Technology) mounting and curing equipment that can adjust the position of the UV lamp. Utility Model Content

[0005] In order to overcome the shortcomings of existing technologies, such as the inability of fixed light source layout to meet diverse production needs, resulting in low efficiency and unstable curing quality, this utility model provides an SMT chip mounting and curing equipment that can adjust the position of the UV lamp.

[0006] The technical solution of this utility model is: an SMT chip mounting and curing equipment, including a curing chamber, guide plates, a chamber door, a placement plate, and magnetic blocks. Guide plates are fixedly connected to both sides of the curing chamber, and the chamber door is slidably provided by the two guide plates. The placement plate is placed inside the curing chamber, and magnetic blocks are provided at the lower part of the guide plates. The magnetic blocks attract the chamber door. The equipment also includes a guide rod, a lead screw, a moving frame, a UV lamp, and a handle. The guide rod is fixedly connected inside the curing chamber, and the lead screw is rotatably provided inside the curing chamber. Two moving frames are threaded on the lead screw, and the moving frames are slidably connected to the guide rod. A UV lamp is installed inside the moving frame, and handles are fixedly connected to both ends of the lead screw.

[0007] In one embodiment, the device further includes a connecting rod, a rotating plate, a dustproof net, and a pull plate. Two connecting rods are fixedly connected to the top of the curing chamber, a rotating plate is rotatably mounted on the connecting rods, a dustproof net is embedded in the top of the curing chamber, and a pull plate is fixedly connected to the front side of the rotating plate.

[0008] In one embodiment, the device further includes a support plate, a storage plate, and screws. Two support plates are mounted on the rear top of the curing box by screws, and the storage plate is fixedly connected to the top of the two support plates.

[0009] In one embodiment, an observation panel is also included, which is embedded in the door.

[0010] In one embodiment, an anti-slip sleeve is also included, with the handle covered by the anti-slip sleeve.

[0011] In one embodiment, a damping ring is also included, with the connecting rod fitted with the damping ring.

[0012] Compared with the prior art, this utility model provides an SMT chip mounting and curing equipment with the following beneficial effects: 1. By rotating the handle, the lead screw is driven to rotate, and the rotation of the lead screw drives the moving frame to move in opposite or opposite directions along the guide rod. Thus, the distance and irradiation range between the UV lamp and the workpiece can be adjusted according to the workpiece of different sizes or curing requirements to achieve uniform and efficient ultraviolet irradiation and promote the rapid curing of the chip adhesive or solder paste.

[0013] 2. By rotating the rotating plate in the opposite direction to cover it with the dustproof net, the air outlet is closed, preventing external pollutants from entering and reducing heat loss inside the chamber, which helps maintain the stability of the curing environment.

[0014] 3. The storage plate can be used to temporarily store tools, spare parts or materials to be processed, effectively utilizing the top space of the equipment and improving the convenience of operation and the compactness of the overall structure. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0016] Figure 2 This is a partial sectional view of the curing box, guide plate, and box door of this utility model.

[0017] Figure 3 This is a partial sectional view of the guide rod, moving frame, and UV lamp components of this utility model.

[0018] Figure 4 This is a partial sectional view of the connecting rod, rotating plate, and dustproof net of this utility model.

[0019] Figure 5 This is a three-dimensional structural diagram of the support plate, storage plate, screws, and other components of this utility model.

[0020] The markings in the diagram are as follows: 1-Curing box, 2-Guide plate, 3-Box door, 4-Observation plate, 5-Placement plate, 6-Guide rod, 7-Screw rod, 8-Moving frame, 9-UV lamp, 10-Handle, 11-Magnetic block, 12-Anti-slip sleeve, 13-Connecting rod, 14-Rotating plate, 15-Dustproof net, 16-Pull plate, 17-Support plate, 18-Storage plate, 19-Screw, 20-Damping ring. Detailed Implementation

[0021] The present invention will be further described below with reference to the embodiments shown in the accompanying drawings.

[0022] Example 1: An SMT (Surface Mount Technology) chip bonding and curing equipment, please refer to [link / reference]. Figures 1-5 The system includes a curing chamber 1, guide plates 2, a door 3, a placement plate 5, and magnetic blocks 11. Guide plates 2 are fixedly connected to both sides of the curing chamber 1, and the door 3 is slidably mounted on both guide plates 2. The placement plate 5 is placed inside the curing chamber 1. Magnetic blocks 11 are located at the bottom of the guide plates 2, attracting the door 3. The system also includes a guide rod 6, a lead screw 7, a moving frame 8, a UV lamp 9, and a handle 10. The guide rod 6 is fixedly connected inside the curing chamber 1, and the lead screw 7 is rotatably mounted inside the curing chamber 1. A screw is threaded onto the lead screw 7. The device features two movable frames 8, which are slidably connected to the guide rod 6. A UV lamp 9 is installed inside the movable frame 8. Handles 10 are fixedly connected to both ends of the lead screw 7. An observation plate 4 is embedded in the door 3, allowing real-time observation of the curing process inside the chamber without frequent opening and closing of the door 3, thus ensuring the stability of the curing environment. The handle 10 is fitted with an anti-slip sleeve 12, which reduces friction between the hand and the handle 10, facilitating grip and application of force, and improving operational comfort and safety.

