Photovoltaic module and powered device

Abstract

This application relates to a photovoltaic module and an electrical device. The photovoltaic module includes a backsheet layer, which comprises a substrate layer and an inorganic ceramic coating located on at least one side of the substrate layer. This application reduces the overall shrinkage variation of the backsheet layer by forming an inorganic ceramic coating on the surface of the substrate layer. This inorganic ceramic coating constrains the expansion or contraction of the substrate layer, thereby improving the warpage problem of the backsheet layer.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, specifically to a photovoltaic module and an electrical device. Background Technology

[0002] As photovoltaic (PV) applications continue to expand, the demands for PV modules are also constantly evolving. In the residential sector, the requirements for PV modules include weight reduction, adjustments to installation methods, and maintenance of product performance. Although there are currently many alternatives to glass for PV module encapsulation, long-term verification has shown that glass-encapsulated PV modules exhibit better results in terms of reliability and technological maturity. However, glass-encapsulated PV modules are prone to warping. Summary of the Invention

[0003] This application aims to at least partially address one of the technical problems in the related art. Therefore, one objective of this application is to provide photovoltaic modules and electrical equipment that facilitate the improvement of warping problems.

[0004] The first aspect of this application proposes a photovoltaic module including a backsheet layer, the backsheet layer including a substrate layer and an inorganic ceramic coating located on at least one side of the substrate layer.

[0005] This application forms an inorganic ceramic coating on the surface of the substrate layer. Under lamination conditions, the inorganic ceramic coating expands and contracts less than that of polymer materials. Therefore, the inorganic ceramic coating constrains the expansion or contraction of the substrate layer, thereby reducing the overall shrinkage of the backing layer and thus helping to improve the warping problem of the backing layer.

[0006] In some implementations, at least one of the following A to D is satisfied:

[0007] A: The thickness of the backing layer is 0.2mm-1mm;

[0008] B: The thickness of the inorganic ceramic coating is 0.005mm-0.1mm;

[0009] C: The connection structure between the inorganic ceramic coating and the substrate layer includes one or more of the following: physical adsorption, diffusion bonding, and chemical bonding;

[0010] D: Inorganic ceramic coatings include inorganic non-metallic ceramic coatings.

[0011] In some embodiments, the backsheet layer includes one or more of double-sided coated backsheets, single-sided coated backsheets, and co-extruded backsheets.

[0012] In some embodiments, the double-coated backsheet includes a first organic resin coating, an inorganic ceramic coating, a substrate layer, and a second organic resin coating, all layered together.

[0013] In some implementations, the double-sided coated backsheet satisfies at least one of the following a to d:

[0014] a: The thickness of the first organic resin coating is 0.005mm-0.02mm;

[0015] b: The thickness of the inorganic ceramic coating is 0.005mm-0.1mm;

[0016] c: The thickness of the substrate layer is 0.2mm-0.8mm;

[0017] d: The thickness of the second organic resin coating is 0.005mm-0.02mm.

[0018] In some embodiments, the single-sided coated backsheet includes a stacked organic resin coating, an inorganic ceramic coating, a substrate layer, an adhesive layer, and a weather-resistant layer.

[0019] In some implementations, the single-sided coated backsheet satisfies at least one of the following i to v:

[0020] i: The thickness of the organic resin coating is 0.005mm-0.1mm;

[0021] ii: The thickness of the inorganic ceramic coating is 0.005mm-0.02mm;

[0022] iii: The thickness of the substrate layer is 0.2mm-0.75mm;

[0023] iv: The thickness of the adhesive layer is 0.005mm-0.02mm;

[0024] v: The thickness of the weather-resistant layer is 0.015mm-0.05mm.

[0025] In some embodiments, the co-extruded backsheet includes a stacked inorganic ceramic coating and a substrate layer, wherein the substrate layer is a co-extruded substrate layer.

[0026] In some implementations, the co-extruded backsheet satisfies at least one of the following I to II:

[0027] I: The thickness of the inorganic ceramic coating is 0.005mm-0.1mm;

[0028] II: The thickness of the substrate layer is 0.1mm-0.9mm.

[0029] The second aspect of this application provides an electrical device including the photovoltaic module described above.

[0030] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0031] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0032] Figure 1 A schematic diagram of the photovoltaic module is shown.

[0033] Appendix Figure 1 The attached figure labels are:

[0034] Front panel layer 1, first adhesive film layer 2, battery cell layer 3, second adhesive film layer 4, back panel layer 5.

[0035] Figure 2 A schematic diagram of the double-sided coated backplate is shown.

[0036] Appendix Figure 2 The attached figure labels are:

[0037] First organic resin coating 51, inorganic ceramic coating 52, substrate layer 53, second organic resin coating 54.

[0038] Figure 3 A schematic diagram of a single-sided coated backplate is shown.

[0039] Appendix Figure 3 The attached figure labels are:

[0040] 51. Organic resin coating, 52. Inorganic ceramic coating, 53. Substrate layer, 54. Adhesive layer, 55. Weather-resistant layer.

[0041] Figure 4 A schematic diagram of the co-extruded backsheet is shown.

