A novel ceramic packaging structure

Abstract

This application relates to the field of electronic packaging, and in particular to a novel ceramic packaging structure, comprising a ceramic shell, a ceramic circuit board, and a metal cover. The ceramic shell has an assembly cavity in the middle, with a first metallized region at the bottom and a positioning portion and a second metallized region on the sidewalls. The first and second metallized regions are respectively provided with first and second copper clips, and a metal sealing ring is located at the top. The ceramic circuit board is formed by stacking and sintering multiple layers of printed ceramic sheets, integrating electronic components and bonding them to the second metallized region via metal wires. The metal cover is fixed to the sealing ring to seal the assembly cavity. Furthermore, the metallized regions have capillary interconnections filled with conductive filler, as well as related conductive sheets and other structures. This novel ceramic packaging structure enables high-density assembly and high-power-density design, ensuring stable operation of internal electronic components, and its structural design facilitates airflow and electrical connections.

Description

Technical Field

[0001] This application relates to the field of electronic component packaging, and in particular to a novel ceramic packaging structure. Background Technology

[0002] In the field of electronic component packaging, a good packaging structure can ensure the stable operation of electronic devices in complex working environments, improve product reliability and lifespan, and drive the development of electronic devices towards higher performance and smaller size. Ceramics, with their excellent insulation, thermal conductivity, chemical stability, and good hermeticity, are widely used in electronic component packaging.

[0003] In the field of traditional ceramic packaging, various methods are typically employed to address the packaging challenges of electronic components. A common approach is to encapsulate the electronic components in a standard ceramic shell. This shell is generally a single-layer structure with a simple design, providing only basic physical protection. Alternatively, traditional ceramic packaging structures often use a circuit substrate or printed circuit board in conjunction with the ceramic shell to encapsulate the electronic components. To ensure the seal, the openings of the ceramic shell are usually sealed with plastic or glass covers to prevent damage to the internal electronic components from external environmental factors.

[0004] However, most existing technologies encapsulate electronic components using a single-layer structure, which occupies a large space, and the stability of the encapsulation structure cannot be guaranteed when it operates over a wide temperature range. Utility Model Content

[0005] To overcome the shortcomings of the prior art, this application provides a novel ceramic packaging structure that can not only encapsulate a variety of components but also effectively reduce the space occupied. At the same time, it can ensure the sealing of the packaging structure when the ambient temperature changes, reduce the risk of thermal mismatch, and realize high-density assembly and high-power-density design of the packaging structure.

[0006] This application is achieved through the following technical solution: A novel ceramic packaging structure, comprising: A ceramic housing has an assembly cavity in the middle for assembling a circuit board; the bottom of the assembly cavity has a first metallized area, and the side wall of the assembly cavity has a positioning part for defining the position of the circuit board and a second metallized area for electrically connecting with the circuit board; a first copper clip is provided on the first metallized area at the bottom of the ceramic housing, and a second copper clip is provided on the second metallized area on the side wall of the assembly cavity; a metal sealing ring is provided on the top of the ceramic housing. The ceramic circuit board is made of multiple layers of printed ceramic sheets stacked and sintered together. It integrates several electronic components, is fixed on the positioning part, and is bonded with metal wires between itself and the second metallization area. A metal cover plate, which is fixed to a sealing ring, is used to seal the assembly cavity.

[0007] By adopting the above technical solution, the assembly cavity of the ceramic shell can be used to assemble circuit boards, enabling the packaging structure to encapsulate multiple electronic components within a limited space, thus improving the space utilization rate of the packaging structure. The first and second metallized areas respectively realize the electrical connection between the assembly cavity and the circuit board and the external circuit. The positioning part can accurately define the position of the circuit board and provide stable support for the circuit board, facilitating the installation of the ceramic circuit board. The first and second copper clips facilitate connection with the external circuit, and the metal sealing ring facilitates the installation of the metal cover plate. The ceramic circuit board is made of multi-layer printed ceramic sheets stacked and sintered, which can integrate electronic components. It is electrically connected to the second metallized area through metal wire bonding. The metal sealing ring on the top of the ceramic shell cooperates with the metal cover plate to achieve a high airtight seal of the assembly cavity, preventing the intrusion of external moisture, dust, etc., and protecting the internal electronic components (especially chips) from the influence of the external environment.