[0023] When this equipment is needed, pull the door 3 and let it slide upward along the guide plate 2. During the opening process, the magnetic block 11 separates from the door 3 and releases the adsorption state. After opening the door 3, place the SMT chip circuit board to be cured on the placement plate 5. After placement, push the door 3 to slide downward along the guide plate 2 to close. When the door 3 is completely closed, its lower part is adsorbed by the magnetic block 11 to achieve a stable seal and prevent accidental opening during the curing process. Then, turn on the UV lamp 9 to irradiate the SMT chip circuit board with ultraviolet light. During this process, by turning the handle 10, the lead screw 7 is driven to rotate. The rotation of the lead screw 7 drives the moving frame 8 to move in opposite or opposite directions along the guide rod 6, thereby adjusting the position of the UV lamp 9. The distance between the UV lamp 9 and the workpiece and the irradiation range can be adjusted according to different workpiece sizes or curing requirements to achieve uniform and efficient ultraviolet irradiation and promote the rapid curing of the chip adhesive or solder paste.

[0024] Example 2: Based on Example 1, please refer to... Figure 1 and Figure 4It also includes a connecting rod 13, a rotating plate 14, a dustproof net 15, and a pull plate 16. Two connecting rods 13 are fixedly connected to the top of the curing box 1. The rotating plate 14 is rotatably mounted on the connecting rod 13. The dustproof net 15 is embedded in the top of the curing box 1. The pull plate 16 is fixedly connected to the front side of the rotating plate 14. A damping ring 20 is sleeved on the connecting rod 13. The damping ring 20 makes the rotating plate 14 rotate smoothly and can stop at any angle.

[0025] When it is necessary to expel the gas generated during the curing process or lower the temperature inside the chamber, the rotating plate 14 can be manually rotated to open the dustproof net 15 on top, thereby opening the air outlet. At this time, the gas inside the curing chamber 1 can be naturally discharged through the dustproof net 15 to achieve ventilation. While allowing gas to flow, the dustproof net 15 effectively blocks external dust from entering the chamber, keeping the interior clean. After exhausting, the rotating plate 14 is rotated in the opposite direction to cover the dustproof net 15, closing the air outlet and preventing external pollutants from entering. This also reduces heat loss inside the chamber and helps maintain a stable curing environment.

[0026] Please see Figure 1 and Figure 5 It also includes a support plate 17, a storage plate 18 and screws 19. Two support plates 17 are installed on the rear top of the curing box 1 by screws 19, and the storage plate 18 is fixedly connected to the top of the two support plates 17.

[0027] When using the equipment, the storage plate 18 can be used to temporarily store tools, spare parts or materials to be processed, effectively utilizing the top space of the equipment and improving operational convenience and the compactness of the overall structure.

[0028] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. All equivalent substitutions made within the principles of this utility model should be included within the protection scope of this utility model. Contents not described in detail in this utility model are existing technologies known to those skilled in the art.

Claims

1. An SMT (Surface Mount Technology) chip bonding and curing equipment, comprising a curing chamber (1), guide plates (2), a chamber door (3), a placement plate (5), and a magnetic block (11), wherein guide plates (2) are fixedly connected to both sides of the curing chamber (1), and the chamber door (3) is slidably provided on both guide plates (2), the placement plate (5) is placed inside the curing chamber (1), and a magnetic block (11) is provided at the lower part of the guide plates (2), the magnetic block (11) adsorbing the chamber door (3), characterized in that: It also includes a guide rod (6), a lead screw (7), a moving frame (8), a UV lamp (9), and a handle (10). The guide rod (6) is fixedly connected inside the curing box (1). The lead screw (7) is rotatably installed inside the curing box (1). Two moving frames (8) are threaded on the lead screw (7). The moving frames (8) are slidably connected to the guide rod (6). The UV lamp (9) is installed inside the moving frames (8). The handles (10) are fixedly connected to both ends of the lead screw (7).

2. The SMT assembly and curing equipment as described in claim 1, characterized in that: It also includes connecting rods (13), rotating plate (14), dustproof net (15) and pull plate (16). Two connecting rods (13) are fixedly connected to the top of the curing box (1). The rotating plate (14) is rotatably installed on the connecting rods (13). The dustproof net (15) is embedded in the top of the curing box (1). The pull plate (16) is fixedly connected to the front side of the rotating plate (14).

3. The SMT assembly and curing equipment as described in claim 2, characterized in that: It also includes a support plate (17), a storage plate (18) and screws (19). Two support plates (17) are installed on the rear top of the curing box (1) by screws (19), and the storage plate (18) is fixedly connected to the top of the two support plates (17).

4. The SMT assembly and curing equipment as described in claim 3, characterized in that: It also includes an observation panel (4), which is embedded in the door (3).

5. The SMT assembly and curing equipment as described in claim 4, characterized in that: It also includes an anti-slip sleeve (12), which is fitted onto the handle (10).

6. The SMT assembly and curing equipment as described in claim 5, characterized in that: It also includes a damping ring (20), which is fitted on the connecting rod (13).

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