[0042] Appendix Figure 4 Reference numerals in the attached figures: Inorganic ceramic coating 51, substrate layer 52. Detailed Implementation

[0043] The embodiments of this application are described in detail below. The embodiments described below are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0044] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Furthermore, in the description of this application, unless otherwise stated, "multiple" means two or more.

[0045] The endpoints and any values ​​of the ranges disclosed in this application are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this application.

[0046] In this application, the terms "comprising" or "including" are open-ended expressions, meaning they include the content specified in this application but do not exclude other aspects.

[0047] Glass-encapsulated photovoltaic (PV) modules can be divided into single-glass modules and double-glass modules. A single-glass module uses a layer of tempered glass for encapsulation on the front and a polymer material (such as a transparent or white backsheet) for protection on the back. A double-glass module uses tempered glass for encapsulation on both the front and back. In existing glass-encapsulated PV modules, to reduce module weight, the glass thickness is typically gradually reduced. However, reduced glass thickness makes module warping more likely.

[0048] During their investigation into the causes of warping, the inventors discovered two main reasons: firstly, the warping is caused by stress release after the photovoltaic module's glass undergoes high-temperature treatment; secondly, the warping is due to differences in material shrinkage rates, causing the module to warp regularly towards a specific material. The difference in shrinkage rates between different materials during glass thinning in single-glass modules is the primary cause of module warping.

[0049] Furthermore, the front panel of photovoltaic modules typically uses a surface-treated glass layer, making it difficult to adjust and improve the warping problem of photovoltaic modules.

[0050] Therefore, a first aspect of the present application provides a photovoltaic module including a backsheet layer, the backsheet layer including a substrate layer and an inorganic ceramic coating located on at least one side of the substrate layer.

[0051] Typically, the substrate layer of the backsheet is made of polymer materials. During conventional lamination, the expansion rate of polymer materials is much higher than that of glass when the temperature rises. After cooling, the polymer material shrinks, while the glass shrinks less. This uneven expansion and contraction can lead to severe warping problems in photovoltaic modules. However, in the embodiments of this application, an inorganic ceramic coating is formed on the surface of the substrate layer. Under lamination conditions, the expansion and contraction of the inorganic ceramic coating are less than those of the polymer material. Therefore, the inorganic ceramic coating constrains the expansion and contraction of the substrate layer, thereby reducing the overall shrinkage of the backsheet layer and thus helping to improve the warping problem of the backsheet layer.

[0052] Inorganic ceramic coatings can be applied to one side of the substrate layer or to both sides of the substrate layer.

[0053] Conventional lamination conditions in this field include: processing temperature of 45℃-150℃, processing time of 15-25min, and processing pressure of (-20kPa)-(-5kPa).

[0054] In some embodiments of this application, the photovoltaic module satisfies at least one of the following A to D:

[0055] A: The thickness of the backing layer is 0.2mm-1mm;

[0056] B: The thickness of the inorganic ceramic coating is 0.005mm-0.1mm;

[0057] C: The connection structure between the inorganic ceramic coating and the substrate layer includes one or more of physical adsorption, diffusion bonding, and chemical bonding;

[0058] D: Inorganic ceramic coatings include inorganic non-metallic ceramic coatings.

[0059] The thickness of the inorganic ceramic coating may affect its effectiveness in mitigating backsheet warpage and the overall quality of the coating formation. As the thickness of the inorganic ceramic coating decreases, its effectiveness in mitigating backsheet warpage tends to decline. Conversely, as the thickness of the inorganic ceramic coating increases, the difficulty of forming the coating on the substrate layer may increase, potentially affecting the coating's quality and leading to problems such as cracking.

[0060] In this embodiment, the thickness of the inorganic ceramic coating meets the above conditions, which is beneficial to improving the warping problem of the backing layer. Moreover, the preparation difficulty is relatively low, which is beneficial to the formation of a better inorganic ceramic coating, so as to better improve the warping of the backing layer.

[0061] As an example, the thickness of the inorganic ceramic coating is 0.005mm, 0.006mm, 0.007mm, 0.008mm, 0.009mm, 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, etc.

[0062] For example, the thickness of the backsheet layer is 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, etc.

[0063] The connection structure between the inorganic ceramic coating and the substrate layer includes one or more of physical adsorption, diffusion bonding, and chemical bonding; and / or, the inorganic ceramic coating includes inorganic non-metallic ceramic coatings.

[0064] In this embodiment, the inorganic ceramic coating is in close contact with the substrate layer to better achieve the effect of limiting the expansion or contraction of the substrate layer by the inorganic ceramic coating.

[0065] As an example, inorganic ceramic coatings can be physically adsorbed onto the surface of a substrate layer through coating, such as spin coating; in addition, they can be chemically bonded to the substrate layer if there are other conventional binders or other auxiliary materials in the inorganic ceramic coating under conventional lamination temperature and pressure conditions; or diffusion bonding between the substrate layer and the inorganic ceramic coating can be achieved through conventional processes such as vapor deposition.