[0008] Optionally, the first metallized region and the second metallized region are provided with a plurality of capillary connecting holes extending from the assembly cavity to the bottom of the ceramic shell, and the capillary connecting holes are filled with conductive filler.

[0009] By adopting the above technical solution, a number of capillary connecting holes are set in the first metallization region and the second metallization region and filled with conductive filler, the conductive function between the assembly cavity and the bottom of the ceramic shell can be realized, ensuring the electrical connection performance of the ceramic packaging structure and improving the efficiency of signal transmission and current conduction. In addition, setting a number of capillary connecting holes can increase the contact area between the conductive filler and the ceramic shell and improve the heat dissipation effect.

[0010] Optionally, the upper and lower surfaces of the first metallized region and the second metallized region are provided with a plurality of conductive sheets; the conductive sheets abut against the conductive filler; the first copper clip and the second copper clip are fixed on the conductive sheets.

[0011] By adopting the above technical solution, conductive sheets are provided on the upper and lower surfaces of the first metallized region and the second metallized region, and the conductive sheets abut against the conductive filler, which facilitates the fixing of the first copper clip and the second copper clip on the conductive sheets, reduces the contact resistance, enhances the conductivity, and further improves the current transmission efficiency and stability.

[0012] Optionally, the conductive filler is tungsten paste.

[0013] By adopting the above technical solution, tungsten paste is used as the conductive filler. On the one hand, it can fill tiny gaps and improve the tightness of the contact; on the other hand, the high melting point of tungsten paste can ensure the stability of the conductive path between electronic components and external circuits in high-temperature environments.

[0014] Optionally, the positioning part is a positioning shoulder provided on the side wall of the assembly cavity.

[0015] By adopting the above technical solution, the positioning shoulder of the ceramic shell assembly cavity sidewall can accurately define the position of the ceramic circuit board, so that the ceramic circuit board can be more stably fixed in the assembly cavity, ensuring the relative positional accuracy between the components, which is conducive to the smooth progress of subsequent assembly and electrical connection operations.

[0016] Optionally, the second metallized region extends into a positioning shoulder to form a bonding boss.

[0017] By adopting the above technical solution, the second metallized area extends to form a positioning shoulder to form a bonding boss, which facilitates wire bonding between the ceramic circuit board and the second metallized area and improves the convenience of electrical connection operation.

[0018] Optionally, the enclosed space enclosed by the ceramic shell and the metal cover is filled with a protective gas.

[0019] By adopting the above technical solution, the enclosed space enclosed by the ceramic shell and the metal cover is filled with protective gas, which can prevent the internal electronic components from being oxidized and improve the stability and service life of the electronic components.

[0020] Optionally, a connecting seam is formed between the ceramic circuit board and the sidewall of the assembly cavity to allow airflow between the upper and lower spaces.

[0021] By adopting the above technical solution, a connecting seam is formed between the ceramic circuit board and the side wall of the assembly cavity, which enables air circulation between the upper and lower layers. This helps to balance the air pressure in the enclosed space and promotes air exchange to regulate the temperature and humidity inside the cavity, improve the heat dissipation efficiency of the packaging structure, and prevent water vapor condensation and excessive temperature from affecting the performance of electronic components.

[0022] Optionally, both the first and second copper clips have a "Z" shaped structure, including an upper horizontal part, a lower horizontal part, and an oblique part connecting the upper and lower horizontal parts, wherein the lower horizontal part extends out of the side edge of the ceramic shell.

[0023] By adopting the above technical solution, the sloping portions of the first and second copper clips, which are in the shape of a "Z", allow a certain space between the ceramic shell and the external circuit, which facilitates air circulation and improves the heat dissipation capacity of the packaging structure. The lower horizontal portion extends out of the side edge of the ceramic shell, which facilitates the connection of the first and second copper clips with the external circuit, making it convenient for the entire packaging structure to be connected to the external circuit system.

[0024] Optionally, the metal cover plate has marking lines.