[0066] In this embodiment, the inorganic ceramic coating can be made of conventional coating materials in the art. Inorganic non-metallic ceramic coatings can be used, as they have lower shrinkage rates. Under the temperature and pressure conditions of conventional lamination processes, their expansion and contraction are significantly less than those of the polymer materials in the substrate layer, resulting in better constraint and restraint of the substrate layer and thus better mitigating the warpage problem of photovoltaic modules.

[0067] In some embodiments of this application, the inorganic non-metallic ceramic coating includes one or more of silicon nitride ceramic coating, silicon carbide ceramic coating, silicon dioxide ceramic coating, and titanium dioxide ceramic coating.

[0068] As an example, methods for forming an inorganic ceramic coating on the front plate layer include one or more of coating, vapor deposition, and spraying.

[0069] In some embodiments of this application, the backsheet layer includes one or more of double-sided coated backsheets, single-sided coated backsheets, and co-extruded backsheets.

[0070] The backsheet layer in the embodiments of this application can be one or more of the following: double-sided coated backsheet, single-sided coated backsheet, and co-extruded backsheet.

[0071] Double-sided coated backsheets have a well-known meaning in the art, referring to a structure in which both the inner and outer layers of the substrate layer of the backsheet are coated with fluorinated resin or other functional coatings.

[0072] Single-sided coated backsheets, as is known in the art, refer to a structure in which only the inner layer of the substrate layer of the backsheet is coated with a fluoropolymer or other functional coating, while the outer layer uses other materials (such as PE). Typically, the coated side is the inner layer (EVA side), and the uncoated side is the outer layer (air side).

[0073] Co-extruded backsheet, as is known in the art, refers to the substrate layer of a backsheet made through a multi-layer polymer co-extrusion process.

[0074] In this application embodiment, one or more of the following backsheets can be improved by adding an inorganic ceramic coating, that is, forming an inorganic ceramic coating on the substrate layer of the backsheet, thereby improving the problem of photovoltaic module warping.

[0075] In some embodiments of this application, the double-sided coated backplate includes a first organic resin coating, an inorganic ceramic coating, a substrate layer, and a second organic resin coating, all layered together.

[0076] The first organic resin coating includes one or more of fluorinated organic resin coatings and organosilicon resin coatings.

[0077] The substrate layer includes one or more of the following: polyethylene terephthalate layer, polybutylene terephthalate layer, polycarbonate layer, and polypropylene layer.

[0078] The second organic resin coating includes one or more of the following: fluorinated organic resin coating and organosilicon resin coating.

[0079] As an example, such as Figure 2 As shown, the structure of the double-sided coated back plate consists of a first organic resin coating 51, an inorganic ceramic coating 52, a substrate layer 53, and a second organic resin coating 54, which are stacked sequentially.

[0080] In some embodiments of this application, the double-sided coated backsheet satisfies at least one of the following a to d:

[0081] a: The thickness of the first organic resin coating is 0.005mm-0.02mm;

[0082] b: The thickness of the inorganic ceramic coating is 0.005mm-0.1mm;

[0083] c: The thickness of the substrate layer is 0.2mm-0.8mm;

[0084] d: The thickness of the second organic resin coating is 0.005mm-0.02mm.

[0085] As an example, the thickness of the first organic resin coating is 0.005 mm, 0.01 mm, 0.015 mm, 0.02 mm, etc.

[0086] As an example, the thickness of the inorganic ceramic coating is 0.005mm, 0.006mm, 0.007mm, 0.008mm, 0.009mm, 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, etc.

[0087] As an example, the thickness of the substrate layer is 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, etc.

[0088] As an example, the thickness of the second organic resin coating is 0.005 mm, 0.01 mm, 0.015 mm, 0.02 mm, etc.

[0089] In some embodiments of this application, the single-sided coated backplate includes a stacked organic resin coating, an inorganic ceramic coating, a substrate layer, an adhesive layer, and a weather-resistant layer.

[0090] Organic resin coatings include one or more of fluorinated resin coatings and silicone resin coatings.

[0091] The substrate layer includes one or more of the following: polyethylene terephthalate layer, polybutylene terephthalate layer, polycarbonate layer, and polypropylene layer.

[0092] The adhesive layer includes one or more of the following: polyurethane adhesive layer, acrylic adhesive layer, and epoxy resin adhesive layer.

[0093] The weather-resistant layer includes one or more of the following: polyvinylidene fluoride film, polyvinyl fluoride film, and ethylene-tetrafluoroethylene copolymer film.

[0094] As an example, such as Figure 3 As shown, the structure of the single-sided coated back panel consists of an organic resin coating 51, an inorganic ceramic coating 52, a substrate layer 53, an adhesive layer 54, and a weather-resistant layer 55, which are stacked sequentially.

[0095] In some embodiments of this application, the single-sided coated backplate satisfies at least one of the following i to v:

[0096] i: The thickness of the organic resin coating is 0.005mm-0.1mm;

[0097] ii: The thickness of the inorganic ceramic coating is 0.005mm-0.02mm;

[0098] iii: The thickness of the substrate layer is 0.2mm-0.75mm;

[0099] iv: The thickness of the adhesive layer is 0.005mm-0.02mm;

[0100] v: The thickness of the weather-resistant layer is 0.015mm-0.05mm.

[0101] As an example, the thickness of the organic resin coating is 0.005mm, 0.006mm, 0.007mm, 0.008mm, 0.009mm, 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, etc.

[0102] As an example, the thickness of the inorganic ceramic coating is 0.005mm, 0.006mm, 0.007mm, 0.008mm, 0.009mm, 0.01mm, 0.02mm, etc.

[0103] As an example, the thickness of the substrate layer is 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.75mm, etc.

[0104] As an example, the thickness of the adhesive layer is 0.005mm, 0.006mm, 0.007mm, 0.008mm, 0.009mm, 0.01mm, 0.02mm, etc.

[0105] For example, the thickness of the weather-resistant layer is 0.015mm, 0.016mm, 0.017mm, 0.018mm, 0.019mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, etc.

[0106] In some embodiments of this application, the co-extruded backsheet includes a stacked inorganic ceramic coating and a substrate layer, wherein the substrate layer is a co-extruded substrate layer.

[0107] In this embodiment, the substrate layer is a co-extruded substrate layer. As an example, the materials of each co-extruded layer are the same olefin polymer or a combination of different types of olefin copolymers.

[0108] The substrate layer may include one or more of the following: polyethylene-polypropylene co-extruded layer, polyethylene-butene co-extruded layer, and polypropylene-butene co-extruded layer. The materials of each co-extruded layer are either the same olefin polymer or a combination of different olefin copolymers.

[0109] As an example, such as Figure 4 As shown, the co-extruded backsheet has a structure consisting of an inorganic ceramic coating 51 and a substrate layer 52 stacked sequentially.

[0110] In some embodiments of this application, the co-extruded backsheet satisfies at least one of the following I to II:

[0111] I: The thickness of the inorganic ceramic coating is 0.005mm-0.1mm;

[0112] II: The thickness of the substrate layer is 0.1mm-0.9mm.

[0113] As an example, the thickness of the inorganic ceramic coating is 0.005mm, 0.006mm, 0.007mm, 0.008mm, 0.009mm, 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, etc.

[0114] As an example, the thickness of the substrate layer is 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, etc.

[0115] In some embodiments of this application, the inorganic ceramic coating is located on the inner side of the backing layer, and the substrate layer is located on the outer side of the backing layer, which helps to protect the inorganic ceramic coating and improve its weather resistance stability.

[0116] In some embodiments of this application, the photovoltaic module further includes a front panel layer, a first encapsulant layer, a cell layer, and a second encapsulant layer; the front panel layer, the first encapsulant layer, the cell layer, the second encapsulant layer, and the backsheet layer are stacked in one step; and / or, the thickness of the backsheet layer is 0.2 mm to 1 m.

[0117] For example, the thickness of the backsheet layer is 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, etc.

[0118] For a single-glass module, it includes a front panel layer, a first encapsulant layer, a cell layer, a second encapsulant layer, and a backsheet layer stacked in sequence.

[0119] As an example, such as Figure 1 As shown, the structure of the photovoltaic module consists of a front panel layer 1, a first encapsulant layer 2, a cell layer 3, a second encapsulant layer 4, and a back panel layer 5, which are stacked sequentially from top to bottom.

[0120] In some embodiments of this application, the front panel layer includes a glass layer.

[0121] The glass layer has high light transmittance, allowing sunlight to pass through and ensuring that the solar cells receive enough light energy for photoelectric conversion.

[0122] Furthermore, the thickness of the front panel layer is 0.3mm-3.5mm. As examples, the thickness of the front panel layer is 0.3mm, 0.31mm, 0.32mm, 0.33mm, 0.34mm, 0.35mm, etc.

[0123] Furthermore, the glass layer includes one or more of float glass layers and patterned glass layers.

[0124] Furthermore, the glass layer includes a tempered glass layer. The glass layer can be surface-treated, such as by physical tempering or chemical tempering, to form a tempered glass layer.

[0125] In some embodiments of this application, the first film layer includes one or more of EVA ("Ethylene-Vinyl Acetate") film, POE ("Polyolefin Elastomer") film, EPE (EVA-POE-EVA co-extruded film) film, and PVB ("Polyvinyl Butyral") film.

[0126] The first adhesive film layer is used to bond the front panel layer and the cell layer. The material of the first adhesive film layer can be one or more of the above-mentioned adhesive films, all of which are well-known in the art and can be used as photovoltaic encapsulation film products.

[0127] Furthermore, the thickness of the first adhesive film layer is 0.4mm-0.7mm. As an example, the thickness of the first adhesive film layer is 0.4mm, 0.5mm, 0.6mm, 0.7mm, etc.

[0128] Furthermore, the basis weight of the first adhesive film layer is 320 g / m². 2 -480 g / m 2 As an example, the basis weight of the first adhesive film layer is 320 g / m². 2 340g / m 2 360g / m 2 380g / m 2 400g / m 2 420g / m 2 440g / m 2 460g / m 2 480g / m 2 wait.

[0129] In some embodiments of this application, the cell layer includes one or more of the following: PERC cell (passivated emitter and back contact monocrystalline silicon cell), Topcon cell (tunnel oxide passivated contact monocrystalline silicon cell), BC cell (full back electrode contact monocrystalline silicon cell), and HJT cell (heterojunction monocrystalline silicon cell).