[0025] By adopting the above technical solution, it is easier to position the first copper clip and the second copper clip, thereby improving installation efficiency.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. The assembly cavity and positioning part in the middle of the ceramic shell in this application facilitate the assembly and positioning of the ceramic circuit board. The ceramic circuit board is made of multi-layer printed ceramic sheets stacked and sintered, which reduces the space occupied by the packaging structure while ensuring heat dissipation. 2. This application provides several capillary connecting holes extending from the assembly cavity to the bottom of the ceramic shell in the first metallization region and the second metallization region, and fills the capillary connecting holes with conductive filler. The conductive filler abuts against the conductive sheet, so that the electronic components fixed on the assembly cavity and the ceramic circuit board can be connected to the external circuit, thereby realizing high-density assembly and high-power-density design of the packaging structure. 3. This application ensures that the package structure remains stable when operating over a wide temperature range by using a ceramic housing in conjunction with a ceramic circuit board. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the novel ceramic packaging structure described in Embodiment 1; Figure 2 This is a cross-sectional view of the first metallized region in Embodiment 1. Figure 3 This is a cross-sectional view of the novel ceramic packaging structure described in Embodiment 1; Figure 4 This is a top view of the positioning part described in Embodiment 1; Figure 5 This is a schematic diagram of the novel ceramic packaging structure described in Embodiment 2; Figure 6 This is a schematic diagram of the structure of the metal cover plate described in Embodiment 2.

[0028] In the diagram: 1. Ceramic shell; 2. Assembly cavity; 21. Positioning part; 211. Positioning shoulder; 3. First metallized area; 31. First copper clip; 311. Conductive sheet; 32. Copper bridge; 4. Second metallized area; 41. Second copper clip; 411. Upper horizontal part; 412. Lower horizontal part; 413. Sloping part; 42. Bonding boss; 5. Sealing ring; 6. Ceramic circuit board; 61. Metal wire; 62. Connecting seam; 7. Metal cover plate; 71. Marking line; 8. Capillary connecting hole; 81. Conductive filler; 9. Electronic component. Detailed Implementation

[0029] The technical solutions of various embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] Example 1 Reference Figures 1-3 This application discloses a novel ceramic packaging structure, comprising: The ceramic housing 1 has an assembly cavity 2 in the middle for assembling a circuit board; the bottom of the assembly cavity 2 is provided with a first metallized area 3, and the side wall of the assembly cavity 2 is provided with a positioning part 21 for defining the position of the circuit board and a second metallized area 4 for electrically connecting with the circuit board; a first copper clip 31 is provided on the first metallized area 3 at the bottom of the ceramic housing 1, and a second copper clip 41 is provided on the second metallized area 4 on the side wall of the assembly cavity 2; a metal sealing ring 5 is provided on the top of the ceramic housing 1. The ceramic circuit board 6 is formed by stacking and sintering multiple layers of printed ceramic sheets, and integrates several electronic components 9. It is fixed on the positioning part 21 and is bonded with a metal wire 61 to the second metallization region 4. Metal cover plate 7 is fixed on sealing ring 5 and is used to seal assembly cavity 2.

[0031] Specifically, refer to Figure 1 The metal sealing ring 5 is bonded to the top of the ceramic shell 1 via thermally conductive epoxy resin. The metal sealing ring 5 can be made of stainless steel, providing a stable mounting base for the metal cover plate 7. The metal cover plate 7 and the sealing ring 5 can be made of iron-nickel-cobalt alloy. The iron-nickel-cobalt alloy has good matching coefficient of thermal expansion with ceramics, high reliability, and can adapt to temperature changes in the working environment of the packaging structure, ensuring the stability of the packaging structure. The metal cover plate 7 is fixed on the sealing ring 5 to seal the assembly cavity 2. In addition, the enclosed space enclosed by the ceramic shell 1 and the metal cover plate 7 is filled with a protective gas, which can be an inert gas such as nitrogen or argon. These gases can prevent the internal electronic components 9 from being oxidized and extend the service life of the electronic components 9.