[0130] In this embodiment of the application, the solar cell is used to convert solar energy into light energy.

[0131] In some embodiments of this application, the second film layer includes one or more of EVA ("Ethylene-Vinyl Acetate") film, POE ("Polyolefin Elastomer") film, EPE (EVA-POE-EVA co-extruded film) film, and PVB ("Polyvinyl Butyral") film.

[0132] The second adhesive film layer is used to bond the cell layer and the backsheet layer. The material of the second adhesive film layer can be one or more of the adhesive films mentioned above, all of which are well-known in the art and can be used as photovoltaic encapsulation film products.

[0133] Furthermore, the thickness of the second adhesive film layer is 0.4mm-0.7mm. As an example, the thickness of the second adhesive film layer is 0.4mm, 0.5mm, 0.6mm, 0.7mm, etc.

[0134] Furthermore, the basis weight of the second adhesive film layer is 320 g / m². 2 -480 g / m 2 As an example, the basis weight of the second adhesive film layer is 320 g / m². 2 340g / m 2 360g / m 2 380g / m 2 400g / m 2 420g / m 2 440g / m 2 460g / m 2 480g / m 2 wait.

[0135] In some embodiments of this application, a backsheet layer is used to protect and insulate the internal structure of the photovoltaic module (such as solar cells). The aforementioned backsheet layer can be used.

[0136] In some embodiments of this application, the backsheet layer is a co-extruded backsheet, which includes a stacked inorganic ceramic coating and a substrate layer, wherein the substrate layer is a co-extruded substrate layer.

[0137] The structure of a photovoltaic module consists of a front panel layer, a first encapsulant layer, a cell layer, a second encapsulant layer, an inorganic ceramic coating, and a substrate layer, stacked sequentially. This allows the substrate layer to protect the inorganic ceramic coating, reducing the impact of harsh environmental conditions on it, improving its stability, and ultimately enhancing the overall stability of the photovoltaic module.

[0138] The second aspect of this application provides an electrical device including the photovoltaic module described in the first aspect above.

[0139] In this application embodiment, the aforementioned photovoltaic modules can be further processed (such as conventional frame assembly, wiring, etc.) to serve as the power supply for the equipment, or further integrated for use as the power supply.

[0140] As an example, photovoltaic power generation systems include grid-connected systems, where photovoltaic modules can be used in large-scale ground-mounted power plants, distributed photovoltaic power plants, and rooftop photovoltaic systems to convert solar energy into electrical energy and connect it to the grid; and off-grid systems, where photovoltaic modules can provide power to off-grid systems in areas without grid coverage, such as communication base stations and monitoring equipment in remote areas.

[0141] As an example, Building Integrated Photovoltaics (BIPV): Photovoltaic modules can be used on building facades, roofs, or awnings, serving as both building materials and power generators, and are suitable for residential, commercial, and public facilities.

[0142] As an example, agricultural photovoltaic systems: photovoltaic modules are installed above farmland, generating electricity without affecting crop growth, and are suitable for scenarios such as greenhouses; photovoltaic modules are installed on water to achieve the dual benefits of power generation and aquaculture.

[0143] As examples, power banks and portable devices include: solar chargers, where photovoltaic modules are used in portable solar chargers to power devices such as mobile phones and tablets; and solar backpacks, where backpacks with integrated photovoltaic modules can provide power for outdoor activities.

[0144] As an example, in the transportation sector: such as solar-powered cars, some of which use photovoltaic modules as auxiliary power to extend their driving range; and solar streetlights, where single-glass photovoltaic modules provide power for streetlights, suitable for urban roads and rural lighting.

[0145] As examples, other special environment applications include: desert photovoltaic power plants: photovoltaic modules are suitable for harsh environments such as deserts due to their weather resistance and low cost; in high humidity areas, modules can be used in photovoltaic power plants by the sea or in high humidity areas through optimized encapsulation technology.

[0146] As an example, industrial and commercial equipment: industrial electrical equipment, such as photovoltaic modules, provides clean energy for factories, warehouses, etc., reducing electricity costs; commercial facilities, such as billboards, charging piles, etc., use photovoltaic modules to achieve green power supply.

[0147] As an example, scientific research and educational equipment, such as solar experimental devices and photovoltaic modules, are used for teaching and research to help students and researchers understand the principles of solar power generation.

[0148] The following will explain the solution of this application with reference to embodiments. Those skilled in the art will understand that the following embodiments are for illustrative purposes only and should not be considered as limiting the scope of this application. Where specific techniques or conditions are not specified in the embodiments, they are performed according to the techniques or conditions described in the literature in the art or according to the product instructions. Reagents or instruments whose manufacturers are not specified are all conventional products that can be obtained commercially.

[0149] Photovoltaic modules

[0150] Example 1

[0151] The photovoltaic module provided in this embodiment has a stacked structure arranged from top to bottom as follows: front panel layer, first encapsulant layer, cell layer, second encapsulant layer, and backsheet layer. The specific structure is shown below:

[0152] 1) Front panel layer:

[0153] The glass layer is made of 1.1mm thick float glass, and the surface treatment is chemical tempering.

[0154] 2) First adhesive film layer:

[0155] It uses a thickness of 0.5mm and a basis weight of 400g / m³. 2 EVA (Ethylene-Vinyl Acetate Copolymer) photovoltaic encapsulation film products.

[0156] 3) Battery cell layer:

[0157] It is an abbreviation for PERC (Passivated Emitter and Rear Cell), a crystalline silicon solar cell.

[0158] 4) Second adhesive film layer:

[0159] It uses a thickness of 0.4mm and a basis weight of 360g / m³. 2 EVA photovoltaic encapsulation film products.

[0160] 5) Backing layer:

[0161] The backsheet layer is a double-sided coated backsheet (CPC), and its stacked structure is arranged from top to bottom as follows: first organic resin coating, inorganic ceramic coating, substrate layer, and second organic resin coating.

[0162] An inorganic ceramic coating with a thickness of 0.03 mm is applied to the surface of the substrate layer. The coating is a silicon nitride inorganic non-metallic ceramic coating, which is formed on the substrate surface using a deposition process. The coating is resistant to high temperature of 700℃.

[0163] This embodiment uses atomic layer deposition to prepare an inorganic ceramic coating, selecting bis(tert-butylamino)silane as the silicon source and hydrazine as the nitrogen source, with a material molar ratio of 1:1. The specific steps are as follows:

[0164] A silicon source gas pulse is introduced into the reaction chamber and adsorbed onto the surface of the substrate layer. The chamber is then purged with inert argon gas to remove unreacted silicon source and byproducts. A nitrogen source gas pulse is then introduced into the reaction chamber to react with the adsorbed silicon source to generate silicon nitride. The chamber is then purged again with inert gas to remove unreacted nitrogen source and byproducts. This cycle is repeated. By controlling the coating thickness through multiple cycles (silicon source pulse-purging-nitrogen source pulse-purging), an inorganic ceramic coating is formed on the surface of the substrate layer.

[0165] The first organic resin coating is a fluorinated resin coating (specifically a trifluorochloroethylene / vinyl ether copolymer resin coating) with a thickness of 0.015 mm.

[0166] The substrate layer is a polyethylene terephthalate layer with a thickness of 0.24 mm.

[0167] The second organic resin coating is a fluorinated resin coating (specifically a trifluorochloroethylene / vinyl ether copolymer resin coating) with a thickness of 0.015 mm.

[0168] The backsheet layer is 0.3 mm thick and has a shrinkage rate of 0.1% under lamination conditions.

[0169] Example 2

[0170] The photovoltaic module provided in this embodiment has a stacked structure arranged from top to bottom as follows: front panel layer, first encapsulant layer, cell layer, second encapsulant layer, and backsheet layer. The specific structure is shown below:

[0171] 1) Front panel layer:

[0172] The glass layer is made of 0.8mm thick float glass, and the surface treatment is physical tempering.

[0173] 2) First adhesive film layer:

[0174] It uses a thickness of 0.5mm and a basis weight of 400g / m³. 2 EVA (Ethylene-Vinyl Acetate Copolymer) photovoltaic encapsulation film products.

[0175] 3) Battery cell layer:

[0176] BC stands for "Back Contact Cell," a crystalline silicon solar cell with full back electrode contact.

[0177] 4) Second adhesive film layer:

[0178] It uses a thickness of 0.4mm and a basis weight of 360g / m³. 2 EVA photovoltaic encapsulation film products.

[0179] 5) Backing layer:

[0180] The backsheet layer is a single-sided coated backsheet (KPC), and its layered structure is arranged from top to bottom as follows: organic resin coating, inorganic ceramic coating, substrate layer, adhesive layer, and weather-resistant layer.

[0181] An inorganic ceramic coating with a thickness of 0.03 mm is applied to the surface of the substrate layer. The coating is a silicon nitride inorganic non-metallic ceramic coating. The coating process is used to form it on the substrate surface. The coating can withstand a high temperature of 700℃.

[0182] This embodiment uses atomic layer deposition to prepare an inorganic ceramic coating, selecting bis(tert-butylamino)silane as the silicon source and hydrazine as the nitrogen source, with a material molar ratio of 1:1. The specific steps are as follows:

[0183] A silicon source gas pulse is introduced into the reaction chamber and adsorbed onto the surface of the substrate layer. The chamber is then purged with inert argon gas to remove unreacted silicon source and byproducts. A nitrogen source gas pulse is then introduced into the reaction chamber to react with the adsorbed silicon source to generate silicon nitride. The chamber is then purged again with inert gas to remove unreacted nitrogen source and byproducts. This cycle is repeated. By controlling the coating thickness through multiple cycles (silicon source pulse-purging-nitrogen source pulse-purging), an inorganic ceramic coating is formed on the surface of the substrate layer.

[0184] The organic resin coating is a fluorinated resin coating (specifically a trifluorochloroethylene / vinyl ether copolymer resin coating) with a thickness of 0.015 mm.

[0185] The substrate layer is a polyethylene terephthalate layer with a thickness of 0.22 mm.