[0032] Reference Figures 2-4The ceramic housing 1 has an assembly cavity 2 in the middle for assembling a circuit board. A first metallized region 3 is located at the bottom of the assembly cavity 2. Both the first metallized region 3 and the second metallized region 4 have several capillary connecting holes 8 extending from the assembly cavity 2 to the bottom of the ceramic housing 1. The capillary connecting holes 8 are filled with conductive filler 81. When the packaging structure operates over a wide temperature range, the conductive filler 81 can firmly bond with the capillary connecting holes. The conductive filler 81 can be made of tungsten paste, which has good conductivity and high-temperature stability. Furthermore, compared to silver paste, the coefficient of thermal expansion between tungsten paste and ceramic is smaller, reducing the risk of structural thermal failure. Several conductive sheets 311 are provided on the upper and lower surfaces of the first metallized region 3 and the second metallized region 4. The conductive sheets 311 abut against the conductive filler 81. A first copper clip 31 and a second copper clip 41 are fixed to the conductive sheets 311. The conductive sheets 311 can be copper sheets, which can reduce contact resistance, enhance the stability of the electrical connection, and further improve current transmission efficiency and stability. The first metal area connects the electronic component 9 to the external circuit via a copper bridge 32, improving the current carrying capacity of the electronic component 9, increasing heat dissipation, and effectively solving the problem of weak overload capacity. The first copper clip 31 and the second copper clip 41 are both Z-shaped structures, including an upper horizontal part 411, a lower horizontal part 412, and an inclined part 413 connecting the upper horizontal part 411 and the lower horizontal part 412. The lower horizontal part 412 extends out of the side edge of the ceramic shell 1. The Z-shaped structure facilitates the connection and fixation of the first copper clip 31 and the second copper clip 41 with other components. The inclined part 413 of the Z-shaped copper clip allows for a certain space between the ceramic shell 1 and the external circuit, which facilitates air circulation and improves the heat dissipation capacity of the packaging structure.

[0033] Reference Figures 3-4 The ceramic circuit board 6 is formed by stacking and sintering multiple layers of printed ceramic sheets. This manufacturing method makes the ceramic circuit board 6 more dense and stable. As a prior art technology, the ceramic circuit board 6 is prepared using the HTCC ceramic preparation process. The HTCC process mainly includes: casting → punching → screen printing → lamination → debinding → co-firing. Multiple layers of ceramic sheets are punched, screen printed, stacked, and sintered. The ceramic circuit board 6 is fixed on the positioning shoulder 211 and integrates several electronic components 9. The electronic components 9 can be bonded to the ceramic circuit board 6 using thermally conductive epoxy resin. A metal wire 61 is bonded between the ceramic circuit board 6 and the second metallization region 4. The metal wire 61 can be gold wire or aluminum wire, and electrical connection is achieved through the bonding process. The second metallization region 4 extends into the positioning shoulder, forming a bonding boss 42. The setting of the bonding boss 42 facilitates the bonding operation of the metal wire 61, making the connection more reliable.

[0034] Reference Figures 3-4The assembly cavity 2 has a positioning part 21 for defining the position of the circuit board and a second metallized area 4 for electrical connection with the circuit board on its side wall. The positioning part 21 can be a positioning shoulder 211 provided on the side wall of the assembly cavity 2; the positioning shoulder 211 provides support for the ceramic circuit board 6 from three directions, and the shape of the positioning shoulder 211 can be a horizontal step, which can well support the ceramic circuit board 6 and fix it accurately in the corresponding position. Of course, the positioning part 21 can also use a slot or other form to define the position of the circuit board. A connecting seam 62 is formed between the ceramic circuit board 6 and the side wall of the assembly cavity 2 to allow air circulation between the upper and lower spaces. The existence of the connecting seam 62 helps to balance the air pressure in the enclosed space and reduce the impact of air pressure difference caused by temperature changes and other factors on the packaging structure. A first copper clip 31 is provided on the first metallized area 3 at the bottom of the ceramic shell 1, and a second copper clip 41 is provided on the second metallized area 4 on the side wall of the assembly cavity 2. The first metallized area 3 and the second metallized area 4 can realize the electrical connection between the electronic components 9 on the assembly cavity 2 and the ceramic circuit board 6 and the external circuit.

[0035] The implementation principle of this embodiment is as follows: the novel ceramic packaging structure effectively reduces the packaging space through the reasonable combination of the ceramic shell 1, the ceramic circuit board 6, and the metal cover plate 7. The ceramic circuit board 6, which is formed by stacking and sintering multilayer printed ceramic sheets, has a high degree of integration and saves space. At the same time, the excellent properties of the ceramic material and the stable electrical connection and sealing structure between the components enable the packaging structure to maintain structural stability over a wide temperature range, thereby improving the reliability and service life of the electronic components 9.