[0186] The adhesive layer is a polyurethane adhesive layer with a thickness of 0.015 mm.

[0187] The weather-resistant layer is a polyvinylidene fluoride film with a thickness of 0.02 mm.

[0188] The backsheet layer is 0.3 mm thick and has a shrinkage rate of 0.15% under lamination conditions.

[0189] Example 3

[0190] The photovoltaic module provided in this embodiment has a stacked structure arranged from top to bottom as follows: front panel layer, first encapsulant layer, cell layer, second encapsulant layer, and backsheet layer. The specific structure is shown below:

[0191] 1) Front panel layer:

[0192] The glass layer is made of 0.8mm thick float glass, and the surface treatment is physical tempering.

[0193] 2) First adhesive film layer:

[0194] It uses a thickness of 0.5mm and a basis weight of 400g / m³. 2 EVA (Ethylene-Vinyl Acetate Copolymer) photovoltaic encapsulation film products.

[0195] 3) Battery cell layer:

[0196] BC stands for "Back Contact Cell," a crystalline silicon solar cell with full back electrode contact.

[0197] 4) Second adhesive film layer:

[0198] It uses a thickness of 0.4mm and a basis weight of 360g / m³. 2 EVA photovoltaic encapsulation film products.

[0199] 5) Backing layer:

[0200] The backsheet layer is a co-extruded backsheet, and its laminated structure is arranged from top to bottom as inorganic ceramic coating and substrate layer.

[0201] An inorganic ceramic coating with a thickness of 0.03 mm is applied to the surface of the substrate layer. The coating is a silicon nitride inorganic non-metallic ceramic coating. The coating process is used to form it on the substrate surface. The coating can withstand a high temperature of 700℃.

[0202] This embodiment uses atomic layer deposition to prepare an inorganic ceramic coating, selecting bis(tert-butylamino)silane as the silicon source and hydrazine as the nitrogen source, with a material molar ratio of 1:1. The specific steps are as follows:

[0203] A silicon source gas pulse is introduced into the reaction chamber and adsorbed onto the surface of the substrate layer. The chamber is then purged with inert argon gas to remove unreacted silicon source and byproducts. A nitrogen source gas pulse is then introduced into the reaction chamber to react with the adsorbed silicon source to generate silicon nitride. The chamber is then purged again with inert gas to remove unreacted nitrogen source and byproducts. This cycle is repeated. By controlling the coating thickness through multiple cycles (silicon source pulse-purging-nitrogen source pulse-purging), an inorganic ceramic coating is formed on the surface of the substrate layer.

[0204] The substrate layer is a co-extruded layer of ethylene and propylene materials with a thickness of 0.27 mm.

[0205] The backsheet layer is 0.3 mm thick and has a shrinkage rate of 0.12% under lamination conditions.

[0206] Example 4

[0207] The photovoltaic module provided in Example 4 is the same as that in Example 1, except that:

[0208] The thickness of the first organic resin coating is 0.025 mm;

[0209] The thickness of the inorganic ceramic coating is 0.005 mm;

[0210] The thickness of the substrate layer is 0.24 mm;

[0211] The thickness of the second organic resin coating is 0.03 mm;

[0212] The backsheet layer thickness is 0.3 mm. The shrinkage rate under lamination conditions is 0.4%.

[0213] Example 5

[0214] The photovoltaic module provided in Example 5 is the same as that in Example 1, except that:

[0215] The thickness of the first organic resin coating is 0.015 mm;

[0216] The thickness of the inorganic ceramic coating is 0.1 mm;

[0217] The thickness of the substrate layer is 0.24 mm;

[0218] The thickness of the second organic resin coating is 0.015 mm.

[0219] The backsheet layer thickness is 0.37 mm. The shrinkage rate under lamination conditions is 0.02%.

[0220] Comparative Example 1

[0221] The photovoltaic module provided in Comparative Example 1 is as shown in Example 1, except that:

[0222] The backsheet layer is arranged from top to bottom as a first organic resin coating, a substrate layer, and a second organic resin coating, with the thickness of each layer shown below:

[0223] The thickness of the first organic resin coating is 0.015 mm;

[0224] The thickness of the substrate layer is 0.27 mm;

[0225] The thickness of the second organic resin coating is 0.015 mm.

[0226] The shrinkage rate of the backsheet layer under lamination conditions is 0.7%.

[0227] Comparative Example 2

[0228] The photovoltaic module provided in Comparative Example 2 is as shown in Example 2, except that:

[0229] The backsheet layer is arranged from top to bottom as follows: organic resin coating, inorganic ceramic coating, substrate layer, adhesive layer, and weather-resistant layer. The thickness of each layer is shown below:

[0230] The thickness of the organic resin coating is 0.015 mm;

[0231] The thickness of the substrate layer is 0.25 mm;

[0232] The thickness of the adhesive layer is 0.015 mm;

[0233] The thickness of the weather-resistant layer is 0.02 mm.

[0234] The shrinkage rate of the backsheet layer under lamination conditions is 1.0%.

[0235] Comparative Example 3

[0236] The photovoltaic module provided in Comparative Example 3 is as shown in Example 3, except that:

[0237] The backsheet layer consists of only a substrate layer, which is 0.3 mm thick and has a shrinkage rate of 2.0% under lamination conditions.

[0238] [Performance Testing]

[0239] I. Testing Methods

[0240] 1. Warpage test method:

[0241] After the laminated components of each embodiment and comparative example, i.e. photovoltaic modules, are left to stand at 25°C for 3 hours, the front panel is attached to the horizontal platform and placed on the horizontal platform. The height difference between the back panel of the laminate and the horizontal platform is measured from one end to the other along the length of the laminate. The maximum value minus the minimum value is defined as the warpage value of the module.

[0242] 2. Component fragmentation rate during the frame assembly process:

[0243] Fragments generated during the initial raw material cutting, stacking, lamination, and edge trimming processes are not included in the calculation. The component breakage rate during the frame assembly process is assessed separately. Following the existing component production process, an automatic framing machine is used, with the equipment directly sampling the laminated parts and assembling the frames under the same parameters. The ratio of the number of broken components to the total number of framed components is defined as the frame assembly breakage rate.

[0244] 3. Lamination parameters:

[0245] The lamination parameters used in the above embodiments and comparative examples are as follows: vacuuming time 300s, primary lamination pressure -70kPa, secondary lamination pressure -50kPa, tertiary lamination pressure -20kPa, lamination temperature 145℃, and lamination time 600s.

[0246] II. Test Results

[0247] The photovoltaic modules, i.e. laminates, provided in each embodiment and comparative example were tested, and the test results are shown in Table 1.

[0248] Table 1

[0249] Case Component warpage value (mm) Component breakage rate (%) during the frame assembly process Example 1 8 5 Example 2 12 8 Example 3 8 5 Example 4 20 12 Example 5 5 2 Comparative Example 1 25 15 Comparative Example 2 33 20 Comparative Example 3 50 40

[0250] In Table 1, "frame assembly process" refers to the installation of aluminum alloy frames using the laminates provided in the various embodiments and comparative examples to protect the edges of the components, enhance the mechanical strength and stability of the components, and facilitate subsequent installation and use.

[0251] As shown in Table 1, the test results provided in Examples 1-5 of this application can effectively reduce the warpage of the components under conventional lamination conditions and significantly reduce the component fragmentation rate during the frame assembly process. This reduces the risk of reduced product qualification rate due to warpage and the risk of component failure during load testing due to warpage problems that still exist after frame assembly in the subsequent component production process, thus effectively ensuring the performance of the components.

[0252] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A photovoltaic module, characterized in that, The device includes a stacked battery cell layer, a second adhesive film layer, and a backsheet layer. The second adhesive film layer is used to bond the battery cell layer and the backsheet layer. The backsheet layer includes a substrate layer and an inorganic ceramic coating located on at least one side of the substrate layer. The substrate layer is made of a polymer material. The backsheet layer includes one or more of the following: double-sided coated backsheet, single-sided coated backsheet, and co-extruded backsheet; The double-sided coated backplate comprises a first organic resin coating, an inorganic ceramic coating, a substrate layer, and a second organic resin coating, all layered together. The single-sided coated back panel includes a multilayered organic resin coating, an inorganic ceramic coating, a substrate layer, an adhesive layer, and a weather-resistant layer. The co-extruded backsheet comprises a stacked inorganic ceramic coating and a substrate layer, wherein the substrate layer is a co-extruded substrate layer.

2. The photovoltaic module according to claim 1, characterized in that, Satisfy at least one of the following A to D: A: The thickness of the backing layer is 0.2 mm-1 mm; B: The thickness of the inorganic ceramic coating is 0.005 mm-0.1 mm; C: The connection structure between the inorganic ceramic coating and the substrate layer includes one or more of physical adsorption, diffusion bonding, and chemical bonding; D: The inorganic ceramic coating includes inorganic non-metallic ceramic coatings.

3. The photovoltaic module according to claim 1, characterized in that, The double-sided coated backplate satisfies at least one of the following a to d: a: The thickness of the first organic resin coating is 0.005 mm-0.02 mm; b: The thickness of the inorganic ceramic coating is 0.005 mm-0.1 mm; c: The thickness of the substrate layer is 0.2 mm-0.8 mm; d: The thickness of the second organic resin coating is 0.005 mm-0.02 mm.

4. The photovoltaic module according to claim 1, characterized in that, The single-sided coated backplate satisfies at least one of the following i to v: i: The thickness of the organic resin coating is 0.005 mm-0.1 mm; ii: The thickness of the inorganic ceramic coating is 0.005 mm-0.02 mm; iii: The thickness of the substrate layer is 0.2 mm-0.75 mm; iv: The thickness of the adhesive layer is 0.005 mm-0.02 mm; v: The thickness of the weather-resistant layer is 0.015 mm-0.05 mm.

5. The photovoltaic module according to claim 1, characterized in that, The co-extruded backsheet satisfies at least one of the following I to II: I: The thickness of the inorganic ceramic coating is 0.005 mm-0.1 mm; II: The thickness of the substrate layer is 0.1 mm to 0.9 mm.

6. An electrical appliance, characterized in that, The photovoltaic module includes any one of claims 1 to 5.

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