[0036] Example 2 Reference Figures 5-6 The difference between this embodiment and embodiment one is that the side wall of the assembly cavity 2 is provided with positioning shoulders 211 to provide symmetrical support for the ceramic circuit board 6 from opposite sides. A connecting seam 62 is reserved between the ceramic circuit board 6 and the other two side walls of the assembly cavity 2. This arrangement not only provides stable support for the ceramic circuit board 6, but also increases the air circulation channel between the upper and lower spaces, improving the heat dissipation efficiency of the packaging structure. The metal cover plate 7 is provided with marking lines 71, which can facilitate the positioning of the first copper clip 31 and the second copper clip 41, improving the installation efficiency.

[0037] The implementation principle of this embodiment is as follows: The symmetrical arrangement of the positioning shoulders 211 on the side walls of the assembly cavity 2 provides stable support for the ceramic circuit board 6. The connecting seam 62 between the ceramic circuit board 6 and the other two side walls forms an air convection channel between the upper and lower spaces, promoting air circulation. The marking lines 71 on the metal cover plate 7 serve as a spatial positioning reference, which can help operators quickly determine the installation coordinates of the first copper clip 31 and the second copper clip 41, reducing the alignment adjustment time during the assembly process.

[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the technical solutions of the embodiments of this application.

Claims

1. A novel ceramic packaging structure, characterized in that, include: A ceramic housing (1) has an assembly cavity (2) in the middle for assembling a circuit board; the bottom of the assembly cavity (2) is provided with a first metallized area (3), and the side wall of the assembly cavity (2) is provided with a positioning part (21) for defining the position of the circuit board and a second metallized area (4) for electrically connecting with the circuit board; a first copper clip (31) is provided on the first metallized area (3) at the bottom of the ceramic housing (1), and a second copper clip (41) is provided on the second metallized area (4) on the side wall of the assembly cavity (2); a metal sealing ring (5) is provided on the top of the ceramic housing (1). The ceramic circuit board (6) is made of multiple layers of printed ceramic sheets stacked and sintered, and integrates several electronic components (9). It is fixed on the positioning part (21) and has metal wires (61) bonded between it and the second metallization area (4). A metal cover plate (7) is fixed on a sealing ring (5) for sealing the assembly cavity (2).

2. The novel ceramic packaging structure according to claim 1, characterized in that, The first metallized region (3) and the second metallized region (4) are provided with a plurality of capillary connecting holes (8) extending from the assembly cavity (2) to the bottom of the ceramic shell (1), and the capillary connecting holes (8) are filled with conductive filler (81).

3. The novel ceramic packaging structure according to claim 2, characterized in that, The upper and lower surfaces of the first metallized region (3) and the second metallized region (4) are provided with a plurality of conductive sheets (311); the conductive sheets (311) abut against the conductive filler (81); the first copper clip (31) and the second copper clip (41) are fixed on the conductive sheets (311).

4. The novel ceramic packaging structure according to claim 2, characterized in that, The conductive filler (81) is tungsten paste.

5. A novel ceramic packaging structure according to claim 2, characterized in that, The positioning part (21) is a positioning shoulder (211) provided on the side wall of the assembly cavity (2).

6. The novel ceramic packaging structure according to claim 5, characterized in that, The second metallized region (4) extends into a positioning shoulder to form a bonding boss (42).

7. The novel ceramic packaging structure according to claim 1, characterized in that, The enclosed space enclosed by the ceramic shell (1) and the metal cover plate (7) is filled with protective gas.

8. The novel ceramic packaging structure according to claim 1, characterized in that, A connecting seam (62) is formed between the ceramic circuit board (6) and the side wall of the assembly cavity (2) for air circulation between the upper and lower spaces.

9. The novel ceramic packaging structure according to claim 1, characterized in that, The first copper clip (31) and the second copper clip (41) are both in the form of a "Z" shape, including an upper horizontal part (411), a lower horizontal part (412) and an oblique part (413) connecting the upper horizontal part (411) and the lower horizontal part (412), the lower horizontal part (412) extending out of the side edge of the ceramic shell (1).

10. A novel ceramic packaging structure according to claim 1, characterized in that, The metal cover plate (7) is provided with marking lines (71).

Images